ES2148966T3 - Dispositivo electronico moldeado multicapa y metodo para su fabricacion - Google Patents

Dispositivo electronico moldeado multicapa y metodo para su fabricacion

Info

Publication number
ES2148966T3
ES2148966T3 ES97918270T ES97918270T ES2148966T3 ES 2148966 T3 ES2148966 T3 ES 2148966T3 ES 97918270 T ES97918270 T ES 97918270T ES 97918270 T ES97918270 T ES 97918270T ES 2148966 T3 ES2148966 T3 ES 2148966T3
Authority
ES
Spain
Prior art keywords
manufacture
electronic device
multilayer molded
molded electronic
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97918270T
Other languages
English (en)
Inventor
Michael George Todd
Peter Joseph Sinkunas
Andrew Zachary Glovatsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Application granted granted Critical
Publication of ES2148966T3 publication Critical patent/ES2148966T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

UN DISPOSITIVO ELECTRONICO MOLDEADO DE CAPAS MULTIPLES Y METODO PARA SU FABRICACION, EN EL QUE EL DISPOSITIVO COMPRENDE AL MENOS DOS SUSTRATOS TRIDIMENSIONALES MOLDEADOS (12, 14) CON SUPERFICIES DE ACOPLAMIENTO (20, 22) INCLUYENDO CADA SUSTRATO UNA CAPA (16, 18) DE MATERIAL CONDUCTIVO CONFIGURADO EN AL MENOS UNA SUPERFICIE Y VIAS ELECTRICAMENTE CONDUCTORAS (24, 26) EN EMPLAZAMIENTOS SELECCIONADOS DEL SUSTRATO PARA INTERCONEXION DE LAS CAPAS CONDUCTIVAS (16, 18), EN DONDE LOS SUSTRATOS (20, 22) SE UNEN EN SUS SUPERFICIES DE ACOPLAMIENTO Y LAS CAPAS DE CIRCUITO (16, 18) ESTAN ALINEADAS E INTERCONECTADAS PARA FORMAR UNA CAPA MULTIPLE, UN CIRCUITO TRIDIMENSIONAL QUE PUEDE INCLUIR CARACTERISTICAS ESTRUCTURALES MOLDEADAS.
ES97918270T 1996-05-03 1997-05-01 Dispositivo electronico moldeado multicapa y metodo para su fabricacion Expired - Lifetime ES2148966T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/642,722 US5914534A (en) 1996-05-03 1996-05-03 Three-dimensional multi-layer molded electronic device and method for manufacturing same

Publications (1)

Publication Number Publication Date
ES2148966T3 true ES2148966T3 (es) 2000-10-16

Family

ID=24577729

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97918270T Expired - Lifetime ES2148966T3 (es) 1996-05-03 1997-05-01 Dispositivo electronico moldeado multicapa y metodo para su fabricacion

Country Status (5)

Country Link
US (1) US5914534A (es)
EP (1) EP0896787B1 (es)
DE (1) DE69702603T2 (es)
ES (1) ES2148966T3 (es)
WO (1) WO1997042799A1 (es)

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JP3497722B2 (ja) * 1998-02-27 2004-02-16 富士通株式会社 半導体装置及びその製造方法及びその搬送トレイ
US6300687B1 (en) * 1998-06-26 2001-10-09 International Business Machines Corporation Micro-flex technology in semiconductor packages
DE19908574B4 (de) 1999-02-27 2004-02-12 Moeller Gmbh In ein Befehls- oder Meldegerät einrastbares Funktionselement mit einer Leuchtdiode
DE19912256C1 (de) * 1999-03-18 2000-11-16 Siemens Ag Herstellungsverfahren für ein elektronisches Gerät und elektronisches Gerät mit Kunststoffgehäuse
DE10023736A1 (de) * 2000-05-15 2001-11-22 Harting Elektrooptische Bauteile Gmbh & Co Kg Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte
EP1532842B1 (en) * 2002-07-10 2013-08-14 Oticon A/S Hearing aid or similar audio device and method for producing a hearing aid
US7473218B2 (en) * 2002-08-06 2009-01-06 Olympus Corporation Assembling method of capsule medical apparatus
JP2004281248A (ja) * 2003-03-17 2004-10-07 Pioneer Electronic Corp 耐熱絶縁フィルム及び絶縁方法
EP1544917A1 (en) * 2003-12-15 2005-06-22 Dialog Semiconductor GmbH Integrated battery pack with lead frame connection
US7943859B2 (en) * 2004-03-31 2011-05-17 Mitsubishi Cable Industries, Ltd. Circuit board, its manufacturing method, and joint box using circuit board
US7919717B2 (en) 2005-08-19 2011-04-05 Honeywell International Inc. Three-dimensional printed circuit board
JP2008078628A (ja) * 2006-08-25 2008-04-03 Canon Inc 電子モジュールおよびその製造方法
WO2009133969A2 (en) * 2008-04-30 2009-11-05 Panasonic Electric Works Co., Ltd. Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
NL1035663C2 (nl) * 2008-07-04 2010-01-05 Thales Nederland Bv Een werkwijze voor het vervaardigen van een driedimensionale multi-layered (meerlagen) doorverbindingsvoorziening.
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
US9300222B2 (en) * 2013-09-11 2016-03-29 Texas Instruments Incorporated Three-dimensional power supply module with passive stacked over cavity
US9386693B2 (en) 2014-05-05 2016-07-05 Lockheed Martin Corporation Board integrated interconnect
JP6436296B2 (ja) 2014-10-24 2018-12-12 パナソニックＩｐマネジメント株式会社 立体回路基板および当該立体回路基板を用いたセンサモジュール

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Also Published As

Publication number Publication date
WO1997042799A1 (en) 1997-11-13
EP0896787B1 (en) 2000-07-19
US5914534A (en) 1999-06-22
EP0896787A1 (en) 1999-02-17
DE69702603D1 (de) 2000-08-24
DE69702603T2 (de) 2001-03-29

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