FI103994B1 - Menetelmä sähköä johtamattomien substraattien metalloimiseksi - Google Patents

Menetelmä sähköä johtamattomien substraattien metalloimiseksi

Info

Publication number
FI103994B1
FI103994B1 FI960171A FI960171A FI103994B1 FI 103994 B1 FI103994 B1 FI 103994B1 FI 960171 A FI960171 A FI 960171A FI 960171 A FI960171 A FI 960171A FI 103994 B1 FI103994 B1 FI 103994B1
Authority
FI
Finland
Prior art keywords
pct
film
metallization
sec
conductive substrates
Prior art date
Application number
FI960171A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI960171A (fi
FI103994B (fi
FI960171A0 (fi
Inventor
Marcel Negrerie
Hollain Guy De
Guyen Van Huu N
Serge Insenga
Original Assignee
Trefimetaux
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trefimetaux filed Critical Trefimetaux
Publication of FI960171A0 publication Critical patent/FI960171A0/fi
Publication of FI960171A publication Critical patent/FI960171A/fi
Application granted granted Critical
Publication of FI103994B publication Critical patent/FI103994B/fi
Publication of FI103994B1 publication Critical patent/FI103994B1/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H01M4/80—Porous plates, e.g. sintered carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FI960171A 1993-07-16 1996-01-15 Menetelmä sähköä johtamattomien substraattien metalloimiseksi FI103994B1 (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FR9308986 1993-07-16
FR9308986A FR2707673B1 (fr) 1993-07-16 1993-07-16 Procédé de métallisation de substrats non-conducteurs.
FR9400860 1994-01-26
PCT/FR1994/000860 WO1995002715A1 (fr) 1993-07-16 1994-07-11 Procede de metalisation de substrats non-conducteurs

Publications (4)

Publication Number Publication Date
FI960171A0 FI960171A0 (fi) 1996-01-15
FI960171A FI960171A (fi) 1996-03-15
FI103994B FI103994B (fi) 1999-10-29
FI103994B1 true FI103994B1 (fi) 1999-10-29

Family

ID=9449480

Family Applications (1)

Application Number Title Priority Date Filing Date
FI960171A FI103994B1 (fi) 1993-07-16 1996-01-15 Menetelmä sähköä johtamattomien substraattien metalloimiseksi

Country Status (14)

Country Link
US (1) US5674373A (xx)
EP (1) EP0708847B1 (xx)
JP (1) JPH09500174A (xx)
KR (1) KR100309196B1 (xx)
AT (1) ATE150805T1 (xx)
CA (1) CA2167074C (xx)
DE (1) DE69402319T2 (xx)
ES (1) ES2099625T3 (xx)
FI (1) FI103994B1 (xx)
FR (1) FR2707673B1 (xx)
GR (1) GR3022955T3 (xx)
NO (1) NO315279B1 (xx)
PL (1) PL312570A1 (xx)
WO (1) WO1995002715A1 (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2320728A (en) * 1996-12-30 1998-07-01 Coates Brothers Plc Depositing a metallic film involving pretreatment
US6547934B2 (en) 1998-05-18 2003-04-15 Applied Materials, Inc. Reduction of metal oxide in a dual frequency etch chamber
US6297147B1 (en) 1998-06-05 2001-10-02 Applied Materials, Inc. Plasma treatment for ex-situ contact fill
US7053002B2 (en) 1998-12-04 2006-05-30 Applied Materials, Inc Plasma preclean with argon, helium, and hydrogen gases
US6372301B1 (en) * 1998-12-22 2002-04-16 Applied Materials, Inc. Method of improving adhesion of diffusion layers on fluorinated silicon dioxide
US6821571B2 (en) 1999-06-18 2004-11-23 Applied Materials Inc. Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers
FR2799475B1 (fr) * 1999-10-11 2002-02-01 Centre Nat Rech Scient Procede de metallisation d'un substrat isolant par voie electrochimique
US6632344B1 (en) * 2000-03-24 2003-10-14 Robert L. Goldberg Conductive oxide coating process
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
JP3761892B1 (ja) * 2004-10-19 2006-03-29 シャープ株式会社 繊維構造体に制電性を付与する方法およびその方法によって制電性が付与された繊維構造体
JP4803549B2 (ja) * 2006-03-03 2011-10-26 地方独立行政法人 大阪市立工業研究所 亜酸化銅膜に金属銅層を形成する方法
JP6177065B2 (ja) * 2013-09-11 2017-08-09 株式会社クラレ 金属レプリカ及びスタンパの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2893930A (en) * 1956-10-03 1959-07-07 Gen Lab Associates Inc Process of making a ceramic element usable in surface-gap igniters
GB927205A (en) * 1959-08-26 1963-05-29 Nat Res Dev Methods of applying metal deposits to resistive oxide films
US3146125A (en) * 1960-05-31 1964-08-25 Day Company Method of making printed circuits
US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
US5389270A (en) * 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating

Also Published As

Publication number Publication date
KR100309196B1 (ko) 2002-07-02
FI960171A (fi) 1996-03-15
CA2167074A1 (fr) 1995-01-26
CA2167074C (fr) 2004-09-14
NO960178D0 (no) 1996-01-15
WO1995002715A1 (fr) 1995-01-26
NO960178L (no) 1996-01-15
ATE150805T1 (de) 1997-04-15
FR2707673A1 (fr) 1995-01-20
EP0708847A1 (fr) 1996-05-01
GR3022955T3 (en) 1997-06-30
JPH09500174A (ja) 1997-01-07
FI103994B (fi) 1999-10-29
FR2707673B1 (fr) 1995-08-18
US5674373A (en) 1997-10-07
ES2099625T3 (es) 1997-05-16
DE69402319T2 (de) 1997-08-07
PL312570A1 (en) 1996-04-29
EP0708847B1 (fr) 1997-03-26
FI960171A0 (fi) 1996-01-15
NO315279B1 (no) 2003-08-11
DE69402319D1 (de) 1997-04-30

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