CA2279297A1 - Elements inductifs integres sans trous d'interconnexions pour des applications electromagnetiques - Google Patents
Elements inductifs integres sans trous d'interconnexions pour des applications electromagnetiques Download PDFInfo
- Publication number
- CA2279297A1 CA2279297A1 CA002279297A CA2279297A CA2279297A1 CA 2279297 A1 CA2279297 A1 CA 2279297A1 CA 002279297 A CA002279297 A CA 002279297A CA 2279297 A CA2279297 A CA 2279297A CA 2279297 A1 CA2279297 A1 CA 2279297A1
- Authority
- CA
- Canada
- Prior art keywords
- conductor elements
- layer
- magnetic core
- spaced conductor
- isolation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000001939 inductive effect Effects 0.000 title description 13
- 239000004020 conductor Substances 0.000 claims abstract description 71
- 238000002955 isolation Methods 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000005516 engineering process Methods 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 7
- 230000010354 integration Effects 0.000 claims abstract description 6
- 238000005459 micromachining Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 18
- 229920002120 photoresistant polymer Polymers 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000011162 core material Substances 0.000 abstract description 32
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 16
- 238000000059 patterning Methods 0.000 abstract description 6
- 238000004377 microelectronic Methods 0.000 abstract description 5
- 230000008021 deposition Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Burglar Alarm Systems (AREA)
Abstract
La présente invention a trait à un inducteur que l'on peut intégrer dans des circuits et des dispositifs VLSI. Cet inducteur est fabriqué selon un procédé postfonderie de dépôt et de formation de couches de matériau conducteur (32), de matériau isolant (34), de matériau noyau (50), de matériau isolant (52) et de matériau conducteur (54) de façon à produire des bobines conductrices (60, 62) enveloppées autour d'un noyau magnétique, sans qu'il y ait besoin de trous d'interconnexions. Les étapes de fabrication combinent les techniques du microusinage et de la microéléctronique.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79433897A | 1997-02-03 | 1997-02-03 | |
| US08/794,338 | 1997-02-03 | ||
| PCT/US1998/001879 WO1998034287A1 (fr) | 1997-02-03 | 1998-01-30 | Elements inductifs integres sans trous d'interconnexions pour des applications electromagnetiques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2279297A1 true CA2279297A1 (fr) | 1998-08-06 |
Family
ID=25162366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002279297A Abandoned CA2279297A1 (fr) | 1997-02-03 | 1998-01-30 | Elements inductifs integres sans trous d'interconnexions pour des applications electromagnetiques |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1000442A4 (fr) |
| JP (1) | JP2002513511A (fr) |
| KR (1) | KR20000070732A (fr) |
| AU (1) | AU6052498A (fr) |
| CA (1) | CA2279297A1 (fr) |
| TW (1) | TW362287B (fr) |
| WO (1) | WO1998034287A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108426380A (zh) * | 2018-03-13 | 2018-08-21 | 桑夏太阳能股份有限公司 | 一种新型太阳能光伏光热复合集热器 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007072375A2 (fr) * | 2005-12-22 | 2007-06-28 | Koninklijke Philips Electronics N.V. | Procede de fabrication d'un composant microelectronique, au moins un enroulement electriquement conducteur etant dispose autour d'un element de noyau en ferrite |
| WO2019220862A1 (fr) * | 2018-05-18 | 2019-11-21 | 株式会社村田製作所 | Inducteur et son procédé de production |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614554A (en) * | 1968-10-24 | 1971-10-19 | Texas Instruments Inc | Miniaturized thin film inductors for use in integrated circuits |
| US3881244A (en) * | 1972-06-02 | 1975-05-06 | Texas Instruments Inc | Method of making a solid state inductor |
| US3858138A (en) * | 1973-03-05 | 1974-12-31 | Rca Corp | Tuneable thin film inductor |
| US4082916A (en) * | 1976-12-16 | 1978-04-04 | Westinghouse Electric Corporation | Encapsulated electrical inductive apparatus |
| US4600911A (en) * | 1984-03-20 | 1986-07-15 | Pauwels-Trafo Belgium N.V. | Elliptically shaped magnetic core |
| US4848684A (en) * | 1986-11-22 | 1989-07-18 | Kitamura Kiden Co., Ltd. | Wound core having circular and elliptic outer surface portions |
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| JPH05166623A (ja) * | 1991-12-12 | 1993-07-02 | Matsushita Electric Ind Co Ltd | 小形固定コイル |
| US5279988A (en) * | 1992-03-31 | 1994-01-18 | Irfan Saadat | Process for making microcomponents integrated circuits |
-
1998
- 1998-01-30 CA CA002279297A patent/CA2279297A1/fr not_active Abandoned
- 1998-01-30 JP JP53314298A patent/JP2002513511A/ja active Pending
- 1998-01-30 KR KR1019997006982A patent/KR20000070732A/ko not_active Application Discontinuation
- 1998-01-30 EP EP98903872A patent/EP1000442A4/fr not_active Withdrawn
- 1998-01-30 WO PCT/US1998/001879 patent/WO1998034287A1/fr not_active Application Discontinuation
- 1998-01-30 AU AU60524/98A patent/AU6052498A/en not_active Abandoned
- 1998-02-03 TW TW087101261A patent/TW362287B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108426380A (zh) * | 2018-03-13 | 2018-08-21 | 桑夏太阳能股份有限公司 | 一种新型太阳能光伏光热复合集热器 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW362287B (en) | 1999-06-21 |
| KR20000070732A (ko) | 2000-11-25 |
| EP1000442A1 (fr) | 2000-05-17 |
| AU6052498A (en) | 1998-08-25 |
| WO1998034287A1 (fr) | 1998-08-06 |
| JP2002513511A (ja) | 2002-05-08 |
| EP1000442A4 (fr) | 2000-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued | ||
| FZDE | Discontinued |
Effective date: 20020130 |
|
| FZDE | Discontinued |
Effective date: 20020130 |