DE112004002994A5 - Verfahren zur Herstellung eines Messumformers - Google Patents

Verfahren zur Herstellung eines Messumformers Download PDF

Info

Publication number
DE112004002994A5
DE112004002994A5 DE112004002994T DE112004002994T DE112004002994A5 DE 112004002994 A5 DE112004002994 A5 DE 112004002994A5 DE 112004002994 T DE112004002994 T DE 112004002994T DE 112004002994 T DE112004002994 T DE 112004002994T DE 112004002994 A5 DE112004002994 A5 DE 112004002994A5
Authority
DE
Germany
Prior art keywords
transmitter
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112004002994T
Other languages
English (en)
Inventor
Peter Dr.-Ing. Krippner
Fritz B. Prof. Woodside Prinz
Sangkyun Kang
Tibor Mountain View Fabian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
ABB Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Patent GmbH filed Critical ABB Patent GmbH
Publication of DE112004002994A5 publication Critical patent/DE112004002994A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
    • G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
    • G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
DE112004002994T 2004-12-08 2004-12-08 Verfahren zur Herstellung eines Messumformers Withdrawn DE112004002994A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2004/013950 WO2006061036A1 (de) 2004-12-08 2004-12-08 Verfahren zur herstellung eines messumformers

Publications (1)

Publication Number Publication Date
DE112004002994A5 true DE112004002994A5 (de) 2007-10-31

Family

ID=34959455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112004002994T Withdrawn DE112004002994A5 (de) 2004-12-08 2004-12-08 Verfahren zur Herstellung eines Messumformers

Country Status (4)

Country Link
US (1) US7886429B2 (de)
CN (1) CN101069075B (de)
DE (1) DE112004002994A5 (de)
WO (1) WO2006061036A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8319312B2 (en) * 2007-07-23 2012-11-27 Wispry, Inc. Devices for fabricating tri-layer beams
DE102011085652A1 (de) * 2011-11-03 2013-05-08 Robert Bosch Gmbh Vorrichtung zur Erfassung eines Drucks eines fluiden Mediums
JP5912675B2 (ja) * 2012-03-05 2016-04-27 アズビル株式会社 差圧発信器
US9161712B2 (en) * 2013-03-26 2015-10-20 Google Inc. Systems and methods for encapsulating electronics in a mountable device
EP3654005B1 (de) * 2018-11-15 2022-05-11 TE Connectivity Solutions GmbH Differentialdrucksensor

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3748571A (en) 1972-09-07 1973-07-24 Kulite Semiconductors Products Pressure sensitive transducers employing capacitive and resistive variations
US3805377A (en) 1973-04-18 1974-04-23 Itt Method of making a transducer
GB2064873B (en) 1979-11-26 1984-09-05 Eventoff Franklin Neal Pressure sensitive electric switch
US4510671A (en) * 1981-08-31 1985-04-16 Kulite Semiconductor Products, Inc. Dielectrically isolated transducer employing single crystal strain gages
EP0114239A3 (de) * 1982-11-25 1985-05-15 Schoppe & Faeser GmbH Messkapsel für einen kapazitiven Differenzdruck-Messumformer
US4565096A (en) * 1983-12-09 1986-01-21 Rosemount Inc. Pressure transducer
US4732647A (en) * 1984-10-24 1988-03-22 Aine Harry E Batch method of making miniature capacitive force transducers assembled in wafer form
EP0229553A1 (de) * 1985-12-04 1987-07-22 Seb S.A. Verfahren zum Herstellen und Anbringen von Dehnungsmessstreifen und Dehnungsmessstreifen insbesondere während dieses Verfahrens erhalten werden
US4672354A (en) 1985-12-05 1987-06-09 Kulite Semiconductor Products, Inc. Fabrication of dielectrically isolated fine line semiconductor transducers and apparatus
JPH0777273B2 (ja) * 1986-12-24 1995-08-16 キヤノン株式会社 スイッチング素子およびその駆動方法
FR2629592B1 (fr) * 1988-03-30 1990-07-27 Schlumberger Ind Sa Capteur de pression adaptatif
US4808549A (en) * 1988-05-27 1989-02-28 Ford Motor Company Method for fabricating a silicon force transducer
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
DE4031369A1 (de) * 1990-10-04 1992-04-09 Bosch Gmbh Robert Sensor
US5549006A (en) * 1994-05-24 1996-08-27 Kulite Semiconductor Products, Inc. Temperature compensated silicon carbide pressure transducer and method for making the same
US6691581B2 (en) * 1995-05-25 2004-02-17 Kulite Semiconductor Products, Inc. Pressure transducer fabricated from beta silicon carbide
US6327911B1 (en) * 1995-05-25 2001-12-11 Kulite Semiconductor Products High temperature pressure transducer fabricated from beta silicon carbide
US6030851A (en) 1995-06-07 2000-02-29 Grandmont; Paul E. Method for overpressure protected pressure sensor
US6021675A (en) 1995-06-07 2000-02-08 Ssi Technologies, Inc. Resonating structure and method for forming the resonating structure
FR2766919B1 (fr) * 1997-07-30 1999-10-15 Schlumberger Services Petrol Transducteur de pression hydrostatique et/ou de temperature
US6129613A (en) * 1998-01-30 2000-10-10 Philips Electronics North America Corp. Semiconductor manufacturing apparatus and method for measuring in-situ pressure across a wafer
US6556417B2 (en) * 1998-03-10 2003-04-29 Mcintosh Robert B. Method to construct variable-area capacitive transducers
US6604425B1 (en) 2000-06-09 2003-08-12 Hrl Laboratories, Llc Microelectromechanical correlation device and method
EP1407464B1 (de) * 2001-07-17 2011-03-09 SMC Kabushiki Kaisha Elektromechanischer mikrosensor
JP4181778B2 (ja) * 2002-02-05 2008-11-19 ソニー株式会社 配線基板の製造方法

Also Published As

Publication number Publication date
CN101069075B (zh) 2012-05-30
US20080047127A1 (en) 2008-02-28
US7886429B2 (en) 2011-02-15
WO2006061036A1 (de) 2006-06-15
CN101069075A (zh) 2007-11-07

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: ABB AG, 68309 MANNHEIM, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140701