ES2069837T3 - Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa. - Google Patents
Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa.Info
- Publication number
- ES2069837T3 ES2069837T3 ES91311672T ES91311672T ES2069837T3 ES 2069837 T3 ES2069837 T3 ES 2069837T3 ES 91311672 T ES91311672 T ES 91311672T ES 91311672 T ES91311672 T ES 91311672T ES 2069837 T3 ES2069837 T3 ES 2069837T3
- Authority
- ES
- Spain
- Prior art keywords
- transit
- filling
- dimensioners
- multilayer
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/13—High voltage cable, e.g. above 10kv, corona prevention
- Y10S174/33—Method of cable manufacture, assembly, repair, or splicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/916—Narrow band gap semiconductor material, <<1ev
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/928—Active solid-state devices, e.g. transistors, solid-state diodes with shorted PN or schottky junction other than emitter junction
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Abstract
UNA ESTRUCTURA DE CONDENSADOR EN UN CIRCUITO MULTICAPA HIBRIDO CON VARIAS CAPAS AISLANTES (L3, L4), LA ESTRUCTURA DE CONDENSADOR QUE INCLUYE UN RELLENO DE TRANSITO DIELECTRICO (203A) EN UNA VIA FORMADA EN UNA DE LAS CAPAS AISLANTES, UN PRIMER ELEMENTO CONDUCTOR (103A) SUPERPUESTO AL RELLENO DE TRANSITO DIELECTRICO, Y UN SEGUNDO ELEMENTO CONDUCTOR (104A) SUBYACENTE A DICHO RELLENO DE TRANSITO DIELECTRICO. CADA UNO DE LOS ELEMENTOS PRIMERO Y CONDUCTOR INCLUYE UN RELLENO DE TRANSITO CONDUCTOR O UNA LINEA CONDUCTORA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/628,784 US5055966A (en) | 1990-12-17 | 1990-12-17 | Via capacitors within multi-layer, 3 dimensional structures/substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2069837T3 true ES2069837T3 (es) | 1995-05-16 |
Family
ID=24520288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES91311672T Expired - Lifetime ES2069837T3 (es) | 1990-12-17 | 1991-12-16 | Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5055966A (es) |
EP (1) | EP0491542B1 (es) |
JP (1) | JP2874120B2 (es) |
KR (1) | KR950010022B1 (es) |
CA (1) | CA2056740C (es) |
DE (1) | DE69108365T2 (es) |
DK (1) | DK0491542T3 (es) |
ES (1) | ES2069837T3 (es) |
MX (1) | MX9102574A (es) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5144526A (en) * | 1991-08-05 | 1992-09-01 | Hughes Aircraft Company | Low temperature co-fired ceramic structure containing buried capacitors |
US5208726A (en) * | 1992-04-03 | 1993-05-04 | Teledyne Monolithic Microwave | Metal-insulator-metal (MIM) capacitor-around-via structure for a monolithic microwave integrated circuit (MMIC) and method of manufacturing same |
JPH05343855A (ja) * | 1992-06-08 | 1993-12-24 | Cmk Corp | 多層プリント配線板およびその製造方法 |
US5396397A (en) * | 1992-09-24 | 1995-03-07 | Hughes Aircraft Company | Field control and stability enhancement in multi-layer, 3-dimensional structures |
US5780375A (en) * | 1993-10-19 | 1998-07-14 | E. I. Du Pont De Nemours And Company | Thick film composition for modifying the electrical properties of a dielectric layer |
JP3363651B2 (ja) * | 1994-04-21 | 2003-01-08 | キヤノン株式会社 | プリント配線板およびその設計方法 |
US5509200A (en) * | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
JPH08228064A (ja) * | 1994-12-22 | 1996-09-03 | Kanto Kasei Kogyo Kk | プリント回路基板 |
US5633785A (en) * | 1994-12-30 | 1997-05-27 | University Of Southern California | Integrated circuit component package with integral passive component |
US5708570A (en) * | 1995-10-11 | 1998-01-13 | Hughes Aircraft Company | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
US6004839A (en) * | 1996-01-17 | 1999-12-21 | Nec Corporation | Semiconductor device with conductive plugs |
DE19638195A1 (de) * | 1996-09-19 | 1998-04-02 | Bosch Gmbh Robert | Dielektrische Paste |
JP3629348B2 (ja) * | 1997-04-16 | 2005-03-16 | 新光電気工業株式会社 | 配線基板 |
US6261872B1 (en) | 1997-09-18 | 2001-07-17 | Trw Inc. | Method of producing an advanced RF electronic package |
JP3322199B2 (ja) * | 1998-01-06 | 2002-09-09 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
USRE38519E1 (en) * | 1998-08-24 | 2004-05-18 | Panduit Corp. | Low crosstalk modular communication connector |
US6371793B1 (en) | 1998-08-24 | 2002-04-16 | Panduit Corp. | Low crosstalk modular communication connector |
JP3656484B2 (ja) * | 1999-03-03 | 2005-06-08 | 株式会社村田製作所 | セラミック多層基板の製造方法 |
KR101084526B1 (ko) | 1999-09-02 | 2011-11-18 | 이비덴 가부시키가이샤 | 프린트배선판 및 그 제조방법 |
CN101232775B (zh) | 1999-09-02 | 2010-06-09 | 伊比登株式会社 | 印刷布线板及其制造方法 |
AU2001229420A1 (en) | 2000-01-14 | 2001-07-24 | Panduit Corp. | Low crosstalk modular communication connector |
JP2001257471A (ja) * | 2000-03-10 | 2001-09-21 | Ngk Insulators Ltd | 多層配線基板及びその製造方法 |
US6525922B2 (en) * | 2000-12-29 | 2003-02-25 | Intel Corporation | High performance via capacitor and method for manufacturing same |
US6621012B2 (en) * | 2001-02-01 | 2003-09-16 | International Business Machines Corporation | Insertion of electrical component within a via of a printed circuit board |
US6976238B1 (en) * | 2001-06-03 | 2005-12-13 | Cadence Design Systems, Inc. | Circular vias and interconnect-line ends |
US7334326B1 (en) * | 2001-06-19 | 2008-02-26 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having embedded passive components |
JP2003332749A (ja) | 2002-01-11 | 2003-11-21 | Denso Corp | 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板 |
US7052328B2 (en) * | 2002-11-27 | 2006-05-30 | Panduit Corp. | Electronic connector and method of performing electronic connection |
US6908809B1 (en) | 2004-04-02 | 2005-06-21 | Harris Corporation | Embedded capacitors using conductor filled vias |
US20060213686A1 (en) * | 2004-12-28 | 2006-09-28 | Shin-Hsien Wu | Cut Via Structure For And Manufacturing Method Of Connecting Separate Conductors |
US20060162844A1 (en) * | 2005-01-26 | 2006-07-27 | Needes Christopher R | Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof |
US7349196B2 (en) * | 2005-06-17 | 2008-03-25 | Industrial Technology Research Institute | Composite distributed dielectric structure |
US8169014B2 (en) | 2006-01-09 | 2012-05-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interdigitated capacitive structure for an integrated circuit |
JP2009527079A (ja) * | 2006-02-13 | 2009-07-23 | パンデュイット・コーポレーション | 漏話補償機能付きコネクタ |
US7656236B2 (en) | 2007-05-15 | 2010-02-02 | Teledyne Wireless, Llc | Noise canceling technique for frequency synthesizer |
DE102007026880A1 (de) * | 2007-06-08 | 2008-11-20 | Siemens Ag | Leiterplatte und Verfahren zur Herstellung einer Leiterplatte |
KR101124277B1 (ko) * | 2007-07-26 | 2012-03-27 | 가부시키가이샤 무라타 세이사쿠쇼 | 다층 세라믹 기판 및 그 제조 방법 |
DE102007051316B4 (de) * | 2007-10-26 | 2010-12-02 | Continental Automotive Gmbh | Schaltungsträger mit hoher Bauteildichte |
US8179045B2 (en) | 2008-04-22 | 2012-05-15 | Teledyne Wireless, Llc | Slow wave structure having offset projections comprised of a metal-dielectric composite stack |
US8405135B2 (en) | 2010-10-05 | 2013-03-26 | International Business Machines Corporation | 3D via capacitor with a floating conductive plate for improved reliability |
JP6282388B2 (ja) * | 2011-10-24 | 2018-02-21 | デクセリアルズ株式会社 | 静電容量素子、及び共振回路 |
US9202660B2 (en) | 2013-03-13 | 2015-12-01 | Teledyne Wireless, Llc | Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes |
US10014843B2 (en) * | 2013-08-08 | 2018-07-03 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structures with embedded filters |
US9852941B2 (en) | 2014-10-03 | 2017-12-26 | Analog Devices, Inc. | Stacked conductor structure and methods for manufacture of same |
US9496326B1 (en) | 2015-10-16 | 2016-11-15 | International Business Machines Corporation | High-density integrated circuit via capacitor |
TWI656815B (zh) * | 2016-06-21 | 2019-04-11 | 中華精測科技股份有限公司 | 具有過孔電容結構的電路板及其製造方法 |
US20220122929A1 (en) * | 2021-12-24 | 2022-04-21 | Intel Corporation | Package routing for crosstalk reduction in high frequency communication |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349862A (en) * | 1980-08-11 | 1982-09-14 | International Business Machines Corporation | Capacitive chip carrier and multilayer ceramic capacitors |
US4608592A (en) * | 1982-07-09 | 1986-08-26 | Nec Corporation | Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage |
FR2556503B1 (fr) * | 1983-12-08 | 1986-12-12 | Eurofarad | Substrat d'interconnexion en alumine pour composant electronique |
JPH0632378B2 (ja) * | 1985-06-14 | 1994-04-27 | 株式会社村田製作所 | 電子部品内蔵多層セラミック基板 |
US4924353A (en) * | 1985-12-20 | 1990-05-08 | Hughes Aircraft Company | Connector system for coupling to an integrated circuit chip |
US4792779A (en) * | 1986-09-19 | 1988-12-20 | Hughes Aircraft Company | Trimming passive components buried in multilayer structures |
JPS6464394A (en) * | 1987-09-04 | 1989-03-10 | Fujitsu Ltd | Hybrid integrated circuit substrate |
US4925723A (en) * | 1988-09-29 | 1990-05-15 | Microwave Power, Inc. | Microwave integrated circuit substrate including metal filled via holes and method of manufacture |
JPH02239697A (ja) * | 1989-03-13 | 1990-09-21 | Nippon Cement Co Ltd | 回路基板の製造方法 |
US4995941A (en) * | 1989-05-15 | 1991-02-26 | Rogers Corporation | Method of manufacture interconnect device |
-
1990
- 1990-12-17 US US07/628,784 patent/US5055966A/en not_active Expired - Lifetime
-
1991
- 1991-11-29 CA CA002056740A patent/CA2056740C/en not_active Expired - Lifetime
- 1991-12-16 MX MX9102574A patent/MX9102574A/es unknown
- 1991-12-16 JP JP3331966A patent/JP2874120B2/ja not_active Expired - Lifetime
- 1991-12-16 KR KR1019910023098A patent/KR950010022B1/ko active IP Right Grant
- 1991-12-16 EP EP91311672A patent/EP0491542B1/en not_active Expired - Lifetime
- 1991-12-16 DE DE69108365T patent/DE69108365T2/de not_active Expired - Lifetime
- 1991-12-16 ES ES91311672T patent/ES2069837T3/es not_active Expired - Lifetime
- 1991-12-16 DK DK91311672.9T patent/DK0491542T3/da active
Also Published As
Publication number | Publication date |
---|---|
DK0491542T3 (da) | 1995-06-06 |
MX9102574A (es) | 1992-06-01 |
CA2056740A1 (en) | 1992-06-18 |
KR920013500A (ko) | 1992-07-29 |
DE69108365T2 (de) | 1995-10-05 |
US5055966A (en) | 1991-10-08 |
DE69108365D1 (de) | 1995-04-27 |
JPH04299889A (ja) | 1992-10-23 |
JP2874120B2 (ja) | 1999-03-24 |
EP0491542A1 (en) | 1992-06-24 |
KR950010022B1 (ko) | 1995-09-04 |
EP0491542B1 (en) | 1995-03-22 |
CA2056740C (en) | 1996-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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