ES2123174T3 - Procedimiento para la metalizacion estructurada de la superficie de substratos. - Google Patents
Procedimiento para la metalizacion estructurada de la superficie de substratos.Info
- Publication number
- ES2123174T3 ES2123174T3 ES95105976T ES95105976T ES2123174T3 ES 2123174 T3 ES2123174 T3 ES 2123174T3 ES 95105976 T ES95105976 T ES 95105976T ES 95105976 T ES95105976 T ES 95105976T ES 2123174 T3 ES2123174 T3 ES 2123174T3
- Authority
- ES
- Spain
- Prior art keywords
- applying
- layer
- substrate surface
- primer layer
- procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1407—Applying catalyst before applying plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
SE DESCRIBE UN PROCEDIMIENTO PARA METALIZACION ESTRUCTURADA DE SUPERFICIE DE SUBSTRATOS, ESPECIALMENTE DE PLACAS (1) DE CIRCUITO IMPRESO, BAJO UTILIZACION DE RADIACION (5) ELECTROMAGNETICA. EL PROCEDIMIENTO SE CARACTERIZA DE TAL MODO, QUE SOBRE EL SUBSTRATO (PLACA 1 DE CIRCUITO IMPRESO) SE APLICA COMPLETAMENTE UNA PRIMERA CAPA (2) NO CONDUCTORA ELECTRICA SOBRE LA PRIMERA CAPA (2) POR MEDIO DE UNA RADIACION (5) ELECTROMAGNETICA EN LA ZONA UV, SE APLICA DE FORMA COMPLETA UNA CAPA (4) DE CUBIERTA NO CONDUCTORA ELECTRICA, DE MODO QUE LA CAPA (4) DE CUBIERTA SE APLICA CON UN ESPESOR, QUE ES AL MENOS IGUAL AL ESPESOR DE LA CAPA (3) METALICA A SER APLICADA, DE TAL MODO QUE LA CAPA (4) DE CUBIERTA EN ZONAS PARCIALES SE APLICA BAJO RADIACION (5) ELECTROMAGNETICA QUE ACTUA EN ZONAS DE UV, BAJO FORMACION DE ESTRUCTURA (6) CON FLANCOS (7) AGUDOS Y EMPINADOS Y BAJO EL DEPOSITADO LIBRE DE LA PRIMERA CAPA (2), DE FORMA QUE EN LAS ZONAS QUE SE GUIAN SOBRE LAS ESTRUCTURAS (6) COLOCADAS LIBREMENTE CON RESPECTO A LA CAPA (2) PRIMARIA, QUE DISPONEN DE LOS FLANCOS (7) SE APLICA UN BAÑO REDUCTIVO PARA LA FORMACION DE PISTAS CONDUCTORAS DE UNA CAPA (3) METALICA. EL PROCEDIMIENTO PERMITE UNA METALIZACION ESTRUCTURADA DE LA SUPERFICIE DE LOS SUBSTRATOS, SIN QUE SEA NECESARIO UN PROCESO DE CAUTERIZADO AL AGUA FUERTE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4414225 | 1994-04-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2123174T3 true ES2123174T3 (es) | 1999-01-01 |
Family
ID=6516259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95105976T Expired - Lifetime ES2123174T3 (es) | 1994-04-23 | 1995-04-21 | Procedimiento para la metalizacion estructurada de la superficie de substratos. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5576073A (es) |
EP (1) | EP0679052B1 (es) |
JP (1) | JPH0856066A (es) |
AT (1) | ATE171588T1 (es) |
DE (2) | DE4417245A1 (es) |
DK (1) | DK0679052T3 (es) |
ES (1) | ES2123174T3 (es) |
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US7033648B1 (en) * | 1995-02-06 | 2006-04-25 | International Business Machines Corporations | Means of seeding and metallizing polyimide |
DE19620095B4 (de) * | 1996-05-18 | 2006-07-06 | Tamm, Wilhelm, Dipl.-Ing. (FH) | Verfahren zur Herstellung von Leiterplatten |
DE19625386A1 (de) * | 1996-06-25 | 1998-01-02 | Siemens Ag | Verfahren zur Herstellung einer Leiterplatte |
US8071384B2 (en) | 1997-12-22 | 2011-12-06 | Roche Diagnostics Operations, Inc. | Control and calibration solutions and methods for their use |
DE19910482A1 (de) * | 1999-03-10 | 2000-05-04 | Stp Elektronische Systeme Gmbh | Verfahren zur Herstellung von Leiterplatten-Schaltungsebenen |
AU7091500A (en) * | 1999-08-30 | 2001-03-26 | Board Of Regents University Of Nebraska Lincoln | Three-dimensional electrical interconnects |
US7073246B2 (en) * | 1999-10-04 | 2006-07-11 | Roche Diagnostics Operations, Inc. | Method of making a biosensor |
US6645359B1 (en) * | 2000-10-06 | 2003-11-11 | Roche Diagnostics Corporation | Biosensor |
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-
1994
- 1994-05-17 DE DE4417245A patent/DE4417245A1/de not_active Withdrawn
-
1995
- 1995-04-21 EP EP95105976A patent/EP0679052B1/de not_active Expired - Lifetime
- 1995-04-21 AT AT95105976T patent/ATE171588T1/de not_active IP Right Cessation
- 1995-04-21 DK DK95105976T patent/DK0679052T3/da active
- 1995-04-21 ES ES95105976T patent/ES2123174T3/es not_active Expired - Lifetime
- 1995-04-21 US US08/427,093 patent/US5576073A/en not_active Expired - Fee Related
- 1995-04-21 DE DE59503657T patent/DE59503657D1/de not_active Expired - Fee Related
- 1995-04-24 JP JP7120393A patent/JPH0856066A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0679052A1 (de) | 1995-10-25 |
US5576073A (en) | 1996-11-19 |
DE4417245A1 (de) | 1995-10-26 |
DK0679052T3 (da) | 1999-06-14 |
EP0679052B1 (de) | 1998-09-23 |
JPH0856066A (ja) | 1996-02-27 |
ATE171588T1 (de) | 1998-10-15 |
DE59503657D1 (de) | 1998-10-29 |
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