US20110100427A1 - Bypass diode for photovoltaic cells - Google Patents
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- US20110100427A1 US20110100427A1 US12/986,283 US98628311A US2011100427A1 US 20110100427 A1 US20110100427 A1 US 20110100427A1 US 98628311 A US98628311 A US 98628311A US 2011100427 A1 US2011100427 A1 US 2011100427A1
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- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims description 10
- 230000000295 complement effect Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/044—PV modules or arrays of single PV cells including bypass diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a bypass diode for a photovoltaic cell, of particular but by no means exclusive application in photovoltaic cell modules for use in solar concentrators of solar photovoltaic power systems.
- Multijunction solar cells are used in solar concentrator photovoltaic power systems for generating power owing to their high efficiency. Although such solar cells are expensive, these efficiencies are sufficiently high to render such arrangements economically feasible. However, to maintain the reliability of such arrangements in which multiple cells are arranged in series, it is desirable to have a bypass diode for each cell in a series. The bypass diode prevents overloading of its corresponding cell when that cell has a reduced power output owing to poor illumination or performance, or some other malfunction. This allows the rest of the series of cells constituting a module to continue operating.
- the number of cells in series which determines the bus voltage, is usually greater than a hundred, so the bypassing of a single, failed cell will result in a power loss of 1% or less.
- the bypass diodes thus allow the system to keep operating with minimal loss of output.
- bypass diodes are essentially adjacent to the cells, are unsuitable for systems with closely packed cells, such as dish concentrator or central receiver systems.
- the present invention provides in a first aspect a photovoltaic power module, comprising a substrate thermally couplable to a heat sink, one or more photovoltaic cells mounted to the substrate, metallised zones constituting a circuit and provided between the substrate and the cells, the metallised zones being electrically and thermally coupled to the cells, and one or more bypass diodes each corresponding to a respective one or more of the cells.
- Each of the diodes is located between the substrate and the cells and at least in part between conducting portions of the metallised zones to permit reduced separation between the cells and the metallised zones, and the metallised zones underlie a substantial portion of each of the cells, to facilitate heat flow from said cells to said substrate.
- the circuit takes the form of a printed or laminated circuit and each of the diodes is located between neighbouring metallised zones of the circuit.
- each of the diodes has a thickness that is substantially equal to or less than the thickness of the metallised zones.
- the diodes do not prevent the solar cells from being packed as closely as previously.
- the substrate may include one or more recesses for at least partially (though conceivably wholly) accommodating the diodes (preferably one diode per recess).
- the diodes are also between the substrate and the cells (their still being substrate material on the side of the diodes opposite the cells), but the diodes are also at least to some extent surrounded by substrate material.
- the conducting portions of the circuit are contoured to fit or accommodate the diodes.
- the terminals of each of the diodes are metallised to complement the shape of the conducting portions.
- the present invention provides in a further aspect a method of bypassing one or more photovoltaic cells in a photovoltaic power module, comprising locating one or more bypass diodes, each corresponding to a respective one or more of the cells, between the cells and the substrate of the module, and at least in part between conducting portions of metallised zones constituting a circuit provided on the substrate between the substrate and the cells, electrically and thermally coupling the metallised zones to the cells such that the metallised zones underlie a substantial port-ion of each of the cells in order to facilitate heat flow from the cells to the substrate, and electrically coupling the bypass diodes to the metallised zones with the bypass diodes arranged to bypass a corresponding one or more cells if a voltage across the corresponding one or more cells drops below a predetermined level or is reversed.
- the circuit is a printed or laminated circuit.
- each of the diodes is located between neighbouring metallised zones of the circuit.
- the method includes contouring portions of the circuit (in one embodiment the metallised zones) to fit the diodes.
- the terminals of each of the diodes are metallised to complement the shape of the conducting portions.
- the method includes providing one or more recesses in said substrate for at least partially (and in some cases wholly) accommodating the diodes (preferably one diode per recess).
- the diodes are located between the cells and the substrate (their still being substrate material on the side of the diodes opposite the cells), but the diodes are also at least to some extent surrounded by substrate material.
- FIG. 1 is a cross-sectional view of a portion of a photovoltaic module according to an embodiment of the present invention
- FIG. 2 is a schematic plan view of a bypass diode and adjacent metallised circuit of the module of FIG. 1 ;
- FIG. 3 is a plan view comparable to FIG. 2 but more closely to scale of the bypass diode and adjacent metallised circuit of the module of FIG. 1 ;
- FIG. 4 is a cross-sectional view of a portion of a photovoltaic module according to another embodiment of the present invention.
- FIG. 1 A representative detail of a photovoltaic module according to an embodiment of the present invention is shown in cross-section at 10 in FIG. 1 .
- the module includes an insulating substrate 12 with a thickness of 0.6 mm.
- the substrate 12 forms part of a printed circuit comprising the substrate 12 and metallised zones 14 .
- the metallised zones 14 have a thickness of approximately 0.3 mm.
- Each of a plurality of photovoltaic cells 16 is soldered to the metallised zones 14 by means of solder 18 (shown hashed in the figure).
- solder 18 shown hashed in the figure.
- a bypass diode 20 with terminals 22 a and 22 b is provided between that cell 16 and the substrate 12 .
- Each cell 16 is connected in parallel across its respective bypass diode 20 .
- the diode 20 is electrically coupled to the appropriate portions of the metallised zones 14 of the circuit board by solder 18 , so that it is in parallel with the corresponding cell 16 .
- the photovoltaic module includes a plurality of groups of cells. Each group of cells is then provided with a bypass diode 20 , and the group of cells is connected in parallel with its corresponding bypass diode 20 .
- Each bypass diode 20 has a thickness approximately equal to or somewhat less than that of the metallised zones 14 , hence also approximately equal to or somewhat less than 0.3 mm.
- the bypass diodes 20 thus do not increase the thickness of the module 10 and, being beneath the cells 16 , do not restrict how closely the cells 16 can be packed in the module 10 .
- the diodes 20 would be positioned on the solder paste printed substrate 12 , after which the solar photovoltaic cells 16 would be placed over the diodes 20 onto the metallised zones 14 . In this manner the diode is integrated into the closely packed module 10 without requiring additional diode space around the photovoltaic cells 16 .
- FIG. 2 is a plan view of cross-section AA from FIG. 1 , through the plane of the metallised zones 14 and the diode 20 , with the alignment of solar cell 16 (or, in an alternative embodiment, cell 16 and adjacent cells 16 ′ and 16 ′′) shown by means of a dotted lines.
- the metallised zones 14 are shaped to accommodate the diode 20 and, in particular, terminals 22 a and 22 b of diode 20 .
- Solder 18 establishes the necessary electrical contact between the diode 20 and the metallised zones 14 of the circuit board.
- the device is shown schematically for the sake of clarity.
- the diode 20 is smaller than it appears compared with the metallised zones 14 .
- the gap between the metallised zones 14 would typically be about 0.7 mm, widening to about 1.5 mm to accommodate the diode 20 .
- the area without metal for the cells to be soldered to is small.
- the width (from left to right in this view) of the metallised zones 14 would typically be about 15 mm, while the width (from top to bottom in this view) of cell 16 would typically be about 10 mm. Neighbouring solar cells ( 16 , 16 ′, 16 ′′) are thus very close.
- FIG. 3 is comparable to FIG. 2 , but more closely to scale so that a better idea of the relative sizes of the diode, cells and metallised zones can be ascertained.
- FIG. 4 is a cross-sectional view (comparable to that of FIG. 1 ) of a representative detail 30 of a photovoltaic module according to an alternative embodiment.
- like reference numerals have been used to identify like features when compared with the embodiment of FIG. 1 .
- the diode module of this embodiment includes an insulating substrate 32 with a thickness generally of 0.6 mm.
- the substrate 32 forms part of a printed circuit comprising the substrate 32 and metallised zones 14 .
- the metallised zones 14 have a thickness of approximately 0.3 mm.
- bypass diode 34 (with terminals 36 a and 36 b ) has a thickness greater than that of diode 20 of FIG. 1 and hence greater than that of metallised zones 14 .
- a shallow recess 38 is provided in substrate 32 in order to accommodate bypass diode 34 to a depth sufficient to ensure that bypass diode 34 does not extend upwardly beyond the metallised zones 14 .
- the solder 18 extends downwardly into the recess 38 to a sufficient extent to ensure good electrical contact is made with terminals 36 a and 36 b.
- This embodiment allows the use of diodes with a somewhat greater thickness than in the embodiment shown in FIG. 1 , which in some applications may be desirable or necessary owing to diode availability or cost.
- bypass diode arrangement of this invention allows one to minimize the impedance of thermal transfer between the cell and the substrate. Such impedance—particularly in high intensity or high power applications—could otherwise seriously compromise performance or even render the device impractical.
Abstract
A photovoltaic power module, comprising a substrate provided with a circuit, one or more photovoltaic cells mounted to the substrate and electrically connected to the circuit, and one or more bypass diodes, each corresponding to a respective one or more of the cells, wherein each of the diodes is located between the substrate and the cells and between conducting portions of the circuit.
Description
- This application is a Continuation of U.S. Ser. No. 10/557,456, filed 13 Nov. 2006, which is a National Stage of PCT/AU2004/000667, filed 19 May 2004 which claims benefit of U.S. provisional application Ser. No. 60/471,342, filed 19 May 2003, and which application(s) are incorporated herein by reference. To the extent appropriate, a claim of priority is made to each of the above disclosed applications.
- The present invention relates to a bypass diode for a photovoltaic cell, of particular but by no means exclusive application in photovoltaic cell modules for use in solar concentrators of solar photovoltaic power systems.
- Multijunction solar cells are used in solar concentrator photovoltaic power systems for generating power owing to their high efficiency. Although such solar cells are expensive, these efficiencies are sufficiently high to render such arrangements economically feasible. However, to maintain the reliability of such arrangements in which multiple cells are arranged in series, it is desirable to have a bypass diode for each cell in a series. The bypass diode prevents overloading of its corresponding cell when that cell has a reduced power output owing to poor illumination or performance, or some other malfunction. This allows the rest of the series of cells constituting a module to continue operating.
- The number of cells in series, which determines the bus voltage, is usually greater than a hundred, so the bypassing of a single, failed cell will result in a power loss of 1% or less. The bypass diodes thus allow the system to keep operating with minimal loss of output.
- One existing system is illustrated in U.S. Pat. No. 6,020,555, in which each cell is connected in parallel with its corresponding bypass diode resulting in a series of diodes in parallel with a series of cells.
- However, in existing arrangements, where the bypass diodes are essentially adjacent to the cells, are unsuitable for systems with closely packed cells, such as dish concentrator or central receiver systems.
- The present invention provides in a first aspect a photovoltaic power module, comprising a substrate thermally couplable to a heat sink, one or more photovoltaic cells mounted to the substrate, metallised zones constituting a circuit and provided between the substrate and the cells, the metallised zones being electrically and thermally coupled to the cells, and one or more bypass diodes each corresponding to a respective one or more of the cells. Each of the diodes is located between the substrate and the cells and at least in part between conducting portions of the metallised zones to permit reduced separation between the cells and the metallised zones, and the metallised zones underlie a substantial portion of each of the cells, to facilitate heat flow from said cells to said substrate.
- Preferably the circuit takes the form of a printed or laminated circuit and each of the diodes is located between neighbouring metallised zones of the circuit. Preferably each of the diodes has a thickness that is substantially equal to or less than the thickness of the metallised zones. Thus, because the diodes are located (along with the circuit) between the substrate and the cells, the diodes do not prevent the solar cells from being packed as closely as previously.
- Alternatively, however, if it is not possible to obtain or employ diodes that are sufficiently thin to be accommodated by one of the metallised zones (which may have a thickness of only 0.3 mm) the substrate may include one or more recesses for at least partially (though conceivably wholly) accommodating the diodes (preferably one diode per recess). Thus, in this embodiment the diodes are also between the substrate and the cells (their still being substrate material on the side of the diodes opposite the cells), but the diodes are also at least to some extent surrounded by substrate material.
- Preferably the conducting portions of the circuit (in one embodiment the metallised zones) are contoured to fit or accommodate the diodes. Preferably the terminals of each of the diodes are metallised to complement the shape of the conducting portions.
- The present invention provides in a further aspect a method of bypassing one or more photovoltaic cells in a photovoltaic power module, comprising locating one or more bypass diodes, each corresponding to a respective one or more of the cells, between the cells and the substrate of the module, and at least in part between conducting portions of metallised zones constituting a circuit provided on the substrate between the substrate and the cells, electrically and thermally coupling the metallised zones to the cells such that the metallised zones underlie a substantial port-ion of each of the cells in order to facilitate heat flow from the cells to the substrate, and electrically coupling the bypass diodes to the metallised zones with the bypass diodes arranged to bypass a corresponding one or more cells if a voltage across the corresponding one or more cells drops below a predetermined level or is reversed.
- Preferably the circuit is a printed or laminated circuit. Preferably each of the diodes is located between neighbouring metallised zones of the circuit.
- Preferably the method includes contouring portions of the circuit (in one embodiment the metallised zones) to fit the diodes. Preferably the terminals of each of the diodes are metallised to complement the shape of the conducting portions.
- In one embodiment, the method includes providing one or more recesses in said substrate for at least partially (and in some cases wholly) accommodating the diodes (preferably one diode per recess). Thus, in this embodiment the diodes are located between the cells and the substrate (their still being substrate material on the side of the diodes opposite the cells), but the diodes are also at least to some extent surrounded by substrate material.
- In order that the present invention may be more clearly ascertained, embodiments will now be described by way of example, with reference to the accompanying drawing, in which:
-
FIG. 1 is a cross-sectional view of a portion of a photovoltaic module according to an embodiment of the present invention; -
FIG. 2 is a schematic plan view of a bypass diode and adjacent metallised circuit of the module ofFIG. 1 ; -
FIG. 3 is a plan view comparable toFIG. 2 but more closely to scale of the bypass diode and adjacent metallised circuit of the module ofFIG. 1 ; and -
FIG. 4 is a cross-sectional view of a portion of a photovoltaic module according to another embodiment of the present invention. - A representative detail of a photovoltaic module according to an embodiment of the present invention is shown in cross-section at 10 in
FIG. 1 . The module includes aninsulating substrate 12 with a thickness of 0.6 mm. Thesubstrate 12 forms part of a printed circuit comprising thesubstrate 12 andmetallised zones 14. Themetallised zones 14 have a thickness of approximately 0.3 mm. - Each of a plurality of
photovoltaic cells 16 is soldered to themetallised zones 14 by means of solder 18 (shown hashed in the figure). For eachsolar cell 16, abypass diode 20 withterminals cell 16 and thesubstrate 12. Eachcell 16 is connected in parallel across itsrespective bypass diode 20. - The
diode 20 is electrically coupled to the appropriate portions of themetallised zones 14 of the circuit board bysolder 18, so that it is in parallel with thecorresponding cell 16. - In an alternative embodiment, the photovoltaic module includes a plurality of groups of cells. Each group of cells is then provided with a
bypass diode 20, and the group of cells is connected in parallel with itscorresponding bypass diode 20. - Each
bypass diode 20 has a thickness approximately equal to or somewhat less than that of themetallised zones 14, hence also approximately equal to or somewhat less than 0.3 mm. Thebypass diodes 20 thus do not increase the thickness of themodule 10 and, being beneath thecells 16, do not restrict how closely thecells 16 can be packed in themodule 10. - It is envisaged that, during manufacture, the
diodes 20 would be positioned on the solder paste printedsubstrate 12, after which the solarphotovoltaic cells 16 would be placed over thediodes 20 onto themetallised zones 14. In this manner the diode is integrated into the closely packedmodule 10 without requiring additional diode space around thephotovoltaic cells 16. -
FIG. 2 is a plan view of cross-section AA fromFIG. 1 , through the plane of themetallised zones 14 and thediode 20, with the alignment of solar cell 16 (or, in an alternative embodiment,cell 16 andadjacent cells 16′ and 16″) shown by means of a dotted lines. In this (plan) view, it will be apparent how themetallised zones 14 are shaped to accommodate thediode 20 and, in particular,terminals diode 20.Solder 18 establishes the necessary electrical contact between thediode 20 and themetallised zones 14 of the circuit board. - The device is shown schematically for the sake of clarity. In reality, the
diode 20 is smaller than it appears compared with themetallised zones 14. Thus, the gap between themetallised zones 14 would typically be about 0.7 mm, widening to about 1.5 mm to accommodate thediode 20. Thus, the area without metal for the cells to be soldered to is small. - The width (from left to right in this view) of the
metallised zones 14 would typically be about 15 mm, while the width (from top to bottom in this view) ofcell 16 would typically be about 10 mm. Neighbouring solar cells (16, 16′, 16″) are thus very close. -
FIG. 3 is comparable toFIG. 2 , but more closely to scale so that a better idea of the relative sizes of the diode, cells and metallised zones can be ascertained. -
FIG. 4 is a cross-sectional view (comparable to that ofFIG. 1 ) of arepresentative detail 30 of a photovoltaic module according to an alternative embodiment. In this figure, like reference numerals have been used to identify like features when compared with the embodiment ofFIG. 1 . - As in the embodiment of
FIG. 1 , the diode module of this embodiment includes an insulatingsubstrate 32 with a thickness generally of 0.6 mm. Thesubstrate 32 forms part of a printed circuit comprising thesubstrate 32 and metallisedzones 14. Themetallised zones 14 have a thickness of approximately 0.3 mm. However, bypass diode 34 (withterminals diode 20 ofFIG. 1 and hence greater than that ofmetallised zones 14. Thus, ashallow recess 38 is provided insubstrate 32 in order to accommodatebypass diode 34 to a depth sufficient to ensure thatbypass diode 34 does not extend upwardly beyond themetallised zones 14. Thesolder 18 extends downwardly into therecess 38 to a sufficient extent to ensure good electrical contact is made withterminals - This embodiment allows the use of diodes with a somewhat greater thickness than in the embodiment shown in
FIG. 1 , which in some applications may be desirable or necessary owing to diode availability or cost. - Thus, the bypass diode arrangement of this invention allows one to minimize the impedance of thermal transfer between the cell and the substrate. Such impedance—particularly in high intensity or high power applications—could otherwise seriously compromise performance or even render the device impractical.
- Modifications within the scope of the invention may be readily effected by those skilled in the art. It is to be understood, therefore, that this invention is not limited to the particular embodiments described by way of example here and above.
- In the claims that follow and in the preceding description of the invention, except where the context requires otherwise owing to express language or necessary implication, the word “comprise” or variations such as “comprises” or “comprising” is used in an inclusive sense, i.e. to specify the presence of the stated features but not to preclude the presence or addition of further features in various embodiments of the invention.
- Further, any reference herein to prior art is not intended to imply that such prior art forms or formed a part of the common general knowledge.
Claims (16)
1. A photovoltaic power module, comprising:
a substrate thermally couplable to a heat sink;
one or more photovoltaic cells mounted to said substrate;
metallised zones constituting a circuit and provided between said substrate and said cells, said metallised zones being electrically and thermally coupled to said cells; and
one or more bypass diodes each corresponding to a respective one or more of said cells;
wherein each of said diodes is located between said substrate and said cells and at least in part between conducting portions of said metallised zones to permit reduced separation between said cells and said metallised zones and wherein said metallised zones underlie a substantial portion of each of said cells, to facilitate heat flow from said cells to said substrate.
2. A photovoltaic power module as claimed in claim 1 , wherein said circuit takes the form of a printed or laminated circuit and each of said diodes is located between neighbouring metallised zones of said circuit.
3. A photovoltaic power module as claimed in claim 2 , wherein each of said diodes has a thickness that is substantially equal to or less than the thickness of said metallised zones.
4. A photovoltaic power module as claimed in claim 2 , wherein the substrate includes one or more recesses for at least partially accommodating the diodes.
5. A photovoltaic power module as claimed in claim 1 , wherein the conducting portions of the circuit are contoured to fit or accommodate said diodes.
6. A photovoltaic power module as claimed in claim 5 , wherein each of said diodes has metallised terminals that complement the shape of said conducting portions.
7. A photovoltaic power module as claimed in claim 1 , wherein said diodes do not protrude towards said cells beyond said metallised zones.
8. A photovoltaic power module as claimed in claim 1 , wherein each of said diodes are thermally coupled to said metallised zones via at least two cooling paths.
9. A solar concentrator including a photovoltaic power module as claimed in claim 1 .
10. A method of bypassing one or more photovoltaic cells in a photovoltaic power module, comprising:
locating one or more bypass diodes, each corresponding to a respective one or more of said cells, between said cells and the substrate of said module, and at least in part between conducting portions of metallised zones constituting a circuit provided on said substrate between said substrate and said cells;
electrically and thermally coupling said metallised zones to said cells such that said metallised zones underlie a substantial portion of each of said cells in order to facilitate heat flow from said cells to said substrate; and
electrically coupling said bypass diodes to said metallised zones with said bypass diodes arranged to bypass a corresponding one or more cells if a voltage across said corresponding one or more cells drops below a predetermined level or is reversed.
11. A method as claimed in claim 10 , wherein the circuit is a printed or laminated circuit.
12. A method as claimed in claim 10 , including locating each of said diodes between neighbouring metallised zones of said circuit.
13. A method as claimed in claim 10 , including providing each of said diodes with a thickness that is substantially equal to or less than the thickness of said metallised zones.
14. A method as claimed in claim 10 , including providing said substrate with one or more recesses for at least partially accommodating said diodes.
15. A method as claimed in claim 10 , including contouring portions of the circuit to fit or accommodate said diodes.
16. A method as claimed in claim 10 , wherein each of said diodes has metallised terminals that complement the shape of said conducting portions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/986,283 US20110100427A1 (en) | 2003-05-19 | 2011-01-07 | Bypass diode for photovoltaic cells |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US47134203P | 2003-05-19 | 2003-05-19 | |
US10/557,456 US7888592B2 (en) | 2003-05-19 | 2004-05-19 | Bypass diode for photovoltaic cells |
PCT/AU2004/000667 WO2004102678A1 (en) | 2003-05-19 | 2004-05-19 | Bypass diode for photovoltaic cells |
US12/986,283 US20110100427A1 (en) | 2003-05-19 | 2011-01-07 | Bypass diode for photovoltaic cells |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
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PCT/AU2004/000667 Continuation WO2004102678A1 (en) | 2003-05-19 | 2004-05-19 | Bypass diode for photovoltaic cells |
US11/557,456 Continuation US8041506B2 (en) | 2005-11-07 | 2006-11-07 | Mapping in mobile devices |
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US20110100427A1 true US20110100427A1 (en) | 2011-05-05 |
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US10/557,456 Expired - Fee Related US7888592B2 (en) | 2003-05-19 | 2004-05-19 | Bypass diode for photovoltaic cells |
US12/986,283 Abandoned US20110100427A1 (en) | 2003-05-19 | 2011-01-07 | Bypass diode for photovoltaic cells |
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US10/557,456 Expired - Fee Related US7888592B2 (en) | 2003-05-19 | 2004-05-19 | Bypass diode for photovoltaic cells |
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US (2) | US7888592B2 (en) |
EP (1) | EP1636857B1 (en) |
CN (1) | CN100420038C (en) |
AT (1) | ATE474329T1 (en) |
AU (1) | AU2004239803B2 (en) |
DE (1) | DE602004028123D1 (en) |
ES (1) | ES2348945T3 (en) |
HK (1) | HK1095203A1 (en) |
WO (1) | WO2004102678A1 (en) |
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WO2013078498A1 (en) * | 2011-11-30 | 2013-06-06 | Solar Systems Pty Ltd | Semiconductor substrate for a photovoltaic power module |
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US7671270B2 (en) * | 2007-07-30 | 2010-03-02 | Emcore Solar Power, Inc. | Solar cell receiver having an insulated bypass diode |
CA2722714C (en) * | 2008-05-12 | 2014-07-08 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Photovoltaic generator with a spherical imaging lens for use with a paraboloidal solar reflector |
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Also Published As
Publication number | Publication date |
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HK1095203A1 (en) | 2007-04-27 |
DE602004028123D1 (en) | 2010-08-26 |
US7888592B2 (en) | 2011-02-15 |
US20070089774A1 (en) | 2007-04-26 |
ATE474329T1 (en) | 2010-07-15 |
WO2004102678A1 (en) | 2004-11-25 |
AU2004239803B2 (en) | 2008-12-18 |
EP1636857B1 (en) | 2010-07-14 |
ES2348945T3 (en) | 2010-12-17 |
CN100420038C (en) | 2008-09-17 |
EP1636857A1 (en) | 2006-03-22 |
AU2004239803A1 (en) | 2004-11-25 |
CN1802754A (en) | 2006-07-12 |
EP1636857A4 (en) | 2006-09-27 |
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