KR980007876A - 프린트회로기판용 구리박 및 그 제조방법과 이 구리박을 사용한 적층체 및 프린트회로기판 - Google Patents

프린트회로기판용 구리박 및 그 제조방법과 이 구리박을 사용한 적층체 및 프린트회로기판 Download PDF

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KR980007876A
KR980007876A KR1019970025205A KR19970025205A KR980007876A KR 980007876 A KR980007876 A KR 980007876A KR 1019970025205 A KR1019970025205 A KR 1019970025205A KR 19970025205 A KR19970025205 A KR 19970025205A KR 980007876 A KR980007876 A KR 980007876A
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copper foil
layer
benzotriazole
printed circuit
circuit board
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KR1019970025205A
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KR100299156B1 (ko
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마코토 도바시
히로아키 쿠리하라
토시코 요코타
히로시 하타
나오토미 타카하시
타쯔야 수도
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사코 유키오
미쯔이킨조쿠코교 가부시기가이샤
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • C23C22/26—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds containing also organic compounds
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12611—Oxide-containing component
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    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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    • Y10T428/273—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.] of coating

Abstract

본 발명은, 내상처성이 개선되고, 그 결과 구리박의 상처나 갈라진 곳의 발생을 최소한으로 할 수 있고, 또한 구리박으로의 수지입자의 부착을 방지할 수 있는, 프린트회로기판제조용 구리박 및 이 구리박을 작성하는 방법을 제공하는 것을 과제로 하며, 그 해결수단으로서 표면위에, 아연 또는 아연합금으로 이루어진 제1층과, 향상된 내상처성을 가지는 데 충분한 두께를 가진 벤조트리아졸 또는 그 유도체로 이루어진 제2층을 구비하는 프린트회로기판용 구리박에 관한 것이다.

Description

프린트회로기판용 구리박 및 그 제조방법과 이 구리박을 사용한 적층체 및 프린트회로기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 1은 구리박의 상처수와 BAT의 퇴적량과의 관계를 표시한 그래프, 도 2는 소정의 BAT퇴적량에 달할 때까지의, BAT용액의 액온과 접촉시간과의 관계를 표시한 그래프.

Claims (18)

  1. 프린트회로기판용 구리박에 있어서, 상기 구리박의 표면위에 아연 또는 아연합금으로 이루어진 제1층과, 증진시킨 내상처성을 부여하는데 충분한 두께를 가진 벤조트리아졸 또는 그 유도체로 이루어진 제2층을 도포해서 내상처성을 개선한 것을 특징으로 하는 상기 프린트회로기판용 구리박.
  2. 제1항에 있어서, 상기 제2층이, 적어도 5㎎/㎡의 균일한 퇴적층인 것을 특징으로 하는 프린트회로기판용 구리박.
  3. 제2항에 있어서, 상기 제2층이 5~8㎎/㎡의 균일한 퇴적층인 것을 특징으로 하는 프린트회로기판용 구리박.
  4. 제1항에 있어서, 상기 제1층과 제2층과의 사이에 배치된 크로메이트층을 또 포함하고, 이 크로메이트층이 1.5㎎/㎡이하인 것을 특징으로 하는 프린트회로기판용 구리박.
  5. 제1항에 있어서, 상기 제2의 층을 소망의 두께로 퇴적하는데 충분한 시간을 걸어서, 적어도 액은 20℃의 벤조트리아졸수용액을 사용해서 상기 제1의 층을 함유한 구리에 접촉시켜서, 상기 제2의 벤조트리아졸층을 퇴적시키는 것을 특징으로 하는 프린트회로기판용 구리박.
  6. 제5항에 있어서, 상기 퇴적온도가 40에서 70℃인 것을 특징으로 하는 프린트회로기판용 구리박.
  7. 제5항에 있어서, 상기 제2의 층이 퇴적된 후, 수세되는 것을 특징으로 하는 프린트회로기판용 구리박.
  8. 제1항에 있어서, 상기 제1층 및 제2층이, 상기 구리박의 공택면위에 도포되는 것을 특징으로 하는 프린트회로기판용 구리박.
  9. 기판의 층 및 청구항 1에 기재된 구리박의 적어도 1개의 층을 구비하는 적층제로서, 상기 제1층 및 제2층을 포함한 구리박표면이 노출되고 있는 것을 특징으로 하는 이 구리박을 사용한 적층체.
  10. 청구항 9에 기재된 적어도 1개의 적층체를 구비하는 것을 특징으로 하는 프린트회로기판.
  11. 구리박을 충분한 벤조트리아졸을 퇴적하는 데 충분한 온도 및 시간으로 벤조트리아졸수용액과 접촉시켜서 증진시킨 내상처성을 부여하는 것을 특징으로 하는 구리박에 벤조트리아졸 보호층을 도포하는 방법.
  12. 제11항에 있어서, 상기 용액을 적어도 20℃의 액온으로 상기 구리박에 도포하는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
  13. 제12항에 있어서, 상기 용액 40 ~ 70℃의 액온에서 상기 구리박에 도포하는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
  14. 제11항에 있어서, 상기 벤조트리아졸을, 구리박에 대해서 적어도 5㎎/㎡의 층에서 퇴적하는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
  15. 제14항에 있어서, 상기 벤조트리아졸을, 구리박에 대해서 약 약 5~8㎎/㎡의 층에서 퇴적하는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
  16. 제11항에 있어서, 상기 구리박이 상기 벤조트리아졸을 퇴적하기 전에 퇴적된 아연 또는 아연합금의 층을 포함하는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
  17. 제16항에 있어서, 상기 구리박이 상기 아연 또는 아연합금의 층과 상기 벤조트리아졸과의 사이에 퇴적된 크로메이트층을 포함하는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
  18. 제11항에 있어서, 상기 벤조트리아졸수용액을 상기 구리박의 광택면에 접촉시키는 것을 특징으로 하는 구리박에 벤조트리아졸보호층을 도포하는 방법.
KR1019970025205A 1996-06-17 1997-06-17 프린트회로기판용구리박및그제조방법과이구리박을사용한적층제및프린트회로기판 KR100299156B1 (ko)

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Publication number Priority date Publication date Assignee Title
FR2804973B1 (fr) 2000-02-11 2002-09-20 Univ Paris 7 Denis Diderot Materiau metallique dont la surface est modifiee, son procede de preparation et utilisation du materiau modifie
JP4309602B2 (ja) 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
US6770976B2 (en) 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
JP4330979B2 (ja) * 2003-11-13 2009-09-16 福田金属箔粉工業株式会社 表面処理電解銅箔
US7383629B2 (en) * 2004-11-19 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
JP4884298B2 (ja) * 2007-05-17 2012-02-29 日本化薬株式会社 樹脂層付き銅箔
MY162358A (en) * 2010-11-22 2017-06-15 Mitsui Mining & Smelting Co Surface-treated copper foil
JP2012158828A (ja) * 2011-02-03 2012-08-23 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法
US10057984B1 (en) * 2017-02-02 2018-08-21 Chang Chun Petrochemical Co., Ltd. Composite thin copper foil and carrier

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4093768A (en) 1976-02-19 1978-06-06 Freeman Chemical Corporation Copper foil electrical laminate with reinforced plastics
US4731128A (en) 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion
JPH01240683A (ja) 1988-03-19 1989-09-26 Sanshin Kagaku Kogyo Kk 銅のエッチング液組成物およびエッチング方法
JPH0783168B2 (ja) 1988-04-13 1995-09-06 株式会社日立製作所 プリント板の製造方法
JPH0366496A (ja) 1989-08-03 1991-03-22 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
JPH04202780A (ja) 1990-11-30 1992-07-23 Shikoku Chem Corp 銅及び銅合金の表面処理方法並びに印刷配線板
JP2575242B2 (ja) 1991-07-17 1997-01-22 タムラ化研株式会社 プリント配線板用表面保護剤
JPH0685417A (ja) 1992-08-28 1994-03-25 Nikko Guurudo Foil Kk 印刷回路用銅箔の表面処理方法
JPH0685455A (ja) 1992-08-28 1994-03-25 Nikko Guurudo Foil Kk 印刷回路用銅箔の表面処理方法
JP3329572B2 (ja) 1994-04-15 2002-09-30 福田金属箔粉工業株式会社 印刷回路用銅箔およびその表面処理方法
TW256858B (en) 1994-08-30 1995-09-11 Mitsui Mining & Smelting Co Copper foil for printed circuit board

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DE69707568D1 (de) 2001-11-29
JPH1068087A (ja) 1998-03-10
CN1116789C (zh) 2003-07-30
CN1174491A (zh) 1998-02-25
EP0814644A1 (en) 1997-12-29
EP0814644B1 (en) 2001-10-24
US6322904B1 (en) 2001-11-27
DE69707568T2 (de) 2002-07-11
TW369785B (en) 1999-09-11
ID17285A (id) 1997-12-18
ES2162160T3 (es) 2001-12-16

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