FI120997B - Taipuisa piirilevy - Google Patents
Taipuisa piirilevy Download PDFInfo
- Publication number
- FI120997B FI120997B FI20022140A FI20022140A FI120997B FI 120997 B FI120997 B FI 120997B FI 20022140 A FI20022140 A FI 20022140A FI 20022140 A FI20022140 A FI 20022140A FI 120997 B FI120997 B FI 120997B
- Authority
- FI
- Finland
- Prior art keywords
- circuit board
- flexible circuit
- electrically insulating
- flexible
- conductive strips
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims description 176
- 239000000758 substrate Substances 0.000 claims description 54
- 238000000576 coating method Methods 0.000 claims description 36
- 239000011248 coating agent Substances 0.000 claims description 33
- 230000007935 neutral effect Effects 0.000 claims description 31
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 239000004642 Polyimide Substances 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 9
- 229910000906 Bronze Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000010974 bronze Substances 0.000 claims description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 17
- 238000012360 testing method Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012384 transportation and delivery Methods 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001376322A JP4063533B2 (ja) | 2001-12-10 | 2001-12-10 | フレキシブル配線板 |
JP2001376322 | 2001-12-10 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20022140A0 FI20022140A0 (fi) | 2002-12-04 |
FI20022140A FI20022140A (fi) | 2003-06-11 |
FI120997B true FI120997B (fi) | 2010-05-31 |
Family
ID=19184539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20022140A FI120997B (fi) | 2001-12-10 | 2002-12-04 | Taipuisa piirilevy |
Country Status (5)
Country | Link |
---|---|
US (1) | US6737589B2 (zh) |
JP (1) | JP4063533B2 (zh) |
KR (1) | KR100496485B1 (zh) |
CN (1) | CN1269388C (zh) |
FI (1) | FI120997B (zh) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6885549B2 (en) * | 2002-04-11 | 2005-04-26 | Dell Products L.P. | System and method for flexible circuits |
US7116522B2 (en) * | 2003-05-19 | 2006-10-03 | Hewlett-Packard Development Company, L.P. | System and method related to a flexible circuit |
WO2004110114A1 (en) * | 2003-06-02 | 2004-12-16 | Showa Denko K.K. | Flexible wiring board and flex-rigid wiring board |
EP1551037A1 (de) * | 2004-01-05 | 2005-07-06 | Alcan Technology & Management Ltd. | Flexibler Träger mit elektrisch leitfähiger Struktur |
JP2005340382A (ja) * | 2004-05-25 | 2005-12-08 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法 |
US7331010B2 (en) | 2004-10-29 | 2008-02-12 | International Business Machines Corporation | System, method and storage medium for providing fault detection and correction in a memory subsystem |
US7354794B2 (en) * | 2005-02-18 | 2008-04-08 | Lexmark International, Inc. | Printed conductive connectors |
JP2007005782A (ja) * | 2005-05-27 | 2007-01-11 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
KR100640659B1 (ko) * | 2005-08-01 | 2006-11-01 | 삼성전자주식회사 | 가요성 인쇄회로 및 이의 제조방법 |
US7518831B2 (en) * | 2005-10-04 | 2009-04-14 | Certance Llc | Low impedance flexible circuit for tape head |
US7685392B2 (en) | 2005-11-28 | 2010-03-23 | International Business Machines Corporation | Providing indeterminate read data latency in a memory system |
KR100666224B1 (ko) * | 2006-02-27 | 2007-01-09 | 삼성전자주식회사 | 개구를 가지는 리지드 플렉시블 인쇄회로기판 |
JP4912960B2 (ja) * | 2007-06-06 | 2012-04-11 | 日本メクトロン株式会社 | プリント配線板 |
JP5000451B2 (ja) * | 2007-10-15 | 2012-08-15 | 日東電工株式会社 | 配線回路基板 |
KR100956238B1 (ko) * | 2007-12-18 | 2010-05-04 | 삼성전기주식회사 | 굴곡성 인쇄회로기판 및 그 제조방법 |
JP2009188379A (ja) * | 2008-01-07 | 2009-08-20 | Nitto Denko Corp | 配線回路基板 |
JP2009177030A (ja) * | 2008-01-25 | 2009-08-06 | Opnext Japan Inc | 光送信モジュール及び光伝送装置 |
KR100987191B1 (ko) | 2008-04-18 | 2010-10-11 | (주)기가레인 | 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판 |
US7812258B2 (en) * | 2008-04-23 | 2010-10-12 | Hitachi Global Storage Technologies Netherlands, B.V. | Flex cable with biased neutral axis |
JP2009302342A (ja) * | 2008-06-13 | 2009-12-24 | Denso Corp | 多層基板及びその設計方法 |
WO2010058622A1 (ja) * | 2008-11-19 | 2010-05-27 | シャープ株式会社 | フレキシブル基板およびそれを備えた表示装置 |
JP5407404B2 (ja) * | 2009-02-19 | 2014-02-05 | ソニー株式会社 | 配線基板とその製造方法、チューナモジュール、及び電子機器 |
CN102474978B (zh) * | 2009-07-13 | 2015-08-19 | 株式会社村田制作所 | 信号线路及其制造方法 |
WO2011018979A1 (ja) | 2009-08-11 | 2011-02-17 | 株式会社村田製作所 | 多層基板 |
KR101130697B1 (ko) * | 2010-05-07 | 2012-04-02 | 삼성전자주식회사 | 복수 층의 신축성 배선 |
WO2013005549A1 (ja) * | 2011-07-05 | 2013-01-10 | 株式会社村田製作所 | フレキシブル多層基板 |
JP5703525B2 (ja) * | 2011-08-23 | 2015-04-22 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板及び該フレキシブルプリント配線板の製造方法 |
US9131602B2 (en) * | 2012-02-24 | 2015-09-08 | Mediatek Inc. | Printed circuit board for mobile platforms |
WO2014065172A1 (ja) * | 2012-10-26 | 2014-05-01 | 株式会社村田製作所 | フレキシブル基板 |
US9560748B2 (en) | 2013-01-04 | 2017-01-31 | Bose Corporation | Flexible printed circuit |
KR101473312B1 (ko) * | 2013-05-31 | 2014-12-16 | 삼성디스플레이 주식회사 | 플렉시블 터치스크린패널과 그것을 구비한 플렉시블 디스플레이 장치 |
KR102062108B1 (ko) * | 2013-06-10 | 2020-01-03 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조 방법 |
CN104349575B (zh) * | 2013-07-31 | 2017-12-26 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板及其制作方法 |
JP5658399B1 (ja) * | 2014-05-21 | 2015-01-21 | 株式会社フジクラ | プリント配線板 |
TWI552039B (zh) * | 2014-06-27 | 2016-10-01 | 群創光電股份有限公司 | 觸控顯示裝置 |
KR102320382B1 (ko) * | 2015-01-28 | 2021-11-02 | 삼성디스플레이 주식회사 | 전자 장치 |
JP6426067B2 (ja) * | 2015-08-06 | 2018-11-21 | 日本メクトロン株式会社 | 多層フレキシブルプリント配線板およびその製造方法 |
US10111329B2 (en) * | 2015-12-18 | 2018-10-23 | Portwell Inc. | Flexible flat cable structure capable of improving crosstalk interference |
CN105407632B (zh) * | 2015-12-29 | 2018-06-29 | 广东欧珀移动通信有限公司 | 柔性电路板走线结构及移动终端 |
KR20210026209A (ko) * | 2019-08-29 | 2021-03-10 | 삼성전자주식회사 | 인쇄회로 기판 및 그를 포함하는 전자 장치 |
CN113766725B (zh) * | 2020-06-03 | 2023-06-20 | 鹏鼎控股(深圳)股份有限公司 | 高频电路板及其制作方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
US5136123A (en) * | 1987-07-17 | 1992-08-04 | Junkosha Co., Ltd. | Multilayer circuit board |
US4864722A (en) * | 1988-03-16 | 1989-09-12 | International Business Machines Corporation | Low dielectric printed circuit boards |
FR2640457B1 (fr) * | 1988-12-09 | 1991-01-25 | Thomson Csf | Dispositif de raccordement de composants et module fonctionnel l'utilisant |
US5285018A (en) * | 1992-10-02 | 1994-02-08 | International Business Machines Corporation | Power and signal distribution in electronic packaging |
WO1994018812A1 (en) * | 1993-02-02 | 1994-08-18 | Ast Research, Inc. | A circuit board arrangement including shielding grids, and constructing thereof |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
JPH0837351A (ja) * | 1994-07-21 | 1996-02-06 | Amp Japan Ltd | フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板 |
JP3113153B2 (ja) * | 1994-07-26 | 2000-11-27 | 株式会社東芝 | 多層配線構造の半導体装置 |
JP3263705B2 (ja) * | 1995-09-21 | 2002-03-11 | 三菱電機株式会社 | プリント配線板およびフラットパネル・ディスプレイ駆動回路用プリント配線板およびフラットパネル・ディスプレイ装置 |
JP3062435B2 (ja) * | 1995-11-10 | 2000-07-10 | 日本碍子株式会社 | フレキシブル基板並びにそれに用いるBe−Cu合金箔およびその製造方法 |
JPH10303521A (ja) * | 1997-04-23 | 1998-11-13 | Hitachi Ltd | 伝送線路基板 |
US6495770B2 (en) * | 2000-12-04 | 2002-12-17 | Intel Corporation | Electronic assembly providing shunting of electrical current |
US20020189854A1 (en) * | 2001-04-10 | 2002-12-19 | Crumly William R. | Design for long fatigue life in flexible circuits |
-
2001
- 2001-12-10 JP JP2001376322A patent/JP4063533B2/ja not_active Expired - Fee Related
-
2002
- 2002-12-02 US US10/308,212 patent/US6737589B2/en not_active Expired - Lifetime
- 2002-12-04 FI FI20022140A patent/FI120997B/fi not_active IP Right Cessation
- 2002-12-09 KR KR10-2002-0077836A patent/KR100496485B1/ko not_active IP Right Cessation
- 2002-12-10 CN CNB021540985A patent/CN1269388C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6737589B2 (en) | 2004-05-18 |
KR100496485B1 (ko) | 2005-06-22 |
US20030116343A1 (en) | 2003-06-26 |
FI20022140A0 (fi) | 2002-12-04 |
CN1427662A (zh) | 2003-07-02 |
CN1269388C (zh) | 2006-08-09 |
JP2003179317A (ja) | 2003-06-27 |
KR20030047829A (ko) | 2003-06-18 |
JP4063533B2 (ja) | 2008-03-19 |
FI20022140A (fi) | 2003-06-11 |
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Legal Events
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FG | Patent granted |
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