US20060115918A1 - Method for manufacturing a magnetic field detecting element - Google Patents
Method for manufacturing a magnetic field detecting element Download PDFInfo
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- US20060115918A1 US20060115918A1 US11/336,881 US33688106A US2006115918A1 US 20060115918 A1 US20060115918 A1 US 20060115918A1 US 33688106 A US33688106 A US 33688106A US 2006115918 A1 US2006115918 A1 US 2006115918A1
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- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims description 79
- 238000005530 etching Methods 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 152
- 230000008569 process Effects 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 22
- 239000000696 magnetic material Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007429 general method Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/04—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/04—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle
- G01R33/05—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle in thin-film element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Magnetic Variables (AREA)
- Semiconductor Integrated Circuits (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Geophysics And Detection Of Objects (AREA)
- Hall/Mr Elements (AREA)
Abstract
A method for manufacturing a magnetic field detecting element having a soft magnetic core formed on a substrate, first and second coils, each having coil lines, arranged above and below the core, the method including forming a seed film on the substrate, removing a portion of the seed film using a predetermined pattern so that coil lines constituting the first coil subsequently formed on the seed film are separated, forming a first plating mold having grooves corresponding to the predetermined pattern on an upper portion of the seed film, forming coil lines constituting the first coil by filling the grooves of the first plating mold with metal, forming the soft magnetic core and the second coil on an upper portion of the substrate and on the seed film where the first coil is formed, and cutting off edges of the substrate so that the separated coil lines are insulated.
Description
- This is a divisional application based on pending application Ser. No. 10/784,479, filed Feb. 23, 2004, the entire convents of which is hereby incorporated by reference.
- 1. Field of the Invention
- The present invention relates to a magnetic field detecting element and a method for manufacturing the same. More particularly, the present invention relates to a magnetic field detecting element and a method for manufacturing the same by forming a soft magnetic core and a coil in a thin film type on a semiconductor substrate using a semiconductor process.
- 2. Description of the Related Art
- Conventionally, a high sensitivity magnetic sensor has included a soft magnetic material and a coil. Such a magnetic sensor is generally manufactured by winding a coil on a soft magnetic core, and requires an electronic circuit for obtaining a magnetic field proportional to a measured magnetic field. Recently, a method for realizing a magnetic field detecting element of such a magnetic sensor has been suggested, in which a soft magnetic thin film core and a plane thin film coil are formed on a semiconductor substrate using a semiconductor process.
- A general method for manufacturing a magnetic field detecting element using a semiconductor process is illustrated in
FIGS. 1A through 1J . - Referring to
FIG. 1A , afirst seed film 2 is formed on asemiconductor substrate 1. A photoresist of a predetermined height (not shown) is formed on thefirst seed film 2. InFIG. 1B , a first plating mold 3 having a plurality ofgrooves 3 a is formed by exposing and developing the photoresist. Next, thegrooves 3 a of the first plating mold 3 are filled with metal by a process, e.g., electric plating, so that a plurality ofcoil lines FIG. 1C . Then, the first plating mold 3 and the seed film under the first plating mold 3 are removed, thereby forming afirst coil 4 consisting of a plurality ofcoil lines FIG. 1D . - After the
first coil 4 is formed, a firstinsulating film 5 is formed to cover thefirst coil 4 on thesemiconductor substrate 1, as shown inFIG. 1E . Then, a soft magnetic material film (not shown) is formed on an upper surface of the firstinsulating film 5, and the soft magnetic material film is patterned and etched to form a softmagnetic core 6, as shown inFIG. 1F . - Subsequently, a second
insulating film 7 of a predetermined thickness is formed on the softmagnetic core 6 of thesemiconductor substrate 1, as shown inFIG. 1G . Then, as shown inFIG. 1H , viaholes coil lines 4 a and 4 o at either end of thefirst coil 4, are formed, and asecond seed film 9 is formed to a predetermined thickness on an upper surface of the secondinsulating film 7. Next, a thick photoresist (not shown) is formed on thesecond seed film 9 and a second platingmold 10 having a plurality ofgrooves 10 a and having thevia holes - As shown in
FIG. 1I , metal is formed in the plurality ofgrooves 10 a of the second platingmold 10 so that a plurality ofcoil lines mold 10 and thesecond seed film 9 under the second platingmold 10 are removed, thereby forming asecond coil 11 consisting of the plurality ofcoil lines FIG. 1J . - Finally, although not shown, a protection film is spread on an upper portion of the
second coil 11, whereby manufacturing of the magnetic field detecting element is complete. - However, according to the foregoing general method for manufacturing the magnetic field detecting element, the
seed film 2 between thecoil lines coil lines first coil 4 are insulated from each other. For that purpose, after the first plating mold 3 is removed, theinsulating film 5 must be formed on thefirst coil 4 for subsequent processes, thereby complicating the manufacturing process. - In addition, performance of the soft
magnetic core 6 in the foregoing magnetic field detecting element is poor because thesemiconductor substrate 1 for supporting the softmagnetic core 6 is uneven. Since thefirst coil 4 is projected onto thesemiconductor substrate 1, the general magnetic field detecting element has a weakness in that the thickness of the first and the secondinsulating films insulating films via holes first coil 4 with thesecond coil 11, becomes difficult. Also, a pitch between the coil lines, which influences performance of the sensor becomes large, causing further negative effects in the element. - The present invention is therefore directed to a magnetic field detecting element and a method for manufacturing the same, which substantially overcome one or more of the problems due to the limitations and disadvantages of the related art.
- It is a feature of an embodiment of the present invention to provide a method for manufacturing a magnetic field detecting element having a simple manufacturing process, in which a plating mold need not be removed for removal of a seed film to provide insulation between coil lines, thereby reducing restrictions on a material suitable for use as an insulating film.
- It is another feature of an embodiment of the present invention to provide a method for manufacturing a magnetic field detecting element having a simple manufacturing process, in which planarization of a semiconductor substrate on which a coil is formed may be easily performed, and in which a thickness of a planarization material and a film for constructing the magnetic field detecting element are thin.
- It is still another feature of an embodiment of the present invention to provide a magnetic field detecting element having improved performance manufactured by a simplified process.
- At least one of the above and other features and advantages of the present invention may be realized by providing a method for manufacturing a magnetic field detecting element having a soft magnetic core formed on a semiconductor substrate, first and second coils arranged on upper and lower surfaces of the soft magnetic core, respectively, the first and second coils each having a plurality of coil lines, the method including forming a seed film to a predetermined thickness on the semiconductor substrate, removing a portion of the seed film using a predetermined pattern so that each of the plurality of coil lines constituting the first coil that is subsequently formed on a remaining portion of the seed film is separated from the others, forming a first plating mold having a plurality of grooves corresponding to the predetermined pattern, on an upper portion of the seed film, forming the plurality of coil lines constituting the first coil by filling the plurality of grooves of the first plating mold with metal, forming the soft magnetic core and the second coil on an upper portion of the semiconductor substrate and on the remaining portion of the seed film where the first coil is formed, and cutting off edges of the semiconductor substrate so that each of the plurality of coil lines separated by the predetermined pattern are insulated from each other.
- Removing the portion of the seed film may further include forming a photoresist layer on an upper surface of the seed film, exposing and developing the photoresist to form the predetermined pattern, and etching the seed film according to the predetermined pattern.
- Filling the plurality of grooves of the first plating mold with metal may include electric plating.
- Forming the soft magnetic core may further include planarizing an upper surface of the semiconductor substrate on which the first coil is formed, spreading an insulating film on the planarized upper surface of the semiconductor substrate, spreading a soft magnetic material film on an upper surface of the insulating film, forming a photoresist layer on the soft magnetic material film and exposing and developing the photoresist layer to form a pattern of the soft magnetic core, and etching the soft magnetic material film according to the pattern.
- Forming the soft magnetic core may include removing the first plating mold, forming an insulating film to a height greater than a height of the first coil on an upper surface of the semiconductor substrate from which the first plating mold has been removed, spreading a soft magnetic material film on an upper surface of the insulating film, forming a photoresist layer on the soft magnetic material film and exposing and developing the photoresist layer to form a pattern of the soft magnetic core, and etching the soft magnetic material film according to the pattern.
- At least one of the above and other features and advantages of the present invention may be realized by providing a method for manufacturing a magnetic field detecting element having a soft magnetic core formed on a semiconductor substrate, first and second coils respectively arranged on upper and lower surfaces of the soft magnetic core, the first and second coils each having a plurality of coil lines, the method including forming a first seed film to a predetermined thickness on the semiconductor substrate, removing a portion of the first seed film using a predetermined first pattern so that each of the plurality of coil lines constituting the first coil to be subsequently formed on the first seed film is separated from the others, forming a first plating mold having a plurality of grooves that corresponds to the predetermined first pattern, on an upper portion of the first seed film, forming the plurality of coil lines constituting the first coil by filling the plurality of grooves of the first plating mold with metal, forming the soft magnetic core on the semiconductor substrate where the first coil is formed, forming a second insulating film on the semiconductor substrate where the soft magnetic core is formed, forming a second seed film on an upper surface of the second insulating film, removing the second seed film using a predetermined second pattern so that a plurality of coil lines constituting the second coil to be subsequently formed on the second seed film are separated from each other, forming a second plating mold having a plurality of grooves corresponding to the second pattern, on an upper portion of the second seed film, forming a plurality of coil lines constituting the second coil by filling the plurality of grooves of the second plating mold with metal, and cutting off edges on sides of the semiconductor substrate so that each of the plurality of coil lines constituting the first and the second coils separated by the first and the second patterns are insulated from each other.
- Filling the plurality of grooves of the first and the second plating molds with metal may include electric plating.
- Forming the soft magnetic core may further include planarizing an upper surface of the semiconductor substrate on which the first coil is formed, spreading a first insulating film on the planarized upper surface of the semiconductor substrate, spreading a soft magnetic material film on an upper portion of the first insulating film, forming a photoresist layer on the soft magnetic material film and exposing and developing the photoresist layer to form a pattern of the soft magnetic core, and etching the soft magnetic material film according to the pattern.
- At least one of the above and other features and advantages of the present invention may be realized by providing a method for manufacturing a magnetic field detecting element, including forming a well to a predetermined depth in a semiconductor substrate, forming a first coil on the semiconductor substrate, the first coil being arranged within the well below an upper surface of the semiconductor substrate, forming a first insulating film on an upper portion of the first coil and forming a soft magnetic core on an upper portion of the first insulating film, forming a second insulating film on an upper portion of the soft magnetic core, and forming a second coil on an upper portion of the second insulating film.
- At least one of the above and other features and advantages of the present invention may be realized by providing a method for manufacturing a magnetic field detecting element including preparing a semiconductor substrate, forming a well to a predetermined depth in the semiconductor substrate, forming a first coil consisting of a plurality of coil lines within the well of the semiconductor substrate, forming a first insulating film on an upper portion of the semiconductor substrate including the well, forming a soft magnetic core on an upper portion of the first insulating film, forming a second insulating film on an upper portion of the first insulating film including the soft magnetic core, and forming a second coil corresponding to the first coil, on an upper portion of the second insulating film.
- Forming the well may include etching inner sidewalls of the well to be gradually inclined from an upper portion of the well to a bottom of the well.
- Forming the first coil may further include forming a first seed film on a surface of the well, forming a first plating mold having a plurality of grooves on the first seed film, forming a plurality of coil lines constituting the first coil by filling the plurality of grooves of the first plating mold with metal, and removing the first plating mold and the first seed film under the first plating mold.
- Filling the plurality of grooves of the first plating mold with metal may include electric plating.
- Forming the second coil may further include forming a via hole by etching the first and second insulating films on both sides of the soft magnetic core, forming a second seed film on an upper surface of the second insulating film in which the via hole is formed, forming a second plating mold having a plurality of grooves on the second seed film, forming a plurality of coil lines constituting a second coil by filling the plurality of grooves of the second plating mold with metal and connecting the first coil with the second coil through the via hole, and removing the second plating mold and the second seed film under the second plating mold.
- Filling the plurality of grooves of the second plating mold with metal may include electric plating.
- The method may further include forming a protection film on the semiconductor substrate including the second coil to protect a structure formed thereon.
- At least one of the above and other features and advantages of the present invention may be realized by providing a magnetic field detecting element including a semiconductor substrate, a soft magnetic core formed on an upper portion of the semiconductor substrate, an insulating film positioned on an upper and a lower portions of the soft magnetic core, and first and second coils, each including a plurality of coil lines, formed to enclose the soft magnetic core with the insulating film intervening therebetween, wherein a well of a predetermined depth is formed in the semiconductor substrate and the plurality of coil lines constituting the first coil are arranged within the well.
- A height of the coil lines and a depth of the well may be the same.
- The first coil may be positioned at a lower portion of the soft magnetic core and the second coil may be positioned at an upper portion of the soft magnetic core, and the plurality of coil lines of the first and second coils may be connected by a third coil filling a via hole formed through the insulating film on both sides of the soft magnetic core.
- Inner sidewalls of the well may be gradually inclined from an upper portion of the well to a bottom of the well.
- The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
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FIGS. 1A through 1J illustrate cross-sectional views of stages in a general method for manufacturing a magnetic field detecting element; -
FIGS. 2A through 2K illustrate cross-sectional views of stages in a method for manufacturing a magnetic field detecting element according to an embodiment of the present invention; -
FIG. 3A illustrates a plan view showing a status that a seed film formed on a semiconductor substrate is removed by a predetermined pattern; -
FIG. 3B illustrates a plan view showing a cut-off line for cutting off the semiconductor substrate in order to insulate coil lines after forming a plurality of coil lines on the seed film shown inFIG. 3A ; -
FIG. 4 illustrates a cross-sectional view of a modified example of a method for manufacturing a magnetic field detecting element according to an embodiment of the present invention; -
FIGS. 5A through 5I illustrate cross-sectional views of stages in a method for manufacturing a magnetic field detecting element according to another embodiment of the present invention; -
FIGS. 6A through 6H illustrate cross-sectional views of stages in a method for manufacturing a magnetic field detecting element according to still another embodiment of the present invention; and -
FIGS. 7A through 7H illustrate cross-sectional views taken along line III-III ofFIGS. 6A through 6H , respectively. - Korean Patent Application Nos. 2003-11807, filed Feb. 25, 2003, and 2003-34191, filed May 28, 2003, are incorporated herein by reference in their entirety.
- The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. Like reference numerals refer to like elements throughout.
- The matters defined in the description such as a detailed construction and elements are nothing but the ones provided to assist in a comprehensive understanding of the invention. Thus, it is apparent that the present invention can be performed without those defined matters. Also, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.
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FIGS. 2A through 2K illustrate views showing stages in a method for manufacturing a magnetic field detecting element according to an embodiment of the present invention. Referring toFIG. 2A , an oxidation film (not shown) for electric insulation is formed on asemiconductor substrate 100, and afirst seed film 102 for plating is formed on the oxidation film. - Next, as shown in
FIG. 2B , thefirst seed film 102 formed on thesemiconductor substrate 100 is partially removed using a predetermined pattern such as that shown inFIG. 3A . The partial removal of thefirst seed film 102 is for insulating, in a simple manner, a plurality of coil lines constituting a first coil that is subsequently formed on thefirst seed film 102. InFIGS. 2B and 3A ,reference numeral 103 indicates a seed film pattern to be removed from thefirst seed film 102. InFIG. 3A ,reference numeral 107 indicates a position of a subsequently formed plurality of coil lines. As shown inFIG. 3A , thepattern 103 is positioned between adjacent coil lines of the plurality ofcoil lines 107, and each one of the plurality of coil lines is partitioned from adjacent coil lines and connected through the seed film 102 (ofFIG. 2B ) at edges thereof 102 a. As a result, as shown inFIG. 3B , if fourlines 110 connecting theedges 102 a of thepattern 103 are cut, the positions of the coil lines are insulated from each other. - Partial removal of the
first seed film 102 ofFIG. 2A is performed by first applying a photoresist layer (not shown) on thefirst seed film 102 and exposing and developing the photoresist layer to form a pattern. Then, theseed film pattern 103 to be removed is etched using the photoresist pattern as an etching mask. Theseed film pattern 103 to be removed is formed such thatparts 102 b, where a plurality ofcoil lines 107 constituting a first coil 106 (ofFIG. 2D ) are to be formed, are insulated from each other, and edges 102 a are connected to each other as shown inFIG. 3A . - The
seed film 102 is electrically connected from a viewpoint of theentire semiconductor substrate 100, but theparts 102 b, where the plurality ofcoil lines 107 constituting thefirst coil 106 are to be formed, are formed in such a way that theparts 102 b can be electrically insulated from each other if the connection parts, i.e., theedges 102 a, are cut. Here, generally, the first coil is formed in such a way that an exciting coil and a magnetic field detecting coil are wired one time by turns. Also, only one of either the exciting coil or the magnetic field detecting coil may be wired in a form of a solenoid. Then, thepattern 103 of theseed film 102 is removed through etching, the photoresist is removed, and partial removal of theseed film 102 is complete, as shown inFIG. 2B . - Referring to
FIG. 2C , afirst plating mold 104 is formed on an upper surface of thefirst seed film 102, which has been partially removed using thepredetermined pattern 103, and a thick photoresist layer is formed, exposed and developed on thefirst plating mold 104, thereby forming a plurality ofgrooves 104 a in thefirst plating mold 104. Each of the plurality ofgrooves 104 a of thefirst plating mold 104 is filled with metal, thereby forming a plurality ofcoil lines first coil 106, as shown inFIG. 2D . If the metal is deposited by electric plating, metal sticks to and grows on theseed film 102 at a bottom of thegrooves 104 a, whereby the plurality ofcoil lines - After planarizing or otherwise leveling an upper surface of the
first plating mold 104, a firstinsulating film 120 is formed to a predetermined thickness on the level upper surface of thefirst plating mold 104, as shown inFIG. 2E . Then, a soft magnetic material film (not shown) is stacked on an upper surface of the first insulatingfilm 120 and a softmagnetic core 122 is formed by pattern formation and etching of the soft magnetic material film, as shown inFIG. 2F . - An insulating film for forming the soft
magnetic core 122 may be formed such that thefirst plating mold 104 is removed and the insulating material is formed on thesemiconductor substrate 100 to have a height greater than that of thefirst coil 106, so that a firstinsulating film 120 a is formed, as shown inFIG. 4 . Forming theinsulation film 120 a for forming the softmagnetic core 122 according to such a method eliminates the need to perform a planarization process. - After the soft
magnetic core 122 is formed, a secondinsulating film 125 is formed to a predetermined thickness on the first insulatingfilm 120 of thesemiconductor substrate 100, as shown inFIG. 2G . Then, viaholes 135 for communicating with coil lines that form both ends of thefirst coil 106 are formed through the secondinsulating film 125. - Then, as shown in
FIG. 2H , asecond seed film 130 is formed on an upper surface of the secondinsulating film 125 and a photoresist (not shown) is thickly spread on thesecond seed film 130. Asecond plating mold 132 having a pattern that corresponds to a shape of a second coil 136 (ofFIG. 2I ), i.e., a plurality ofgrooves 132 a, is formed by exposing and developing processes. At this time, thesecond coil 136, which corresponds to thefirst coil 106, may be formed in such a way that an exciting coil and an magnetic field detecting coil are wired one time by turns, or only one of either the exciting coil or the magnetic field detecting coil may be wired in a form of a solenoid. - Each of the plurality of
grooves 132 a of thesecond plating mold 132 is then filled with metal by electric plating so that a plurality ofcoil lines second coil 136 is formed, as shown inFIG. 2I . Then, if thesecond plating mold 132 and the seed film under thatsecond plating mold 132 are removed, a magnetic field detecting element having thesecond coil 136 is obtained, as shown inFIG. 2J . - In
FIG. 2K , aprotection film 140 for protecting structures including thesecond coil 136 is formed on an upper portion of thesecond coil 136. - As previously described, after the
first coil 106, the softmagnetic core 122, and thesecond coil 136 are formed on thesemiconductor substrate 100,edge portions 102 a of thefirst seed film 102 are cut off along a cut-offline 110, as shown inFIG. 3B , by a dicing process. Thus, as shown inFIG. 3B , each of the plurality ofcoil lines 107 constituting thefirst coil 106 is electrically separated and insulated from the others. -
FIGS. 5A through 5I illustrate cross-sectional views showing stages in another method for manufacturing a magnetic field detecting element according to an embodiment of the present invention. - In
FIGS. 5A through 5I , processes up to a process for forming the secondinsulating film 125 after forming the oxidation film on thesemiconductor substrate 100, as shown inFIGS. 5A through 5E , are the same as those in the foregoing embodiment shown inFIGS. 2A through 2G . Therefore, a detailed description thereof will be omitted. - As shown in
FIG. 5F , asecond seed film 141 is formed on an upper surface of the secondinsulating film 125, and thesecond seed film 141 is partially removed in a manner similar to that used for partial removal of thefirst seed film 102. Namely, after a photoresist (not shown) is thickly spread on thesecond seed film 141, aseed film pattern 141 a to be removed is formed by exposing and developing processes. At this time, theseed film pattern 141 a to be removed is formed in such a way that each one of the plurality ofcoil lines 137 constituting thesecond coil 136 is insulated from each adjacent coil line, but each of the plurality ofcoil lines 137 is connected at edges of theseed film 141. More specifically, theseed film pattern 141 a is formed in the same manner as theseed film pattern 103 of the above-describedfirst seed film 102. - Therefore, if the
semiconductor substrate 100 is cut off along its edges, each of the plurality ofcoil lines 137 is electrically separated and insulated from the others. It is preferable that a cut-off line (not shown) of thesecond coil 136 is overlapped on the cut-offline 110 of thefirst coil 106 so that the pluralities ofcoil lines second coils - After formation of the
seed film pattern 141 a, a photoresist (not shown) is spread thickly on an upper surface of thesecond seed film 141 that has been partially removed by a predetermined pattern, and asecond plating mold 142 having a pattern that corresponds to thesecond coil 136, i.e., a plurality of thegrooves 142 a, is formed by exposing and developing processes, as shownFIG. 5G . Then, as shown inFIG. 5H , each of the plurality ofgrooves 142 a of thesecond plating mold 142 is filled with metal so that the plurality ofcoil lines - In
FIG. 5I , aprotection film 150 is then formed on an upper portion of a resultant structure including thesecond plating mold 142. Finally, thesemiconductor 100 is cut off along edges thereof according to a cut-offline 110 by the dicing process, as shown inFIG. 3B . - According to methods for manufacturing a magnetic field detecting element of the present invention as described in the above embodiments, since a plating mold does not need to be removed to perform partial removal of a seed film, it is possible to provide a simplified manufacturing process for a magnetic field detecting element in which a material used for an insulating film is relatively unrestricted.
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FIGS. 6A through 6H illustrate stages in a method for manufacturing a magnetic field detecting element according to still another embodiment of the present invention.FIGS. 7A through 7H illustrate cross-sectional views taken along line III-III ofFIG. 6A throughFIG. 6H , respectively. - Referring to
FIGS. 6H and 7H , a magnetic field detecting element manufactured according to a manufacturing method of the present invention includes asemiconductor substrate 200, a softmagnetic core 220, first and second insulatingfilms magnetic core 220, and first andsecond coils second coils magnetic core 220 with the insulatingfilms magnetic core 220 and the first andsecond coils second coils coil lines - The
first coil 250 is positioned at a lower side of the softmagnetic core 220, and thesecond coil 260 is positioned at an upper side of the softmagnetic core 220. More particularly, thesemiconductor substrate 200 has a well 211 formed therein to a depth (D ofFIG. 6B ) from an upper surface of thesemiconductor substrate 200, and thefirst coil 250 is arranged within thewell 211. Therefore, thefirst coil 250 may not be exposed to the surface of thesemiconductor substrate 200. - A height (H of
FIG. 6B ) of the plurality ofcoil lines first coil 250 formed within thewell 211 is the same as the depth of thewell 211. Therefore, an upper surface of thecoil lines 251 maintains a same plane as the upper surface of thesemiconductor substrate 200. - As described above, unlike a conventional magnetic field detecting element, since the
first coil 250 does not project beyond the upper surface of thesemiconductor substrate 200, but is formed in the well 211 of thesubstrate 200 to have an upper surface at a same plane as the upper surface of thesemiconductor substrate 200, it is easy to planarize thesemiconductor substrate 200, and it is possible to make a thickness of a planarization material, such as the insulatingfilms - Therefore, performance deterioration of a soft magnetic core generated due to unevenness in a conventional semiconductor substrate and difficulty in an etching process generated due to a thick insulating film in a conventional semiconductor substrate do not occur in the magnetic field detecting element manufactured according to an embodiment of the present invention, in which a magnetic field detecting element having high sensitivity and fine pitch between coils thereof may be formed.
- The well 211 has an approximately rectangular shape, but has inner sidewalls of that are gradually inclined from an upper portion thereof to a bottom thereof, and which may be formed by a variety of the etching technologies generally well known in the art.
- Also, as shown in
FIGS. 7G and 7H , the first andsecond coils third coil 300, which is formed upon formation of thesecond coil 260, by filling with metal throughholes magnetic core 220 and passing through the first and second insulatingfilms - A method for manufacturing the magnetic field detecting element of
FIGS. 6H and 7H according to an embodiment of the present invention will now be described with reference toFIGS. 6A through 6G andFIGS. 7A through 7G . -
FIGS. 6A and 7A illustrate cross-sectional views showing afirst plating mold 270 for forming thefirst coil 250 formed on an upper surface of thesemiconductor substrate 200 in which the well 211 is formed. Although not specifically shown inFIG. 6A or 7A, a seed film for plating is formed on a surface of the well 211, and thefirst plating mold 270 is formed by exposing and developing processes after a photoresist is thickly spread on the seed film. Thefirst plating mold 270 has a plurality ofgrooves 270 a. - If the seed film and the
first plating mold 270 are removed after the plurality ofgrooves 270 a of thefirst plating mold 270 are filled with metal by means of an electric plating method so that the plurality ofcoil lines first coil 250 as shown inFIGS. 6B and 7B is formed in the well 211 of thesemiconductor substrate 200. Thefirst coil 250 does not project above the surface of thesemiconductor substrate 200 but formed is in the same plane as thesemiconductor substrate 200. - After that, as shown in
FIGS. 6C and 7C , an insulating material is spread on the upper surface of thesemiconductor substrate 200 in which thefirst coil 250 is formed, so that the first insulatingfilm 230 for planarization and insulation is formed. Thefirst coil 250 formed in the well 211 is not projected beyond an upper surface of thesemiconductor substrate 200, but an upper surface of thefirst coil 250 is at a same plane as the upper surface of thesemiconductor substrate 200, so that planarization of thesemiconductor substrate 200 is easily performed, and the insulatingfilm 230 may be formed to be very thin as well. - After the first insulating
film 230 is formed, a soft magnetic material film is stacked on the first insulatingfilm 230 and the softmagnetic core 220 is formed by pattern formation and etching of the soft magnetic material film, as shown inFIGS. 6D and 7D . - Then, an insulating material is formed to a predetermined thickness on an upper surface of the first insulating
film 230 including the softmagnetic core 220, so that a secondinsulating film 240, as shown inFIGS. 6E and 7E , is formed. - Portions of the second
insulating film 240, which correspond to both ends of the softmagnetic core 220, are etched so that throughholes FIG. 7F , are formed, and a process for forming thesecond coil 260 proceeds. At this time, since the thickness of the first and the second insulatingfilms holes - The formation of the
second coil 260 is performed in such a manner that a seed film (not shown) is formed on an upper surface of the secondinsulating film 240 in which the throughholes second plating mold 280 having a plurality ofgrooves 280 a is formed by exposing and developing processes as shown inFIGS. 6F and 7F . - After the
second plating mold 280 is formed, each of the plurality ofgrooves 280 a is filled with metal by means of electric plating, so that a plurality ofcoil lines second coil 260 is formed, as shown inFIGS. 6G and 7G . At this time, the throughholes third coil 300 connecting thefirst coil 250 at a lower side of the softmagnetic core 220 to thesecond coil 260 at an upper side of the softmagnetic core 220. Therefore, thecoils coils magnetic core 220. - If the seed film and the
second plating mold 280 are removed after thecoil line 261 is formed, thesecond coil 260 is exposed, whereby a thin type magnetic field detecting element as shown inFIGS. 6H and 7H is manufactured. Here, the magnetic field detecting element manufactured by the present invention may reduce an entire height of the magnetic field detecting element by as much as the depth of the well 211 formed in thesemiconductor substrate 200, thus a thin structure may be realized. - On an upper surface of the
semiconductor substrate 200, a protection film for protecting structures formed thereon may be formed. - As is apparent from the foregoing, according to the present invention, since a first coil is not projected beyond an upper surface of a semiconductor substrate but is positioned within a well formed in the semiconductor substrate, it is easy to perform planarization of the semiconductor substrate, and it is possible to reduce a thickness of a planarization material as well. Therefore, performance improvement of a soft magnetic core is expected due to improvement in a degree of planarization. Further, simplification of an etching process for forming a through hole is expected due to realization of a thin insulating film. Also, a pitch between coils may be reduced due to simplification of the etching process, thus sensitivity of a sensor may be improved.
- According to the various embodiments of the present invention, manufacturing of a magnetic field detecting element is simplified, whereby productivity improvement is expected and a thin-type element of good sensitivity may be manufactured as well.
- Exemplary embodiments of the present invention have been disclosed herein and, although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.
Claims (16)
1-8. (canceled)
9. A method for manufacturing a magnetic field detecting element, comprising:
forming a well to a predetermined depth in a semiconductor substrate;
forming a first coil on the semiconductor substrate, the first coil being arranged within the well at or below an upper surface of the semiconductor substrate;
forming a first insulating film on an upper portion of the first coil and forming a soft magnetic core on an upper portion of the first insulating film;
forming a second insulating film on an upper portion of the soft magnetic core; and
forming a second coil on an upper portion of the second insulating film.
10. A method for manufacturing a magnetic field detecting element, comprising:
preparing a semiconductor substrate;
forming a well to a predetermined depth in the semiconductor substrate;
forming a first coil consisting of a plurality of coil lines within the well of the semiconductor substrate;
forming a first insulating film on an upper portion of the semiconductor substrate including the well;
forming a soft magnetic core on an upper portion of the first insulating film;
forming a second insulating film on an upper portion of the first insulating film including the soft magnetic core; and
forming a second coil corresponding to the first coil, on an upper portion of the second insulating film.
11. The method as claimed in claim 10 , wherein forming the well comprises etching inner sidewalls of the well to be gradually inclined from an upper portion of the well to a bottom of the well.
12. The method as claimed in claim 10 , wherein forming the first coil further comprises:
forming a first seed film on a surface of the well;
forming a first plating mold having a plurality of grooves on the first seed film;
forming a plurality of coil lines constituting the first coil by filling the plurality of grooves of the first plating mold with metal; and
removing the first plating mold and the first seed film under the first plating mold.
13. The method as claimed in claim 12 , wherein filling the plurality of grooves of the first plating mold with metal comprises electric plating.
14. The method as claimed in claim 10 , wherein forming the second coil further comprises:
forming a via hole by etching the first and second insulating films on both sides of the soft magnetic core;
forming a second seed film on an upper surface of the second insulating film in which the via hole is formed;
forming a second plating mold having a plurality of grooves on the second seed film;
forming a plurality of coil lines constituting a second coil by filling the plurality of grooves of the second plating mold with metal and connecting the first coil with the second coil through the via hole; and
removing the second plating mold and the second seed film under the second plating mold.
15. The method as claimed in claim 14 , wherein filling the plurality of grooves of the second plating mold with metal comprises electric plating.
16. The method as claimed in claim 10 , further comprising forming a protection film on the semiconductor substrate including the second coil to protect a structure formed thereon.
17-20. (canceled)
21. The method as claimed in claim 9 , wherein forming the well comprises etching inner sidewalls of the well to be gradually inclined from an upper portion of the well to a bottom of the well.
22. The method as claimed in claim 9 , wherein forming the first coil further comprises:
forming a first seed film on a surface of the well;
forming a first plating mold having a plurality of grooves on the first seed film;
forming a plurality of coil lines constituting the first coil by filling the plurality of grooves of the first plating mold with metal; and
removing the first plating mold and the first seed film under the first plating mold.
23. The method as claimed in claim 22 , wherein filling the plurality of grooves of the first plating mold with metal comprises electric plating.
24. The method as claimed in claim 9 , wherein forming the second coil further comprises:
forming a via hole by etching the first and second insulating films on both sides of the soft magnetic core;
forming a second seed film on an upper surface of the second insulating film in which the via hole is formed;
forming a second plating mold having a plurality of grooves on the second seed film;
forming a plurality of coil lines constituting a second coil by filling the plurality of grooves of the second plating mold with metal and connecting the first coil with the second coil through the via hole; and
removing the second plating mold and the second seed film under the second plating mold.
25. The method as claimed in claim 24 , wherein filling the plurality of grooves of the second plating mold with metal comprises electric plating.
26. The method as claimed in claim 9 , further comprising forming a protection film on the semiconductor substrate including the second coil to protect a structure formed thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/336,881 US20060115918A1 (en) | 2003-02-25 | 2006-01-23 | Method for manufacturing a magnetic field detecting element |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030011807A KR100546880B1 (en) | 2003-02-25 | 2003-02-25 | Fabricating method for micro field sensor |
KR2003-11807 | 2003-02-25 | ||
KR2003-34191 | 2003-05-28 | ||
KR10-2003-0034191A KR100518796B1 (en) | 2003-05-28 | 2003-05-28 | Magnetic field sensing device and method for fabricating thereof |
US10/784,479 US7041526B2 (en) | 2003-02-25 | 2004-02-23 | Magnetic field detecting element and method for manufacturing the same |
US11/336,881 US20060115918A1 (en) | 2003-02-25 | 2006-01-23 | Method for manufacturing a magnetic field detecting element |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/784,479 Division US7041526B2 (en) | 2003-02-25 | 2004-02-23 | Magnetic field detecting element and method for manufacturing the same |
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US20060115918A1 true US20060115918A1 (en) | 2006-06-01 |
Family
ID=36567864
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10/784,479 Expired - Lifetime US7041526B2 (en) | 2003-02-25 | 2004-02-23 | Magnetic field detecting element and method for manufacturing the same |
US11/336,881 Abandoned US20060115918A1 (en) | 2003-02-25 | 2006-01-23 | Method for manufacturing a magnetic field detecting element |
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US10/784,479 Expired - Lifetime US7041526B2 (en) | 2003-02-25 | 2004-02-23 | Magnetic field detecting element and method for manufacturing the same |
Country Status (5)
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US (2) | US7041526B2 (en) |
EP (2) | EP1602936B1 (en) |
JP (2) | JP2004258038A (en) |
AT (1) | ATE364846T1 (en) |
DE (1) | DE602004006905T2 (en) |
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US20190331742A1 (en) * | 2016-02-11 | 2019-10-31 | Texas Instruments Incorporated | Layouts for interlevel crack prevention in fluxgate technology manufacturing |
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KR100662610B1 (en) * | 2005-01-25 | 2007-01-02 | 삼성전자주식회사 | Magnetic field sensing device and method for fabricating the same |
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KR101952872B1 (en) | 2017-06-23 | 2019-05-17 | 삼성전기주식회사 | Coil component and method for fabricating the same |
WO2019018925A1 (en) * | 2017-07-25 | 2019-01-31 | Tsafaridis, Demetrius | Multi-layer thin film stress sensor for non-destructive testing of ferromagnetic materials |
TWI798287B (en) * | 2017-12-08 | 2023-04-11 | 日商日本電產理德股份有限公司 | Manufacturing method of MI element and MI element |
KR102096760B1 (en) * | 2018-07-04 | 2020-04-03 | 스템코 주식회사 | Coil device and fabricating method thereof |
JP7203400B1 (en) * | 2022-10-17 | 2023-01-13 | マグネデザイン株式会社 | Method for manufacturing GSR element |
JP7201194B1 (en) * | 2022-10-17 | 2023-01-10 | マグネデザイン株式会社 | Method for manufacturing magnetic field detection element |
JP7207676B1 (en) * | 2022-10-17 | 2023-01-18 | マグネデザイン株式会社 | Method for manufacturing GSR element |
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Also Published As
Publication number | Publication date |
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JP4633096B2 (en) | 2011-02-16 |
ATE364846T1 (en) | 2007-07-15 |
EP1602936A1 (en) | 2005-12-07 |
US7041526B2 (en) | 2006-05-09 |
EP1467216A3 (en) | 2005-01-26 |
DE602004006905T2 (en) | 2008-02-07 |
EP1467216B1 (en) | 2007-06-13 |
JP2004258038A (en) | 2004-09-16 |
EP1467216A2 (en) | 2004-10-13 |
DE602004006905D1 (en) | 2007-07-26 |
EP1602936B1 (en) | 2012-06-06 |
US20050006713A1 (en) | 2005-01-13 |
JP2008003105A (en) | 2008-01-10 |
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