ES2085098T3 - Procedimiento de fabricacion de un circuito impreso multicapa. - Google Patents
Procedimiento de fabricacion de un circuito impreso multicapa.Info
- Publication number
- ES2085098T3 ES2085098T3 ES93118917T ES93118917T ES2085098T3 ES 2085098 T3 ES2085098 T3 ES 2085098T3 ES 93118917 T ES93118917 T ES 93118917T ES 93118917 T ES93118917 T ES 93118917T ES 2085098 T3 ES2085098 T3 ES 2085098T3
- Authority
- ES
- Spain
- Prior art keywords
- printed circuit
- multilayer printed
- manufacturing procedure
- members
- conductive layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
UN METODO PARA FABRICAR UN TABLERO DE CABLEADO IMPRESO DE VARIAS CAPAS COMPRENDE: FIJAR LOS MIEMBROS CONDUCTORES SOBRE CAPAS CONDUCTORAS; SUPERPONER VARIOS TABLEROS DE CABLEADO IMPRESO Y; CONECTAR ELECTRICAMENTE LAS CAPAS CONDUCTORAS UNA A OTRA MEDIANTE LOS MIEMBROS CONDUCTORES. PARA MANTENER UNA DISTANCIA CONSTANTE ENTRE LAS PIEZAS SEPARADORAS DE LAS CAPAS CONDUCTORAS, ESTAN PROVISTAS EN LOS MIEMBROS DE CONDUCCION.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63332013A JPH0614598B2 (ja) | 1988-12-29 | 1988-12-29 | 多層プリント基板の製造方法 |
JP1077480A JPH0736471B2 (ja) | 1989-03-29 | 1989-03-29 | 多層基板の接合方法 |
JP1149972A JPH0671144B2 (ja) | 1989-06-13 | 1989-06-13 | 多層高密度実装モジュール |
JP1194928A JPH0360096A (ja) | 1989-07-27 | 1989-07-27 | 多層プリント配線基板の製造方法 |
JP1237478A JPH071830B2 (ja) | 1989-09-13 | 1989-09-13 | 多層プリント配線基板の接続方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2085098T3 true ES2085098T3 (es) | 1996-05-16 |
Family
ID=27524672
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93118917T Expired - Lifetime ES2085098T3 (es) | 1988-12-29 | 1989-12-28 | Procedimiento de fabricacion de un circuito impreso multicapa. |
ES93118943T Expired - Lifetime ES2104023T3 (es) | 1988-12-29 | 1989-12-28 | Procedimiento de fabricacion de placa de cableado impreso multicapa. |
ES89124088T Expired - Lifetime ES2069570T3 (es) | 1988-12-29 | 1989-12-28 | Procedimiento de fabricacion de una placa de conexionado impreso de multiples capas. |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93118943T Expired - Lifetime ES2104023T3 (es) | 1988-12-29 | 1989-12-28 | Procedimiento de fabricacion de placa de cableado impreso multicapa. |
ES89124088T Expired - Lifetime ES2069570T3 (es) | 1988-12-29 | 1989-12-28 | Procedimiento de fabricacion de una placa de conexionado impreso de multiples capas. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5031308A (es) |
EP (3) | EP0607534B1 (es) |
KR (1) | KR940009175B1 (es) |
CA (1) | CA2006776C (es) |
DE (3) | DE68926055T2 (es) |
ES (3) | ES2085098T3 (es) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5299730A (en) * | 1989-08-28 | 1994-04-05 | Lsi Logic Corporation | Method and apparatus for isolation of flux materials in flip-chip manufacturing |
US5948533A (en) * | 1990-02-09 | 1999-09-07 | Ormet Corporation | Vertically interconnected electronic assemblies and compositions useful therefor |
US5280414A (en) * | 1990-06-11 | 1994-01-18 | International Business Machines Corp. | Au-Sn transient liquid bonding in high performance laminates |
CA2059020C (en) * | 1991-01-09 | 1998-08-18 | Kohji Kimbara | Polyimide multilayer wiring board and method of producing same |
JPH04278598A (ja) * | 1991-03-07 | 1992-10-05 | Nec Corp | 多層印刷配線板の製造方法 |
JPH0779191B2 (ja) * | 1991-04-08 | 1995-08-23 | 株式会社東芝 | 立体配線板の製造方法 |
TW210422B (es) * | 1991-06-04 | 1993-08-01 | Akzo Nv | |
CA2083077C (en) * | 1991-11-18 | 1997-12-23 | Kohji Kimbara | Polyimide multilayer interconnection board and method of making the same |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
ATE255276T1 (de) * | 1991-12-31 | 2003-12-15 | Tessera Inc | Mehrlageschaltungsherstellung und stuktur mit anpassungsmöglichkeit und komponenten dafür |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US5276955A (en) * | 1992-04-14 | 1994-01-11 | Supercomputer Systems Limited Partnership | Multilayer interconnect system for an area array interconnection using solid state diffusion |
US5309122A (en) * | 1992-10-28 | 1994-05-03 | Ball Corporation | Multiple-layer microstrip assembly with inter-layer connections |
US5303862A (en) * | 1992-12-31 | 1994-04-19 | International Business Machines Corporation | Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures |
US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
DE4312976A1 (de) * | 1993-04-21 | 1994-10-27 | Bosch Gmbh Robert | Kontaktierung von elektrisch leitenden Schichten eines Schichtsystems |
JPH06342976A (ja) * | 1993-06-01 | 1994-12-13 | Nippondenso Co Ltd | 基板の接続方法 |
US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
WO1995004387A1 (en) * | 1993-07-27 | 1995-02-09 | Citizen Watch Co., Ltd. | An electrical connecting structure and a method for electrically connecting terminals to each other |
US5346117A (en) * | 1993-07-27 | 1994-09-13 | International Business Machines Corporation | Method of fabricating a parallel processor package |
US5617300A (en) * | 1993-08-23 | 1997-04-01 | Nagano Japan Radio Co., Ltd. | Connecting method of printed substrate and apparatus |
JP3286651B2 (ja) * | 1993-12-27 | 2002-05-27 | 株式会社住友金属エレクトロデバイス | セラミック多層配線基板およびその製造法並びにセラミック多層配線基板用導電材料 |
US5454506A (en) * | 1994-03-01 | 1995-10-03 | International Business Machines Corporation | Structure and process for electro/mechanical joint formation |
US5613033A (en) * | 1995-01-18 | 1997-03-18 | Dell Usa, Lp | Laminated module for stacking integrated circuits |
US5876842A (en) * | 1995-06-07 | 1999-03-02 | International Business Machines Corporation | Modular circuit package having vertically aligned power and signal cores |
DE69626747T2 (de) * | 1995-11-16 | 2003-09-04 | Matsushita Electric Ind Co Ltd | Gedruckte Leiterplatte und ihre Anordnung |
EP0805614B1 (en) * | 1995-11-17 | 2005-04-13 | Kabushiki Kaisha Toshiba | Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar |
US6147870A (en) * | 1996-01-05 | 2000-11-14 | Honeywell International Inc. | Printed circuit assembly having locally enhanced wiring density |
US5839188A (en) * | 1996-01-05 | 1998-11-24 | Alliedsignal Inc. | Method of manufacturing a printed circuit assembly |
WO1997027490A1 (en) * | 1996-01-25 | 1997-07-31 | General Dynamics Information Systems, Inc. | Performing an operation on an integrated circuit |
US5808874A (en) * | 1996-05-02 | 1998-09-15 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US5873161A (en) * | 1996-07-23 | 1999-02-23 | Minnesota Mining And Manufacturing Company | Method of making a Z axis interconnect circuit |
KR100267558B1 (ko) * | 1997-05-13 | 2000-10-16 | 구자홍 | Bga 패키지와 인쇄 회로 기판의 접합 장치 |
US5979043A (en) * | 1997-07-14 | 1999-11-09 | Ford Motor Company | Method of manufacturing a circuit assembly from two or more layers of flexible film |
US6159586A (en) * | 1997-09-25 | 2000-12-12 | Nitto Denko Corporation | Multilayer wiring substrate and method for producing the same |
US6026564A (en) * | 1998-04-10 | 2000-02-22 | Ang Technologies Inc. | Method of making a high density multilayer wiring board |
US6138894A (en) * | 1998-11-25 | 2000-10-31 | Intermedics Inc. | Method for coupling a circuit component to a substrate |
JP3701139B2 (ja) * | 1999-05-17 | 2005-09-28 | アルプス電気株式会社 | プリント配線基板とそれを用いたスイッチ |
KR100764582B1 (ko) * | 1999-08-11 | 2007-10-09 | 테세라, 인코포레이티드 | 기상 접속 기술 |
US6675469B1 (en) * | 1999-08-11 | 2004-01-13 | Tessera, Inc. | Vapor phase connection techniques |
US6646364B1 (en) * | 2000-07-11 | 2003-11-11 | Honeywell International Inc. | MEMS actuator with lower power consumption and lower cost simplified fabrication |
JP3473601B2 (ja) * | 2000-12-26 | 2003-12-08 | 株式会社デンソー | プリント基板およびその製造方法 |
JP3867523B2 (ja) * | 2000-12-26 | 2007-01-10 | 株式会社デンソー | プリント基板およびその製造方法 |
US7331502B2 (en) * | 2001-03-19 | 2008-02-19 | Sumitomo Bakelite Company, Ltd. | Method of manufacturing electronic part and electronic part obtained by the method |
KR100443736B1 (ko) * | 2002-04-22 | 2004-08-09 | 주식회사 코스모텍 | 범프를 이용한 고집적 인쇄회로기판의 제조 방법 |
JP3879651B2 (ja) * | 2002-10-21 | 2007-02-14 | ソニー株式会社 | 積層配線基板、タッチパネル及びこれらの製造方法 |
DE112004002994A5 (de) * | 2004-12-08 | 2007-10-31 | Abb Patent Gmbh | Verfahren zur Herstellung eines Messumformers |
JP2009170753A (ja) * | 2008-01-18 | 2009-07-30 | Panasonic Corp | 多層プリント配線板とこれを用いた実装体 |
JP2011009335A (ja) * | 2009-06-24 | 2011-01-13 | Fujitsu Ltd | 半田接合構造及びこれを用いた電子装置並びに半田接合方法 |
DE202009009087U1 (de) * | 2009-07-01 | 2010-12-09 | Aizo Ag Deutschland | Eingebetteter Sandwich-Hybridschaltkreis |
TWM441292U (en) * | 2012-06-08 | 2012-11-11 | Hon Hai Prec Ind Co Ltd | Printed circuit board |
JP5931799B2 (ja) * | 2013-05-28 | 2016-06-08 | 株式会社日立製作所 | 層間接続基板およびその製造方法 |
CN106794532B (zh) * | 2014-10-07 | 2019-11-01 | 法国圣戈班玻璃厂 | 制造具有导电涂层和焊接在其上的金属带的板的方法以及相应的板 |
US10096958B2 (en) * | 2015-09-24 | 2018-10-09 | Spire Manufacturing Inc. | Interface apparatus for semiconductor testing and method of manufacturing same |
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-
1989
- 1989-12-26 US US07/456,946 patent/US5031308A/en not_active Expired - Lifetime
- 1989-12-28 ES ES93118917T patent/ES2085098T3/es not_active Expired - Lifetime
- 1989-12-28 EP EP93118943A patent/EP0607534B1/en not_active Expired - Lifetime
- 1989-12-28 EP EP93118917A patent/EP0607532B1/en not_active Expired - Lifetime
- 1989-12-28 DE DE68926055T patent/DE68926055T2/de not_active Expired - Fee Related
- 1989-12-28 ES ES93118943T patent/ES2104023T3/es not_active Expired - Lifetime
- 1989-12-28 DE DE68921732T patent/DE68921732T2/de not_active Expired - Fee Related
- 1989-12-28 DE DE68928150T patent/DE68928150T2/de not_active Expired - Fee Related
- 1989-12-28 CA CA002006776A patent/CA2006776C/en not_active Expired - Fee Related
- 1989-12-28 EP EP89124088A patent/EP0379736B1/en not_active Expired - Lifetime
- 1989-12-28 ES ES89124088T patent/ES2069570T3/es not_active Expired - Lifetime
- 1989-12-29 KR KR1019890020640A patent/KR940009175B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0607534A3 (en) | 1994-09-28 |
EP0607532A3 (en) | 1994-09-28 |
EP0379736B1 (en) | 1995-03-15 |
DE68928150D1 (de) | 1997-08-07 |
EP0607534A2 (en) | 1994-07-27 |
ES2104023T3 (es) | 1997-10-01 |
EP0607532A2 (en) | 1994-07-27 |
EP0379736A1 (en) | 1990-08-01 |
CA2006776C (en) | 1995-01-17 |
DE68926055D1 (de) | 1996-04-25 |
DE68921732T2 (de) | 1995-07-13 |
DE68926055T2 (de) | 1996-10-24 |
ES2069570T3 (es) | 1995-05-16 |
DE68921732D1 (de) | 1995-04-20 |
EP0607532B1 (en) | 1996-03-20 |
KR940009175B1 (ko) | 1994-10-01 |
DE68928150T2 (de) | 1997-11-27 |
EP0607534B1 (en) | 1997-07-02 |
CA2006776A1 (en) | 1990-06-29 |
US5031308A (en) | 1991-07-16 |
KR900011360A (ko) | 1990-07-11 |
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