WO2019220862A1 - Inducteur et son procédé de production - Google Patents

Inducteur et son procédé de production Download PDF

Info

Publication number
WO2019220862A1
WO2019220862A1 PCT/JP2019/016838 JP2019016838W WO2019220862A1 WO 2019220862 A1 WO2019220862 A1 WO 2019220862A1 JP 2019016838 W JP2019016838 W JP 2019016838W WO 2019220862 A1 WO2019220862 A1 WO 2019220862A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
region
conductor portions
layer
inductor
Prior art date
Application number
PCT/JP2019/016838
Other languages
English (en)
Japanese (ja)
Inventor
牛見　義光
篤史 世古
亜季子 宇野
竹内　雅樹
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2019220862A1 publication Critical patent/WO2019220862A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Definitions

  • the present invention relates to an inductor and a manufacturing method thereof.
  • a first example of an inductor is described in JP-T-2002-513511 (Patent Document 1).
  • a pattern of a first conductive layer is formed on a substrate, and a first isolation layer is formed so as to cover it.
  • a seed layer is formed on the upper side of the first isolation layer, and a magnetic core is formed by electroplating so as to cover the exposed portion of the seed layer.
  • a second example of the inductor is described in JP-T-2004-524696 (Patent Document 2).
  • a coil is formed in a recess formed in a substrate.
  • JP 2002-513511 A JP-T-2004-524696
  • the first isolation layer is formed on the substrate so as to cover the pattern of the first conductive layer. Irregularities occur on the surface of one isolation layer. Since the magnetic core is formed on the first isolation layer having such irregularities, the axis of the magnetic core can be in a non-linear state due to the irregularities. In such a magnetic core, the magnetization direction is disturbed, the original magnetic characteristics of the magnetic film are not exhibited, and the performance as an inductor is inferior.
  • an object of the present invention is to provide an inductor that can arrange the direction of magnetization and can satisfactorily exhibit the performance as an inductor according to the original magnetic characteristics of the magnetic film, and a method for manufacturing the inductor.
  • an inductor includes a substrate having a main surface and a plurality of portions arranged so as to protrude from both sides of the first region across the first region set on the main surface.
  • a second insulating layer disposed in the region to be extended, a magnetic core disposed so as to extend into the first region above the second insulating layer, and a third covering the upper side and the side of the magnetic core.
  • An insulating layer and a plurality of second conductor portions connected to the plurality of first conductor portions and arranged to straddle an upper side of the third insulating layer, and an upper surface of the plurality of first conductor portions and the above
  • the upper surface of the first insulating layer is located in the same plane and is above the first conductor portion.
  • the magnetic core 5 can be formed on a substantially non-concave surface. . Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
  • FIG. 3 is a plan view corresponding to that shown in FIG. 2. It is explanatory drawing of the 2nd process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is explanatory drawing of the 3rd process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is a top view corresponding to what was shown in FIG. It is explanatory drawing of the 4th process of the manufacturing method of the inductor in Embodiment 1 based on this invention.
  • FIG. 10 is a plan view corresponding to that shown in FIG. 9. It is explanatory drawing of the 6th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is explanatory drawing of the 7th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is a top view corresponding to what was shown in FIG. It is explanatory drawing of the 8th process of the manufacturing method of the inductor in Embodiment 1 based on this invention. It is a top view corresponding to what was shown in FIG.
  • FIG. 32 is a plan view corresponding to that shown in FIG. 31. It is explanatory drawing of the 9th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. It is a top view corresponding to what was shown in FIG. It is explanatory drawing of the 10th process of the manufacturing method of the inductor in Embodiment 2 based on this invention. It is explanatory drawing of the 1st modification of the magnetic core with which the inductor based on this invention is equipped. It is explanatory drawing of the 2nd modification of the magnetic core with which the inductor based on this invention is equipped. It is explanatory drawing of the 3rd modification of the magnetic core with which the inductor based on this invention is equipped.
  • FIG. 1 shows a flowchart of the method for manufacturing an inductor in the present embodiment.
  • a plurality of first inductors arranged so as to protrude from both sides of the first region across the first region with respect to the substrate having the main surface in which the first region is set.
  • Step S1 of forming one conductor portion on the main surface Step S2 of forming a first insulating layer so as to cover the plurality of first conductor portions and to separate the plurality of first conductor portions from each other.
  • step S5 Forming a magnetic core in the step S5 and the magnetic A step S6 of forming a third insulating layer so as to cover the upper side and the side of the upper side, and a plurality of second conductor portions connected to the plurality of first conductor portions and straddling the upper side of the third insulating layer.
  • step S7 Forming step S7.
  • the first conductor portion and the second conductor portion are alternately connected to form a coil structure.
  • an SiO 2 layer 12 is formed on the Si substrate 11 as an insulating film.
  • a substrate formed of a material such as glass may be used instead of the Si substrate 11.
  • the insulating film formed on the upper surface may be an Al 2 O 3 layer or the like.
  • the insulating film should just be a film
  • the substrate 1 is a combination of the Si substrate 11 and the SiO 2 layer 12.
  • the substrate 1 has a main surface 1u. In the example shown in FIG. 2, the main surface 1 u is the upper surface of the SiO 2 layer 12.
  • Fig. 3 shows a plan view of this state.
  • a first region 4 is set on the main surface 1 u of the substrate 1.
  • the first region 4 is a region where a magnetic core is to be arranged.
  • the first region 4 is conceptual and is indicated by a two-dot chain line that represents an imaginary line.
  • seed layer 2 is formed so as to cover main surface 1 u of substrate 1.
  • the seed layer 2 covers the upper surface of the SiO 2 layer 12.
  • the seed layer 2 may be formed of a material such as Cu or Au.
  • the seed layer 2 can be formed by sputtering, for example.
  • a resist pattern 18 is formed on the seed layer 2. For patterning, a resist layer is once formed so as to cover the entire seed layer 2, the resist layer is exposed so as to correspond to a desired pattern, and unnecessary portions of the resist layer are removed by development.
  • FIG. 6 shows a plan view of the state shown in FIG.
  • each opening 18 a of the resist pattern 18 extends in a direction slightly inclined from the direction perpendicular to the longitudinal direction of the first region 4.
  • the coil axis of the coil structure formed later extends in the vertical direction in FIG.
  • FIG. 6 a cross-sectional view taken along an appropriate straight line in a direction perpendicular to the longitudinal direction of the first region 4 corresponds to FIG. 5.
  • the length and ratio of the opening 18a of the resist pattern 18 appearing on the left and right respectively are different from those shown in FIG. 5, but FIG. For simplicity, the two openings 18a having the same length are schematically shown as being visible.
  • Electrolytic plating is performed to form a plating layer 21a in the shape of the opening 18a of the resist pattern 18 as shown in FIG.
  • the plating layer 21a is formed only in the region of the seed layer 2 exposed through the opening 18a.
  • the plating layer 21a may be formed of a material such as Cu, for example.
  • the first conductor portion 21 is arranged in a line so as to cross the first region 4 and protrude to both sides of the first region 4.
  • substrate 1 the process of forming the 1st conductor part 21 in the board
  • substrate 1 is process S1.
  • the first conductor portion 21 forms a lower part of a coil structure that surrounds the magnetic core, and may be referred to as a “lower coil electrode”.
  • a first insulating layer 31 is formed as shown in FIG. A plan view of this state is shown in FIG.
  • the first insulating layer 31 is formed so as to cover the plurality of first conductor portions 21 and to separate the plurality of first conductor portions 21 from each other.
  • the material of the first insulating layer 31 may be polyimide, resist, or the like, for example.
  • a method such as spin coating or laminating may be used to form the first insulating layer 31.
  • Step 3 Planarization is performed.
  • the top surface of the first conductor portion 21 and the top surface of the first insulating layer 31 are collectively planarized while the first conductor portion 21 is exposed.
  • cutting may be used as shown in FIG. In the example shown in FIG. 11, cutting is performed by relatively moving the blade 15 in the direction of the arrow 91.
  • a grinding process may be used in addition to the cutting process.
  • the state after step S3 is shown in FIG.
  • the planarization process the upper surface of the first conductor portion 21 and the upper surface of the first insulating layer 31 are located in the same plane.
  • a plan view of this state is shown in FIG.
  • the plurality of first conductor portions 21 are exposed while the upper surface of the first insulating layer 31 is widened.
  • the second insulating layer 32 is formed along the first region 4 above the upper surfaces of the plurality of first conductor portions 21 as shown in FIG. A plan view of this state is shown in FIG.
  • the second insulating layer 32 is formed so as to expose both ends of each of the plurality of first conductor portions 21.
  • the second insulating layer 32 can be formed by photolithography or the like.
  • the second insulating layer 32 is formed in a region including at least the first region 4.
  • An example of the state after step S4 is shown in FIG.
  • a magnetic core is formed so as to extend into the first region 4 above the second insulating layer 32.
  • FIG. 16 shows an example in which the magnetic core 5 is formed. A plan view of this state is shown in FIG.
  • the number of magnetic layers included in the magnetic core 5 may be one.
  • the magnetic core 5 has a structure including a plurality of magnetic layers.
  • the magnetic core 5 includes a magnetic layer 51 and an insulating layer 52.
  • two magnetic layers 51 have a structure in which one insulating layer 52 is sandwiched.
  • the third insulating layer 33 is formed so as to cover the upper side and the side of the magnetic core 5.
  • the third insulating layer 33 is formed in a desired range by photolithography.
  • the third insulating layer 33 is formed so as to expose both ends of each of the plurality of first conductor portions 21.
  • the 2nd conductor part 22 is formed.
  • the plurality of second conductor portions 22 are formed so as to connect the ends of the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33.
  • a plan view of this state is shown in FIG.
  • FIG. 19 when attention is paid to one of the plurality of first conductor portions 21, an end of the first conductor portion 21 and an end of another first conductor portion 21 adjacent to the first conductor portion 21 are Connected by the second conductor 22.
  • the electrode pads 25 a and 25 b are formed simultaneously with the second conductor portion 22.
  • the end of the uppermost first conductor portion 21 and the electrode pad 25 a are connected by the same conductor portion as that of the second conductor portion 22.
  • the lowermost end of the first conductor portion 21 and the electrode pad 25 b are connected by the same conductor portion as the second conductor portion 22.
  • the electrode pads 25a and 25b and the conductor portions connected thereto may also be formed by patterning simultaneously with the second conductor portion 22 using the same material as the second conductor portion 22.
  • the second conductor portion 22 forms an upper part of a coil structure that surrounds the magnetic core later, and may be referred to as an “upper coil electrode”.
  • the first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure.
  • inductor 101 in the present embodiment can be obtained.
  • a sectional view of inductor 101 in the present embodiment is shown in FIG. 18, and a plan view thereof is shown in FIG.
  • inductor 101 in the present embodiment protrudes on both sides of first region across substrate 1 having main surface 1u and a first region set on main surface 1u.
  • the plurality of first conductor portions 21 arranged in this manner, the first insulating layer 31 arranged on the main surface 1u and separating each of the plurality of first conductor portions 21 from each other, and the top surfaces of the plurality of first conductor portions 21
  • a second insulating layer 32 disposed in a region including the first region on the upper side; a magnetic core 5 disposed so as to extend into the first region on the upper side of the second insulating layer 32;
  • a third insulating layer 33 that covers the upper side and the side of the core 5, and a plurality of second conductor portions 22 that are connected to the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33.
  • each of the plurality of first conductor portions 21 and the upper surface of the first insulating layer 31 are located in the same plane.
  • the first conductor portion 21 and the second conductor portion 22 are alternately connected to form a coil structure.
  • each of the plurality of first conductor portions 21 may be linear.
  • each of the plurality of second conductor portions 22 may be linear.
  • the magnetic core 5 can be formed on a substantially non-concave surface. . Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
  • a plurality of surfaces are located in the same surface may be a result of performing some flattening process on the plurality of surfaces.
  • the plurality of surfaces are not necessarily in the same plane, and there may be a slight level difference.
  • such a good inductor can be efficiently manufactured.
  • inductor 101 in the present embodiment can also be expressed as follows from another aspect.
  • inductor 101 in the present embodiment protrudes on both sides of first region across substrate 1 having main surface 1u and a first region defined on main surface 1u.
  • the plurality of first conductor portions 21 arranged in this manner, the first insulating layer 22 arranged on the main surface 1u and separating each of the plurality of first conductor portions 21 from each other, and the top surfaces of the plurality of first conductor portions 21
  • a second insulating layer 32 disposed along the first region on the upper side, a magnetic core 5 disposed so as to extend into the first region above the second insulating layer 32, and a magnetic core 5
  • a third insulating layer 33 covering the upper side and the side of the first insulating layer 33, and a plurality of second conductor portions 22 arranged so as to connect ends of the plurality of first conductor portions 21 and straddle the upper side of the third insulating layer 33.
  • the top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are collectively planar
  • the top surfaces of the plurality of first conductor portions 21 and the top surface of the first insulating layer 31 are collectively planarized, and the magnetic core 5 is a flat surface obtained in this way. Formed on top. Therefore, since the axis of the magnetic core can be made linear, it is possible to realize an inductor in which the direction of magnetization is aligned and the performance as an inductor can be satisfactorily exhibited according to the original magnetic characteristics of the magnetic film. .
  • FIG. 20 shows a flowchart of the inductor manufacturing method according to the present embodiment.
  • Step S6 for forming the third insulating layer as described above, and Step S7 for forming the plurality of second conductor portions so as to be connected to the plurality of first conductor portions and straddle the upper side of the third insulating layer.
  • the first conductor portion and the second conductor portion are alternately connected to form a coil structure.
  • an SiO 2 layer 12 is formed on the Si substrate 11 as an insulating film.
  • a first insulating layer 31 is formed so as to cover main surface 1u.
  • an opening 8 is formed in the first insulating layer 31 as shown in FIG. A plan view of this state is shown in FIG.
  • the opening 8 is formed in a linear shape so as to cross the first region 4 and protrude to both sides of the first region 4.
  • the seed layer 2 is formed.
  • the material of the seed layer 2 may be either Cu or Au.
  • the seed layer 2 covers the upper surface of the first insulating layer 31 and also covers the side surfaces and the bottom surface of the opening 8.
  • a resist layer 16 is formed. The resist layer 16 is once formed on the entire surface and then patterned to cover a region other than the opening 8 as shown in FIG.
  • step S13 a plurality of first conductor portions are formed on the main surface so as to fill the opening 8.
  • electrolytic plating such as Cu may be performed.
  • the structure shown in FIG. 26 is obtained.
  • the plating layer 21 a is formed so as to fill the opening 8. A plan view of this state is shown in FIG.
  • the upper surface of the first conductor portion 21 and the upper surface of the first insulating layer 31 are collectively planarized.
  • the first conductor portion 21 is a combination of the seed layer 2 and the plating layer 21a.
  • cutting may be used as shown in FIG. In the example shown in FIG. 28, cutting is performed by relatively moving the blade 15 in the direction of the arrow 91.
  • the details of the planarization process are as described in the first embodiment.
  • FIG. 29 shows the state after step S3. A plan view of this state is shown in FIG. The plurality of first conductor portions 21 are exposed while the upper surface of the first insulating layer 31 is widened.
  • the second insulating layer 32 is formed along the first region 4 above the upper surfaces of the plurality of first conductor portions 21 as shown in FIG. A plan view of this state is shown in FIG. Details of the second insulating layer 32 are the same as those described in the first embodiment.
  • step S5 a magnetic core is formed so as to extend into the first region 4 above the second insulating layer 32.
  • FIG. 33 shows an example in which the magnetic core 5 is formed. A plan view of this state is shown in FIG.
  • the magnetic core 5 includes a structure in which two magnetic layers 51 and three insulating layers 52 are alternately stacked.
  • the third insulating layer 33 is formed so as to cover the upper side and the side of the magnetic core 5. Details of the third insulating layer 33 are the same as those described in the first embodiment.
  • the 2nd conductor part 22 is formed. Details of the second conductor portion 22 are the same as those described in the first embodiment.
  • FIG. 35 A cross-sectional view of the inductor 102 is shown in FIG. 35, and a plan view thereof is the same as that shown in FIG. 19 in the first embodiment.
  • a good inductor can be efficiently manufactured as in the manufacturing method shown in the first embodiment.
  • the step S3 for performing the flattening process is performed by cutting, grinding, or polishing.
  • high-precision flattening can be performed.
  • the flattening process can be performed with high accuracy by using, for example, a surface planar.
  • the surface planar may be, for example, manufactured by Disco Corporation.
  • a spindle with a diamond tool is rotated, and cutting is performed by the diamond tool.
  • the rotation axis of the spindle is in the vertical direction, and the diamond tool rotates in a certain horizontal plane, and the work piece supported substantially horizontally is relatively below the rotating diamond tool in the horizontal direction. Make it progress. By doing so, the upper surface of the workpiece can be cut and flattened.
  • the magnetic core 5 is formed by alternately laminating magnetic layers 51 and nonmagnetic layers having lower conductivity than the magnetic layers 51. It is preferable that the structure is included. By adopting this configuration, a magnetic core with good characteristics can be obtained.
  • the insulating layer 52 is disposed as an example of the non-magnetic layer having lower conductivity than the magnetic layer 51, but is not limited to the insulating layer 52.
  • the above-described nonmagnetic layer preferably has a conductivity of 1 ⁇ 10 3 S / cm or less.
  • the inductor may include a magnetic core 5i instead of the magnetic core 5.
  • the magnetic core 5 i includes only one magnetic layer 51 above the seed layer 6.
  • the inductor may include a magnetic core 5j instead of the magnetic core 5.
  • the magnetic core 5j includes two or more magnetic layers arranged in a direction parallel to the main surface 1u and electrically or physically separated from each other when viewed in a cross section perpendicular to the coil axis of the coil structure.
  • the coil axis of the coil structure extends in a direction perpendicular to the paper surface in FIG.
  • the magnetic core 5j includes magnetic layers 51a, 51b, 51c, and 51d.
  • the magnetic layer 51a and the magnetic layer 51b are at the same height and are separated from each other by an insulating layer.
  • the magnetic layer 51c and the magnetic layer 51d are at the same height and are separated from each other by an insulating layer.
  • the insulating layer 52 overlaps the magnetic material layers 51a and 51b, and the magnetic material layers 51c and 51d overlap the magnetic material layers 51a and 51b.
  • the inductor may include a magnetic core 5k instead of the magnetic core 5.
  • the magnetic core 5k includes a magnetic layer 51s and an insulating layer 52t.
  • the magnetic core 5k includes a structure in which the magnetic layer 51s and the insulating layer 52t are arranged in a checkered pattern when viewed in a cross section perpendicular to the coil axis of the coil structure. Such a structure may be used.
  • the adjacent magnetic layer 51s is arranged obliquely above or obliquely below one magnetic layer 51s, but these are not in direct contact with each other.
  • the insulating layer 52t is given as an example of a nonmagnetic layer having lower conductivity than the magnetic layer 51s, and is not limited to the insulating layer as long as it is a nonmagnetic layer having lower conductivity than the magnetic layer 51s. Absent. That is, the magnetic core may include a structure in which the magnetic layer and the nonmagnetic layer are arranged in a checkered pattern.
  • FIGS. 36 to 38 show a state in the middle of manufacturing.
  • each layer covering the upper side of the magnetic core does not exist yet, but when actually becoming an inductor, each layer covering the upper side of the magnetic core is formed as described in the first and second embodiments. .
  • the inductor is not limited to the solenoid type, and may be, for example, a toroidal type.
  • the material layer disposed in combination with the magnetic layer inside the magnetic core is referred to as an “insulating layer”, but instead of the insulating layer, a nonmagnetic material having lower conductivity than the magnetic layer. It may be a layer.
  • the nonmagnetic layer preferably has a conductivity of 1 ⁇ 10 3 S / cm or less.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un inducteur (101) qui est équipé : d'un substrat (1) ayant une surface principale (1u) ; une pluralité de premiers conducteurs agencés (21) ; une première couche isolante (31) qui est positionnée sur la surface principale (1u) et sépare la pluralité de premiers conducteurs (21) les uns des autres ; une seconde couche isolante (32) qui est positionnée au-dessus des surfaces supérieures de la pluralité de premiers conducteurs (21) ; un noyau magnétique (5) qui est positionné au-dessus de la deuxième couche isolante (32) ; une troisième couche isolante (33) qui recouvre le dessus et les côtés du noyau magnétique (5); et une pluralité de seconds conducteurs (22) qui sont positionnés de manière à chevaucher le dessus de la troisième couche isolante (33) et sont connectés à la pluralité de premiers conducteurs (21). Les surfaces supérieures de la pluralité de premiers conducteurs (21) et de la surface supérieure de la première couche isolante (31) sont positionnées dans le même plan, et une structure de bobine est formée en connectant alternativement les premiers conducteurs (21) et les seconds conducteurs (22) les uns aux autres.
PCT/JP2019/016838 2018-05-18 2019-04-19 Inducteur et son procédé de production WO2019220862A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018096601 2018-05-18
JP2018-096601 2018-05-18

Publications (1)

Publication Number Publication Date
WO2019220862A1 true WO2019220862A1 (fr) 2019-11-21

Family

ID=68540220

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/016838 WO2019220862A1 (fr) 2018-05-18 2019-04-19 Inducteur et son procédé de production

Country Status (1)

Country Link
WO (1) WO2019220862A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473658A (en) * 1987-09-14 1989-03-17 Nec Corp Semiconductor device
JPH04363006A (ja) * 1990-05-31 1992-12-15 Toshiba Corp 平面型磁気素子
JPH0729732A (ja) * 1993-07-09 1995-01-31 Fuji Electric Co Ltd 薄膜磁気素子
JP2002100733A (ja) * 2000-09-21 2002-04-05 Nec Corp 高周波集積回路装置
JP2002513511A (ja) * 1997-02-03 2002-05-08 ユニバーシティー オブ ユタ リサーチ ファンデーション 電磁気応用のためのヴァイアの無い集積誘導性素子
JP2002525869A (ja) * 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 磁気コアを有するコイルが設けられている表面を有する半導体基体を備えた半導体デバイスの製造方法
JP2003257739A (ja) * 2002-02-28 2003-09-12 Koa Corp 高周波デバイス
JP2007103686A (ja) * 2005-10-05 2007-04-19 Tdk Corp コモンモードチョークコイル及びその製造方法
WO2009072423A1 (fr) * 2007-12-07 2009-06-11 Murata Manufacturing Co., Ltd. Composant électronique laminé

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473658A (en) * 1987-09-14 1989-03-17 Nec Corp Semiconductor device
JPH04363006A (ja) * 1990-05-31 1992-12-15 Toshiba Corp 平面型磁気素子
JPH0729732A (ja) * 1993-07-09 1995-01-31 Fuji Electric Co Ltd 薄膜磁気素子
JP2002513511A (ja) * 1997-02-03 2002-05-08 ユニバーシティー オブ ユタ リサーチ ファンデーション 電磁気応用のためのヴァイアの無い集積誘導性素子
JP2002525869A (ja) * 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 磁気コアを有するコイルが設けられている表面を有する半導体基体を備えた半導体デバイスの製造方法
JP2002100733A (ja) * 2000-09-21 2002-04-05 Nec Corp 高周波集積回路装置
JP2003257739A (ja) * 2002-02-28 2003-09-12 Koa Corp 高周波デバイス
JP2007103686A (ja) * 2005-10-05 2007-04-19 Tdk Corp コモンモードチョークコイル及びその製造方法
WO2009072423A1 (fr) * 2007-12-07 2009-06-11 Murata Manufacturing Co., Ltd. Composant électronique laminé

Similar Documents

Publication Publication Date Title
CN1914699B (zh) 电子元件的制造方法、母板和电子元件
US20060115918A1 (en) Method for manufacturing a magnetic field detecting element
US8325003B2 (en) Common mode filter and method of manufacturing the same
JP5673358B2 (ja) コイル部品及びその製造方法
CN102222622B (zh) 半导体装置和半导体装置的制造方法
JP5346044B2 (ja) 積層半導体基板およびその製造方法並びに積層チップパッケージの製造方法
JP4638322B2 (ja) コモンモードフィルタ
JP2010219332A (ja) 多層配線層の電源配線構造およびその製造方法
TW201507567A (zh) 具有嵌入式濾波器的多層電子結構
JP5113025B2 (ja) コイル構造体及びその製造方法
CN112908611B (zh) 线圈部件
TWI500134B (zh) 矽穿孔基板結構及其堆疊組合
WO2011040953A1 (fr) Procédé de fabrication de mémoire de haute densité
CN103337493B (zh) 具有在平面内方向上延伸的一体化通孔的多层电子结构
US20080120828A1 (en) High Density Planarized Inductor And Method Of Making The Same
KR20190106243A (ko) 코일 부품
JP4209882B2 (ja) コモンモードフィルタ
CN103188867B (zh) 具有新型传输线的多层电子结构
WO2019220862A1 (fr) Inducteur et son procédé de production
KR100668957B1 (ko) 엠아이엠 캐패시터 제조 방법
CN106531882B (zh) 电磁阻抗感测元件及其制作方法
JP2006173163A (ja) チップコイル
JP7424157B2 (ja) 電子部品及びその製造方法
TWI538168B (zh) 三維半導體元件及其製造方法
JP2009111036A (ja) 薄膜トランスおよびその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19804430

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19804430

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP