EP3017082A1 - An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte - Google Patents
An eine indirekte kühlvorrichtung angepasstes target mit kühlplatteInfo
- Publication number
- EP3017082A1 EP3017082A1 EP14737147.0A EP14737147A EP3017082A1 EP 3017082 A1 EP3017082 A1 EP 3017082A1 EP 14737147 A EP14737147 A EP 14737147A EP 3017082 A1 EP3017082 A1 EP 3017082A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- target
- cooling
- self
- thermally conductive
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 29
- 239000012528 membrane Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000110 cooling liquid Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000006506 Brasenia schreberi Nutrition 0.000 description 1
- 244000267222 Brasenia schreberi Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Definitions
- the present invention relates to a target whose surface serves as a material source in the context of PVD processes, in particular under vacuum conditions.
- the invention relates in particular to those targets which are used for sputtering (hereinafter the term “sputtering” is used synonymously with the PVD method "sputtering").
- sputtering is used synonymously with the PVD method "sputtering”
- Such a target is usually supported in the application of a source holder, are provided in the means of cooling of the.
- the invention relates to a coating source comprising such a target.
- the surface of a target is bombarded with ions under vacuum conditions. Due to the bombardment, material is knocked out of the target surface, which can deposit on substrates provided in the field of view of the target surface.
- the ions required for this purpose are provided by a plasma built up over the target surface. Applying a negative voltage to the target accelerates the ions towards it. The more ions flow per unit time, the higher the coating rate becomes. The higher the voltage applied to the target, the higher the impact velocity of the ions on the target surface, and the higher the energy expelled from the target atomized material. A high power input is therefore desirable.
- dependencies between the degree of ionization of the sputtered material and the power density are known. These effects are used in the HIPIMS process.
- the average power density applied to such a sputtering target is typically in the range of 5 W / cm 2 to 30 W / cm 2 .
- the target 201 is secured with its back 203 to a source support 205 (e.g., screwed or clamped) with a self-contained cooling plate 207 integrated into the source support 205.
- the cooling plate 207 comprises, for example, a cooling channel 209 through which coolant flows, through whose moving liquid the heat is dissipated.
- the cooling liquid channel is limited by a solid fixed cover.
- the target is for the purpose of cooling and electrical contact with this cover, for example with screws on the circumference or if necessary attached in the middle of the target.
- this method has two problems:
- the heat transfer is formed by the surface of the Tarruckückseite and the surface of the cooling plate. Without special measures, these two surfaces form an interface that deviates greatly from an ideal smooth contact pairing. Such a situation is shown in FIG.
- the heat transfer is greatly reduced in this case and proves to be pressure-dependent.
- contact pressure can only be introduced via the fastening screws, i. the heat transfer can only be improved locally.
- This situation can be improved by providing a contact foil between the two surfaces.
- This can e.g. made of indium, tin, or graphite. Due to their ductility, these films can compensate for unevenness between the target back surface and the surface of the cooling plate. In addition, the contact pressure can be applied more uniformly over the surface.
- a disadvantage of this method is that the mounting of a contact foil, especially for vertically mounted targets, is difficult and cumbersome. This is especially relevant if there is too frequent change of the target material.
- graphite foils although the lateral thermal conductivity is good, the transverse thermal conductivity is poor. Graphite foils must therefore be thin on the one hand so that their poor transverse thermal conductivity does not prevent the cooling process. On the other hand, a certain film thickness is necessary to prevent damage to the film during assembly. Therefore graphite foils with a thickness not less than 0.5mm are used.
- the invention is based on a further development of the above-sketched indirect cooling device.
- the object is achieved in that at the Rear side of the target body is attached a self-adhesive carbon film in fixed association with the target body. If the target body is not mounted, the film can be adhesively bonded to the back of the target body uniformly and without gaps. A very good thermal contact between the back of the target body and the carbon foil is thus ensured.
- the target body can then be mounted in a simple manner on the source holder.
- the carbon foil fixed to the target now has the effect of a contact foil between the surface of the cooling plate and the rear side of the target body.
- the use of such a self-adhesive carbon film is not common in the field of vacuum technology. Since the adhesive used for the production of the self-adhesive carbon foil strongly outgas under vacuum conditions and thus have a negative influence on the vacuum and the corresponding volatile constituents lead to the contamination of the substrates to be treated under vacuum, such substances are not used.
- Figure 1 shows a conventional coating source with direct cooling.
- Figure 2 shows a conventional coating source with indirect cooling.
- FIG. 3 shows the limited thermal contact in the case of a coating source with cooling according to FIG. 2.
- Figure 4 shows in cross section an embodiment of the inventive target with attached self-adhesive carbon film.
- FIG. 5 shows the inventive target integrated into a coating source with indirect cooling in a first embodiment.
- FIG. 6 shows the inventive target integrated into a coating source in a second embodiment.
- FIG. 4 a shows a target 401, on the rear side of the target 403 of which a one-sidedly self-adhesive carbon foil 407 with a thickness of between 0.1 mm and less than 0.5 mm is applied.
- the preferred thickness of the carbon foil selected in the example is 0.125 mm.
- a contact film from Kunze with the product identification number KU-CB1205-AV was used.
- the carbon film comprises an adhesive film 409 which makes the carbon film the self-adhesive film, as well as a carbon film 411.
- the target according to FIG. 4 can be integrated well into a coating source with indirect cooling, as shown in FIG. 5:
- the target 501 with self-adhesive carbon foil 507 is fixed with the screws 513 to the front side of a source holder 505, wherein a cooling plate with cooling channel into the source holder 509 is integrated and the carbon foil 507 is pressed onto the back 503 of the cooling plate, whereby a good thermal contact with the cooling plates is formed. Due to the inventive fact that the carbon foil is adhered to the Tar Wegückseite a target change is very easy, even if the target is mounted vertically in a coating chamber.
- An improved variant of the indirect cooling is indirect cooling by means of a movable membrane, as shown in FIG.
- the structure is similar to the outlined in Figure 5 with target 601 with self-adhesive carbon film 607, source holder 605,dekanai 609, although that wall of the Cooling plate, which separates the cooling channel 609 of the carbon film 607, is formed in this preferred embodiment as a flexible membrane 603.
- the coolant may be, for example, water. When changing the target, no release of a water seal is necessary.
- the membrane 603 is uniformly pressed against the target rear side and thus against the self-adhesive carbon foil 607 and due to the hydrostatic pressure prevailing in the cooling channel 609 very good, flat heat contact.
- a target without inventive self-adhesive carbon foil as in measurement no. 1 of Table 1 can be safely operated for mechanical reasons only up to a sputtering power of 2.5 kW.
- the performance compatibility is more than doubled.
- target materials ie for other AITi or AlCr ratios and also for pure aluminum, titanium and / or chromium targets, there is a qualitative indication similar picture.
- the present invention shows a particularly good effect when target thicknesses between 6 mm and 18 mm are used.
- the target thickness is between 6 mm and 12 mm.
- the target 701 is designed as a target with self-adhesive carbon foil 705 on the back of the target 703 and bayonet profiling 707 according to FIG.
- a preferred coating source according to this embodiment has the indirect cooling with membrane described in connection with FIG. 6 and the counterparts necessary for the bayonet fixing. This allows a high and homogeneous contact pressure.
- This preferred embodiment is particularly advantageous in connection with powder metallurgy targets because they are mechanically weakened from a temperature of 150 ° C. and the thermal expansion increases. Due to the reduction of the target temperature and the mechanical clearance given by the bayonet fixation, this thermal stress is considerably reduced. For chrome targets, for example, power densities up to 100 W / cm 2 are possible.
- a target has been disclosed, which is designed as a material source for a gas phase deposition method with a front side and a rear side, which is characterized in that a self-adhesive carbon foil is glued to the rear side.
- the target may be formed as a material source for a sputtering process and / or for a spark evaporation process.
- the thickness of the self-adhesive carbon film may be, for example, between 0.25 mm and 0.5 mm and preferably have a thickness of 0.125 mm.
- a coating source comprising a target as described above, which is arranged on a source holder, in which an indirect cooling with cooling channel is integrated, has been disclosed.
- That wall which separates the cooling channel from the self-adhesive carbon foil is preferably formed as a flexible membrane, whereby the self-adhesive carbon foil makes surface contact with the membrane forms.
- the circumference of the target of the coating source is preferably designed to cooperate with the source holder in the form of a bayonet closure, whereby a high and homogeneous contact pressure is realized.
- a further plate with high thermal conductivity is provided between the target and the component which comprises a cooling channel for removing the heat.
- This may be for example a molybdenum plate or a copper plate.
- the further plate may be in detachable contact with the component comprising the cooling channel. Again, it is important that there is a very good thermal contact over a large area.
- a self-adhesive carbon foil may be provided on that side of the further plate. In this case, it is favorable if a self-adhesive carbon foil is also provided on the rear of the tar as described above.
- a self-adhesive carbon film is provided on both sides of the further plate.
- both the target side is taken care of over a large area for a good thermal contact and it is provided for a good thermal contact with the cooling channel comprehensive component.
- the thus formed further plate is thus covered on both sides with self-adhesive carbon film.
- This additional plate can easily be chosen so thick that it has sufficient stability so that the handling when changing target no problem.
- This embodiment also has the advantage that no expensive components such as the cooling channel component or the target must be covered with foil. At least if copper is used as a further plate, this is a very cost-effective variant. If one of the two self-adhesive carbon foils is damaged, it will only cost a small amount to replace this additional plate.
- Figure 8 shows schematically the corresponding structure of this embodiment. Shown is the component 805 with the cooling channel 807 through which the heat is ultimately dissipated. On the other, thermally conductive plate 803 is located on one side of a first self-adhesive carbon film 811 and on the other side a second self-adhesive carbon film 809 is glued. On this turn, the target 801 is arranged.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013011074.2A DE102013011074A1 (de) | 2013-07-03 | 2013-07-03 | An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte |
PCT/EP2014/001782 WO2015000577A1 (de) | 2013-07-03 | 2014-06-30 | An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3017082A1 true EP3017082A1 (de) | 2016-05-11 |
Family
ID=51167845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14737147.0A Pending EP3017082A1 (de) | 2013-07-03 | 2014-06-30 | An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte |
Country Status (16)
Country | Link |
---|---|
US (1) | US10636635B2 (pt) |
EP (1) | EP3017082A1 (pt) |
JP (1) | JP6652485B2 (pt) |
KR (1) | KR102274485B1 (pt) |
CN (1) | CN105283577B (pt) |
BR (1) | BR112015032156B1 (pt) |
CA (1) | CA2916770C (pt) |
DE (1) | DE102013011074A1 (pt) |
HK (1) | HK1214309A1 (pt) |
IL (1) | IL243137B (pt) |
MX (1) | MX2015016869A (pt) |
MY (1) | MY186272A (pt) |
PH (1) | PH12015502733B1 (pt) |
RU (1) | RU2016103234A (pt) |
SG (1) | SG11201510190YA (pt) |
WO (1) | WO2015000577A1 (pt) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2019131010A1 (ja) * | 2017-12-27 | 2020-12-17 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
CN108130516A (zh) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | 一种使用泡沫金属增强冷却的真空镀阴极靶 |
CN112599446A (zh) * | 2020-12-15 | 2021-04-02 | 华能新能源股份有限公司 | 一种真空蒸镀用基片辅助降温装置 |
CN113667947B (zh) * | 2021-07-23 | 2023-04-21 | 镇江市德利克真空设备科技有限公司 | 一种应用于阴极平台的智能温控装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5082595A (en) * | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4569745A (en) * | 1982-10-05 | 1986-02-11 | Fujitsu Limited | Sputtering apparatus |
DE4015388C2 (de) * | 1990-05-14 | 1997-07-17 | Leybold Ag | Kathodenzerstäubungsvorrichtung |
DE59208623D1 (de) * | 1991-05-08 | 1997-07-24 | Balzers Hochvakuum | Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer |
WO1998007565A1 (en) * | 1996-08-23 | 1998-02-26 | Tosoh Smd, Inc. | Bonding with a conductive adhesive sheet material |
US5985115A (en) * | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
EP0951049A1 (de) * | 1998-04-16 | 1999-10-20 | Balzers Aktiengesellschaft | Haltering sowie Target und Verfahren zu seiner Herstellung |
KR100291330B1 (ko) | 1998-07-02 | 2001-07-12 | 윤종용 | 반도체장치제조용스퍼터링설비및이를이용한스퍼터링방법 |
JP2001164361A (ja) * | 1999-12-09 | 2001-06-19 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット冷却構造 |
WO2004023515A1 (de) * | 2002-09-03 | 2004-03-18 | Umicore Materials Ag | Zerstäubungskatode, herstellverfahren sowie katode hierzu |
DE102004058280A1 (de) | 2004-12-02 | 2006-06-08 | Tesa Ag | Doppelseitige Haftklebebänder zur Herstellung bzw. Verklebung von LC-Displays mit lichtabsorbierenden Eigenschaften |
EP1752556B1 (de) * | 2005-08-02 | 2007-10-31 | Applied Materials GmbH & Co. KG | Rohrkathode für die Verwendung bei einem Sputterprozess |
JP5236400B2 (ja) * | 2008-09-04 | 2013-07-17 | 太陽ホールディングス株式会社 | 導電ペーストおよびそれを用いた電極 |
DE102008060113A1 (de) | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
CN201778106U (zh) | 2010-07-27 | 2011-03-30 | 上海北玻镀膜技术工业有限公司 | 真空镀膜设备中的矩形平面磁控阴极结构 |
-
2013
- 2013-07-03 DE DE102013011074.2A patent/DE102013011074A1/de not_active Withdrawn
-
2014
- 2014-06-30 WO PCT/EP2014/001782 patent/WO2015000577A1/de active Application Filing
- 2014-06-30 JP JP2016522328A patent/JP6652485B2/ja not_active Expired - Fee Related
- 2014-06-30 BR BR112015032156-9A patent/BR112015032156B1/pt active IP Right Grant
- 2014-06-30 US US14/902,577 patent/US10636635B2/en active Active
- 2014-06-30 MY MYPI2015704722A patent/MY186272A/en unknown
- 2014-06-30 EP EP14737147.0A patent/EP3017082A1/de active Pending
- 2014-06-30 CN CN201480033082.8A patent/CN105283577B/zh active Active
- 2014-06-30 CA CA2916770A patent/CA2916770C/en active Active
- 2014-06-30 RU RU2016103234A patent/RU2016103234A/ru not_active Application Discontinuation
- 2014-06-30 KR KR1020167002290A patent/KR102274485B1/ko active IP Right Grant
- 2014-06-30 SG SG11201510190YA patent/SG11201510190YA/en unknown
- 2014-06-30 MX MX2015016869A patent/MX2015016869A/es unknown
-
2015
- 2015-12-07 PH PH12015502733A patent/PH12015502733B1/en unknown
- 2015-12-15 IL IL243137A patent/IL243137B/en active IP Right Grant
-
2016
- 2016-02-29 HK HK16102317.4A patent/HK1214309A1/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5082595A (en) * | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
Also Published As
Publication number | Publication date |
---|---|
WO2015000577A1 (de) | 2015-01-08 |
BR112015032156A2 (pt) | 2017-07-25 |
PH12015502733A1 (en) | 2016-03-07 |
BR112015032156B1 (pt) | 2021-07-06 |
JP6652485B2 (ja) | 2020-02-26 |
US20160172166A1 (en) | 2016-06-16 |
CA2916770A1 (en) | 2015-01-08 |
KR20160029081A (ko) | 2016-03-14 |
PH12015502733B1 (en) | 2016-03-07 |
SG11201510190YA (en) | 2016-01-28 |
KR102274485B1 (ko) | 2021-07-09 |
HK1214309A1 (zh) | 2016-07-22 |
CN105283577B (zh) | 2018-11-20 |
JP2016523315A (ja) | 2016-08-08 |
MY186272A (en) | 2021-07-01 |
IL243137B (en) | 2021-03-25 |
RU2016103234A (ru) | 2017-08-08 |
US10636635B2 (en) | 2020-04-28 |
MX2015016869A (es) | 2016-09-23 |
CN105283577A (zh) | 2016-01-27 |
DE102013011074A1 (de) | 2015-01-08 |
CA2916770C (en) | 2022-06-07 |
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