FI122216B - Rigid-flex moduuli - Google Patents
Rigid-flex moduuli Download PDFInfo
- Publication number
- FI122216B FI122216B FI20095005A FI20095005A FI122216B FI 122216 B FI122216 B FI 122216B FI 20095005 A FI20095005 A FI 20095005A FI 20095005 A FI20095005 A FI 20095005A FI 122216 B FI122216 B FI 122216B
- Authority
- FI
- Finland
- Prior art keywords
- layer
- contact
- component
- conductor
- conductors
- Prior art date
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Classifications
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095005A FI122216B (fi) | 2009-01-05 | 2009-01-05 | Rigid-flex moduuli |
GB0922218A GB2469704A (en) | 2009-01-05 | 2009-12-21 | Rigid-flex circuit board, with embedded component, comprising a flexible region formed by removing sacrificial material |
JP2010000225A JP5714231B2 (ja) | 2009-01-05 | 2010-01-04 | リジッド‐フレックス回路基板の製造方法及びリジッド‐フレックスエレクトロニクスモジュール |
KR1020100000426A KR101615955B1 (ko) | 2009-01-05 | 2010-01-05 | 리지드-플렉스 모듈 및 제조 방법 |
CN201810095305.3A CN108133897B (zh) | 2009-01-05 | 2010-01-05 | 多芯片封装 |
CN201010002019A CN101770959A (zh) | 2009-01-05 | 2010-01-05 | 刚柔结合的组件和制造方法 |
US12/652,399 US9425158B2 (en) | 2009-01-05 | 2010-01-05 | Rigid-flex module and manufacturing method |
US15/211,051 US9674948B2 (en) | 2009-01-05 | 2016-07-15 | Rigid-flex electronic module |
US15/407,273 US9820375B2 (en) | 2009-01-05 | 2017-01-17 | Rigid-flex module and manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095005 | 2009-01-05 | ||
FI20095005A FI122216B (fi) | 2009-01-05 | 2009-01-05 | Rigid-flex moduuli |
Publications (3)
Publication Number | Publication Date |
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FI20095005A0 FI20095005A0 (fi) | 2009-01-05 |
FI20095005A FI20095005A (fi) | 2010-07-15 |
FI122216B true FI122216B (fi) | 2011-10-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20095005A FI122216B (fi) | 2009-01-05 | 2009-01-05 | Rigid-flex moduuli |
Country Status (6)
Country | Link |
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US (3) | US9425158B2 (zh) |
JP (1) | JP5714231B2 (zh) |
KR (1) | KR101615955B1 (zh) |
CN (2) | CN108133897B (zh) |
FI (1) | FI122216B (zh) |
GB (1) | GB2469704A (zh) |
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CN203072246U (zh) | 2012-12-31 | 2013-07-17 | 奥特斯(中国)有限公司 | 用于生产印制电路板的半成品 |
JPWO2014118916A1 (ja) * | 2013-01-30 | 2017-01-26 | 株式会社メイコー | 部品内蔵基板の製造方法 |
US10219384B2 (en) | 2013-11-27 | 2019-02-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
AT515101B1 (de) | 2013-12-12 | 2015-06-15 | Austria Tech & System Tech | Verfahren zum Einbetten einer Komponente in eine Leiterplatte |
AT515447B1 (de) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte |
US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
CN105282995B (zh) * | 2014-06-24 | 2018-04-06 | 健鼎(无锡)电子有限公司 | 移除部分的多层线路结构的方法 |
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-
2009
- 2009-01-05 FI FI20095005A patent/FI122216B/fi active IP Right Grant
- 2009-12-21 GB GB0922218A patent/GB2469704A/en not_active Withdrawn
-
2010
- 2010-01-04 JP JP2010000225A patent/JP5714231B2/ja active Active
- 2010-01-05 CN CN201810095305.3A patent/CN108133897B/zh active Active
- 2010-01-05 KR KR1020100000426A patent/KR101615955B1/ko active IP Right Grant
- 2010-01-05 US US12/652,399 patent/US9425158B2/en active Active
- 2010-01-05 CN CN201010002019A patent/CN101770959A/zh active Pending
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2016
- 2016-07-15 US US15/211,051 patent/US9674948B2/en active Active
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2017
- 2017-01-17 US US15/407,273 patent/US9820375B2/en active Active
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US20160330830A1 (en) | 2016-11-10 |
US9425158B2 (en) | 2016-08-23 |
US9674948B2 (en) | 2017-06-06 |
US20100170703A1 (en) | 2010-07-08 |
US9820375B2 (en) | 2017-11-14 |
CN101770959A (zh) | 2010-07-07 |
JP2010157739A (ja) | 2010-07-15 |
FI20095005A0 (fi) | 2009-01-05 |
US20170127508A1 (en) | 2017-05-04 |
CN108133897B (zh) | 2022-05-03 |
CN108133897A (zh) | 2018-06-08 |
KR20100081282A (ko) | 2010-07-14 |
GB2469704A (en) | 2010-10-27 |
GB0922218D0 (en) | 2010-02-03 |
JP5714231B2 (ja) | 2015-05-07 |
KR101615955B1 (ko) | 2016-04-28 |
FI20095005A (fi) | 2010-07-15 |
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