DE3788564D1 - Verfahren zur Vorbehandlung eines Substrates für die stromlose Metallisierung. - Google Patents

Verfahren zur Vorbehandlung eines Substrates für die stromlose Metallisierung.

Info

Publication number
DE3788564D1
DE3788564D1 DE87115344T DE3788564T DE3788564D1 DE 3788564 D1 DE3788564 D1 DE 3788564D1 DE 87115344 T DE87115344 T DE 87115344T DE 3788564 T DE3788564 T DE 3788564T DE 3788564 D1 DE3788564 D1 DE 3788564D1
Authority
DE
Germany
Prior art keywords
pretreating
substrate
electroless metallization
electroless
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87115344T
Other languages
English (en)
Other versions
DE3788564T2 (de
Inventor
Suryadevara V Babu
Gerald Walter Jones
Neng-Hsing Dr Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3788564D1 publication Critical patent/DE3788564D1/de
Application granted granted Critical
Publication of DE3788564T2 publication Critical patent/DE3788564T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19873788564 1986-10-27 1987-10-20 Verfahren zur Vorbehandlung eines Substrates für die stromlose Metallisierung. Expired - Fee Related DE3788564T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92329186A 1986-10-27 1986-10-27

Publications (2)

Publication Number Publication Date
DE3788564D1 true DE3788564D1 (de) 1994-02-03
DE3788564T2 DE3788564T2 (de) 1994-06-30

Family

ID=25448457

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873788564 Expired - Fee Related DE3788564T2 (de) 1986-10-27 1987-10-20 Verfahren zur Vorbehandlung eines Substrates für die stromlose Metallisierung.

Country Status (3)

Country Link
EP (1) EP0268821B1 (de)
JP (1) JPS63111180A (de)
DE (1) DE3788564T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301568A (ja) * 1989-05-15 1990-12-13 Nisshinbo Ind Inc 合成樹脂構造物の金属被覆方法
US5340451A (en) * 1990-10-04 1994-08-23 International Business Machines Corporation Process for producing a metal organic polymer combination
JPH04234437A (ja) * 1990-10-04 1992-08-24 Internatl Business Mach Corp <Ibm> 金属−有機ポリマー結合体の製造方法
FR2840761B1 (fr) * 2002-06-06 2004-08-27 Framatome Connectors Int Pieces en matieres plastique metallisees
DE102006014317A1 (de) * 2006-03-23 2007-09-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Bauteils mit einem Hohlraum und Vorrichtung mit einem zur Führung eines Fluids geeigneten Hohlraum
JP2015190056A (ja) * 2014-03-31 2015-11-02 株式会社サーテックカリヤ 無電解めっき方法および無電解めっき物
CN106413266B (zh) * 2015-07-29 2018-11-23 苏州卫鹏机电科技有限公司 一种聚酰亚胺无胶柔性印刷线路板的制备方法
CN107371338B (zh) * 2016-05-13 2019-08-20 苏州卫鹏机电科技有限公司 一种超薄金属层的印刷线路板的制备方法
JP6925814B2 (ja) * 2017-02-02 2021-08-25 株式会社電子技研 樹脂および樹脂の製造方法
CN110970629B (zh) * 2019-11-08 2022-07-26 苏州卫鹏机电科技有限公司 燃料电池膜电极ccm及其制备方法、装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568562A (en) * 1984-11-28 1986-02-04 General Dynamics, Pomona Division Method of electroless plating employing plasma treatment

Also Published As

Publication number Publication date
JPH021911B2 (de) 1990-01-16
EP0268821B1 (de) 1993-12-22
DE3788564T2 (de) 1994-06-30
EP0268821A1 (de) 1988-06-01
JPS63111180A (ja) 1988-05-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee