AU6052498A - Vialess integrated inductive elements for electromagnetic applications - Google Patents
Vialess integrated inductive elements for electromagnetic applicationsInfo
- Publication number
- AU6052498A AU6052498A AU60524/98A AU6052498A AU6052498A AU 6052498 A AU6052498 A AU 6052498A AU 60524/98 A AU60524/98 A AU 60524/98A AU 6052498 A AU6052498 A AU 6052498A AU 6052498 A AU6052498 A AU 6052498A
- Authority
- AU
- Australia
- Prior art keywords
- conductor elements
- layer
- spaced conductor
- magnetic core
- isolation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000001939 inductive effect Effects 0.000 title description 13
- 239000004020 conductor Substances 0.000 claims description 69
- 238000002955 isolation Methods 0.000 claims description 51
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 238000005516 engineering process Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 230000010354 integration Effects 0.000 claims description 5
- 238000005459 micromachining Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000011162 core material Substances 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 7
- 238000000059 patterning Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Burglar Alarm Systems (AREA)
Description
VIALESS INTEGRATED INDUCTIVE ELEMENTS FOR ELECTRO MAGNETIC APPLICATIONS
BACKGROUND OF THE INVENTION
Technical Field: This invention relates to microelectronics. It is specifically directed to inductive devices which are batch fabricated by the application of micromachining technology.
State of the Art: Devices of various types have been batch fabricated using integrated circuit processing technology. Certain passive devices, notably resistors and capacitors, have been successfully incorporated in standard "very large scale integration" (VLSI) circuit design, and are routinely batch fabricated in accordance with conventional integrated circuit technology. The techniques developed for integrating other passive devices are inappropriate for the fabrication of inductors, however. The fabrication of the coils needed for inductors represents a special technical problem. Moreover, the microelectronic batch processes needed for obtaining a low reluctance magnetic core are undeveloped.
Inductors having a maximum linear turns density of approximately 15 turns/mm have been fabricated for high flux applications. Vias have been provided through plasma etching procedures, and conductors have been provided by electroplating. Inductors have also been fabricated by means of thick film technology. These previous efforts are disclosed in the literature, for example, by the papers: CH. Ahn, "Micromachined Components As Integrated Inductors and Magnetic Microactuators " , Ph.D. Dissertation, Georgia Institute of Technology, May, 1993, Chapter 2; B. Lochel, A. Maciossek, M. Rothe, and W. Windbracke,
"Micro Coils Fabricated By UV Depth Lithography and Galvanoplating", Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, pp. 264-267; N. Yamada, Y. Yokoyama, and H. Tanaka, "Fabrication of Wrapped Micro Coils Wound Around A Magnetic Core" , Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, pp. 272-275; Y. Watanabe, M. Edo, H. Nakazawa, and E. Yonezawa, "A New Fabrication Process of a Planar Coil Using Photosensitive Polyimide and
Electroplating", Proceedings of the 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, pp. 268-271.
U.S. Patent 3,614,554 discloses the fabrication of inductor coils with feed through holes (vias) through the use of thin film technology. The metallic layers deposited by this means are necessarily of very thin cross section, and thus the current carrying coils are characterized by high resistance, while the magnetic cores are characterized by high reluctance. The presence of vias contributes to both conductor resistance per turn and power loss. There remains a need for a process for the batch fabrication of inductors which is compatible with integrated circuit processing technology and which minimizes the number of additional processing steps necessary to integrate the inductor into a circuit or micro system. Ideally, the inductors resulting from this process should be capable of producing a relatively large electromotive force. Such a device would find application in various sensing applications.
DISCLOSURE OF THE INVENTION This invention provides a novel inductive element, which may be constructed through batch fabrication techniques. A typical fabrication process for realization of the inductor utilizes standard microelectronics materials and equipment. The inductor may be fabricated by means of a post process utilizing micromachining technologies, rather than the thin film technologies conventional to integrated circuit fabrication. Presently preferred fabrication procedures utilize relatively few, typically four, masks, and are completely compatible with, although distinguishable from, current integrated circuit fabrication technology.
The manufacturing process used to realize the integrated inductive components of the invention can be implemented to enhance or supplement foundry produced integrated circuits. The process requires no high temperature processing steps or specialized equipment or materials. The inductor of this invention is generic in character; variations on the manufacturing procedure in accordance with specific design requirements produce a corresponding variety of integrated magnetic components.
Generally, a planar substrate element serves as the structural base for the magnetic component of this invention. The substrate element may comprise any of the materials commonly used for that purpose by the microelectronic industry, including without limitation, silicon, gallium arsenide, indium phosphide, and ceramics. The substrate element may contain integrated circuit elements of systems with which a component fashioned in accordance with this invention is to be integrated.
In normal practice, an insulating layer is deposited on the substrate, and is patterned to open contact pads for connection from the magnetic component to any underlying circuitry. A first (bottom) conductor is deposited and patterned in accordance with conventional photolithographic techniques. The conductor may comprise any or a combination of conductive materials, typically low resistance metals. These metals may be deposited by means of sputtering, electron beam evaporation, filament evaporation, electro-deposition or other suitable techniques. After patterning of the bottom conductor, an insulating layer (typically between about lμm to about 10μm thick) is deposited and patterned over the bottom conductors for isolation between the coil element and the magnetic core element(s). Conventional polymeric insulating materials, including polyimide and photoresist, are suitable for this layer. After patterning of the bottom isolation layer, a metallic seed layer (typically copper or gold) is deposited and patterned. The magnetic core is then deposited atop a patterned portion of the seed layer. This procedure may be accomplished by means of micro molding technology. The avoidance of sharp corners is desirable to reduce flux build-up (and saturation) at bends in the magnetic core of the devices. In general, any magnetic material that can be electroplated is a viable candidate for use in an inductor. The core material selected for any specific device depends upon the characteristics of interest (e.g. high permeability, low losses at high frequencies). The thickness of the electroplated metal is typically 1 μm to 50 μm.
After electro-deposition of the core material, another coat of insulating material (usually within the range of about lμm to about 10μm thick) is typically deposited and patterned over the core. This procedure is followed by deposition and patterning of a second (top) conductor. The same materials are generally, but not
necessarily, used for the top insulator and conductor as for the bottom insulator and conductor, respectively.
The entire structure may be encapsulated for protection from moisture. For this step, a moisture resistant material is required. Bio compatible encapsulation may be required to render the inductors suitable for use in conductive body fluids, for example. Polyimide and parylene are examples of suitable encapsulating materials for most applications.
There are many practical applications in which an integrated inductive component of this invention offers size and cost reduction over currently available macroscopic counterparts. The inductive elements of preferred embodiments provide a low reluctance core. In any case, inductors of this invention may be incorporated in a variety of practical devices, notably, integrated inductors, integrated transformers, position sensors, telemetry systems and micromotors.
According to a preferred configuration, bar -type inductive elements are fashioned with metallic (ideally an electric grade aluminum alloy) conductors wrapped around a permalloy magnetic core. Connection between the upper and lower conductors of the device requires no vias. Therefore, losses due to series resistance through the wrapped conductor are minimized, and the heat generated by relatively large currents is also minimized. When an inductive component of this invention is used in a high frequency transformer application, the mutual flux produced by the primary (excitation) side should be maximized correspondingly to maximize the magnetization inductance of the transformer. With the magnetization inductance maximized, the behavior of the transformer more closely approximates that of an ideal transformer at high frequencies. The device may be embodied as an isolation transformer for use in communication applications. Typically, these applications require transmission of high frequency signals in the megahertz range, currents in the milliampere range and voltages less than 20 volts. Other devices capable of operating at much higher (100's of) volts are within contemplation. In general, an inductor capable of integration into solid state integrated circuits may be fabricated in accordance with this invention by first selecting an appropriate substrate from those otherwise useful in the fabrication of integrated
circuits (an "integrated circuit component substrate".) A first conductive layer is then deposited atop the substrate, the first conductive layer being patterned to provide a first set of spaced conductor elements. A first isolation layer is then deposited atop the first conductive layer, the first isolation layer being patterned to expose opposite ends of individual conductors of the first set of spaced conductor elements. A magnetic core element may then be deposited atop the first isolation layer within the boundaries of the first set of spaced conductor elements. A second isolation layer is deposited atop the magnetic core element, the second isolation layer being patterned to expose the opposite ends of individual conductors of the first set of spaced conductor elements. A second conductive layer is then deposited atop the second isolation layer in contact with the opposite ends of the first set of spaced conductors, the second conductive layer being patterned to provide a second set of spaced conductor elements. The conductors of the first and second sets of spaced conductor elements are inherently interconnected (as a consequence of patterning) to form primary and secondary coils around the core element. A moisture barrier coating may be applied to surround an entire assembly comprising the first conductive layer, the first isolation layer, the core, the second isolation layer and the second conductive layer.
Significantly, the magnetic core is most practically fabricated through micromachining technology, including the steps of depositing a metallic seed layer atop the first isolation layer, depositing a layer of photoresist over the seed layer, etching the photoresist to create a mold, the bottom of which is composed of the seed layer, electroplating the core within the mold atop the seed layer, and removing the excess portion of the photoresist layer and the seed layer. By "excess" is meant all of the seed layer not covered by core material, and all of the photoresist layer not previously etched away during patterning. Ideally, the core is electroplated until it overflows the mold, whereby to achieve a shape characterized by an elliptical cross section. This elliptical section can be established as viewed from any or all coordinate axis directions.
BRIEF DESCRIPTION OF THE DRAWINGS In the drawings, which illustrate what is currently regarded as the best mode for carrying out the invention:
FIGs. 1-4 are schematic illustrations of the steps of a fabrication process of the invention;
FIG. 5 is a perspective view of an inductive component of the invention; FIG. 6 is a sectional view taken along the reference line 6-6 of FIG. 5; FIG. 7 is a perspective view of a magnetic position sensor of the invention; and FIG. 8 is a sectional view taken along the reference line 8-8 of FIG. 7.
BEST MODES FOR CARRYING OUT THE INVENTION
A vialess inductive component, designated generally 26 (FIG. 4), is fabricated atop a suitable substrate 30. A first conductive layer 32 is deposited on the substrate 30. (Although not shown, an isolation layer is often interposed between the substrate 30 and the first conductive layer.) A first isolation layer 34 is deposited atop the first conductive layer, leaving end portions 36, 38 exposed. A 0.1 μm thick layer of copper metal is deposited over the first isolation layer 34 to function as an electroplating seed layer 39. A 0.5 μm photoresist layer 40 is deposited over the seed layer and terminal ends (FIG. 2), leaving an open portion (mold) 42 of the photoresist layer 40 to expose the electroplating seed layer 39. A low reluctance magnetic core 50 is electroplated atop the isolation layer (FIG. 3). The photoresist 40 and seed 39 layers are then removed.
As best shown by FIG. 3, the magnetic core 50 material is allowed to "overplate" out of the mold 42. This overplating allows for an elliptical cross-section, which is useful for obtaining coverage over the magnetic core 50 in subsequent steps. Moreover, overplating eliminates sharp corners in the magnetic core material.
As best shown by FIG. 4, a second isolation layer 52 is deposited over the core 50, followed by the deposition of a second conductive layer 54. The entire assembly can then be encapsulated with suitable protective material 56.
Referring to FIGs. 5 and 6, the basic inductive device is shown embodied as a transformer. The conductive layers 32, 54 are of aluminum and are patterned cooperatively as primary 60 and secondary 62 coils, characterized by high turns density. The isolation layers 34, 52 are of polyimide insulation material. The performance of a 1 : 1 transformer of similar construction has been characterized. The efficiency of the device tested was approximately 85 % . This efficiency can be increased by reducing the winding resistance of the current carrying coil. Such a reduction can be effected by either or both increasing the cross-sectional area of the conductor and decreasing the contact resistance between the upper and lower conductors of the device. The device has been operated up to 10 MHz with minimal changes in characteristics due to high frequency losses. This performance is attributable to: 1) the correct choice of magnetic core materials, 2) the large cross sectional area of the core, and 3) the elimination of sharp corners due to the elliptical design of the core. Presently, the maximum turns density of the devices is 100 turns/mm. The resistance of the coils is less than 1.0 ohms per turn at 500 mA of current.
The inductive component 26 may alternatively be embodied as a magnetic position sensor, as illustrated by FIGs. 7 and 8. The structure is similar to that depicted by FIGs. 5 and 6, except that the core 70 is shorter than the tunnel 72 provided by the isolation layers 34, 52. Moreover, the core 70 is reciprocally mounted within the tunnel between blocks 74, 76 of non-magnetic shielding material. Longitudinal movement of the core 70 within the tunnel 72 causes detectable changes in the current and/or voltage detected in the secondary coil 62.
Reference in this disclosure to details of the illustrated and other preferred embodiments is not intended to limit the scope of the appended claims which themselves recite those features regarded as important to the invention. Those skilled in the art will recognize variations and modifications to the specific teachings of this disclosure which are, nevertheless, consistent with its teachings and objectives.
Claims (20)
1. An inductor capable of integration into solid state integrated circuits, comprising: a. a substrate; b. a first conductive layer deposited atop said substrate, said first conductive layer being patterned to provide a first set of spaced conductor elements; c. a first isolation layer deposited atop said first conductive layer, said first isolation layer being patterned to expose opposite ends of individual conductors of said first set of spaced conductor elements; d. A magnetic core element, between about 1 and 50╬╝m in thickness, deposited atop said first isolation layer within boundaries of said first set of spaced conductor elements; e. a second isolation layer deposited atop said magnetic core element, said second isolation layer being patterned to expose said opposite ends of said individual conductors of said first set of spaced conductor elements; and f. a second conductive layer deposited atop said second isolation layer in contact with said opposite ends of said individual conductors of said first set of spaced conductor elements said second conductive layer being patterned to provide a second set of spaced conductor elements, the conductors of said first and second sets of spaced conductor elements being interconnected to form primary and secondary coils around said magnetic core element.
2. An inductor according to Claim 1, further comprising a moisture barrier coating surrounding an assembly comprising said elements a. through f..
3. An inductor according to Claim 1, further including a metallic seed layer between said elements c. and d..
4. An inductor according to Claim 3, wherein said magnetic core element is fabricated through micromachining technology, including the steps of: depositing a layer of photoresist over said seed layer; etching said layer of photoresist to create a mold, a bottom of which is composed of said seed layer; electroplating said magnetic core within said mold atop said seed layer; and removing an excess portion of said photoresist layer and said seed layer.
5. An inductor according to Claim 4, wherein said magnetic core element is electroplated until it overflows said mold, whereby to achieve a shape characterized by an elliptical cross section.
6. An inductor, comprising: a. an integrated circuit component substrate; b. a first conductive layer deposited atop said substrate, said first conductive layer being patterned to provide a first set of spaced conductor elements; c. a first isolation layer deposited atop said first conductive layer, said first isolation layer being patterned to expose opposite ends of individual conductors of said first set of spaced conductor elements; d. A magnetic core element electroplated atop said first isolation layer within boundaries of said first set of spaced conductor elements; e. a second isolation layer deposited atop said magnetic core element, said second isolation layer being patterned to expose said opposite ends of said individual conductors of said first set of spaced conductor elements; and f. a second conductive layer deposited atop said second isolation layer in contact with said opposite ends of said individual conductors of said first set of spaced conductor elements, said second conductive layer being patterned to provide a second set of spaced conductor elements, the conductors of said first and second sets of spaced conductor elements being interconnected to form primary and secondary coils around said magnetic core element.
7. An inductor according to Claim 6, further including a metallic seed layer between said elements c. and d..
8. An inductor according to Claim 7, wherein said magnetic core element is fabricated through micromachining technology, including the steps of: depositing a layer of photoresist over said seed layer; etching said layer of photoresist to create a mold, a bottom of which is composed of said seed layer; electroplating said magnetic core element within said mold atop said seed layer; and removing an excess portion of said photoresist layer and said seed layer.
9. An inductor according to Claim 8, wherein said magnetic core element is electroplated until it overflows said mold, whereby to achieve a shape characterized by an elliptical cross section.
10. An inductor according to Claim 9, further comprising a moisture barrier coating surrounding an assembly comprising said elements a. through f.
11. An inductor capable of integration into solid state integrated circuits, comprising: a. a substrate; b. a first conductive layer deposited atop said substrate, said first conductive layer being patterned to provide a first set of spaced conductor elements; c. a first polymeric isolation layer deposited atop said first conductive layer, said first isolation layer being patterned to expose opposite ends of individual conductors of said first set of spaced conductor elements; d. a magnetic core element greater than 1 ╬╝m in thickness deposited atop said first isolation layer within boundaries defined by said first set of spaced conductor elements; e. a second polymeric isolation layer deposited atop said magnetic core element, said second isolation layer being patterned to expose said opposite ends of said individual conductors of said first set of spaced conductor elements; and f. a second conductive layer deposited atop said second isolation layer in contact with said opposite ends of said individual conductors of said first set of spaced conductor elements, said second conductive layer being patterned to provide a second set of spaced conductor elements, the conductors of said first and second sets of spaced conductor elements being interconnected to form primary and secondary coils around said magnetic core element.
12. An inductor according to Claim 11, wherein said first and second isolation layers are at least about 1 ╬╝m thick.
13. An inductor according to Claim 11 , wherein first and second isolation layers are formed of polymeric photoresist or polyimide material.
14. An inductor according to Claim 11 , wherein said magnetic core element is between about 1 and about 50 ╬╝m in thickness, and said first and second isolation layers are between about 1 and about 10 ╬╝m in thickness.
15. An inductor according to Claim 14, wherein first and second isolation layers are formed of polymeric photoresist or polyimide material.
16. An inductor capable of integration into solid state integrated circuits, comprising: a. a substrate; b. a first conductive layer deposited atop said substrate, said first conductive layer being patterned to provide a first set of spaced conductor elements; c. a first polymeric isolation layer deposited atop said first conductive layer, said first isolation layer being patterned to expose opposite ends of individual conductors of said first set of spaced conductor elements; d. a magnetic core element electroplated atop said first isolation layer within boundaries defined by said first set of spaced conductor elements; e. a second polymeric isolation layer deposited atop said magnetic core element, said second isolation layer being patterned to expose said opposite ends of said individual conductors of said first set of spaced conductor elements; and f. a second conductive layer deposited atop said second isolation layer in contact with said opposite ends of said individual conductors of said first set of spaced conductor elements, said second conductive layer being patterned to provide a second set of spaced conductor elements, the conductors of said first and second sets of spaced conductor elements being interconnected to form primary and secondary coils around said magnetic core element.
17. An inductor according to Claim 16, wherein said first and second isolation layers are at least about 1 ╬╝m thick.
18. An inductor according to Claim 16, wherein first and second isolation layers are formed of polymeric photoresist or polyimide material.
19. An inductor according to Claim 16, wherein said magnetic core element is between about 1 and about 50 ╬╝m in thickness, and said first and second isolation layers are between about 1 and about 10 ╬╝m in thickness.
20. An inductor according to Claim 19, wherein first and second isolation layers are formed of polymeric photoresist or polyimide material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79433897A | 1997-02-03 | 1997-02-03 | |
| US08794338 | 1997-02-03 | ||
| PCT/US1998/001879 WO1998034287A1 (en) | 1997-02-03 | 1998-01-30 | Vialess integrated inductive elements for electromagnetic applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU6052498A true AU6052498A (en) | 1998-08-25 |
Family
ID=25162366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU60524/98A Abandoned AU6052498A (en) | 1997-02-03 | 1998-01-30 | Vialess integrated inductive elements for electromagnetic applications |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1000442A4 (en) |
| JP (1) | JP2002513511A (en) |
| KR (1) | KR20000070732A (en) |
| AU (1) | AU6052498A (en) |
| CA (1) | CA2279297A1 (en) |
| TW (1) | TW362287B (en) |
| WO (1) | WO1998034287A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007072375A2 (en) * | 2005-12-22 | 2007-06-28 | Koninklijke Philips Electronics N.V. | Method for manufacturing a microelectronic device, wherein at least one electrically conductive winding is arranged around a ferrite core element |
| CN108426380A (en) * | 2018-03-13 | 2018-08-21 | 桑夏太阳能股份有限公司 | A kind of solar energy photovoltaic photo-thermal compound heat collector |
| WO2019220862A1 (en) * | 2018-05-18 | 2019-11-21 | 株式会社村田製作所 | Inductor and method for producing same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614554A (en) * | 1968-10-24 | 1971-10-19 | Texas Instruments Inc | Miniaturized thin film inductors for use in integrated circuits |
| US3881244A (en) * | 1972-06-02 | 1975-05-06 | Texas Instruments Inc | Method of making a solid state inductor |
| US3858138A (en) * | 1973-03-05 | 1974-12-31 | Rca Corp | Tuneable thin film inductor |
| US4082916A (en) * | 1976-12-16 | 1978-04-04 | Westinghouse Electric Corporation | Encapsulated electrical inductive apparatus |
| US4600911A (en) * | 1984-03-20 | 1986-07-15 | Pauwels-Trafo Belgium N.V. | Elliptically shaped magnetic core |
| DE3783731T2 (en) * | 1986-11-22 | 1993-05-13 | Kitamura Kiden Kk | WINDING CORE WITH A CIRCULAR CIRCUIT AND ELLIPTIC SECTIONS. |
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| JPH05166623A (en) * | 1991-12-12 | 1993-07-02 | Matsushita Electric Ind Co Ltd | Small fixed coil |
| US5279988A (en) * | 1992-03-31 | 1994-01-18 | Irfan Saadat | Process for making microcomponents integrated circuits |
-
1998
- 1998-01-30 AU AU60524/98A patent/AU6052498A/en not_active Abandoned
- 1998-01-30 WO PCT/US1998/001879 patent/WO1998034287A1/en not_active Application Discontinuation
- 1998-01-30 EP EP98903872A patent/EP1000442A4/en not_active Withdrawn
- 1998-01-30 CA CA002279297A patent/CA2279297A1/en not_active Abandoned
- 1998-01-30 KR KR1019997006982A patent/KR20000070732A/en not_active Application Discontinuation
- 1998-01-30 JP JP53314298A patent/JP2002513511A/en active Pending
- 1998-02-03 TW TW087101261A patent/TW362287B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000070732A (en) | 2000-11-25 |
| JP2002513511A (en) | 2002-05-08 |
| EP1000442A1 (en) | 2000-05-17 |
| CA2279297A1 (en) | 1998-08-06 |
| TW362287B (en) | 1999-06-21 |
| WO1998034287A1 (en) | 1998-08-06 |
| EP1000442A4 (en) | 2000-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6249039B1 (en) | Integrated inductive components and method of fabricating such components | |
| EP2297751B1 (en) | Planar, monolithically integrated coil | |
| CN102446916B (en) | There is integrated circuit and the manufacture method thereof of core inductor | |
| US7250842B1 (en) | MEMS inductor with very low resistance | |
| US10049803B2 (en) | Arrayed embedded magnetic components and methods | |
| Ahn et al. | A fully integrated surface micromachined magnetic microactuator with a multilevel meander magnetic core | |
| Park et al. | Ferrite-based integrated planar inductors and transformers fabricated at low temperature | |
| US6417754B1 (en) | Three-dimensional coil inductor | |
| Ahn et al. | A fully integrated planar toroidal inductor with a micromachined nickel-iron magnetic bar | |
| Park et al. | Batch-fabricated microinductors with electroplated magnetically anisotropic and laminated alloy cores | |
| Ahn et al. | A planar micromachined spiral inductor for integrated magnetic microactuator applications | |
| WO2002023563A2 (en) | Advanced electronic microminiature coil and method of manufacturing | |
| US7140092B2 (en) | Methods for manufacturing inductor cores | |
| US6990725B2 (en) | Fabrication approaches for the formation of planar inductors and transformers | |
| Park et al. | Integrated electroplated micromachined magnetic devices using low temperature fabrication processes | |
| Park et al. | Packaging compatible microtransformers on a silicon substrate | |
| Allen | MEMS technology for the fabrication of RF magnetic components | |
| US7676922B1 (en) | Method of forming a saucer-shaped half-loop MEMS inductor with very low resistance | |
| AU6052498A (en) | Vialess integrated inductive elements for electromagnetic applications | |
| WO1998034287A9 (en) | Vialess integrated inductive elements for electromagnetic applications | |
| US20230071379A1 (en) | Coil component and manufacturing method therefor | |
| EP1542261B1 (en) | Method of producing an element comprising an electrical conductor encircled by magnetic material | |
| TW506045B (en) | Method for forming high performance system-on-chip using post passivation process | |
| KR101853850B1 (en) | Micro Inductor and Method of Manufacturing the Same | |
| Liakopoulos et al. | Microfabricated toroidal-type planar inductors for MEMS and power electronic applications |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK1 | Application lapsed section 142(2)(a) - no request for examination in relevant period |