JPS6455382A - Apparatus for forming uniform layer on substrate by cathodic sputtering - Google Patents

Apparatus for forming uniform layer on substrate by cathodic sputtering

Info

Publication number
JPS6455382A
JPS6455382A JP63190757A JP19075788A JPS6455382A JP S6455382 A JPS6455382 A JP S6455382A JP 63190757 A JP63190757 A JP 63190757A JP 19075788 A JP19075788 A JP 19075788A JP S6455382 A JPS6455382 A JP S6455382A
Authority
JP
Japan
Prior art keywords
substrate
uniform layer
forming uniform
cathodic sputtering
cathodic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63190757A
Other languages
Japanese (ja)
Inventor
Kemeraa Giyuntaa
Buorufu Hansu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Publication of JPS6455382A publication Critical patent/JPS6455382A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
JP63190757A 1987-08-01 1988-08-01 Apparatus for forming uniform layer on substrate by cathodic sputtering Pending JPS6455382A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3725571A DE3725571A1 (en) 1987-08-01 1987-08-01 DEVICE FOR PRODUCING LAYERS WITH EVEN THICKNESS PROFILE ON SUBSTRATES BY CATHODE SPRAYING

Publications (1)

Publication Number Publication Date
JPS6455382A true JPS6455382A (en) 1989-03-02

Family

ID=6332880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63190757A Pending JPS6455382A (en) 1987-08-01 1988-08-01 Apparatus for forming uniform layer on substrate by cathodic sputtering

Country Status (5)

Country Link
US (1) US4793911A (en)
EP (1) EP0302167B1 (en)
JP (1) JPS6455382A (en)
KR (1) KR890003985A (en)
DE (2) DE3725571A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
CA2137471A1 (en) 1992-06-26 1994-01-06 Tugrul Yasar Transport system for wafer processing line
DE4301189C2 (en) * 1993-01-19 2000-12-14 Leybold Ag Device for coating substrates
US5468299A (en) * 1995-01-09 1995-11-21 Tsai; Charles S. Device comprising a flat susceptor rotating parallel to a reference surface about a shaft perpendicular to this surface
US5795448A (en) * 1995-12-08 1998-08-18 Sony Corporation Magnetic device for rotating a substrate
US6497799B1 (en) 2000-04-14 2002-12-24 Seagate Technology Llc Method and apparatus for sputter deposition of multilayer films
US6770146B2 (en) 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2039416A1 (en) * 1969-08-11 1971-02-25 Varian Associates Vacuum electroplating device
US3785853A (en) * 1972-05-24 1974-01-15 Unicorp Inc Continuous deposition reactor
GB1478464A (en) * 1973-10-11 1977-06-29 Triplex Safety Glass Co Reactive sputtering apparatus and supply leads therefor
DE2900724C2 (en) * 1979-01-10 1986-05-28 Siemens AG, 1000 Berlin und 8000 München Device for coating substrates in a vacuum
DE3306870A1 (en) * 1983-02-26 1984-08-30 Leybold-Heraeus GmbH, 5000 Köln DEVICE FOR PRODUCING LAYERS WITH ROTATIONALLY SYMMETRIC THICK PROFILE BY CATODENSIONING
GB8332089D0 (en) * 1983-12-01 1984-01-11 Atomic Energy Authority Uk Electrodes
US4701251A (en) * 1986-02-03 1987-10-20 Bvt Limited Apparatus for sputter coating discs
US4808291A (en) * 1987-09-09 1989-02-28 Denton Vacuum Inc. Apparatus for coating compact disks

Also Published As

Publication number Publication date
EP0302167A2 (en) 1989-02-08
DE3870752D1 (en) 1992-06-11
EP0302167A3 (en) 1990-03-28
KR890003985A (en) 1989-04-19
EP0302167B1 (en) 1992-05-06
DE3725571A1 (en) 1989-02-09
US4793911A (en) 1988-12-27

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