FR2021494A1 - - Google Patents

Info

Publication number
FR2021494A1
FR2021494A1 FR6936554A FR6936554A FR2021494A1 FR 2021494 A1 FR2021494 A1 FR 2021494A1 FR 6936554 A FR6936554 A FR 6936554A FR 6936554 A FR6936554 A FR 6936554A FR 2021494 A1 FR2021494 A1 FR 2021494A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR6936554A
Other versions
FR2021494B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2021494A1 publication Critical patent/FR2021494A1/fr
Application granted granted Critical
Publication of FR2021494B1 publication Critical patent/FR2021494B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR696936554A 1968-10-24 1969-10-24 Expired FR2021494B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77037568A 1968-10-24 1968-10-24

Publications (2)

Publication Number Publication Date
FR2021494A1 true FR2021494A1 (fr) 1970-07-24
FR2021494B1 FR2021494B1 (fr) 1973-04-06

Family

ID=25088336

Family Applications (1)

Application Number Title Priority Date Filing Date
FR696936554A Expired FR2021494B1 (fr) 1968-10-24 1969-10-24

Country Status (6)

Country Link
US (1) US3614554A (fr)
CA (1) CA925221A (fr)
DE (1) DE1952160A1 (fr)
FR (1) FR2021494B1 (fr)
GB (1) GB1279160A (fr)
NL (1) NL6915363A (fr)

Families Citing this family (143)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898595A (en) * 1970-11-02 1975-08-05 Cunningham Corp Magnetic printed circuit
US3731005A (en) * 1971-05-18 1973-05-01 Metalized Ceramics Corp Laminated coil
US3858138A (en) * 1973-03-05 1974-12-31 Rca Corp Tuneable thin film inductor
US4024565A (en) * 1973-10-30 1977-05-17 General Electric Company Deep diode solid state transformer
US3988764A (en) * 1973-10-30 1976-10-26 General Electric Company Deep diode solid state inductor coil
US4071378A (en) * 1975-02-27 1978-01-31 General Electric Company Process of making a deep diode solid state transformer
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
DE3036704A1 (de) * 1980-09-29 1982-05-13 Siemens AG, 1000 Berlin und 8000 München Hybridspule und verfahren zu deren herstellung
DE3039163A1 (de) * 1980-10-16 1982-05-13 Siemens AG, 1000 Berlin und 8000 München Eine veraenderbare induktivitaet aufweisende hybridspule und verfahren zu deren justierung
JPS61501533A (ja) * 1984-03-22 1986-07-24 モステック・コ−ポレイション 集積回路の付加部品
US4870541A (en) * 1987-12-16 1989-09-26 Ford Micro Electronics Shielded bar-cap
DE3941323C2 (de) * 1988-12-14 1994-04-21 Fraunhofer Ges Forschung Halbleiterelement mit einer integrierten Induktivität und Verfahren zu seiner Herstellung
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5227659A (en) * 1990-06-08 1993-07-13 Trustees Of Boston University Integrated circuit inductor
JPH0653055A (ja) * 1990-10-16 1994-02-25 Vlt Corp 導電体と導電ランで構成された電磁巻線
US5336921A (en) * 1992-01-27 1994-08-09 Motorola, Inc. Vertical trench inductor
DE4306655C2 (de) * 1992-03-04 1997-04-30 Toshiba Kawasaki Kk Verfahren zum Herstellen eines planaren Induktionselements
US5392020A (en) * 1992-12-14 1995-02-21 Chang; Kern K. N. Flexible transformer apparatus particularly adapted for high voltage operation
US5574420A (en) * 1994-05-27 1996-11-12 Lucent Technologies Inc. Low profile surface mounted magnetic devices and components therefor
GB2290913B (en) * 1994-06-30 1998-03-11 Plessey Semiconductors Ltd Multi-chip module inductor structure
US5640311A (en) * 1994-08-30 1997-06-17 Soohoo; Ronald F. Miniaturized high frequency direct current power supply
US5621624A (en) * 1994-08-30 1997-04-15 Soohoo; Ronald F. Miniaturized high frequency direct current power supply
DE4442994A1 (de) * 1994-12-02 1996-06-05 Philips Patentverwaltung Planare Induktivität
KR100211814B1 (ko) * 1995-11-30 1999-08-02 전주범 플라이백 트랜스포머의 가요성 2차코일 권선구조와 그 제조방법
US5877668A (en) * 1995-11-30 1999-03-02 Daewoo Electronics Co., Ltd. Flyback transformer having a flexible coil winding structure and manufacturing process thereof
US5767563A (en) * 1995-12-22 1998-06-16 Micron Technology, Inc. Inductor formed at least partially in a substrate
US5610569A (en) * 1996-01-31 1997-03-11 Hughes Electronics Staggered horizontal inductor for use with multilayer substrate
US5877667A (en) * 1996-08-01 1999-03-02 Advanced Micro Devices, Inc. On-chip transformers
KR100250225B1 (ko) 1996-11-19 2000-04-01 윤종용 집적회로용 인덕터 및 그 제조방법
CA2279297A1 (fr) * 1997-02-03 1998-08-06 University Of Utah Research Foundation Elements inductifs integres sans trous d'interconnexions pour des applications electromagnetiques
DE69737411T2 (de) * 1997-02-28 2007-10-31 Telefonaktiebolaget Lm Ericsson (Publ) Verbesserter q-Induktor mit mehreren Metallisierungsschichten
KR100233237B1 (ko) * 1997-09-10 1999-12-01 정선종 삼차원 코일 구조 미세 인덕터 및 그 형성 방법
US6013939A (en) * 1997-10-31 2000-01-11 National Scientific Corp. Monolithic inductor with magnetic flux lines guided away from substrate
US5959522A (en) * 1998-02-03 1999-09-28 Motorola, Inc. Integrated electromagnetic device and method
US6060759A (en) * 1998-03-06 2000-05-09 International Business Machines Corporation Method and apparatus for creating improved inductors for use with electronic oscillators
US7107666B2 (en) * 1998-07-23 2006-09-19 Bh Electronics Method of manufacturing an ultra-miniature magnetic device
KR100530871B1 (ko) * 1998-08-14 2006-06-16 이해영 본딩와이어인덕터와그것을이용한본딩와이어인덕터배열구조,칩인덕터,커플러및변압기
JP2002525869A (ja) 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 磁気コアを有するコイルが設けられている表面を有する半導体基体を備えた半導体デバイスの製造方法
US6194774B1 (en) * 1999-03-10 2001-02-27 Samsung Electronics Co., Ltd. Inductor including bonding wires
US6498557B2 (en) * 1999-05-28 2002-12-24 Honeywell International Inc. Three-dimensional micro-coils in planar substrates
US6445271B1 (en) * 1999-05-28 2002-09-03 Honeywell International Inc. Three-dimensional micro-coils in planar substrates
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
DE19945855A1 (de) * 1999-09-24 2001-03-29 Bosch Gmbh Robert Mikrospule
DE19956555A1 (de) * 1999-11-24 2001-06-21 Thomson Brandt Gmbh Hochfrequenzspule sowie diesbezüglicher Transformator
US6480086B1 (en) * 1999-12-20 2002-11-12 Advanced Micro Devices, Inc. Inductor and transformer formed with multi-layer coil turns fabricated on an integrated circuit substrate
US6329892B1 (en) * 2000-01-20 2001-12-11 Credence Systems Corporation Low profile, current-driven relay for integrated circuit tester
DE10002377A1 (de) * 2000-01-20 2001-08-02 Infineon Technologies Ag Spule und Spulensystem zur Integration in eine mikroelektronische Schaltung sowie mikroelektronische Schaltung
US6535098B1 (en) * 2000-03-06 2003-03-18 Chartered Semiconductor Manufacturing Ltd. Integrated helix coil inductor on silicon
US6819527B1 (en) * 2000-03-23 2004-11-16 Hitachi Global Storage Technologies, Inc. Magnetic head with lower coil traces connected to integrally formed vertical interconnects and upper coil traces through plural insulating layer arrangement
US6586309B1 (en) * 2000-04-24 2003-07-01 Chartered Semiconductor Manufacturing Ltd. High performance RF inductors and transformers using bonding technique
DE20017549U1 (de) * 2000-05-31 2001-01-04 Siemens Ag Transformator oder Drossel
US6639298B2 (en) * 2001-06-28 2003-10-28 Agere Systems Inc. Multi-layer inductor formed in a semiconductor substrate
US6512285B1 (en) * 2001-10-05 2003-01-28 Skyworks Solutions, Inc. High inductance inductor in a semiconductor package
US8749054B2 (en) 2010-06-24 2014-06-10 L. Pierre de Rochemont Semiconductor carrier with vertical power FET module
KR100432662B1 (ko) * 2002-03-09 2004-05-22 삼성전기주식회사 인쇄회로기판 기술을 이용한 미약자계 감지용 센서 및 그제조방법
KR100432661B1 (ko) * 2002-03-09 2004-05-22 삼성전기주식회사 인쇄회로기판 기술을 이용한 미약자계 감지용 센서 및 그제조방법
JP4010920B2 (ja) * 2002-09-30 2007-11-21 Ｔｄｋ株式会社 インダクティブ素子の製造方法
US6987645B2 (en) * 2003-04-01 2006-01-17 Sae Magnetics (H.K.) Ltd. Thin-film magnetic head and method of manufacturing same, and thin-film magnetic head substructure
JP3983199B2 (ja) * 2003-05-26 2007-09-26 沖電気工業株式会社 半導体装置及びその製造方法
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
KR20060108633A (ko) * 2003-10-16 2006-10-18 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 코일, 집적 회로, 전자 장치 및 2차원 안테나
US6998952B2 (en) * 2003-12-05 2006-02-14 Freescale Semiconductor, Inc. Inductive device including bond wires
US6931712B2 (en) * 2004-01-14 2005-08-23 International Business Machines Corporation Method of forming a dielectric substrate having a multiturn inductor
US7262680B2 (en) * 2004-02-27 2007-08-28 Illinois Institute Of Technology Compact inductor with stacked via magnetic cores for integrated circuits
US7196607B2 (en) * 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
US7229908B1 (en) * 2004-06-04 2007-06-12 National Semiconductor Corporation System and method for manufacturing an out of plane integrated circuit inductor
JP4843611B2 (ja) * 2004-10-01 2011-12-21 デ，ロシェモント，エル．，ピエール セラミックアンテナモジュール及びその製造方法
DE102005026410B4 (de) * 2005-06-08 2007-06-21 Vacuumschmelze Gmbh & Co. Kg Anordnung mit einem induktiven Bauelement
US8350657B2 (en) * 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
JP4945561B2 (ja) 2005-06-30 2012-06-06 デ，ロシェモント，エル．，ピエール 電気コンポーネントおよびその製造方法
JP4825465B2 (ja) * 2005-07-26 2011-11-30 スミダコーポレーション株式会社 磁気素子
US7511356B2 (en) * 2005-08-31 2009-03-31 Micron Technology, Inc. Voltage-controlled semiconductor inductor and method
US8354294B2 (en) * 2006-01-24 2013-01-15 De Rochemont L Pierre Liquid chemical deposition apparatus and process and products therefrom
US20070188920A1 (en) * 2006-02-16 2007-08-16 Samsung Electronics Co., Ltd. Microinductor and fabrication method thereof
US7875955B1 (en) 2006-03-09 2011-01-25 National Semiconductor Corporation On-chip power inductor
US7367113B2 (en) * 2006-04-06 2008-05-06 United Microelectronics Corp. Method for fabricating a transformer integrated with a semiconductor structure
US7340825B2 (en) * 2006-07-06 2008-03-11 Harris Corporation Method of making a transformer
US7449987B2 (en) * 2006-07-06 2008-11-11 Harris Corporation Transformer and associated method of making
US7524731B2 (en) * 2006-09-29 2009-04-28 Freescale Semiconductor, Inc. Process of forming an electronic device including an inductor
WO2008060551A2 (fr) 2006-11-14 2008-05-22 Pulse Engineering, Inc. Dispositifs d'induction sans fil et procédés correspondants
US20090085704A1 (en) * 2007-10-01 2009-04-02 Infineon Technologies Austria Ag Chip inductor
US7868431B2 (en) * 2007-11-23 2011-01-11 Alpha And Omega Semiconductor Incorporated Compact power semiconductor package and method with stacked inductor and integrated circuit die
US7884696B2 (en) * 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Lead frame-based discrete power inductor
US7884452B2 (en) 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Semiconductor power device package having a lead frame-based integrated inductor
US8217748B2 (en) * 2007-11-23 2012-07-10 Alpha & Omega Semiconductor Inc. Compact inductive power electronics package
CN101552093B (zh) * 2008-01-25 2012-01-04 万国半导体股份有限公司 基于引线框架的分立功率电感
US7982572B2 (en) 2008-07-17 2011-07-19 Pulse Engineering, Inc. Substrate inductive devices and methods
US7959598B2 (en) 2008-08-20 2011-06-14 Asante Solutions, Inc. Infusion pump systems and methods
US7786839B2 (en) * 2008-12-28 2010-08-31 Pratt & Whitney Rocketdyne, Inc. Passive electrical components with inorganic dielectric coating layer
US8952858B2 (en) 2009-06-17 2015-02-10 L. Pierre de Rochemont Frequency-selective dipole antennas
US8922347B1 (en) 2009-06-17 2014-12-30 L. Pierre de Rochemont R.F. energy collection circuit for wireless devices
US9664711B2 (en) 2009-07-31 2017-05-30 Pulse Electronics, Inc. Current sensing devices and methods
US9823274B2 (en) 2009-07-31 2017-11-21 Pulse Electronics, Inc. Current sensing inductive devices
CN101998756A (zh) * 2009-08-11 2011-03-30 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8552708B2 (en) 2010-06-02 2013-10-08 L. Pierre de Rochemont Monolithic DC/DC power management module with surface FET
US9023493B2 (en) 2010-07-13 2015-05-05 L. Pierre de Rochemont Chemically complex ablative max-phase material and method of manufacture
CN103180955B (zh) 2010-08-23 2018-10-16 L·皮尔·德罗什蒙 具有谐振晶体管栅极的功率场效应晶体管
US8591262B2 (en) 2010-09-03 2013-11-26 Pulse Electronics, Inc. Substrate inductive devices and methods
EP2636069B1 (fr) 2010-11-03 2021-07-07 L. Pierre De Rochemont Porte-puces à semi-conducteurs présentant des dispositifs à points quantiques intégrés de manière monolithique, et leur procédé de fabrication
US9559053B2 (en) * 2011-04-21 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Compact vertical inductors extending in vertical planes
US20130027170A1 (en) * 2011-06-30 2013-01-31 Analog Devices, Inc. Isolated power converter with magnetics on chip
WO2013026056A1 (fr) * 2011-08-18 2013-02-21 Northeastern University Inducteurs magnétoélectriques accordables électrostatiquement à large gamme d'inductance accordable
US9006862B2 (en) 2011-09-09 2015-04-14 Stmicroelectronics S.R.L. Electronic semiconductor device with integrated inductor, and manufacturing method
JP5815353B2 (ja) * 2011-09-28 2015-11-17 株式会社フジクラ コイル配線素子およびコイル配線素子の製造方法
US9105627B2 (en) * 2011-11-04 2015-08-11 International Business Machines Corporation Coil inductor for on-chip or on-chip stack
KR101827047B1 (ko) 2012-03-02 2018-02-07 펄스 일렉트로닉스, 인크. 피착 안테나 장치 및 방법
US9304149B2 (en) 2012-05-31 2016-04-05 Pulse Electronics, Inc. Current sensing devices and methods
US10893609B2 (en) 2012-09-11 2021-01-12 Ferric Inc. Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy
US11064610B2 (en) 2012-09-11 2021-07-13 Ferric Inc. Laminated magnetic core inductor with insulating and interface layers
US11116081B2 (en) 2012-09-11 2021-09-07 Ferric Inc. Laminated magnetic core inductor with magnetic flux closure path parallel to easy axes of magnetization of magnetic layers
US9844141B2 (en) 2012-09-11 2017-12-12 Ferric, Inc. Magnetic core inductor integrated with multilevel wiring network
US11058001B2 (en) 2012-09-11 2021-07-06 Ferric Inc. Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer
US11197374B2 (en) 2012-09-11 2021-12-07 Ferric Inc. Integrated switched inductor power converter having first and second powertrain phases
US10244633B2 (en) 2012-09-11 2019-03-26 Ferric Inc. Integrated switched inductor power converter
US20140125446A1 (en) 2012-11-07 2014-05-08 Pulse Electronics, Inc. Substrate inductive device methods and apparatus
US9871448B2 (en) 2012-12-31 2018-01-16 Nvidia Corporation Super N-phase switching mode power supply
US9337251B2 (en) * 2013-01-22 2016-05-10 Ferric, Inc. Integrated magnetic core inductors with interleaved windings
DE102013013464B4 (de) 2013-08-14 2021-06-24 Gottfried Wilhelm Leibniz Universität Hannover Elektronisches Bauteil
US9831198B2 (en) * 2013-08-22 2017-11-28 Nvidia Corporation Inductors for integrated voltage regulators
US9306776B2 (en) 2013-09-10 2016-04-05 Nvidia Corporation Filtering high speed signals
US10020561B2 (en) 2013-09-19 2018-07-10 Pulse Finland Oy Deposited three-dimensional antenna apparatus and methods
US20150108969A1 (en) * 2013-10-22 2015-04-23 Texas Instruments Incorporated On-Chip Linear Variable Differential Transformer
US9355956B2 (en) * 2013-11-01 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Inductor for semiconductor integrated circuit
US9647053B2 (en) 2013-12-16 2017-05-09 Ferric Inc. Systems and methods for integrated multi-layer magnetic films
US10251280B2 (en) 2013-12-31 2019-04-02 Texas Instruments Incorporated Integrated circuit with micro inductor and micro transformer with magnetic core
CN106463828B (zh) 2014-02-12 2021-04-06 脉冲芬兰有限公司 用于导电元件沉积和形成的方法和设备
US9991040B2 (en) 2014-06-23 2018-06-05 Ferric, Inc. Apparatus and methods for magnetic core inductors with biased permeability
US11302469B2 (en) 2014-06-23 2022-04-12 Ferric Inc. Method for fabricating inductors with deposition-induced magnetically-anisotropic cores
US10629357B2 (en) 2014-06-23 2020-04-21 Ferric Inc. Apparatus and methods for magnetic core inductors with biased permeability
DE202014005370U1 (de) * 2014-06-27 2014-07-14 Würth Elektronik eiSos Gmbh & Co. KG Induktives Bauteil
US9833802B2 (en) 2014-06-27 2017-12-05 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
EP3374905A1 (fr) 2016-01-13 2018-09-19 Bigfoot Biomedical, Inc. Interface utilisateur pour système de gestion du diabète
EP3374004B1 (fr) 2016-01-14 2023-06-28 Bigfoot Biomedical, Inc. Ajustement des débits d'administration d'insuline
US10354950B2 (en) 2016-02-25 2019-07-16 Ferric Inc. Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
US20170365395A1 (en) * 2016-06-17 2017-12-21 Dyi-chung Hu 3d spiral inductor
US11033682B2 (en) 2017-01-13 2021-06-15 Bigfoot Biomedical, Inc. Insulin delivery methods, systems and devices
USD874471S1 (en) 2017-06-08 2020-02-04 Insulet Corporation Display screen with a graphical user interface
USD928199S1 (en) 2018-04-02 2021-08-17 Bigfoot Biomedical, Inc. Medication delivery device with icons
USD920343S1 (en) 2019-01-09 2021-05-25 Bigfoot Biomedical, Inc. Display screen or portion thereof with graphical user interface associated with insulin delivery
US11018065B2 (en) 2019-08-22 2021-05-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure with magnetic element in testing region
USD977502S1 (en) 2020-06-09 2023-02-07 Insulet Corporation Display screen with graphical user interface

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305814A (en) * 1967-02-21 Hybrid solid state device
FR1476476A (fr) * 1966-04-20 1967-04-07 Xerox Corp éléments inductifs à pellicule mince
FR1524322A (fr) * 1967-03-30 1968-05-10 Radiotechnique Coprim Rtc Procédé de fabrication d'inductance, notamment pour circuits intégrés, et inductance obtenue

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3454945A (en) * 1964-09-18 1969-07-08 Texas Instruments Inc Modular integrated electronics radar
US3359467A (en) * 1965-02-04 1967-12-19 Texas Instruments Inc Resistors for integrated circuits
US3413716A (en) * 1965-04-30 1968-12-03 Xerox Corp Thin-film inductor elements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305814A (en) * 1967-02-21 Hybrid solid state device
FR1476476A (fr) * 1966-04-20 1967-04-07 Xerox Corp éléments inductifs à pellicule mince
FR1524322A (fr) * 1967-03-30 1968-05-10 Radiotechnique Coprim Rtc Procédé de fabrication d'inductance, notamment pour circuits intégrés, et inductance obtenue

Also Published As

Publication number Publication date
DE1952160A1 (de) 1970-05-27
US3614554A (en) 1971-10-19
NL6915363A (fr) 1970-04-28
GB1279160A (en) 1972-06-28
FR2021494B1 (fr) 1973-04-06
CA925221A (en) 1973-04-24

Similar Documents

Publication Publication Date Title
FR2021494B1 (fr)
AU1946070A (fr)
AU428130B2 (fr)
AU2374870A (fr)
AU5184069A (fr)
AU6168869A (fr)
AU6171569A (fr)
AU416157B2 (fr)
AU429879B2 (fr)
AU2581067A (fr)
AU4811568A (fr)
AU421558B1 (fr)
AU2580267A (fr)
AU3789668A (fr)
AR203075Q (fr)
AU3224368A (fr)
AU4224469A (fr)
AU5758767A (fr)
AU3083868A (fr)
AU2889368A (fr)
AU4270368A (fr)
BE630165A (fr)
BE728545A (fr)
BE642636A (fr)
BE581157A (fr)

Legal Events

Date Code Title Description
ST Notification of lapse