GB927205A - Methods of applying metal deposits to resistive oxide films - Google Patents

Methods of applying metal deposits to resistive oxide films

Info

Publication number
GB927205A
GB927205A GB29175/59A GB2917559A GB927205A GB 927205 A GB927205 A GB 927205A GB 29175/59 A GB29175/59 A GB 29175/59A GB 2917559 A GB2917559 A GB 2917559A GB 927205 A GB927205 A GB 927205A
Authority
GB
United Kingdom
Prior art keywords
oxide
film
reduced
case
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB29175/59A
Inventor
Leopold Samuel Phillips
George Victor Planer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Development Corp UK
Original Assignee
National Research Development Corp UK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Development Corp UK filed Critical National Research Development Corp UK
Priority to GB29175/59A priority Critical patent/GB927205A/en
Publication of GB927205A publication Critical patent/GB927205A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Switches (AREA)
  • Thermistors And Varistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

927,205. Couplings; electrolytically plating reduced oxide surfaces. NATIONAL RESEARCH DEVELOPMENT CORPORATION. Nov. 10, 1960 [Aug. 26, 1959], No. 29175/59. Classes 38 (1) and 41. In an oxide-film resistor parts of the surface of the film are chemically reduced and then electroplated to provide metallically reinforced track portions for the wiper contact in the case of a variable resistor or terminations in the case of a fixed resistor. The preferred deposition metal is rhodium, though other metals such as gold or copper may be used. The metallic oxide film may be deposited upon a glass base by spraying a mixture of tin and antimony chlorides in aqueous solution on to the base which is held at a temperature of 500-600‹ C. The oxide film may then be masked with a cellulose paint over those portions not to be plated, and the surface of the exposed oxide portions mildly reduced using a paste of zinc powder in dilute HCl solution. The reduced surface is then cleaned and electroplated, e.g. by applying the plating solution, sulphuric or phosphoric acid in the case of rhodium, with an impregnated cotton wool tampon surrounding a carbon rod which is made the anode, while the oxide film constitutes the cathode. The metal deposit is lightly abraded and the paint mask removed using a chalk suspension in water, and then the deposit is annealed in oxygen-free nitrogen, argon or a vacuum at 500‹ C. for about five minutes. A thin film of a silver paint may be applied to metal terminations before soldered connections are applied. U.S.A. Specification 2,762,725 is referred to.
GB29175/59A 1959-08-26 1959-08-26 Methods of applying metal deposits to resistive oxide films Expired GB927205A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB29175/59A GB927205A (en) 1959-08-26 1959-08-26 Methods of applying metal deposits to resistive oxide films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB29175/59A GB927205A (en) 1959-08-26 1959-08-26 Methods of applying metal deposits to resistive oxide films

Publications (1)

Publication Number Publication Date
GB927205A true GB927205A (en) 1963-05-29

Family

ID=10287331

Family Applications (1)

Application Number Title Priority Date Filing Date
GB29175/59A Expired GB927205A (en) 1959-08-26 1959-08-26 Methods of applying metal deposits to resistive oxide films

Country Status (1)

Country Link
GB (1) GB927205A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064211A2 (en) * 1981-04-30 1982-11-10 Taiyo Yuden Co., Ltd. A method of forming electrodes on ceramic bodies to provide electronic components
US5674373A (en) * 1993-07-16 1997-10-07 Trefimetaux Method for metallizing non-conductive substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064211A2 (en) * 1981-04-30 1982-11-10 Taiyo Yuden Co., Ltd. A method of forming electrodes on ceramic bodies to provide electronic components
EP0064211A3 (en) * 1981-04-30 1984-05-16 Taiyo Yuden Co., Ltd. A method of forming electrodes on ceramic bodies to provide electronic components
US5674373A (en) * 1993-07-16 1997-10-07 Trefimetaux Method for metallizing non-conductive substrates

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