WO2019220862A1 - Inductor and method for producing same - Google Patents

Inductor and method for producing same Download PDF

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Publication number
WO2019220862A1
WO2019220862A1 PCT/JP2019/016838 JP2019016838W WO2019220862A1 WO 2019220862 A1 WO2019220862 A1 WO 2019220862A1 JP 2019016838 W JP2019016838 W JP 2019016838W WO 2019220862 A1 WO2019220862 A1 WO 2019220862A1
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WIPO (PCT)
Prior art keywords
insulating layer
region
conductor portions
layer
inductor
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PCT/JP2019/016838
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French (fr)
Japanese (ja)
Inventor
牛見　義光
篤史 世古
亜季子 宇野
竹内　雅樹
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株式会社村田製作所
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Publication of WO2019220862A1 publication Critical patent/WO2019220862A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Definitions

  • the present invention relates to an inductor and a manufacturing method thereof.
  • a first example of an inductor is described in JP-T-2002-513511 (Patent Document 1).
  • a pattern of a first conductive layer is formed on a substrate, and a first isolation layer is formed so as to cover it.
  • a seed layer is formed on the upper side of the first isolation layer, and a magnetic core is formed by electroplating so as to cover the exposed portion of the seed layer.
  • a second example of the inductor is described in JP-T-2004-524696 (Patent Document 2).
  • a coil is formed in a recess formed in a substrate.
  • JP 2002-513511 A JP-T-2004-524696
  • the first isolation layer is formed on the substrate so as to cover the pattern of the first conductive layer. Irregularities occur on the surface of one isolation layer. Since the magnetic core is formed on the first isolation layer having such irregularities, the axis of the magnetic core can be in a non-linear state due to the irregularities. In such a magnetic core, the magnetization direction is disturbed, the original magnetic characteristics of the magnetic film are not exhibited, and the performance as an inductor is inferior.
  • an object of the present invention is to provide an inductor that can arrange the direction of magnetization and can satisfactorily exhibit the performance as an inductor according to the original magnetic characteristics of the magnetic film, and a method for manufacturing the inductor.
  • an inductor includes a substrate having a main surface and a plurality of portions arranged so as to protrude from both sides of the first region across the first region set on the main surface.
  • a second insulating layer disposed in the region to be extended, a magnetic core disposed so as to extend into the first region above the second insulating layer, and a third covering the upper side and the side of the magnetic core.
  • An insulating layer and a plurality of second conductor portions connected to the plurality of first conductor portions and arranged to straddle an upper side of the third insulating layer, and an upper surface of the plurality of first conductor portions and the above
  • the upper surface of the first insulating layer is located in the same plane and is above the first conductor portion.
  • the magnetic core 5 can be formed on a substantially non-concave surface. . Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
  • FIG. 3 is a plan view corresponding to that shown in FIG. 2. It is explanatory drawing of the 2nd process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is explanatory drawing of the 3rd process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is a top view corresponding to what was shown in FIG. It is explanatory drawing of the 4th process of the manufacturing method of the inductor in Embodiment 1 based on this invention.
  • FIG. 10 is a plan view corresponding to that shown in FIG. 9. It is explanatory drawing of the 6th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is explanatory drawing of the 7th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is a top view corresponding to what was shown in FIG. It is explanatory drawing of the 8th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is a top view corresponding to what was shown in FIG.
  • FIG. 32 is a plan view corresponding to that shown in FIG. 31. It is explanatory drawing of the 9th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. It is a top view corresponding to what was shown in FIG. It is explanatory drawing of the 10th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. It is explanatory drawing of the 1st modification of the magnetic core with which the inductor based on this invention is equipped. It is explanatory drawing of the 2nd modification of the magnetic core with which the inductor based on this invention is equipped. It is explanatory drawing of the 3rd modification of the magnetic core with which the inductor based on this invention is equipped.
  • FIG. 1 shows a flowchart of the method for manufacturing an inductor in the present embodiment.
  • a plurality of first inductors arranged so as to protrude from both sides of the first region across the first region with respect to the substrate having the main surface in which the first region is set.
  • Step S1 of forming one conductor portion on the main surface Step S2 of forming a first insulating layer so as to cover the plurality of first conductor portions and to separate the plurality of first conductor portions from each other.
  • step S5 Forming a magnetic core in the step S5 and the magnetic A step S6 of forming a third insulating layer so as to cover the upper side and the side of the upper side, and a plurality of second conductor portions connected to the plurality of first conductor portions and straddling the upper side of the third insulating layer.
  • step S7 Forming step S7.
  • the first conductor portion and the second conductor portion are alternately connected to form a coil structure.
  • an SiO 2 layer 12 is formed on the Si substrate 11 as an insulating film.
  • a substrate formed of a material such as glass may be used instead of the Si substrate 11.
  • the insulating film formed on the upper surface may be an Al 2 O 3 layer or the like.
  • the insulating film should just be a film
  • the substrate 1 is a combination of the Si substrate 11 and the SiO 2 layer 12.
  • the substrate 1 has a main surface 1u. In the example shown in FIG. 2, the main surface 1 u is the upper surface of the SiO 2 layer 12.
  • Fig. 3 shows a plan view of this state.
  • a first region 4 is set on the main surface 1 u of the substrate 1.
  • the first region 4 is a region where a magnetic core is to be arranged.
  • the first region 4 is conceptual and is indicated by a two-dot chain line that represents an imaginary line.
  • seed layer 2 is formed so as to cover main surface 1 u of substrate 1.
  • the seed layer 2 covers the upper surface of the SiO 2 layer 12.
  • the seed layer 2 may be formed of a material such as Cu or Au.
  • the seed layer 2 can be formed by sputtering, for example.
  • a resist pattern 18 is formed on the seed layer 2. For patterning, a resist layer is once formed so as to cover the entire seed layer 2, the resist layer is exposed so as to correspond to a desired pattern, and unnecessary portions of the resist layer are removed by development.
  • FIG. 6 shows a plan view of the state shown in FIG.
  • each opening 18 a of the resist pattern 18 extends in a direction slightly inclined from the direction perpendicular to the longitudinal direction of the first region 4.
  • the coil axis of the coil structure formed later extends in the vertical direction in FIG.
  • FIG. 6 a cross-sectional view taken along an appropriate straight line in a direction perpendicular to the longitudinal direction of the first region 4 corresponds to FIG. 5.
  • the length and ratio of the opening 18a of the resist pattern 18 appearing on the left and right respectively are different from those shown in FIG. 5, but FIG. For simplicity, the two openings 18a having the same length are schematically shown as being visible.
  • Electrolytic plating is performed to form a plating layer 21a in the shape of the opening 18a of the resist pattern 18 as shown in FIG.
  • the plating layer 21a is formed only in the region of the seed layer 2 exposed through the opening 18a.
  • the plating layer 21a may be formed of a material such as Cu, for example.
  • the first conductor portion 21 is arranged in a line so as to cross the first region 4 and protrude to both sides of the first region 4.
  • substrate 1 the process of forming the 1st conductor part 21 in the board
  • substrate 1 is process S1.
  • the first conductor portion 21 forms a lower part of a coil structure that surrounds the magnetic core, and may be referred to as a “lower coil electrode”.
  • a first insulating layer 31 is formed as shown in FIG. A plan view of this state is shown in FIG.
  • the first insulating layer 31 is formed so as to cover the plurality of first conductor portions 21 and to separate the plurality of first conductor portions 21 from each other.
  • the material of the first insulating layer 31 may be polyimide, resist, or the like, for example.
  • a method such as spin coating or laminating may be used to form the first insulating layer 31.
  • Step 3 Planarization is performed.
  • the top surface of the first conductor portion 21 and the top surface of the first insulating layer 31 are collectively planarized while the first conductor portion 21 is exposed.
  • cutting may be used as shown in FIG. In the example shown in FIG. 11, cutting is performed by relatively moving the blade 15 in the direction of the arrow 91.
  • a grinding process may be used in addition to the cutting process.
  • the state after step S3 is shown in FIG.
  • the planarization process the upper surface of the first conductor portion 21 and the upper surface of the first insulating layer 31 are located in the same plane.
  • a plan view of this state is shown in FIG.
  • the plurality of first conductor portions 21 are exposed while the upper surface of the first insulating layer 31 is widened.
  • the second insulating layer 32 is formed along the first region 4 above the upper surfaces of the plurality of first conductor portions 21 as shown in FIG. A plan view of this state is shown in FIG.
  • the second insulating layer 32 is formed so as to expose both ends of each of the plurality of first conductor portions 21.
  • the second insulating layer 32 can be formed by photolithography or the like.
  • the second insulating layer 32 is formed in a region including at least the first region 4.
  • An example of the state after step S4 is shown in FIG.
  • a magnetic core is formed so as to extend into the first region 4 above the second insulating layer 32.
  • FIG. 16 shows an example in which the magnetic core 5 is formed. A plan view of this state is shown in FIG.
  • the number of magnetic layers included in the magnetic core 5 may be one.
  • the magnetic core 5 has a structure including a plurality of magnetic layers.
  • the magnetic core 5 includes a magnetic layer 51 and an insulating layer 52.
  • two magnetic layers 51 have a structure in which one insulating layer 52 is sandwiched.
  • the third insulating layer 33 is formed so as to cover the upper side and the side of the magnetic core 5.
  • the third insulating layer 33 is formed in a desired range by photolithography.
  • the third insulating layer 33 is formed so as to expose both ends of each of the plurality of first conductor portions 21.
  • the 2nd conductor part 22 is formed.
  • the plurality of second conductor portions 22 are formed so as to connect the ends of the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33.
  • a plan view of this state is shown in FIG.
  • FIG. 19 when attention is paid to one of the plurality of first conductor portions 21, an end of the first conductor portion 21 and an end of another first conductor portion 21 adjacent to the first conductor portion 21 are Connected by the second conductor 22.
  • the electrode pads 25 a and 25 b are formed simultaneously with the second conductor portion 22.
  • the end of the uppermost first conductor portion 21 and the electrode pad 25 a are connected by the same conductor portion as that of the second conductor portion 22.
  • the lowermost end of the first conductor portion 21 and the electrode pad 25 b are connected by the same conductor portion as the second conductor portion 22.
  • the electrode pads 25a and 25b and the conductor portions connected thereto may also be formed by patterning simultaneously with the second conductor portion 22 using the same material as the second conductor portion 22.
  • the second conductor portion 22 forms an upper part of a coil structure that surrounds the magnetic core later, and may be referred to as an “upper coil electrode”.
  • the first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure.
  • inductor 101 in the present embodiment can be obtained.
  • a sectional view of inductor 101 in the present embodiment is shown in FIG. 18, and a plan view thereof is shown in FIG.
  • inductor 101 in the present embodiment protrudes on both sides of first region across substrate 1 having main surface 1u and a first region set on main surface 1u.
  • the plurality of first conductor portions 21 arranged in this manner, the first insulating layer 31 arranged on the main surface 1u and separating each of the plurality of first conductor portions 21 from each other, and the top surfaces of the plurality of first conductor portions 21
  • a second insulating layer 32 disposed in a region including the first region on the upper side; a magnetic core 5 disposed so as to extend into the first region on the upper side of the second insulating layer 32;
  • a third insulating layer 33 that covers the upper side and the side of the core 5, and a plurality of second conductor portions 22 that are connected to the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33.
  • each of the plurality of first conductor portions 21 and the upper surface of the first insulating layer 31 are located in the same plane.
  • the first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure.
  • each of the plurality of first conductor portions 21 may be linear.
  • each of the plurality of second conductor portions 22 may be linear.
  • the magnetic core 5 can be formed on a substantially non-concave surface. . Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
  • a plurality of surfaces are located in the same surface may be a result of performing some flattening process on the plurality of surfaces.
  • the plurality of surfaces are not necessarily in the same plane, and there may be a slight level difference.
  • such a good inductor can be efficiently manufactured.
  • inductor 101 in the present embodiment can also be expressed as follows from another aspect.
  • inductor 101 in the present embodiment protrudes on both sides of first region across substrate 1 having main surface 1u and a first region defined on main surface 1u.
  • the plurality of first conductor portions 21 arranged in this manner, the first insulating layer 22 arranged on the main surface 1u and separating each of the plurality of first conductor portions 21 from each other, and the top surfaces of the plurality of first conductor portions 21
  • a second insulating layer 32 disposed along the first region on the upper side, a magnetic core 5 disposed so as to extend into the first region above the second insulating layer 32, and a magnetic core 5
  • a third insulating layer 33 covering the upper side and the side of the first insulating layer 33, and a plurality of second conductor portions 22 arranged so as to connect ends of the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33.
  • the top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are collectively planar
  • the top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are collectively planarized, and the magnetic core 5 is a flat surface obtained in this way. Formed on top. Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
  • FIG. 20 shows a flowchart of the inductor manufacturing method according to the present embodiment.
  • Step S6 for forming the third insulating layer as described above, and Step S7 for forming the plurality of second conductor portions so as to be connected to the plurality of first conductor portions and straddle the upper side of the third insulating layer.
  • the first conductor portion and the second conductor portion are alternately connected to form a coil structure.
  • an SiO 2 layer 12 is formed on the Si substrate 11 as an insulating film.
  • a first insulating layer 31 is formed so as to cover main surface 1u.
  • an opening 8 is formed in the first insulating layer 31 as shown in FIG. A plan view of this state is shown in FIG.
  • the opening 8 is formed in a linear shape so as to cross the first region 4 and protrude to both sides of the first region 4.
  • the seed layer 2 is formed.
  • the material of the seed layer 2 may be either Cu or Au.
  • the seed layer 2 covers the upper surface of the first insulating layer 31 and also covers the side surfaces and the bottom surface of the opening 8.
  • a resist layer 16 is formed. The resist layer 16 is once formed on the entire surface and then patterned to cover a region other than the opening 8 as shown in FIG.
  • step S13 a plurality of first conductor portions are formed on the main surface so as to fill the opening 8.
  • electrolytic plating such as Cu may be performed.
  • the structure shown in FIG. 26 is obtained.
  • the plating layer 21 a is formed so as to fill the opening 8. A plan view of this state is shown in FIG.
  • the upper surface of the first conductor portion 21 and the upper surface of the first insulating layer 31 are collectively planarized.
  • the first conductor portion 21 is a combination of the seed layer 2 and the plating layer 21a.
  • cutting may be used as shown in FIG. In the example shown in FIG. 28, cutting is performed by relatively moving the blade 15 in the direction of the arrow 91.
  • the details of the planarization process are as described in the first embodiment.
  • FIG. 29 shows the state after step S3. A plan view of this state is shown in FIG. The plurality of first conductor portions 21 are exposed while the upper surface of the first insulating layer 31 is widened.
  • the second insulating layer 32 is formed along the first region 4 above the upper surfaces of the plurality of first conductor portions 21 as shown in FIG. A plan view of this state is shown in FIG. Details of the second insulating layer 32 are the same as those described in the first embodiment.
  • step S5 a magnetic core is formed so as to extend into the first region 4 above the second insulating layer 32.
  • FIG. 33 shows an example in which the magnetic core 5 is formed. A plan view of this state is shown in FIG.
  • the magnetic core 5 includes a structure in which two magnetic layers 51 and three insulating layers 52 are alternately stacked.
  • the third insulating layer 33 is formed so as to cover the upper side and the side of the magnetic core 5. Details of the third insulating layer 33 are the same as those described in the first embodiment.
  • the 2nd conductor part 22 is formed. Details of the second conductor portion 22 are the same as those described in the first embodiment.
  • FIG. 35 A cross-sectional view of the inductor 102 is shown in FIG. 35, and a plan view thereof is the same as that shown in FIG. 19 in the first embodiment.
  • a good inductor can be efficiently manufactured as in the manufacturing method shown in the first embodiment.
  • the step S3 for performing the flattening process is performed by cutting, grinding, or polishing.
  • high-precision flattening can be performed.
  • the flattening process can be performed with high accuracy by using, for example, a surface planar.
  • the surface planar may be, for example, manufactured by Disco Corporation.
  • a spindle with a diamond tool is rotated, and cutting is performed by the diamond tool.
  • the rotation axis of the spindle is in the vertical direction, and the diamond tool rotates in a certain horizontal plane, and the work piece supported substantially horizontally is relatively below the rotating diamond tool in the horizontal direction. Make it progress. By doing so, the upper surface of the workpiece can be cut and flattened.
  • the magnetic core 5 is formed by alternately laminating magnetic layers 51 and nonmagnetic layers having lower conductivity than the magnetic layers 51. It is preferable that the structure is included. By adopting this configuration, a magnetic core with good characteristics can be obtained.
  • the insulating layer 52 is disposed as an example of the non-magnetic layer having lower conductivity than the magnetic layer 51, but is not limited to the insulating layer 52.
  • the above-described nonmagnetic layer preferably has a conductivity of 1 ⁇ 10 3 S / cm or less.
  • the inductor may include a magnetic core 5i instead of the magnetic core 5.
  • the magnetic core 5 i includes only one magnetic layer 51 above the seed layer 6.
  • the inductor may include a magnetic core 5j instead of the magnetic core 5.
  • the magnetic core 5j includes two or more magnetic layers arranged in a direction parallel to the main surface 1u and electrically or physically separated from each other when viewed in a cross section perpendicular to the coil axis of the coil structure.
  • the coil axis of the coil structure extends in a direction perpendicular to the paper surface in FIG.
  • the magnetic core 5j includes magnetic layers 51a, 51b, 51c, and 51d.
  • the magnetic layer 51a and the magnetic layer 51b are at the same height and are separated from each other by an insulating layer.
  • the magnetic layer 51c and the magnetic layer 51d are at the same height and are separated from each other by an insulating layer.
  • the insulating layer 52 overlaps the magnetic material layers 51a and 51b, and the magnetic material layers 51c and 51d overlap the magnetic material layers 51a and 51b.
  • the inductor may include a magnetic core 5k instead of the magnetic core 5.
  • the magnetic core 5k includes a magnetic layer 51s and an insulating layer 52t.
  • the magnetic core 5k includes a structure in which the magnetic layer 51s and the insulating layer 52t are arranged in a checkered pattern when viewed in a cross section perpendicular to the coil axis of the coil structure. Such a structure may be used.
  • the adjacent magnetic layer 51s is arranged obliquely above or obliquely below one magnetic layer 51s, but these are not in direct contact with each other.
  • the insulating layer 52t is given as an example of a nonmagnetic layer having lower conductivity than the magnetic layer 51s, and is not limited to the insulating layer as long as it is a nonmagnetic layer having lower conductivity than the magnetic layer 51s. Absent. That is, the magnetic core may include a structure in which the magnetic layer and the nonmagnetic layer are arranged in a checkered pattern.
  • FIGS. 36 to 38 show a state in the middle of manufacturing.
  • each layer covering the upper side of the magnetic core does not exist yet, but when actually becoming an inductor, each layer covering the upper side of the magnetic core is formed as described in the first and second embodiments. .
  • the inductor is not limited to the solenoid type, and may be, for example, a toroidal type.
  • the material layer disposed in combination with the magnetic layer inside the magnetic core is referred to as an “insulating layer”, but instead of the insulating layer, a nonmagnetic material having lower conductivity than the magnetic layer. It may be a layer.
  • the nonmagnetic layer preferably has a conductivity of 1 ⁇ 10 3 S / cm or less.

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  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

An inductor (101) is equipped with: a substrate (1) having a main surface (1u); a plurality of arranged first conductors (21); a first insulating layer (31) which is positioned on the main surface (1u) and separates the plurality of first conductors (21) from one another; a second insulating layer (32) which is positioned above the top surfaces of the plurality of first conductors (21); a magnetic core (5) which is positioned above the second insulating layer (32); a third insulating layer (33) which covers the top and sides of the magnetic core (5); and a plurality of second conductors (22) which are positioned so as to straddle the top of the third insulating layer (33) and are connected to the plurality of first conductors (21). Therein, the top surfaces of the plurality of first conductors (21) and the top surface of the first insulating layer (31) are positioned within the same plane, and a coil structure is formed by alternatingly connecting the first conductors (21) and the second conductors (22) with one another.

Description

インダクタおよびその製造方法Inductor and manufacturing method thereof
　本発明は、インダクタおよびその製造方法に関するものである。 The present invention relates to an inductor and a manufacturing method thereof.
　インダクタの第１の例が、特表２００２－５１３５１１号公報（特許文献１）に記載されている。このインダクタを作製する際には、基板上に第１の導電層のパターンを形成し、これを覆うように第１の隔離層が形成される。第１の隔離層の上側にシード層が形成され、このシード層の露出した部分を覆うように電気めっきにより磁気コアが形成される。 A first example of an inductor is described in JP-T-2002-513511 (Patent Document 1). When manufacturing this inductor, a pattern of a first conductive layer is formed on a substrate, and a first isolation layer is formed so as to cover it. A seed layer is formed on the upper side of the first isolation layer, and a magnetic core is formed by electroplating so as to cover the exposed portion of the seed layer.
　インダクタの第２の例が、特表２００４－５２４６９６号公報（特許文献２）に記載されている。このインダクタにおいては、基板に形成されたくぼみの中にコイルが形成されている。 A second example of the inductor is described in JP-T-2004-524696 (Patent Document 2). In this inductor, a coil is formed in a recess formed in a substrate.
特表２００２－５１３５１１号公報JP 2002-513511 A 特表２００４－５２４６９６号公報JP-T-2004-524696
　特許文献１に記載されたインダクタでは、基板上に第１の導電層のパターンを覆うように第１の隔離層が形成されているが、第１の導電層がある部分とない部分とで第１の隔離層の表面に凹凸が生じる。このような凹凸を有する第１の隔離層の上に磁気コアを形成しているので、凹凸の影響により磁気コアの軸が直線状ではない状態となりうる。このような磁気コアでは、磁化の向きが乱れた状態となり、磁性膜本来の磁気特性が発揮されず、インダクタとして性能が劣ったものとなる。 In the inductor described in Patent Document 1, the first isolation layer is formed on the substrate so as to cover the pattern of the first conductive layer. Irregularities occur on the surface of one isolation layer. Since the magnetic core is formed on the first isolation layer having such irregularities, the axis of the magnetic core can be in a non-linear state due to the irregularities. In such a magnetic core, the magnetization direction is disturbed, the original magnetic characteristics of the magnetic film are not exhibited, and the performance as an inductor is inferior.
　特許文献２に記載されたインダクタでは、誘電体層およびコイル導体層の形成は平坦な基板表面で行なうのではなく、基板に形成されたくぼみの中で行なう必要があるので、プロセスが複雑となる。くぼみを形成するためにドライプロセスを用いる場合にはコストが高くなる。 In the inductor described in Patent Document 2, formation of the dielectric layer and the coil conductor layer is not performed on a flat substrate surface, but needs to be performed in a recess formed in the substrate, so that the process becomes complicated. . The cost increases when a dry process is used to form the depression.
　そこで、本発明は、磁化の向きが整って磁性膜本来の磁気特性に応じてインダクタとしての性能を良好に発揮することができるインダクタおよびその製造方法を提供することを目的とする。 Therefore, an object of the present invention is to provide an inductor that can arrange the direction of magnetization and can satisfactorily exhibit the performance as an inductor according to the original magnetic characteristics of the magnetic film, and a method for manufacturing the inductor.
　上記目的を達成するため、本発明に基づくインダクタは、主表面を有する基板と、上記主表面上に設定される第１領域を横切って上記第１領域の両側にはみ出すように配置された複数の第１導体部と、上記主表面上に配置され、上記複数の第１導体部の各々を互いに隔てる第１絶縁層と、上記複数の第１導体部の上面より上側において上記第１領域を包含する領域に配置された第２絶縁層と、上記第２絶縁層の上側で上記第１領域内に延在するように配置された磁気コアと、上記磁気コアの上側および側方を覆う第３絶縁層と、上記複数の第１導体部と接続して上記第３絶縁層の上側をまたぐように配置された複数の第２導体部とを備え、上記複数の第１導体部の上面と上記第１絶縁層の上面とは、同一面内に位置し、上記第１導体部と上記第２導体部とが交互に連なることによって、コイル構造が形成されている。 In order to achieve the above object, an inductor according to the present invention includes a substrate having a main surface and a plurality of portions arranged so as to protrude from both sides of the first region across the first region set on the main surface. A first conductor layer, a first insulating layer disposed on the main surface and separating each of the plurality of first conductor portions from each other; and the first region above the top surfaces of the plurality of first conductor portions. A second insulating layer disposed in the region to be extended, a magnetic core disposed so as to extend into the first region above the second insulating layer, and a third covering the upper side and the side of the magnetic core. An insulating layer; and a plurality of second conductor portions connected to the plurality of first conductor portions and arranged to straddle an upper side of the third insulating layer, and an upper surface of the plurality of first conductor portions and the above The upper surface of the first insulating layer is located in the same plane and is above the first conductor portion. By the second conductor section is alternately connected, the coil structure is formed.
　本発明によれば、複数の第１導体部２１の上面と第１絶縁層３１の上面とは、同一面内に位置するので、磁気コア５はほぼ凹凸のない面上に形成することができる。したがって、磁気コアの軸を直線状とすることができるので、磁化の向きが整って磁性膜本来の磁気特性に応じてインダクタとしての性能を良好に発揮することができるインダクタを実現することができる。 According to the present invention, since the upper surfaces of the plurality of first conductor portions 21 and the upper surface of the first insulating layer 31 are located in the same plane, the magnetic core 5 can be formed on a substantially non-concave surface. . Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
本発明に基づく実施の形態１におけるインダクタの製造方法のフローチャートである。It is a flowchart of the manufacturing method of the inductor in Embodiment 1 based on this invention. 本発明に基づく実施の形態１におけるインダクタの製造方法の第１の工程の説明図である。It is explanatory drawing of the 1st process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図２に示したものに対応する平面図である。FIG. 3 is a plan view corresponding to that shown in FIG. 2. 本発明に基づく実施の形態１におけるインダクタの製造方法の第２の工程の説明図である。It is explanatory drawing of the 2nd process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 本発明に基づく実施の形態１におけるインダクタの製造方法の第３の工程の説明図である。It is explanatory drawing of the 3rd process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図５に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態１におけるインダクタの製造方法の第４の工程の説明図である。It is explanatory drawing of the 4th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図７に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態１におけるインダクタの製造方法の第５の工程の説明図である。It is explanatory drawing of the 5th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図９に示したものに対応する平面図である。FIG. 10 is a plan view corresponding to that shown in FIG. 9. 本発明に基づく実施の形態１におけるインダクタの製造方法の第６の工程の説明図である。It is explanatory drawing of the 6th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 本発明に基づく実施の形態１におけるインダクタの製造方法の第７の工程の説明図である。It is explanatory drawing of the 7th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図１２に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態１におけるインダクタの製造方法の第８の工程の説明図である。It is explanatory drawing of the 8th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図１４に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態１におけるインダクタの製造方法の第９の工程の説明図である。It is explanatory drawing of the 9th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図１６に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態１におけるインダクタの製造方法の第１０の工程の説明図である。It is explanatory drawing of the 10th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. 図１８に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態２におけるインダクタの製造方法のフローチャートである。It is a flowchart of the manufacturing method of the inductor in Embodiment 2 based on this invention. 本発明に基づく実施の形態２におけるインダクタの製造方法の第１の工程の説明図である。It is explanatory drawing of the 1st process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 本発明に基づく実施の形態２におけるインダクタの製造方法の第２の工程の説明図である。It is explanatory drawing of the 2nd process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 図２２に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態２におけるインダクタの製造方法の第３の工程の説明図である。It is explanatory drawing of the 3rd process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 本発明に基づく実施の形態２におけるインダクタの製造方法の第４の工程の説明図である。It is explanatory drawing of the 4th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 本発明に基づく実施の形態２におけるインダクタの製造方法の第５の工程の説明図である。It is explanatory drawing of the 5th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 図２６に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態２におけるインダクタの製造方法の第６の工程の説明図である。It is explanatory drawing of the 6th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 本発明に基づく実施の形態２におけるインダクタの製造方法の第７の工程の説明図である。It is explanatory drawing of the 7th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 図２９に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態２におけるインダクタの製造方法の第８の工程の説明図である。It is explanatory drawing of the 8th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 図３１に示したものに対応する平面図である。FIG. 32 is a plan view corresponding to that shown in FIG. 31. 本発明に基づく実施の形態２におけるインダクタの製造方法の第９の工程の説明図である。It is explanatory drawing of the 9th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 図３３に示したものに対応する平面図である。It is a top view corresponding to what was shown in FIG. 本発明に基づく実施の形態２におけるインダクタの製造方法の第１０の工程の説明図である。It is explanatory drawing of the 10th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. 本発明に基づくインダクタに備わる磁気コアの第１の変形例の説明図である。It is explanatory drawing of the 1st modification of the magnetic core with which the inductor based on this invention is equipped. 本発明に基づくインダクタに備わる磁気コアの第２の変形例の説明図である。It is explanatory drawing of the 2nd modification of the magnetic core with which the inductor based on this invention is equipped. 本発明に基づくインダクタに備わる磁気コアの第３の変形例の説明図である。It is explanatory drawing of the 3rd modification of the magnetic core with which the inductor based on this invention is equipped.
　図面において示す寸法比は、必ずしも忠実に現実のとおりを表しているとは限らず、説明の便宜のために寸法比を誇張して示している場合がある。以下の説明において、上または下の概念に言及する際には、絶対的な上または下を意味するとは限らず、図示された姿勢の中での相対的な上または下を意味する場合がある。 The dimensional ratios shown in the drawings do not always faithfully represent the actual ones, and the dimensional ratios may be exaggerated for convenience of explanation. In the following description, when referring to a concept above or below, it does not necessarily mean absolute above or below, but may mean relative above or below in the illustrated posture. .
　（実施の形態１）
　図１～図１９を参照して、本発明に基づく実施の形態１におけるインダクタの製造方法について説明する。本実施の形態におけるインダクタの製造方法のフローチャートを図１に示す。 (Embodiment 1)
A method for manufacturing an inductor according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a flowchart of the method for manufacturing an inductor in the present embodiment.
　本実施の形態におけるインダクタの製造方法は、第１領域が設定された主表面を有する基板に対して、前記第１領域を横切って前記第１領域の両側にはみ出すように配置された複数の第１導体部を前記主表面に形成する工程Ｓ１と、前記複数の第１導体部を覆い、かつ、前記複数の第１導体部の各々を互いに隔てるように第１絶縁層を形成する工程Ｓ２と、前記第１導体部を露出させつつ前記第１導体部の上面および前記第１絶縁層の上面を一括して平坦化処理する工程Ｓ３と、前記平坦化処理する工程より後で、前記複数の第１導体部の上面より上側において前記第１領域を包含する領域を覆うように第２絶縁層を形成する工程Ｓ４と、前記第２絶縁層の上側で前記第１領域内に延在するように磁気コアを形成する工程Ｓ５と、前記磁気コアの上側および側方を覆うように第３絶縁層を形成する工程Ｓ６と、前記複数の第１導体部と接続して前記第３絶縁層の上側をまたぐように複数の第２導体部を形成する工程Ｓ７とを含む。前記第１導体部と前記第２導体部とが交互に連なることによって、コイル構造が形成される。 In the inductor manufacturing method according to the present embodiment, a plurality of first inductors arranged so as to protrude from both sides of the first region across the first region with respect to the substrate having the main surface in which the first region is set. Step S1 of forming one conductor portion on the main surface, Step S2 of forming a first insulating layer so as to cover the plurality of first conductor portions and to separate the plurality of first conductor portions from each other The step S3 of collectively flattening the upper surface of the first conductor portion and the upper surface of the first insulating layer while exposing the first conductor portion, and after the step of flattening, Step S4 of forming a second insulating layer so as to cover the region including the first region above the upper surface of the first conductor portion, and extending into the first region above the second insulating layer. Forming a magnetic core in the step S5 and the magnetic A step S6 of forming a third insulating layer so as to cover the upper side and the side of the upper side, and a plurality of second conductor portions connected to the plurality of first conductor portions and straddling the upper side of the third insulating layer. Forming step S7. The first conductor portion and the second conductor portion are alternately connected to form a coil structure.
　各工程について、対応する図を参照しつつ以下に詳しく説明する。
　図２に示すように、Ｓｉ基板１１上に絶縁膜としてＳｉＯ2層１２を形成する。ここでは、Ｓｉ基板１１を用いているが、Ｓｉ基板１１に代えてガラスなどの材料で形成された基板を用いてもよい。ガラス基板を用いる場合、ガラス自体が絶縁性を有するので、上面に絶縁膜を形成することは省略してもよい。また、上面に形成する絶縁膜は、ＳｉＯ2層１２以外に、Ａｌ2Ｏ3層などであってもよい。絶縁膜は、絶縁性が確保できる材料の膜であればよい。図２では、Ｓｉ基板１１とＳｉＯ2層１２とを合わせたものを基板１としている。基板１は主表面１ｕを有する。図２に示した例では、主表面１ｕはＳｉＯ2層１２の上面である。 Each step will be described in detail below with reference to the corresponding drawings.
As shown in FIG. 2, an SiO 2 layer 12 is formed on the Si substrate 11 as an insulating film. Although the Si substrate 11 is used here, a substrate formed of a material such as glass may be used instead of the Si substrate 11. In the case of using a glass substrate, since the glass itself has an insulating property, forming an insulating film on the upper surface may be omitted. In addition to the SiO 2 layer 12, the insulating film formed on the upper surface may be an Al 2 O 3 layer or the like. The insulating film should just be a film | membrane of the material which can ensure insulation. In FIG. 2, the substrate 1 is a combination of the Si substrate 11 and the SiO 2 layer 12. The substrate 1 has a main surface 1u. In the example shown in FIG. 2, the main surface 1 u is the upper surface of the SiO 2 layer 12.
　この状態の平面図を図３に示す。基板１の主表面１ｕに第１領域４が設定されている。第１領域４は磁気コアを配置する予定の領域である。この時点ではまだ磁気コアは全く形成されていないので、第１領域４は概念的なものであり、想像線を意味する二点鎖線で示されている。 Fig. 3 shows a plan view of this state. A first region 4 is set on the main surface 1 u of the substrate 1. The first region 4 is a region where a magnetic core is to be arranged. At this time, since the magnetic core is not formed at all, the first region 4 is conceptual and is indicated by a two-dot chain line that represents an imaginary line.
　図４に示すように、基板１の主表面１ｕを覆うようにシード層２を成膜する。シード層２は、ＳｉＯ2層１２の上面を覆う。シード層２は、たとえばＣｕ、Ａｕなどの材料により形成すればよい。シード層２は、たとえばスパッタにより形成することができる。図５に示すように、シード層２上にレジストパターン１８を形成する。パターニングするには、シード層２の全体を覆うようにレジスト層を一旦形成して、所望のパターンに対応するようにレジスト層を露光させ、不要な部分のレジスト層を現像により除去する。 As shown in FIG. 4, seed layer 2 is formed so as to cover main surface 1 u of substrate 1. The seed layer 2 covers the upper surface of the SiO 2 layer 12. The seed layer 2 may be formed of a material such as Cu or Au. The seed layer 2 can be formed by sputtering, for example. As shown in FIG. 5, a resist pattern 18 is formed on the seed layer 2. For patterning, a resist layer is once formed so as to cover the entire seed layer 2, the resist layer is exposed so as to correspond to a desired pattern, and unnecessary portions of the resist layer are removed by development.
　図５に示した状態の平面図を図６に示す。図６に示した例では、レジストパターン１８の各開口部１８ａは、第１領域４の長手方向に垂直な方向よりやや傾斜した方向に延在している。のちに形成されるコイル構造のコイル軸は、図６における上下方向に延びることとなる。 FIG. 6 shows a plan view of the state shown in FIG. In the example shown in FIG. 6, each opening 18 a of the resist pattern 18 extends in a direction slightly inclined from the direction perpendicular to the longitudinal direction of the first region 4. The coil axis of the coil structure formed later extends in the vertical direction in FIG.
　図６において第１領域４の長手方向に垂直な方向の適当な直線で切った断面図が図５に相当する。実際には、そのような直線で切った場合、左右にそれぞれ現れるレジストパターン１８の開口部１８ａの長さや比率は図５に示すものとは異なるが、図５では、説明をわかりやすくするために単純化して同じ長さの開口部１８ａが２つ見えているものとして模式的に表示している。 6, a cross-sectional view taken along an appropriate straight line in a direction perpendicular to the longitudinal direction of the first region 4 corresponds to FIG. 5. Actually, when cut along such a straight line, the length and ratio of the opening 18a of the resist pattern 18 appearing on the left and right respectively are different from those shown in FIG. 5, but FIG. For simplicity, the two openings 18a having the same length are schematically shown as being visible.
　電解めっきを行ない、図７に示すようにレジストパターン１８の開口部１８ａの形状にめっき層２１ａを形成する。シード層２のうち開口部１８ａを通じて露出していた領域のみにめっき層２１ａが形成される。めっき層２１ａはたとえばＣｕなどの材料で形成してよい。レジストパターン１８を除去した後で、シード層２のうち電解めっきされてない部分をエッチングにより除去する。こうすることで、所望のパターンが得られる。図７に示すように、シード層２とめっき層２１ａとが合わさったものが第１導体部２１となる。この時点で、複数の第１導体部２１が形成されている。この状態の平面図を図８に示す。図８に示すように、第１導体部２１は、第１領域４を横切って第１領域４の両側にはみ出すように線状に配置される。このようにして基板１に第１導体部２１を形成する工程が工程Ｓ１である。第１導体部２１は、のちに磁気コアを取り巻くコイル構造の下部をなすものであり、「下部コイル電極」と呼んでもよい。 Electrolytic plating is performed to form a plating layer 21a in the shape of the opening 18a of the resist pattern 18 as shown in FIG. The plating layer 21a is formed only in the region of the seed layer 2 exposed through the opening 18a. The plating layer 21a may be formed of a material such as Cu, for example. After the resist pattern 18 is removed, a portion of the seed layer 2 that is not electroplated is removed by etching. In this way, a desired pattern can be obtained. As shown in FIG. 7, a combination of the seed layer 2 and the plating layer 21 a becomes the first conductor portion 21. At this point, a plurality of first conductor portions 21 are formed. A plan view of this state is shown in FIG. As shown in FIG. 8, the first conductor portion 21 is arranged in a line so as to cross the first region 4 and protrude to both sides of the first region 4. Thus, the process of forming the 1st conductor part 21 in the board | substrate 1 is process S1. The first conductor portion 21 forms a lower part of a coil structure that surrounds the magnetic core, and may be referred to as a “lower coil electrode”.
　工程Ｓ２として、図９に示すように第１絶縁層３１を形成する。この状態の平面図を図１０に示す。第１絶縁層３１は、複数の第１導体部２１を覆い、かつ、複数の第１導体部２１の各々を互いに隔てるように形成される。第１絶縁層３１の材料は、たとえばポリイミド、レジストなどであってよい。第１絶縁層３１の形成には、たとえばスピンコート、ラミネートなどの方法を用いてよい。 As step S2, a first insulating layer 31 is formed as shown in FIG. A plan view of this state is shown in FIG. The first insulating layer 31 is formed so as to cover the plurality of first conductor portions 21 and to separate the plurality of first conductor portions 21 from each other. The material of the first insulating layer 31 may be polyimide, resist, or the like, for example. For example, a method such as spin coating or laminating may be used to form the first insulating layer 31.
　工程３として平坦化処理を行なう。この工程では、第１導体部２１を露出させつつ第１導体部２１の上面および第１絶縁層３１の上面を一括して平坦化処理する。平坦化処理には、たとえば図１１に示すように切削加工を用いてよい。図１１に示した例では、刃１５を矢印９１の向きに相対的に進行させることによって切削加工を行なっている。平坦化処理には、切削加工の他にたとえば研削加工を用いてもよい。工程Ｓ３を終えた状態を図１２に示す。平坦化処理を行なった結果、第１導体部２１の上面と第１絶縁層３１の上面とが同一面内に位置している。この状態の平面図を図１３に示す。第１絶縁層３１の上面が広がる中に複数の第１導体部２１が露出している。 (Step 3) Planarization is performed. In this step, the top surface of the first conductor portion 21 and the top surface of the first insulating layer 31 are collectively planarized while the first conductor portion 21 is exposed. For the flattening process, for example, cutting may be used as shown in FIG. In the example shown in FIG. 11, cutting is performed by relatively moving the blade 15 in the direction of the arrow 91. For the flattening process, for example, a grinding process may be used in addition to the cutting process. The state after step S3 is shown in FIG. As a result of the planarization process, the upper surface of the first conductor portion 21 and the upper surface of the first insulating layer 31 are located in the same plane. A plan view of this state is shown in FIG. The plurality of first conductor portions 21 are exposed while the upper surface of the first insulating layer 31 is widened.
　平坦化処理する工程Ｓ３より後で、工程Ｓ４として、図１４に示すように複数の第１導体部２１の上面より上側において第１領域４に沿って第２絶縁層３２を形成する。この状態の平面図を図１５に示す。第２絶縁層３２は、複数の第１導体部２１の各々の両端を露出させるように形成される。第２絶縁層３２は、フォトリソグラフィなどによって形成可能である。第２絶縁層３２は、少なくとも第１領域４を包含するような領域に形成される。工程Ｓ４を終えた状態の一例を図１４に示す。 After the flattening step S3, as step S4, the second insulating layer 32 is formed along the first region 4 above the upper surfaces of the plurality of first conductor portions 21 as shown in FIG. A plan view of this state is shown in FIG. The second insulating layer 32 is formed so as to expose both ends of each of the plurality of first conductor portions 21. The second insulating layer 32 can be formed by photolithography or the like. The second insulating layer 32 is formed in a region including at least the first region 4. An example of the state after step S4 is shown in FIG.
　工程Ｓ５として、第２絶縁層３２の上側で第１領域４内に延在するように磁気コアを形成する。図１６に磁気コア５を形成した一例を示す。この状態の平面図を図１７に示す。磁気コア５に含まれる磁性体層の数は１であってもよい。図１６に示した例では、磁気コア５は複数の磁性体層を含む構造となっている。磁気コア５は、磁性体層５１と絶縁層５２とを含む。図１６に示した例では、２つの磁性体層５１が１つの絶縁層５２をサンドイッチした構造となっている。 In step S5, a magnetic core is formed so as to extend into the first region 4 above the second insulating layer 32. FIG. 16 shows an example in which the magnetic core 5 is formed. A plan view of this state is shown in FIG. The number of magnetic layers included in the magnetic core 5 may be one. In the example shown in FIG. 16, the magnetic core 5 has a structure including a plurality of magnetic layers. The magnetic core 5 includes a magnetic layer 51 and an insulating layer 52. In the example shown in FIG. 16, two magnetic layers 51 have a structure in which one insulating layer 52 is sandwiched.
　工程Ｓ６として、図１８に示すように、磁気コア５の上側および側方を覆うように第３絶縁層３３を形成する。第３絶縁層３３はフォトリソグラフィによって所望の範囲に形成する。第３絶縁層３３は、複数の第１導体部２１の各々の両端を露出させるように形成される。 As step S6, as shown in FIG. 18, the third insulating layer 33 is formed so as to cover the upper side and the side of the magnetic core 5. The third insulating layer 33 is formed in a desired range by photolithography. The third insulating layer 33 is formed so as to expose both ends of each of the plurality of first conductor portions 21.
　工程Ｓ７として、図１８に示すように、第２導体部２２を形成する。複数の第２導体部２２は、複数の第１導体部２１の端同士を結び、第３絶縁層３３の上側をまたぐように形成される。この状態の平面図を図１９に示す。図１９に示すように、複数ある第１導体部２１のうちの１つに注目すると、この第１導体部２１の端と、これに隣接する別の１つの第１導体部２１の端とが第２導体部２２によって結ばれる。図１９に示すように、第２導体部２２と同時に電極パッド２５ａ，２５ｂを形成する。図１９において最も上側にある第１導体部２１の端と電極パッド２５ａとは、第２導体部２２と同様の導体部によって結ばれている。図１９において最も下側にある第１導体部２１の端と電極パッド２５ｂとは、第２導体部２２と同様の導体部によって結ばれている。電極パッド２５ａ，２５ｂおよびこれらにつながる導体部も、第２導体部２２と同じ材料によって第２導体部２２と同時にパターニングすることによって形成されるものであってよい。第２導体部２２は、のちに磁気コアを取り巻くコイル構造の上部をなすものであり、「上部コイル電極」と呼んでもよい。第１導体部２１と第２導体部２２とが交互に連なることによって、コイル構造が形成される。 As process S7, as shown in FIG. 18, the 2nd conductor part 22 is formed. The plurality of second conductor portions 22 are formed so as to connect the ends of the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33. A plan view of this state is shown in FIG. As shown in FIG. 19, when attention is paid to one of the plurality of first conductor portions 21, an end of the first conductor portion 21 and an end of another first conductor portion 21 adjacent to the first conductor portion 21 are Connected by the second conductor 22. As shown in FIG. 19, the electrode pads 25 a and 25 b are formed simultaneously with the second conductor portion 22. In FIG. 19, the end of the uppermost first conductor portion 21 and the electrode pad 25 a are connected by the same conductor portion as that of the second conductor portion 22. In FIG. 19, the lowermost end of the first conductor portion 21 and the electrode pad 25 b are connected by the same conductor portion as the second conductor portion 22. The electrode pads 25a and 25b and the conductor portions connected thereto may also be formed by patterning simultaneously with the second conductor portion 22 using the same material as the second conductor portion 22. The second conductor portion 22 forms an upper part of a coil structure that surrounds the magnetic core later, and may be referred to as an “upper coil electrode”. The first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure.
　こうして、本実施の形態におけるインダクタ１０１を得ることができる。本実施の形態におけるインダクタ１０１の断面図は図１８に示すものであり、平面図は図１９に示すものである。 In this way, the inductor 101 in the present embodiment can be obtained. A sectional view of inductor 101 in the present embodiment is shown in FIG. 18, and a plan view thereof is shown in FIG.
　本実施の形態におけるインダクタ１０１は、図１８および図１９に示すように、主表面１ｕを有する基板１と、主表面１ｕ上に設定される第１領域を横切って前記第１領域の両側にはみ出すように配置された複数の第１導体部２１と、主表面１ｕ上に配置され、複数の第１導体部２１の各々を互いに隔てる第１絶縁層３１と、複数の第１導体部２１の上面より上側において前記第１領域を包含する領域に配置された第２絶縁層３２と、第２絶縁層３２の上側で前記第１領域内に延在するように配置された磁気コア５と、磁気コア５の上側および側方を覆う第３絶縁層３３と、複数の第１導体部２１と接続して第３絶縁層３３の上側をまたぐように配置された複数の第２導体部２２とを備える。複数の第１導体部２１の上面と第１絶縁層３１の上面とは、同一面内に位置する。第１導体部２１と第２導体部２２とが交互に連なることによって、コイル構造が形成されている。図８に例示したように、複数の第１導体部２１の各々は、線状であってもよい。図１９に例示したように、複数の第２導体部２２の各々は、線状であってもよい。 As shown in FIGS. 18 and 19, inductor 101 in the present embodiment protrudes on both sides of first region across substrate 1 having main surface 1u and a first region set on main surface 1u. The plurality of first conductor portions 21 arranged in this manner, the first insulating layer 31 arranged on the main surface 1u and separating each of the plurality of first conductor portions 21 from each other, and the top surfaces of the plurality of first conductor portions 21 A second insulating layer 32 disposed in a region including the first region on the upper side; a magnetic core 5 disposed so as to extend into the first region on the upper side of the second insulating layer 32; A third insulating layer 33 that covers the upper side and the side of the core 5, and a plurality of second conductor portions 22 that are connected to the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33. Prepare. The upper surfaces of the plurality of first conductor portions 21 and the upper surface of the first insulating layer 31 are located in the same plane. The first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure. As illustrated in FIG. 8, each of the plurality of first conductor portions 21 may be linear. As illustrated in FIG. 19, each of the plurality of second conductor portions 22 may be linear.
　本実施の形態では、複数の第１導体部２１の上面と第１絶縁層３１の上面とは、同一面内に位置するので、磁気コア５はほぼ凹凸のない面上に形成することができる。したがって、磁気コアの軸を直線状とすることができるので、磁化の向きが整って磁性膜本来の磁気特性に応じてインダクタとしての性能を良好に発揮することができるインダクタを実現することができる。 In the present embodiment, since the top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are located in the same plane, the magnetic core 5 can be formed on a substantially non-concave surface. . Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
　なお、複数の面が「同一面内に位置する」とは、これら複数の面に対して何らかの平坦化処理が行なわれた結果であればよい。これら複数の面が完全な同一平面内にあるとは限らず、若干の段差があってもよい。 It should be noted that “a plurality of surfaces are located in the same surface” may be a result of performing some flattening process on the plurality of surfaces. The plurality of surfaces are not necessarily in the same plane, and there may be a slight level difference.
　本実施の形態で示した製造方法によれば、このような良好なインダクタを効率良く作製することができる。 According to the manufacturing method shown in the present embodiment, such a good inductor can be efficiently manufactured.
　なお、本実施の形態におけるインダクタ１０１は、別の局面から、以下のように表現することもできる。 Note that the inductor 101 in the present embodiment can also be expressed as follows from another aspect.
　本実施の形態におけるインダクタ１０１は、図１８および図１９に示すように、主表面１ｕを有する基板１と、主表面１ｕ上に規定される第１領域を横切って前記第１領域の両側にはみ出すように配置された複数の第１導体部２１と、主表面１ｕ上に配置され、複数の第１導体部２１の各々を互いに隔てる第１絶縁層２２と、複数の第１導体部２１の上面より上側において前記第１領域に沿って配置された第２絶縁層３２と、第２絶縁層３２の上側で前記第１領域内に延在するように配置された磁気コア５と、磁気コア５の上側および側方を覆う第３絶縁層３３と、複数の第１導体部２１の端同士を結び、第３絶縁層３３の上側をまたぐように配置された複数の第２導体部２２とを備える。複数の第１導体部２１の上面と第１絶縁層３１の上面とは、一括して平坦化処理されている。第１導体部２１と第２導体部２２とが交互に連なることによって、コイル構造が形成されている。 As shown in FIGS. 18 and 19, inductor 101 in the present embodiment protrudes on both sides of first region across substrate 1 having main surface 1u and a first region defined on main surface 1u. The plurality of first conductor portions 21 arranged in this manner, the first insulating layer 22 arranged on the main surface 1u and separating each of the plurality of first conductor portions 21 from each other, and the top surfaces of the plurality of first conductor portions 21 A second insulating layer 32 disposed along the first region on the upper side, a magnetic core 5 disposed so as to extend into the first region above the second insulating layer 32, and a magnetic core 5 A third insulating layer 33 covering the upper side and the side of the first insulating layer 33, and a plurality of second conductor portions 22 arranged so as to connect ends of the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33. Prepare. The top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are collectively planarized. The first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure.
　本実施の形態では、複数の第１導体部２１の上面と第１絶縁層３１の上面とは、一括して平坦化処理されており、磁気コア５はこのようにして得られた平坦な面上に形成される。したがって、磁気コアの軸を直線状とすることができるので、磁化の向きが整って磁性膜本来の磁気特性に応じてインダクタとしての性能を良好に発揮することができるインダクタを実現することができる。 In the present embodiment, the top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are collectively planarized, and the magnetic core 5 is a flat surface obtained in this way. Formed on top. Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
　（実施の形態２）
　図２０～図３５を参照して、本発明に基づく実施の形態２におけるインダクタの製造方法について説明する。本実施の形態におけるインダクタの製造方法のフローチャートを図２０に示す。 (Embodiment 2)
A method for manufacturing an inductor according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 20 shows a flowchart of the inductor manufacturing method according to the present embodiment.
　本実施の形態におけるインダクタの製造方法は、第１領域が設定された主表面を有する基板に対して、前記主表面を覆うように第１絶縁層を形成する工程Ｓ１１と、前記第１領域を横切って前記第１領域の両側にはみ出すような開口部を前記第１絶縁層に形成する工程Ｓ１２と、前記開口部を満たすように複数の第１導体部を前記主表面に形成する工程Ｓ１３と、前記第１導体部の上面および前記第１絶縁層の上面を一括して平坦化処理する工程Ｓ３と、前記平坦化処理する工程より後で、前記複数の第１導体部の上面より上側において前記第１領域を包含する領域を覆うように第２絶縁層を形成する工程Ｓ４と、前記第２絶縁層の上側で前記第１領域内に延在するように磁気コアを形成する工程Ｓ５と、前記磁気コアの上側および側方を覆うように第３絶縁層を形成する工程Ｓ６と、前記複数の第１導体部と接続して前記第３絶縁層の上側をまたぐように複数の第２導体部を形成する工程Ｓ７とを含む。前記第１導体部と前記第２導体部とが交互に連なることによって、コイル構造が形成される。 In the method for manufacturing an inductor in the present embodiment, a step S11 of forming a first insulating layer so as to cover the main surface on a substrate having a main surface in which the first region is set; A step S12 of forming an opening in the first insulating layer across the first region across the first region; and a step S13 of forming a plurality of first conductor portions on the main surface so as to fill the opening. And after the step of flattening the upper surface of the first conductor portion and the upper surface of the first insulating layer in a lump, and after the step of flattening, on the upper side of the upper surfaces of the plurality of first conductor portions. Forming a second insulating layer so as to cover a region including the first region, and forming a magnetic core so as to extend into the first region above the second insulating layer; and The upper and side of the magnetic core Step S6 for forming the third insulating layer as described above, and Step S7 for forming the plurality of second conductor portions so as to be connected to the plurality of first conductor portions and straddle the upper side of the third insulating layer. . The first conductor portion and the second conductor portion are alternately connected to form a coil structure.
　各工程について、対応する図を参照しつつ以下に詳しく説明する。実施の形態１で図２に示したように、Ｓｉ基板１１上に絶縁膜としてＳｉＯ2層１２を形成する。工程Ｓ１１として、図２１に示すように、主表面１ｕを覆うように第１絶縁層３１を形成する。 Each step will be described in detail below with reference to the corresponding drawings. As shown in FIG. 2 in the first embodiment, an SiO 2 layer 12 is formed on the Si substrate 11 as an insulating film. As step S11, as shown in FIG. 21, a first insulating layer 31 is formed so as to cover main surface 1u.
　工程Ｓ１２として、図２２に示すように第１絶縁層３１に開口部８を形成する。この状態の平面図を図２３に示す。開口部８は、第１領域４を横切って第１領域４の両側にはみ出すように線状に形成される。 As step S12, an opening 8 is formed in the first insulating layer 31 as shown in FIG. A plan view of this state is shown in FIG. The opening 8 is formed in a linear shape so as to cross the first region 4 and protrude to both sides of the first region 4.
　図２４に示すように、シード層２を形成する。シード層２の材料は、Ｃｕ、Ａｕなどのいずれかであってよい。シード層２は、第１絶縁層３１の上面を覆い、開口部８の側面および底面も覆う。図２５に示すように、レジスト層１６を形成する。レジスト層１６は一旦全面に形成した後でパターニングすることによって、図２５に示すように、開口部８以外の領域を覆うようにする。 As shown in FIG. 24, the seed layer 2 is formed. The material of the seed layer 2 may be either Cu or Au. The seed layer 2 covers the upper surface of the first insulating layer 31 and also covers the side surfaces and the bottom surface of the opening 8. As shown in FIG. 25, a resist layer 16 is formed. The resist layer 16 is once formed on the entire surface and then patterned to cover a region other than the opening 8 as shown in FIG.
　工程Ｓ１３として、開口部８を満たすように複数の第１導体部を前記主表面に形成する。このためには、Ｃｕなどの電解めっきを行なえばよい。電解めっきを行なうことにより、図２６に示す構造が得られる。図２６では、開口部８を埋めるようにめっき層２１ａが形成されている。この状態の平面図を図２７に示す。 In step S13, a plurality of first conductor portions are formed on the main surface so as to fill the opening 8. For this purpose, electrolytic plating such as Cu may be performed. By performing electrolytic plating, the structure shown in FIG. 26 is obtained. In FIG. 26, the plating layer 21 a is formed so as to fill the opening 8. A plan view of this state is shown in FIG.
　工程Ｓ３として、第１導体部２１の上面および第１絶縁層３１の上面を一括して平坦化処理する。第１導体部２１は、シード層２とめっき層２１ａとを合わせたものである。平坦化処理には、図２８に示すように切削加工を用いてよい。図２８に示した例では、刃１５を矢印９１の向きに相対的に進行させることによって切削加工を行なっている。平坦化処理の詳細については、実施の形態１で述べたとおりである。工程Ｓ３を終えた状態を図２９に示す。この状態の平面図を図３０に示す。第１絶縁層３１の上面が広がる中に複数の第１導体部２１が露出している。 As step S3, the upper surface of the first conductor portion 21 and the upper surface of the first insulating layer 31 are collectively planarized. The first conductor portion 21 is a combination of the seed layer 2 and the plating layer 21a. For the flattening process, cutting may be used as shown in FIG. In the example shown in FIG. 28, cutting is performed by relatively moving the blade 15 in the direction of the arrow 91. The details of the planarization process are as described in the first embodiment. FIG. 29 shows the state after step S3. A plan view of this state is shown in FIG. The plurality of first conductor portions 21 are exposed while the upper surface of the first insulating layer 31 is widened.
　平坦化処理する工程Ｓ３より後で、工程Ｓ４として、図３１に示すように複数の第１導体部２１の上面より上側において第１領域４に沿って第２絶縁層３２を形成する。この状態の平面図を図３２に示す。第２絶縁層３２についての詳細は実施の形態１で説明したものと同様である。 After the flattening step S3, as step S4, the second insulating layer 32 is formed along the first region 4 above the upper surfaces of the plurality of first conductor portions 21 as shown in FIG. A plan view of this state is shown in FIG. Details of the second insulating layer 32 are the same as those described in the first embodiment.
　工程Ｓ５として、第２絶縁層３２の上側で第１領域４内に延在するように磁気コアを形成する。図３３に磁気コア５を形成した一例を示す。この状態の平面図を図３４に示す。図３３に示した例では、磁気コア５は、２つの磁性体層５１と３つの絶縁層５２とが交互に積層されたものを含む。 In step S5, a magnetic core is formed so as to extend into the first region 4 above the second insulating layer 32. FIG. 33 shows an example in which the magnetic core 5 is formed. A plan view of this state is shown in FIG. In the example shown in FIG. 33, the magnetic core 5 includes a structure in which two magnetic layers 51 and three insulating layers 52 are alternately stacked.
　工程Ｓ６として、図３５に示すように、磁気コア５の上側および側方を覆うように第３絶縁層３３を形成する。第３絶縁層３３についての詳細は実施の形態１で説明したものと同様である。 As Step S6, as shown in FIG. 35, the third insulating layer 33 is formed so as to cover the upper side and the side of the magnetic core 5. Details of the third insulating layer 33 are the same as those described in the first embodiment.
　工程Ｓ７として、図３５に示すように、第２導体部２２を形成する。第２導体部２２についての詳細は実施の形態１で説明したものと同様である。 As process S7, as shown in FIG. 35, the 2nd conductor part 22 is formed. Details of the second conductor portion 22 are the same as those described in the first embodiment.
　こうして、本実施の形態におけるインダクタ１０２を得ることができる。インダクタ１０２の断面図は図３５に示すものであり、平面図は実施の形態１において図１９に示したものと同様である。 In this way, the inductor 102 in the present embodiment can be obtained. A cross-sectional view of the inductor 102 is shown in FIG. 35, and a plan view thereof is the same as that shown in FIG. 19 in the first embodiment.
　本実施の形態では、実施の形態１で示した製造方法と同様に、良好なインダクタを効率良く作製することができる。 In the present embodiment, a good inductor can be efficiently manufactured as in the manufacturing method shown in the first embodiment.
　実施の形態１，２のいずれにもあてはまることだが、平坦化処理する工程Ｓ３は、切削、研削または研磨加工によって行なわれることが好ましい。この構成を採用することにより、高精度な平坦化を行なうことができる。平坦化処理は、たとえばサーフェスプレーナを用いることによって精度良く行なうことができる。サーフェスプレーナは、たとえばディスコ社製のものであってよい。サーフェスプレーナにおいては、ダイヤモンドバイトを取り付けたスピンドルを回転させ、このダイヤモンドバイトによって、切削が行なわれる。たとえばスピンドルの回転軸は上下方向であって、ダイヤモンドバイトは一定の水平面内で回転する状態とし、この回転するダイヤモンドバイトの下側に、ほぼ水平に支持した被加工物を水平方向に相対的に進行させる。こうすることによって、被加工物の上面を切削加工して平坦化することができる。 As applied to both Embodiments 1 and 2, it is preferable that the step S3 for performing the flattening process is performed by cutting, grinding, or polishing. By adopting this configuration, high-precision flattening can be performed. The flattening process can be performed with high accuracy by using, for example, a surface planar. The surface planar may be, for example, manufactured by Disco Corporation. In the surface planer, a spindle with a diamond tool is rotated, and cutting is performed by the diamond tool. For example, the rotation axis of the spindle is in the vertical direction, and the diamond tool rotates in a certain horizontal plane, and the work piece supported substantially horizontally is relatively below the rotating diamond tool in the horizontal direction. Make it progress. By doing so, the upper surface of the workpiece can be cut and flattened.
　実施の形態１における図１８または実施の形態２における図３５に示したように、磁気コア５は、磁性体層５１と磁性体層５１より導電性が低い非磁性体層とが交互に積層された構造を含むことが好ましい。この構成を採用することにより、良好な特性の磁気コアとすることができる。図１８または図３５では、磁性体層５１より導電性が低い非磁性体層の一例として、絶縁層５２が配置されているが、絶縁層５２に限らない。上述の非磁性体層は、導電率が１×１０3Ｓ／ｃｍ以下であることが好ましい。 As shown in FIG. 18 in the first embodiment or FIG. 35 in the second embodiment, the magnetic core 5 is formed by alternately laminating magnetic layers 51 and nonmagnetic layers having lower conductivity than the magnetic layers 51. It is preferable that the structure is included. By adopting this configuration, a magnetic core with good characteristics can be obtained. In FIG. 18 or FIG. 35, the insulating layer 52 is disposed as an example of the non-magnetic layer having lower conductivity than the magnetic layer 51, but is not limited to the insulating layer 52. The above-described nonmagnetic layer preferably has a conductivity of 1 × 10 3 S / cm or less.
　図３６に示すように、インダクタは、磁気コア５に代えて磁気コア５ｉを備えてもよい。磁気コア５ｉは、シード層６の上側に１つの磁性体層５１のみを備える。 As shown in FIG. 36, the inductor may include a magnetic core 5i instead of the magnetic core 5. The magnetic core 5 i includes only one magnetic layer 51 above the seed layer 6.
　図３７に示すように、インダクタは、磁気コア５に代えて磁気コア５ｊを備えてもよい。磁気コア５ｊは、コイル構造のコイル軸に垂直な断面で見たときに、主表面１ｕに平行な方向に並べられて互いに電気的または物理的に離隔された２以上の磁性体層を含む。コイル構造のコイル軸は、図３７における紙面に垂直な方向に延在する。磁気コア５ｊは、磁性体層５１ａ，５１ｂ，５１ｃ，５１ｄを備える。磁性体層５１ａと磁性体層５１ｂとは同じ高さにあり、絶縁層によって互いに隔てられている。磁性体層５１ｃと磁性体層５１ｄとは同じ高さにあり、絶縁層によって互いに隔てられている。磁性体層５１ａ，５１ｂの上側に絶縁層５２が重なっており、さらにその上側に磁性体層５１ｃ，５１ｄが重なっている。 37, the inductor may include a magnetic core 5j instead of the magnetic core 5. The magnetic core 5j includes two or more magnetic layers arranged in a direction parallel to the main surface 1u and electrically or physically separated from each other when viewed in a cross section perpendicular to the coil axis of the coil structure. The coil axis of the coil structure extends in a direction perpendicular to the paper surface in FIG. The magnetic core 5j includes magnetic layers 51a, 51b, 51c, and 51d. The magnetic layer 51a and the magnetic layer 51b are at the same height and are separated from each other by an insulating layer. The magnetic layer 51c and the magnetic layer 51d are at the same height and are separated from each other by an insulating layer. The insulating layer 52 overlaps the magnetic material layers 51a and 51b, and the magnetic material layers 51c and 51d overlap the magnetic material layers 51a and 51b.
　図３８に示すように、インダクタは、磁気コア５に代えて磁気コア５ｋを備えてもよい。磁気コア５ｋは、磁性体層５１ｓと絶縁層５２ｔとを備える。磁気コア５ｋは、コイル構造のコイル軸に垂直な断面で見たときに、磁性体層５１ｓと絶縁層５２ｔとが市松模様をなすように配置された構造を含む。このような構造であってもよい。１つの磁性体層５１ｓの斜め上または斜め下に隣りの磁性体層５１ｓが配置されているが、これらは直接は接していない。絶縁層５２ｔは、磁性体層５１ｓより導電性が低い非磁性体層の一例として挙げたものであり、磁性体層５１ｓより導電性が低い非磁性体層でありさえすれば、絶縁層に限らない。すなわち、磁気コアは、磁性体層と非磁性体層とが市松模様をなすように配置された構造を含んでいてよい。 As shown in FIG. 38, the inductor may include a magnetic core 5k instead of the magnetic core 5. The magnetic core 5k includes a magnetic layer 51s and an insulating layer 52t. The magnetic core 5k includes a structure in which the magnetic layer 51s and the insulating layer 52t are arranged in a checkered pattern when viewed in a cross section perpendicular to the coil axis of the coil structure. Such a structure may be used. The adjacent magnetic layer 51s is arranged obliquely above or obliquely below one magnetic layer 51s, but these are not in direct contact with each other. The insulating layer 52t is given as an example of a nonmagnetic layer having lower conductivity than the magnetic layer 51s, and is not limited to the insulating layer as long as it is a nonmagnetic layer having lower conductivity than the magnetic layer 51s. Absent. That is, the magnetic core may include a structure in which the magnetic layer and the nonmagnetic layer are arranged in a checkered pattern.
　なお、図３６～図３８では、製造途中の様子を示している。これらの図では、磁気コアの上側に被さる各層がまだ存在しないが、実際にインダクタとなるときには、実施の形態１，２で説明したのと同様に、磁気コアの上側に被さる各層が形成される。 Note that FIGS. 36 to 38 show a state in the middle of manufacturing. In these figures, each layer covering the upper side of the magnetic core does not exist yet, but when actually becoming an inductor, each layer covering the upper side of the magnetic core is formed as described in the first and second embodiments. .
　なお、ここまでソレノイドタイプのインダクタを例に説明してきたが、インダクタは、ソレノイドタイプに限らず、たとえばトロイダルタイプであってもよい。 In addition, although the solenoid type inductor has been described as an example so far, the inductor is not limited to the solenoid type, and may be, for example, a toroidal type.
　なお、ここまでの説明では、磁気コアの内部で磁性体層と組み合わせて配置される材料層を「絶縁層」としたが、絶縁層に代えて、磁性体層より導電性が低い非磁性体層であってもよい。非磁性体層は、導電率が１×１０3Ｓ／ｃｍ以下であることが好ましい。 In the above description, the material layer disposed in combination with the magnetic layer inside the magnetic core is referred to as an “insulating layer”, but instead of the insulating layer, a nonmagnetic material having lower conductivity than the magnetic layer. It may be a layer. The nonmagnetic layer preferably has a conductivity of 1 × 10 3 S / cm or less.
　なお、上記実施の形態のうち複数を適宜組み合わせて採用してもよい。
　なお、今回開示した上記実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更を含むものである。 A plurality of the above embodiments may be combined as appropriate.
In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　１　基板、１ｕ　主表面、２，６，７　シード層、４　第１領域、５，５ｉ，５ｊ，５ｋ　磁気コア、８　（第１絶縁層の）開口部、１１　Ｓｉ基板、１２　ＳｉＯ2層、１５　刃、１６　レジスト層、１７　（レジスト層の）開口部、１８　レジストパターン、１８ａ　開口部、２１　第１導体部、２１ａ，２２ａ　めっき層、２２　第２導体部、２５ａ，２５ｂ　電極パッド、３１　第１絶縁層、３２　第２絶縁層、３３　第３絶縁層、５１，５１ａ，５１ｂ，５１ｃ，５１ｄ，５１ｓ　磁性体層、５２，５２ｔ　絶縁層、９１　矢印、１０１，１０２　インダクタ。 1 substrate, 1u main surface, 2, 6, 7 seed layer, 4 first region, 5, 5i, 5j, 5k magnetic core, 8 opening of (first insulating layer), 11 Si substrate, 12 SiO 2 layer, 15 blade, 16 resist layer, 17 opening (of resist layer), 18 resist pattern, 18a opening, 21 first conductor, 21a, 22a plating layer, 22 second conductor, 25a, 25b electrode pad, 31st 1 insulating layer, 32 second insulating layer, 33 third insulating layer, 51, 51a, 51b, 51c, 51d, 51s magnetic layer, 52, 52t insulating layer, 91 arrow, 101, 102 inductor.

Claims (8)

  1. 　主表面を有する基板と、
    　前記主表面上に設定される第１領域を横切って前記第１領域の両側にはみ出すように配置された複数の第１導体部と、
    　前記主表面上に配置され、前記複数の第１導体部の各々を互いに隔てる第１絶縁層と、
    　前記複数の第１導体部の上面より上側において前記第１領域を包含する領域に配置された第２絶縁層と、
    　前記第２絶縁層の上側で前記第１領域内に延在するように配置された磁気コアと、
    　前記磁気コアの上側および側方を覆う第３絶縁層と、
    　前記複数の第１導体部と接続して前記第３絶縁層の上側をまたぐように配置された複数の第２導体部とを備え、
    　前記複数の第１導体部の上面と前記第１絶縁層の上面とは、同一面内に位置し、
    　前記第１導体部と前記第２導体部とが交互に連なることによって、コイル構造が形成されている、インダクタ。     A substrate having a main surface;
    A plurality of first conductor portions arranged so as to protrude across both sides of the first region across the first region set on the main surface;
    A first insulating layer disposed on the main surface and separating each of the plurality of first conductor portions from each other;
    A second insulating layer disposed in a region including the first region above the upper surfaces of the plurality of first conductor portions;
    A magnetic core arranged to extend into the first region above the second insulating layer;
    A third insulating layer covering the top and sides of the magnetic core;
    A plurality of second conductor portions connected to the plurality of first conductor portions and arranged to straddle the upper side of the third insulating layer;
    The upper surfaces of the plurality of first conductor portions and the upper surface of the first insulating layer are located in the same plane,
    An inductor in which a coil structure is formed by alternately connecting the first conductor portion and the second conductor portion.
  2. 　前記磁気コアは、磁性体層と前記磁性体層より導電性が低い非磁性体層とが交互に積層された構造を含む、請求項１に記載のインダクタ。 The inductor according to claim 1, wherein the magnetic core includes a structure in which a magnetic layer and a nonmagnetic layer having lower conductivity than the magnetic layer are alternately stacked.
  3. 　前記磁気コアは、前記コイル構造のコイル軸に垂直な断面で見たときに、前記主表面に平行な方向に並べられて互いに電気的または物理的に離隔された２以上の磁性体層を含む、請求項１に記載のインダクタ。 The magnetic core includes two or more magnetic layers arranged in a direction parallel to the main surface and electrically or physically separated from each other when viewed in a cross section perpendicular to the coil axis of the coil structure. The inductor according to claim 1.
  4. 　前記磁気コアは、前記コイル構造のコイル軸に垂直な断面で見たときに、磁性体層と前記磁性体層より導電性が低い非磁性体層とが市松模様をなすように配置された構造を含む、請求項１から３のいずれかに記載のインダクタ。 The magnetic core has a structure in which a magnetic layer and a nonmagnetic layer having lower conductivity than the magnetic layer are arranged in a checkered pattern when viewed in a cross section perpendicular to the coil axis of the coil structure. The inductor according to claim 1, comprising:
  5. 　第１領域が設定された主表面を有する基板に対して、前記第１領域を横切って前記第１領域の両側にはみ出すように配置された複数の第１導体部を前記主表面に形成する工程と、
    　前記複数の第１導体部を覆い、かつ、前記複数の第１導体部の各々を互いに隔てるように第１絶縁層を形成する工程と、
    　前記第１導体部を露出させつつ前記第１導体部の上面および前記第１絶縁層の上面を一括して平坦化処理する工程と、
    　前記平坦化処理する工程より後で、前記複数の第１導体部の上面より上側において前記第１領域を包含する領域を覆うように第２絶縁層を形成する工程と、
    　前記第２絶縁層の上側で前記第１領域内に延在するように磁気コアを形成する工程と、
    　前記磁気コアの上側および側方を覆うように第３絶縁層を形成する工程と、
    　前記複数の第１導体部と接続して前記第３絶縁層の上側をまたぐように複数の第２導体部を形成する工程とを含み、
    　前記第１導体部と前記第２導体部とが交互に連なることによって、コイル構造が形成される、インダクタの製造方法。     A step of forming, on the main surface, a plurality of first conductor portions arranged so as to cross over the first region and to protrude from both sides of the first region with respect to a substrate having a main surface in which the first region is set. When,
    Forming a first insulating layer so as to cover the plurality of first conductor portions and to separate the plurality of first conductor portions from each other;
    Flattening the upper surface of the first conductor portion and the upper surface of the first insulating layer together while exposing the first conductor portion;
    A step of forming a second insulating layer so as to cover a region including the first region above the upper surfaces of the plurality of first conductor portions, after the step of performing the planarization process;
    Forming a magnetic core so as to extend into the first region above the second insulating layer;
    Forming a third insulating layer so as to cover an upper side and a side of the magnetic core;
    Forming a plurality of second conductor portions connected to the plurality of first conductor portions and straddling an upper side of the third insulating layer,
    A method of manufacturing an inductor, wherein a coil structure is formed by alternately connecting the first conductor portion and the second conductor portion.
  6. 　第１領域が設定された主表面を有する基板に対して、前記主表面を覆うように第１絶縁層を形成する工程と、
    　前記第１領域を横切って前記第１領域の両側にはみ出すような開口部を前記第１絶縁層に形成する工程と、
    　前記線状の開口部を満たすように複数の第１導体部を前記主表面に形成する工程と、
    　前記第１導体部の上面および前記第１絶縁層の上面を一括して平坦化処理する工程と、
    　前記平坦化処理する工程より後で、前記複数の第１導体部の上面より上側において前記第１領域を包含する領域を覆うように第２絶縁層を形成する工程と、
    　前記第２絶縁層の上側で前記第１領域内に延在するように磁気コアを形成する工程と、
    　前記磁気コアの上側および側方を覆うように第３絶縁層を形成する工程と、
    　前記複数の第１導体部と接続して前記第３絶縁層の上側をまたぐように複数の第２導体部を形成する工程とを含み、
    　前記第１導体部と前記第２導体部とが交互に連なることによって、コイル構造が形成される、インダクタの製造方法。     Forming a first insulating layer on the substrate having a main surface in which the first region is set so as to cover the main surface;
    Forming an opening in the first insulating layer that extends across the first region and on both sides of the first region;
    Forming a plurality of first conductor portions on the main surface so as to fill the linear openings;
    Flattening the upper surface of the first conductor portion and the upper surface of the first insulating layer together;
    A step of forming a second insulating layer so as to cover a region including the first region on the upper side of the upper surfaces of the plurality of first conductor portions after the step of planarizing;
    Forming a magnetic core so as to extend into the first region above the second insulating layer;
    Forming a third insulating layer so as to cover an upper side and a side of the magnetic core;
    Forming a plurality of second conductor portions connected to the plurality of first conductor portions and straddling an upper side of the third insulating layer,
    A method of manufacturing an inductor, wherein a coil structure is formed by alternately connecting the first conductor portion and the second conductor portion.
  7. 　前記平坦化処理する工程は、切削、研削または研磨加工によって行なわれる、請求項５または６に記載のインダクタの製造方法。 The method for manufacturing an inductor according to claim 5 or 6, wherein the flattening step is performed by cutting, grinding, or polishing.
  8. 　前記非磁性体層は、導電率が１×１０3Ｓ／ｃｍ以下である、請求項２に記載のインダクタ。 The inductor according to claim 2, wherein the nonmagnetic layer has a conductivity of 1 × 10 3 S / cm or less.
PCT/JP2019/016838 2018-05-18 2019-04-19 Inductor and method for producing same WO2019220862A1 (en)

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JP2003257739A (en) * 2002-02-28 2003-09-12 Koa Corp High-frequency device
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JPS6473658A (en) * 1987-09-14 1989-03-17 Nec Corp Semiconductor device
JPH04363006A (en) * 1990-05-31 1992-12-15 Toshiba Corp Flat magnetic element
JPH0729732A (en) * 1993-07-09 1995-01-31 Fuji Electric Co Ltd Thin film magnetic element
JP2002513511A (en) * 1997-02-03 2002-05-08 ユニバーシティー オブ ユタ リサーチ ファンデーション Via-free integrated inductive devices for electromagnetic applications
JP2002525869A (en) * 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Method for manufacturing semiconductor device having semiconductor substrate having surface on which coil having magnetic core is provided
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WO2009072423A1 (en) * 2007-12-07 2009-06-11 Murata Manufacturing Co., Ltd. Laminated electronic component

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