FI122216B - Rigid-flex moduuli - Google Patents

Rigid-flex moduuli Download PDF

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Publication number
FI122216B
FI122216B FI20095005A FI20095005A FI122216B FI 122216 B FI122216 B FI 122216B FI 20095005 A FI20095005 A FI 20095005A FI 20095005 A FI20095005 A FI 20095005A FI 122216 B FI122216 B FI 122216B
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FI
Finland
Prior art keywords
layer
contact
component
conductor
conductors
Prior art date
Application number
FI20095005A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20095005A0 (fi
FI20095005A (fi
Inventor
Antti Iihola
Tuomas Waris
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Publication of FI20095005A0 publication Critical patent/FI20095005A0/fi
Priority to FI20095005A priority Critical patent/FI122216B/fi
Priority to GB0922218A priority patent/GB2469704A/en
Priority to JP2010000225A priority patent/JP5714231B2/ja
Priority to CN201810095305.3A priority patent/CN108133897B/zh
Priority to KR1020100000426A priority patent/KR101615955B1/ko
Priority to CN201010002019A priority patent/CN101770959A/zh
Priority to US12/652,399 priority patent/US9425158B2/en
Publication of FI20095005A publication Critical patent/FI20095005A/fi
Application granted granted Critical
Publication of FI122216B publication Critical patent/FI122216B/fi
Priority to US15/211,051 priority patent/US9674948B2/en
Priority to US15/407,273 priority patent/US9820375B2/en

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    • HELECTRICITY
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    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
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    • H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
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    • H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L24/82Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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FI20095005A 2009-01-05 2009-01-05 Rigid-flex moduuli FI122216B (fi)

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FI20095005A FI122216B (fi) 2009-01-05 2009-01-05 Rigid-flex moduuli
GB0922218A GB2469704A (en) 2009-01-05 2009-12-21 Rigid-flex circuit board, with embedded component, comprising a flexible region formed by removing sacrificial material
JP2010000225A JP5714231B2 (ja) 2009-01-05 2010-01-04 リジッド‐フレックス回路基板の製造方法及びリジッド‐フレックスエレクトロニクスモジュール
KR1020100000426A KR101615955B1 (ko) 2009-01-05 2010-01-05 리지드-플렉스 모듈 및 제조 방법
CN201810095305.3A CN108133897B (zh) 2009-01-05 2010-01-05 多芯片封装
CN201010002019A CN101770959A (zh) 2009-01-05 2010-01-05 刚柔结合的组件和制造方法
US12/652,399 US9425158B2 (en) 2009-01-05 2010-01-05 Rigid-flex module and manufacturing method
US15/211,051 US9674948B2 (en) 2009-01-05 2016-07-15 Rigid-flex electronic module
US15/407,273 US9820375B2 (en) 2009-01-05 2017-01-17 Rigid-flex module and manufacturing method

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Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102386329B (zh) * 2011-11-14 2014-04-30 中山大学 一种柔性电子器件的制作方法
US9818049B2 (en) * 2011-12-08 2017-11-14 Tmd Holding B.V. Anti skimming and anti shimming card feed unit, kernel element, read out unit, transaction machine and method
US9355990B2 (en) 2012-09-11 2016-05-31 Meiko Electronics Co., Ltd. Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method
JP5840598B2 (ja) 2012-12-17 2016-01-06 株式会社ジャパンディスプレイ タッチ検出機能付き表示装置、電子機器及びタッチ検出機能付き表示装置の製造方法
CN203072246U (zh) 2012-12-31 2013-07-17 奥特斯(中国)有限公司 用于生产印制电路板的半成品
JPWO2014118916A1 (ja) * 2013-01-30 2017-01-26 株式会社メイコー 部品内蔵基板の製造方法
US10219384B2 (en) 2013-11-27 2019-02-26 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Circuit board structure
AT515101B1 (de) 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
AT515447B1 (de) 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
CN105282995B (zh) * 2014-06-24 2018-04-06 健鼎(无锡)电子有限公司 移除部分的多层线路结构的方法
CN104766826B (zh) * 2015-01-23 2020-11-13 珠海欧比特宇航科技股份有限公司 一种用于飞参记录仪的存储器组件及其加工方法
DE102015113324A1 (de) 2015-08-12 2017-02-16 Schweizer Electronic Ag Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung
DE102015113322B3 (de) * 2015-08-12 2016-11-17 Schweizer Electronic Ag Hochfrequenzantenne, Hochfrequenzsubstrat mit Hochfrequenzantenne und Verfahren zur Herstellung
CN105161343A (zh) * 2015-10-19 2015-12-16 精元电脑股份有限公司 键盘电路板模组
US20170196094A1 (en) * 2015-12-30 2017-07-06 AT&S Austria Electronic component packaged in a flexible component carrier
US9633950B1 (en) * 2016-02-10 2017-04-25 Qualcomm Incorporated Integrated device comprising flexible connector between integrated circuit (IC) packages
CN107872925A (zh) 2016-09-27 2018-04-03 奥特斯奥地利科技与系统技术有限公司 将部件嵌入导电箔上的芯中
KR20200030411A (ko) * 2018-09-12 2020-03-20 엘지이노텍 주식회사 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스
CN209376018U (zh) 2018-11-14 2019-09-10 奥特斯(中国)有限公司 具有改进的弯曲性能的部件承载件
KR102653216B1 (ko) * 2018-11-16 2024-04-01 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 전자기기
CN110248500B (zh) * 2019-06-24 2021-05-04 深圳华麟电路技术有限公司 用于伸缩式摄像头的软硬结合板及其制作工艺
CN113131291B (zh) * 2021-03-11 2023-05-12 东莞市晟合科技有限公司 一种搭载电子元器件的连接线及其制作方法
CN114189998A (zh) * 2021-12-23 2022-03-15 江西荣晖电子有限公司 一种零溢胶刚挠板产品的制作方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4003344C1 (zh) 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
JPH05267846A (ja) * 1992-03-17 1993-10-15 Hitachi Chem Co Ltd フレックス・リジット配線板の製造法
JP3310037B2 (ja) * 1993-01-05 2002-07-29 株式会社東芝 プリント配線板の製造方法
JPH08125342A (ja) * 1994-10-21 1996-05-17 Nec Corp フレキシブル多層配線基板とその製造方法
JPH08288655A (ja) * 1995-04-18 1996-11-01 Nippon Avionics Co Ltd フレックス・リジッド・プリント配線板の製造方法
JP2001015917A (ja) * 1999-06-30 2001-01-19 Toshiba Corp リジッドフレックスプリント配線板の製造方法
JP2001308540A (ja) * 2000-04-21 2001-11-02 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法
US6686298B1 (en) 2000-06-22 2004-02-03 Micron Technology, Inc. Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates
JP2004140018A (ja) * 2002-10-15 2004-05-13 Denso Corp 多層基板の製造方法、多層基板、及びそれを用いたモバイル機器
FI115601B (fi) 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
JPWO2004093508A1 (ja) * 2003-04-18 2006-07-13 イビデン株式会社 フレックスリジッド配線板
FI20031341A (fi) * 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US20050092519A1 (en) * 2003-11-05 2005-05-05 Beauchamp John K. Partially flexible circuit board
FI117814B (fi) 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
JP2006140213A (ja) * 2004-11-10 2006-06-01 Cmk Corp リジッドフレックス多層プリント配線板
FI117369B (fi) 2004-11-26 2006-09-15 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
DE102004057505B4 (de) * 2004-11-29 2008-08-21 Lisa Dräxlmaier GmbH Elektrisches Funktionsbauteil
JP2006202889A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックス多層プリント配線板の製造方法
FI122128B (fi) 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
KR101004994B1 (ko) * 2005-07-29 2011-01-04 교에이 덴시 가부시키가이샤 굴곡식 리지드 프린트 배선판 및 그 제조 방법
US20090032757A1 (en) 2005-07-29 2009-02-05 Yasuhide Maruyama Valve Having Diameter-Reducible Joint Part, Joint for Diameter Reduction, and Plumbing System Using These
US8335084B2 (en) * 2005-08-01 2012-12-18 Georgia Tech Research Corporation Embedded actives and discrete passives in a cavity within build-up layers
US7523547B2 (en) 2005-08-31 2009-04-28 International Business Machines Corporation Method for attaching a flexible structure to a device and a device having a flexible structure
JP4592751B2 (ja) * 2005-10-14 2010-12-08 株式会社フジクラ プリント配線基板の製造方法
FI20060256L (fi) * 2006-03-17 2006-03-20 Imbera Electronics Oy Piirilevyn valmistaminen ja komponentin sisältävä piirilevy
KR100800475B1 (ko) 2006-07-10 2008-02-04 삼성전자주식회사 적층형 반도체 패키지 및 그 제조방법
KR100754080B1 (ko) 2006-07-13 2007-08-31 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
JP5168838B2 (ja) * 2006-07-28 2013-03-27 大日本印刷株式会社 多層プリント配線板及びその製造方法
WO2008027396A1 (en) * 2006-08-28 2008-03-06 Chipstack Inc. Rigid flex printed circuit board
US7659617B2 (en) 2006-11-30 2010-02-09 Tessera, Inc. Substrate for a flexible microelectronic assembly and a method of fabricating thereof
KR100837276B1 (ko) 2006-12-20 2008-06-11 삼성전자주식회사 인쇄 회로 기판 및 이를 사용하는 반도체 메모리 모듈
AT11664U1 (de) * 2007-02-16 2011-02-15 Austria Tech & System Tech Verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hiefür
CN100501991C (zh) * 2007-06-29 2009-06-17 中兴通讯股份有限公司 一种封装芯片及对芯片进行封装的方法
TWI345432B (en) * 2007-07-26 2011-07-11 Nan Ya Printed Circuit Board Corp Method for manufacturing a rigid-flex circuit board
US9885154B2 (en) 2009-01-28 2018-02-06 Donaldson Company, Inc. Fibrous media

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US9425158B2 (en) 2016-08-23
US9674948B2 (en) 2017-06-06
US20100170703A1 (en) 2010-07-08
US9820375B2 (en) 2017-11-14
CN101770959A (zh) 2010-07-07
JP2010157739A (ja) 2010-07-15
FI20095005A0 (fi) 2009-01-05
US20170127508A1 (en) 2017-05-04
CN108133897B (zh) 2022-05-03
CN108133897A (zh) 2018-06-08
KR20100081282A (ko) 2010-07-14
GB2469704A (en) 2010-10-27
GB0922218D0 (en) 2010-02-03
JP5714231B2 (ja) 2015-05-07
KR101615955B1 (ko) 2016-04-28
FI20095005A (fi) 2010-07-15

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