JP2002513511A - 電磁気応用のためのヴァイアの無い集積誘導性素子 - Google Patents
電磁気応用のためのヴァイアの無い集積誘導性素子Info
- Publication number
- JP2002513511A JP2002513511A JP53314298A JP53314298A JP2002513511A JP 2002513511 A JP2002513511 A JP 2002513511A JP 53314298 A JP53314298 A JP 53314298A JP 53314298 A JP53314298 A JP 53314298A JP 2002513511 A JP2002513511 A JP 2002513511A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- spaced
- magnetic core
- inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001939 inductive effect Effects 0.000 title description 13
- 239000004020 conductor Substances 0.000 claims abstract description 59
- 238000002955 isolation Methods 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims 16
- 239000011162 core material Substances 0.000 abstract description 32
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000004377 microelectronic Methods 0.000 abstract description 5
- 238000000059 patterning Methods 0.000 abstract description 5
- 238000005459 micromachining Methods 0.000 abstract description 3
- 238000005266 casting Methods 0.000 abstract description 2
- 230000008021 deposition Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Burglar Alarm Systems (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79433897A | 1997-02-03 | 1997-02-03 | |
| US08/794,338 | 1997-02-03 | ||
| PCT/US1998/001879 WO1998034287A1 (fr) | 1997-02-03 | 1998-01-30 | Elements inductifs integres sans trous d'interconnexions pour des applications electromagnetiques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002513511A true JP2002513511A (ja) | 2002-05-08 |
Family
ID=25162366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53314298A Pending JP2002513511A (ja) | 1997-02-03 | 1998-01-30 | 電磁気応用のためのヴァイアの無い集積誘導性素子 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1000442A4 (fr) |
| JP (1) | JP2002513511A (fr) |
| KR (1) | KR20000070732A (fr) |
| AU (1) | AU6052498A (fr) |
| CA (1) | CA2279297A1 (fr) |
| TW (1) | TW362287B (fr) |
| WO (1) | WO1998034287A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019220862A1 (fr) * | 2018-05-18 | 2019-11-21 | 株式会社村田製作所 | Inducteur et son procédé de production |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007072375A2 (fr) * | 2005-12-22 | 2007-06-28 | Koninklijke Philips Electronics N.V. | Procede de fabrication d'un composant microelectronique, au moins un enroulement electriquement conducteur etant dispose autour d'un element de noyau en ferrite |
| CN108426380A (zh) * | 2018-03-13 | 2018-08-21 | 桑夏太阳能股份有限公司 | 一种新型太阳能光伏光热复合集热器 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614554A (en) * | 1968-10-24 | 1971-10-19 | Texas Instruments Inc | Miniaturized thin film inductors for use in integrated circuits |
| US3881244A (en) * | 1972-06-02 | 1975-05-06 | Texas Instruments Inc | Method of making a solid state inductor |
| US3858138A (en) * | 1973-03-05 | 1974-12-31 | Rca Corp | Tuneable thin film inductor |
| US4082916A (en) * | 1976-12-16 | 1978-04-04 | Westinghouse Electric Corporation | Encapsulated electrical inductive apparatus |
| US4600911A (en) * | 1984-03-20 | 1986-07-15 | Pauwels-Trafo Belgium N.V. | Elliptically shaped magnetic core |
| US4848684A (en) * | 1986-11-22 | 1989-07-18 | Kitamura Kiden Co., Ltd. | Wound core having circular and elliptic outer surface portions |
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| JPH05166623A (ja) * | 1991-12-12 | 1993-07-02 | Matsushita Electric Ind Co Ltd | 小形固定コイル |
| US5279988A (en) * | 1992-03-31 | 1994-01-18 | Irfan Saadat | Process for making microcomponents integrated circuits |
-
1998
- 1998-01-30 CA CA002279297A patent/CA2279297A1/fr not_active Abandoned
- 1998-01-30 EP EP98903872A patent/EP1000442A4/fr not_active Withdrawn
- 1998-01-30 WO PCT/US1998/001879 patent/WO1998034287A1/fr not_active Application Discontinuation
- 1998-01-30 JP JP53314298A patent/JP2002513511A/ja active Pending
- 1998-01-30 KR KR1019997006982A patent/KR20000070732A/ko not_active Application Discontinuation
- 1998-01-30 AU AU60524/98A patent/AU6052498A/en not_active Abandoned
- 1998-02-03 TW TW087101261A patent/TW362287B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019220862A1 (fr) * | 2018-05-18 | 2019-11-21 | 株式会社村田製作所 | Inducteur et son procédé de production |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000070732A (ko) | 2000-11-25 |
| CA2279297A1 (fr) | 1998-08-06 |
| EP1000442A1 (fr) | 2000-05-17 |
| AU6052498A (en) | 1998-08-25 |
| TW362287B (en) | 1999-06-21 |
| EP1000442A4 (fr) | 2000-05-17 |
| WO1998034287A1 (fr) | 1998-08-06 |
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