FR2243242B1 - - Google Patents

Info

Publication number
FR2243242B1
FR2243242B1 FR7430208A FR7430208A FR2243242B1 FR 2243242 B1 FR2243242 B1 FR 2243242B1 FR 7430208 A FR7430208 A FR 7430208A FR 7430208 A FR7430208 A FR 7430208A FR 2243242 B1 FR2243242 B1 FR 2243242B1
Authority
FR
France
Prior art keywords
heat sink
chip
flat surface
grooves
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7430208A
Other languages
English (en)
French (fr)
Other versions
FR2243242A1 (cg-RX-API-DMAC10.html
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2243242A1 publication Critical patent/FR2243242A1/fr
Application granted granted Critical
Publication of FR2243242B1 publication Critical patent/FR2243242B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W40/10—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H10W72/073—
    • H10W72/07336—
    • H10W72/322—
    • H10W72/352—
    • H10W90/736—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7430208A 1973-09-12 1974-09-05 Expired FR2243242B1 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US396565A US3860949A (en) 1973-09-12 1973-09-12 Semiconductor mounting devices made by soldering flat surfaces to each other

Publications (2)

Publication Number Publication Date
FR2243242A1 FR2243242A1 (cg-RX-API-DMAC10.html) 1975-04-04
FR2243242B1 true FR2243242B1 (cg-RX-API-DMAC10.html) 1978-09-15

Family

ID=23567745

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7430208A Expired FR2243242B1 (cg-RX-API-DMAC10.html) 1973-09-12 1974-09-05

Country Status (13)

Country Link
US (1) US3860949A (cg-RX-API-DMAC10.html)
JP (2) JPS5057579A (cg-RX-API-DMAC10.html)
BE (1) BE819707A (cg-RX-API-DMAC10.html)
BR (1) BR7407411D0 (cg-RX-API-DMAC10.html)
CA (1) CA1001326A (cg-RX-API-DMAC10.html)
DE (1) DE2442159A1 (cg-RX-API-DMAC10.html)
FR (1) FR2243242B1 (cg-RX-API-DMAC10.html)
GB (1) GB1440545A (cg-RX-API-DMAC10.html)
IN (1) IN142824B (cg-RX-API-DMAC10.html)
IT (1) IT1020252B (cg-RX-API-DMAC10.html)
NL (1) NL7411774A (cg-RX-API-DMAC10.html)
SE (1) SE403851B (cg-RX-API-DMAC10.html)
YU (1) YU37042B (cg-RX-API-DMAC10.html)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
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US4100589A (en) * 1975-07-17 1978-07-11 Harris Corporation Microcircuit device including hybrid circuit carrier
DE2556469C3 (de) * 1975-12-15 1978-09-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement mit Druckkontakt
US4152175A (en) * 1978-07-24 1979-05-01 The United States Of America As Represented By The United States Department Of Energy Silicon solar cell assembly
JPS5568661A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Structure for mounting power transistor
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
DE3040867C2 (de) * 1980-10-30 1985-01-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur Herstellung einer Halbleiteranordnung
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
US4566170A (en) * 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4759829A (en) * 1985-06-27 1988-07-26 Rca Corporation Device header and method of making same
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
GB2194477A (en) * 1986-08-28 1988-03-09 Stc Plc Solder joint
DE4107660C2 (de) * 1991-03-09 1995-05-04 Bosch Gmbh Robert Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen
DE4110318C2 (de) * 1991-03-28 2001-10-11 Bosch Gmbh Robert Verfahren zum Zusammenlöten zweier Bauteile
JPH06188385A (ja) * 1992-10-22 1994-07-08 Mitsubishi Electric Corp 半導体装置およびその製造方法
DE29510336U1 (de) * 1995-06-26 1995-08-24 Siemens AG, 80333 München Leistungshybridschaltung
KR19980024134A (ko) * 1996-09-18 1998-07-06 모기 쥰이찌 반도체 패키지
US6081426A (en) * 1996-09-18 2000-06-27 Shinko Electric Industries Co., Ltd. Semiconductor package having a heat slug
EP0873809A1 (fr) * 1997-04-23 1998-10-28 AML Microtechnique Lorraine Société Anonyme Pièces destinées à être assemblées par soudure au bain de sel
DE19735247C2 (de) * 1997-08-14 2001-12-20 Winkelmann & Pannhoff Gmbh Verfahren zum Verlöten von Bauteilen und Bauteil zur Durchführung des Verfahrens
US7011378B2 (en) * 1998-09-03 2006-03-14 Ge Novasensor, Inc. Proportional micromechanical valve
US6523560B1 (en) 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
CN1322282A (zh) 1998-09-03 2001-11-14 卢卡斯新星传感器公司 正比微机械装置
WO2001022489A2 (de) * 1999-09-22 2001-03-29 Siemens Aktiengesellschaft Steuergerät, insbesondere für die kraftfahrzeugtechnik
US6845962B1 (en) * 2000-03-22 2005-01-25 Kelsey-Hayes Company Thermally actuated microvalve device
US6505811B1 (en) 2000-06-27 2003-01-14 Kelsey-Hayes Company High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
US6822318B2 (en) * 2001-05-14 2004-11-23 Lightconnect, Inc. Stress isolating die attach structure and method
US7164585B2 (en) * 2003-03-31 2007-01-16 Intel Corporation Thermal interface apparatus, systems, and methods
US20070251586A1 (en) * 2003-11-24 2007-11-01 Fuller Edward N Electro-pneumatic control valve with microvalve pilot
EP1694990A4 (en) * 2003-11-24 2009-12-09 Microstaq Inc MICRO-VALVE DEVICE FOR CONTROLLING A VARIABLE DISPLACEMENT COMPRESSOR
US8011388B2 (en) * 2003-11-24 2011-09-06 Microstaq, INC Thermally actuated microvalve with multiple fluid ports
JP2007525630A (ja) * 2004-02-27 2007-09-06 アルーマナ、マイクロウ、エルエルシー ハイブリッド・マイクロ／マクロ・プレート弁
US7803281B2 (en) * 2004-03-05 2010-09-28 Microstaq, Inc. Selective bonding for forming a microvalve
US7156365B2 (en) * 2004-07-27 2007-01-02 Kelsey-Hayes Company Method of controlling microvalve actuator
CN100591916C (zh) * 2005-01-14 2010-02-24 麦克罗斯塔克公司 用于控制变容积式压缩机的方法和系统
US7265977B2 (en) * 2005-01-18 2007-09-04 International Business Machines Corporation Active liquid metal thermal spreader
US7239517B2 (en) * 2005-04-11 2007-07-03 Intel Corporation Integrated heat spreader and method for using
US8156962B2 (en) 2006-12-15 2012-04-17 Dunan Microstaq, Inc. Microvalve device
WO2008121369A1 (en) 2007-03-30 2008-10-09 Microstaq, Inc. Pilot operated micro spool valve
WO2008121365A1 (en) 2007-03-31 2008-10-09 Microstaq, Inc. Pilot operated spool valve
CN102164846B (zh) * 2008-08-09 2016-03-30 盾安美斯泰克公司(美国) 改进的微型阀装置
US8113482B2 (en) * 2008-08-12 2012-02-14 DunAn Microstaq Microvalve device with improved fluid routing
WO2010065804A2 (en) 2008-12-06 2010-06-10 Microstaq, Inc. Fluid flow control assembly
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
WO2010117874A2 (en) 2009-04-05 2010-10-14 Microstaq, Inc. Method and structure for optimizing heat exchanger performance
CN102575782B (zh) 2009-08-17 2014-04-09 盾安美斯泰克股份有限公司 微型机械装置和控制方法
CN102812538B (zh) 2010-01-28 2015-05-13 盾安美斯泰克股份有限公司 用以促进接合的重调节半导体表面的方法
US9006844B2 (en) 2010-01-28 2015-04-14 Dunan Microstaq, Inc. Process and structure for high temperature selective fusion bonding
US8996141B1 (en) 2010-08-26 2015-03-31 Dunan Microstaq, Inc. Adaptive predictive functional controller
JP5631775B2 (ja) * 2011-02-24 2014-11-26 新光電気工業株式会社 複合めっき液
US8925793B2 (en) 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
US9140613B2 (en) 2012-03-16 2015-09-22 Zhejiang Dunan Hetian Metal Co., Ltd. Superheat sensor
US9188375B2 (en) 2013-12-04 2015-11-17 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly
EP3359900B1 (de) * 2015-10-06 2021-02-24 Linde GmbH Randleisten mit oberflächenstruktur für plattenwärmetauscher

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond
DE2060933C3 (de) * 1970-12-10 1978-08-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Sockel für ein Halbleiterbauelementgehäuse und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
BE819707A (fr) 1974-12-31
NL7411774A (nl) 1975-03-14
US3860949A (en) 1975-01-14
IN142824B (cg-RX-API-DMAC10.html) 1977-08-27
FR2243242A1 (cg-RX-API-DMAC10.html) 1975-04-04
YU243174A (en) 1982-06-18
GB1440545A (en) 1976-06-23
JPS5392385U (cg-RX-API-DMAC10.html) 1978-07-28
DE2442159A1 (de) 1975-03-13
IT1020252B (it) 1977-12-20
AU7304474A (en) 1976-03-11
BR7407411D0 (pt) 1975-07-08
SE403851B (sv) 1978-09-04
YU37042B (en) 1984-08-31
SE7411472L (cg-RX-API-DMAC10.html) 1975-03-13
CA1001326A (en) 1976-12-07
JPS5057579A (cg-RX-API-DMAC10.html) 1975-05-20

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