ES8801064A1 - Un modulo de refrigeracion por evaporacion para enfriar multiples chips semiconductores - Google Patents

Un modulo de refrigeracion por evaporacion para enfriar multiples chips semiconductores

Info

Publication number
ES8801064A1
ES8801064A1 ES554529A ES554529A ES8801064A1 ES 8801064 A1 ES8801064 A1 ES 8801064A1 ES 554529 A ES554529 A ES 554529A ES 554529 A ES554529 A ES 554529A ES 8801064 A1 ES8801064 A1 ES 8801064A1
Authority
ES
Spain
Prior art keywords
coolant
reliquification
bubble
efficiency
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES554529A
Other languages
English (en)
Other versions
ES554529A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60092511A external-priority patent/JPS61251159A/ja
Priority claimed from JP60225211A external-priority patent/JPS6285448A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of ES8801064A1 publication Critical patent/ES8801064A1/es
Publication of ES554529A0 publication Critical patent/ES554529A0/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

MODULO DE REFRIGERACION POR EVAPORACION PARA ENFRIAR MULTIPLES CHIPS SEMICONDUCTORES, MONTADOS EN UNA PLACA DE CIRCUITO SUMERGIDA EN UN REFRIGERANTE. CONSTA DE UNA CAJA (1) PARA CERRAR HERMETICAMENTE EN ELLA EL REFRIGERANTE Y LOS OBJETOS ENFRIADOS, TENIENDO LA MENCIONADA CAJA EN SU PARED LATERAL UN AGUJERO PARA FIJAR HERMETICAMENTE LA PLACA DE CIRCUITO, MIRANDO HACIA EL INTERIOR DE LA CAJA LA SUPERFICIE QUE SOPORTA LOS CHIPS; DE AL MENOS UN TERMOINTERCAMBIADOR (6) PARA ENFRIAR EL REFRIGERANTE Y LICUAR EL GAS REFRIGERANTE EVAPORADO, ESTANDO SUMERGIDOS DICHOS TERMOINTERCAMBIADORES EN EL MENCIONADO REFRIGERANTE.
ES554529A 1985-04-30 1986-04-29 Un modulo de refrigeracion por evaporacion para enfriar multiples chips semiconductores Expired ES8801064A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60092511A JPS61251159A (ja) 1985-04-30 1985-04-30 半導体素子液冷モジユ−ル
JP60225211A JPS6285448A (ja) 1985-10-09 1985-10-09 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
ES8801064A1 true ES8801064A1 (es) 1987-12-01
ES554529A0 ES554529A0 (es) 1987-12-01

Family

ID=26433925

Family Applications (1)

Application Number Title Priority Date Filing Date
ES554529A Expired ES8801064A1 (es) 1985-04-30 1986-04-29 Un modulo de refrigeracion por evaporacion para enfriar multiples chips semiconductores

Country Status (7)

Country Link
US (1) US4704658A (es)
EP (1) EP0200221B1 (es)
KR (1) KR900001393B1 (es)
AU (1) AU566105B2 (es)
CA (1) CA1249063A (es)
DE (1) DE3685909T2 (es)
ES (1) ES8801064A1 (es)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4843520A (en) * 1987-02-03 1989-06-27 Matsushita Electric Industrial Co. Ltd. Electronic circuit module
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
JPH0680914B2 (ja) * 1989-02-06 1994-10-12 富士通株式会社 タンク
EP0453675A1 (en) * 1990-04-27 1991-10-30 Digital Equipment Corporation Independent cooling chamber for multichip unit
EP0456508A3 (en) * 1990-05-11 1993-01-20 Fujitsu Limited Immersion cooling coolant and electronic device using this coolant
US5050114A (en) * 1990-09-17 1991-09-17 Motorola, Inc. Simulation of two-phase liquid cooling for thermal prediction of direct liquid cooling schemes
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US6333849B1 (en) 1996-07-01 2001-12-25 Compaq Computer Corporation Apparatus for liquid cooling of specific computer components
DE19644253A1 (de) * 1996-10-24 1998-05-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
SG64996A1 (en) * 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
DE10158387B4 (de) * 2001-11-28 2017-01-19 Modine Manufacturing Co. Anordnung zur Kühlung von elektrischen Komponenten
DE10244805A1 (de) * 2002-09-26 2004-04-08 Sma Regelsysteme Gmbh Offenporig poröser Kühlkörper eines Wärmetauschers
US20050039888A1 (en) * 2003-08-21 2005-02-24 Pfahnl Andreas C. Two-phase cooling apparatus and method for automatic test equipment
US7084495B2 (en) * 2003-10-16 2006-08-01 Intel Corporation Electroosmotic pumps using porous frits for cooling integrated circuit stacks
US20060162903A1 (en) * 2005-01-21 2006-07-27 Bhatti Mohinder S Liquid cooled thermosiphon with flexible partition
US7506682B2 (en) * 2005-01-21 2009-03-24 Delphi Technologies, Inc. Liquid cooled thermosiphon for electronic components
US7077189B1 (en) 2005-01-21 2006-07-18 Delphi Technologies, Inc. Liquid cooled thermosiphon with flexible coolant tubes
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US20070023169A1 (en) * 2005-07-29 2007-02-01 Innovative Fluidics, Inc. Synthetic jet ejector for augmentation of pumped liquid loop cooling and enhancement of pool and flow boiling
GB2432460B8 (en) * 2005-11-17 2010-08-18 Iceotope Ltd Computer apparatus
DE102006058629B3 (de) * 2006-12-13 2008-07-10 Schuler Pressen Gmbh & Co. Kg Kühlanordnung für einen Kondensator
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
KR101387549B1 (ko) * 2007-09-03 2014-04-24 삼성전자주식회사 인쇄회로기판 및 그의 제조 방법, 및 이를 갖는 메모리모듈 및 그의 제조 방법
TWI423403B (zh) 2007-09-17 2014-01-11 Ibm 積體電路疊層
CN102160171B (zh) * 2008-08-11 2015-07-22 绿色革命冷却股份有限公司 液体浸没的、水平计算机服务器机架及冷却此种服务器机架的系统和方法
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
JP5863643B2 (ja) * 2009-05-12 2016-02-16 アイセオトープ リミテッド 冷却される電子システム
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8094454B2 (en) * 2009-11-23 2012-01-10 Delphi Technologies, Inc. Immersion cooling apparatus for a power semiconductor device
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8797739B2 (en) * 2011-06-23 2014-08-05 Delphi Technologies, Inc. Self circulating heat exchanger
US20130044431A1 (en) * 2011-08-18 2013-02-21 Harris Corporation Liquid cooling of stacked die through substrate lamination
US8619425B2 (en) * 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
US8934250B2 (en) 2012-09-26 2015-01-13 International Business Machines Corporation Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US9328964B2 (en) * 2013-02-01 2016-05-03 Dell Products, L.P. Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system
US20140321053A1 (en) * 2013-04-29 2014-10-30 Brian G. Donnelly Temperature Regulation Via Immersion In A Liquid
US9332674B2 (en) 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
US9282678B2 (en) * 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
WO2017040217A1 (en) * 2015-08-28 2017-03-09 Miyoshi Mark Immersion cooling system with low fluid loss
JP6461361B2 (ja) * 2015-09-14 2019-01-30 三菱電機株式会社 冷却器、電力変換装置、及び冷却システム
JP6659869B2 (ja) * 2015-12-02 2020-03-04 ダウンアンダー・ジオソリューションズ・ピーティーワイ・リミテッド 電子機器用の流体冷却システムおよび方法
GB2550356B (en) 2016-05-16 2021-11-17 Bitfury Group Ltd Filter for immersion cooling apparatus
JP6658312B2 (ja) * 2016-06-01 2020-03-04 富士通株式会社 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法
JP6939034B2 (ja) * 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
CN107979955B (zh) * 2017-11-24 2020-06-30 北京百度网讯科技有限公司 一种模块化液冷服务器机箱
CN107846822A (zh) * 2017-11-26 2018-03-27 北京中热能源科技有限公司 一种电子设备冷却系统
KR101969813B1 (ko) * 2018-04-03 2019-08-13 열두척 주식회사 금속시트를 구비한 냉각장치 및 이를 갖는 암호화폐 채굴 시스템
WO2019194354A1 (ko) * 2018-04-03 2019-10-10 안마이클 금속시트를 구비한 냉각장치 및 암호화폐 채굴 시스템
CN112020265B (zh) * 2019-05-31 2022-06-28 华为技术有限公司 一种散热装置及处理器
US11252840B2 (en) 2019-09-18 2022-02-15 GM Global Technology Operations LLC Vapor cooling of electronics
TWI756618B (zh) * 2020-01-15 2022-03-01 緯穎科技服務股份有限公司 浸沒式冷卻設備
CN113645799A (zh) * 2020-04-27 2021-11-12 富泰华工业（深圳）有限公司 用于电子装置的散热结构及电子装置
CN111857281A (zh) * 2020-08-07 2020-10-30 深圳比特微电子科技有限公司 一种电子设备及用于该电子设备的液体冷却装置
US11856728B2 (en) * 2020-10-29 2023-12-26 Auras Technology Co., Ltd. Liquid cooling device
US12050061B2 (en) * 2020-12-14 2024-07-30 Aavid Thermalloy, Llc Shrouded powder patch
US11917793B2 (en) * 2021-01-11 2024-02-27 Cisco Technology, Inc. Localized immersion cooling enclosure
TWI767546B (zh) * 2021-02-02 2022-06-11 緯穎科技服務股份有限公司 電子設備、浸沒式冷卻系統及液量調節模組
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11608217B1 (en) 2022-01-01 2023-03-21 Liquidstack Holding B.V. Automated closure for hermetically sealing an immersion cooling tank during a hot swap of equipment therein
WO2023135488A2 (en) * 2022-01-15 2023-07-20 Liquidstack Holding B.V. Baffle assembly for use in an immersion cooling system
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand
DE102023129059A1 (de) 2022-10-21 2024-05-02 Hofer Powertrain Innovation Gmbh Elektromaschine mit Verdampfungskühlung, Verdampfungskühlsystem sowie Verdampfungskühlverfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US3489207A (en) * 1968-02-19 1970-01-13 Gen Electric Vapor-cooled electronics enclosures
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
KR860000253B1 (ko) * 1981-04-07 1986-03-21 카다야마 히도하지로 비등 냉각장치(沸騰冷却裝置)
JPS60136352A (ja) * 1983-12-26 1985-07-19 Hitachi Ltd 集積回路チップの冷却装置
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置

Also Published As

Publication number Publication date
EP0200221A3 (en) 1988-10-05
CA1249063A (en) 1989-01-17
DE3685909D1 (de) 1992-08-13
KR900001393B1 (en) 1990-03-09
AU566105B2 (en) 1987-10-08
AU5680186A (en) 1986-11-06
US4704658A (en) 1987-11-03
ES554529A0 (es) 1987-12-01
EP0200221A2 (en) 1986-11-05
DE3685909T2 (de) 1993-02-11
EP0200221B1 (en) 1992-07-08

Similar Documents

Publication Publication Date Title
ES8801064A1 (es) Un modulo de refrigeracion por evaporacion para enfriar multiples chips semiconductores
US4322776A (en) Thermal interconnection
US20110100427A1 (en) Bypass diode for photovoltaic cells
IT1148817B (it) Apparecchiatura per raffreddare moduli circuitali elettronici
JPS5595352A (en) Integrated circuit structure
ATE27207T1 (de) Halbleiter-schaltungsaufbau.
GB1431560A (en) Liquid-cooled electrical apparatus
KR930015998A (ko) 고전력 전자 소자에 의해 발생된 열의 소산성이 개선된 회로 팩
SE8303489D0 (sv) Electrical circuit assemblies
GB1090628A (en) Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components
JPS57107063A (en) Semiconductor package
EP0645593A1 (en) Electronic cooling type refrigerator
FR2824289B1 (fr) Procede et dispositif de depot de colle sur une surface alveolee
JPS5585049A (en) Cooling fin
JPS57162453A (en) Heat radiating device
JPS63181454A (ja) 半導体回路パツケージ
JP2828996B2 (ja) 半導体の冷却装置
JPS6451645A (en) Circuit device with a plurality of electric element to be cooled
JPS5740966A (en) Semiconductor device
JPS642397A (en) Cooling structure of package for electronic circuit
CN206575662U (zh) 集热器及具有该集热器的电路板
JPS6428944A (en) Cooling structure of integrated circuit
JPS645045A (en) Cooling structure for integrated circuit package
ES2026520T3 (es) Conjunto de montaje para modulos electronicos.
JPH039338Y2 (es)