FI852553A7 - Menetelmä alusta-ainepintojen aktivoimiseksi ilman sähkövirtaa suoritettavaan metallointiin. - Google Patents

Menetelmä alusta-ainepintojen aktivoimiseksi ilman sähkövirtaa suoritettavaan metallointiin. Download PDF

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Publication number
FI852553A7
FI852553A7 FI852553A FI852553A FI852553A7 FI 852553 A7 FI852553 A7 FI 852553A7 FI 852553 A FI852553 A FI 852553A FI 852553 A FI852553 A FI 852553A FI 852553 A7 FI852553 A7 FI 852553A7
Authority
FI
Finland
Prior art keywords
substrate surfaces
electroless metallization
activating substrate
activating
electroless
Prior art date
Application number
FI852553A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI852553L (fi
FI852553A0 (fi
Inventor
Gerhard Dieter Wolf
Rudolf Merten
Kirkor Sirinyan
Original Assignee
Bayer Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6239495&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI852553(A7) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bayer Ag filed Critical Bayer Ag
Publication of FI852553A0 publication Critical patent/FI852553A0/fi
Publication of FI852553L publication Critical patent/FI852553L/fi
Publication of FI852553A7 publication Critical patent/FI852553A7/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Control Of El Displays (AREA)
  • Glass Compositions (AREA)
  • Heterocyclic Compounds That Contain Two Or More Ring Oxygen Atoms (AREA)
FI852553A 1984-06-29 1985-06-27 Menetelmä alusta-ainepintojen aktivoimiseksi ilman sähkövirtaa suoritettavaan metallointiin. FI852553A7 (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843424065 DE3424065A1 (de) 1984-06-29 1984-06-29 Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung

Publications (3)

Publication Number Publication Date
FI852553A0 FI852553A0 (fi) 1985-06-27
FI852553L FI852553L (fi) 1985-12-30
FI852553A7 true FI852553A7 (fi) 1985-12-30

Family

ID=6239495

Family Applications (1)

Application Number Title Priority Date Filing Date
FI852553A FI852553A7 (fi) 1984-06-29 1985-06-27 Menetelmä alusta-ainepintojen aktivoimiseksi ilman sähkövirtaa suoritettavaan metallointiin.

Country Status (7)

Country Link
US (1) US4661384A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0166360B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6115984A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE38253T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1248414A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE3424065A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FI (1) FI852553A7 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3615831A1 (de) * 1986-05-10 1987-11-12 Bayer Ag Metallisierte membransysteme
US5389496A (en) * 1987-03-06 1995-02-14 Rohm And Haas Company Processes and compositions for electroless metallization
ATE134369T1 (de) * 1988-11-14 1996-03-15 Univ California Fluoreszierende indikatorfarbstoffe für alkalimetall-kationen, ihre herstellung und verwendung
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
DE4214905C2 (de) * 1992-05-05 1996-06-27 Friwo Silberkraft Ges Fuer Bat Verfahren zur Metallisierung von Kunststoff-Folien und deren Verwendung
US5419954A (en) * 1993-02-04 1995-05-30 The Alpha Corporation Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
US5604191A (en) * 1993-02-24 1997-02-18 Tech Spray, Inc. Composition for removal of ionic salt deposits
US5705463A (en) * 1993-02-24 1998-01-06 Tech Spray, Inc. Composition and process for removal of ionic salt deposits
DE19608354A1 (de) * 1996-02-20 1997-08-21 Univ Karlsruhe Polymere Einschlußverbindungen
JP2000096252A (ja) * 1998-09-18 2000-04-04 C Uyemura & Co Ltd ハードディスク基板へのめっき方法
FR2868085B1 (fr) * 2004-03-24 2006-07-14 Alchimer Sa Procede de revetement selectif d'une surface composite, fabrication d'interconnexions en microelectronique utilisant ce procede, et circuits integres
DE102006007397B3 (de) * 2006-02-17 2007-04-12 Forschungszentrum Karlsruhe Gmbh Verfahren zur Herstellung einer Schicht auf einem Formkörper und dessen Verwendung
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
FR2950062B1 (fr) * 2009-09-11 2012-08-03 Alchimer Solution et procede d'activation de la surface d'un substrat semi-conducteur
JP5558549B2 (ja) * 2012-12-19 2014-07-23 学校法人関東学院 めっき膜の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521445C3 (de) * 1965-06-01 1979-11-29 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Verfahren zur Herstellung von für die stromlose Metallbeschichtung aktivierten Isolierstoffoberflächen
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
US3501332A (en) * 1967-04-28 1970-03-17 Shell Oil Co Metal plating of plastics
US3681209A (en) * 1970-10-27 1972-08-01 Hooker Chemical Corp Metal plating on nonconductive substrates
DE2451217C2 (de) * 1974-10-29 1982-12-23 Basf Ag, 6700 Ludwigshafen Aktivierung von Substraten für die stromlose Metallisierung
DE2842862A1 (de) * 1978-10-02 1980-04-10 Boehringer Mannheim Gmbh Verfahren zur bestimmung von ionen, polaren und/oder lipophilen substanzen in fluessigkeiten
DE2934584A1 (de) * 1979-08-27 1981-03-19 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Aktivierungsbad sowie verfahren zur chemischen metallisierung unter dessen anwendung
EP0051946A1 (en) * 1980-11-07 1982-05-19 Imperial Chemical Industries Plc Metal complexes
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
JPS5962583A (ja) * 1982-09-30 1984-04-10 Ajinomoto Co Inc 環外にビスアミノメチル基を有するクラウンエ−テル化合物及びその製造法
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung

Also Published As

Publication number Publication date
CA1248414A (en) 1989-01-10
FI852553L (fi) 1985-12-30
FI852553A0 (fi) 1985-06-27
JPH0564236B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-14
JPS6115984A (ja) 1986-01-24
DE3565862D1 (en) 1988-12-01
ATE38253T1 (de) 1988-11-15
US4661384A (en) 1987-04-28
EP0166360A3 (en) 1987-02-04
EP0166360A2 (de) 1986-01-02
DE3424065A1 (de) 1986-01-09
EP0166360B1 (de) 1988-10-26

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Legal Events

Date Code Title Description
FA Application withdrawn [patent]

Owner name: BAYER AKTIENGESELLSCHAFT