EP3017082A1 - An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte - Google Patents

An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte

Info

Publication number
EP3017082A1
EP3017082A1 EP14737147.0A EP14737147A EP3017082A1 EP 3017082 A1 EP3017082 A1 EP 3017082A1 EP 14737147 A EP14737147 A EP 14737147A EP 3017082 A1 EP3017082 A1 EP 3017082A1
Authority
EP
European Patent Office
Prior art keywords
target
cooling
self
thermally conductive
conductive plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP14737147.0A
Other languages
German (de)
English (en)
French (fr)
Inventor
Denis Kurapov
Siegfried Krassnitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oerlikon Surface Solutions AG Pfaeffikon
Original Assignee
Oerlikon Surface Solutions AG Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions AG Truebbach filed Critical Oerlikon Surface Solutions AG Truebbach
Publication of EP3017082A1 publication Critical patent/EP3017082A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497Temperature of target
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3417Arrangements
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3423Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)

Definitions

  • the present invention relates to a target whose surface serves as a material source in the context of PVD processes, in particular under vacuum conditions.
  • the invention relates in particular to those targets which are used for sputtering (hereinafter the term “sputtering” is used synonymously with the PVD method "sputtering").
  • sputtering is used synonymously with the PVD method "sputtering”
  • Such a target is usually supported in the application of a source holder, are provided in the means of cooling of the.
  • the invention relates to a coating source comprising such a target.
  • the surface of a target is bombarded with ions under vacuum conditions. Due to the bombardment, material is knocked out of the target surface, which can deposit on substrates provided in the field of view of the target surface.
  • the ions required for this purpose are provided by a plasma built up over the target surface. Applying a negative voltage to the target accelerates the ions towards it. The more ions flow per unit time, the higher the coating rate becomes. The higher the voltage applied to the target, the higher the impact velocity of the ions on the target surface, and the higher the energy expelled from the target atomized material. A high power input is therefore desirable.
  • dependencies between the degree of ionization of the sputtered material and the power density are known. These effects are used in the HIPIMS process.
  • the average power density applied to such a sputtering target is typically in the range of 5 W / cm 2 to 30 W / cm 2 .
  • the target 201 is secured with its back 203 to a source support 205 (e.g., screwed or clamped) with a self-contained cooling plate 207 integrated into the source support 205.
  • the cooling plate 207 comprises, for example, a cooling channel 209 through which coolant flows, through whose moving liquid the heat is dissipated.
  • the cooling liquid channel is limited by a solid fixed cover.
  • the target is for the purpose of cooling and electrical contact with this cover, for example with screws on the circumference or if necessary attached in the middle of the target.
  • this method has two problems:
  • the heat transfer is formed by the surface of the Tarruckückseite and the surface of the cooling plate. Without special measures, these two surfaces form an interface that deviates greatly from an ideal smooth contact pairing. Such a situation is shown in FIG.
  • the heat transfer is greatly reduced in this case and proves to be pressure-dependent.
  • contact pressure can only be introduced via the fastening screws, i. the heat transfer can only be improved locally.
  • This situation can be improved by providing a contact foil between the two surfaces.
  • This can e.g. made of indium, tin, or graphite. Due to their ductility, these films can compensate for unevenness between the target back surface and the surface of the cooling plate. In addition, the contact pressure can be applied more uniformly over the surface.
  • a disadvantage of this method is that the mounting of a contact foil, especially for vertically mounted targets, is difficult and cumbersome. This is especially relevant if there is too frequent change of the target material.
  • graphite foils although the lateral thermal conductivity is good, the transverse thermal conductivity is poor. Graphite foils must therefore be thin on the one hand so that their poor transverse thermal conductivity does not prevent the cooling process. On the other hand, a certain film thickness is necessary to prevent damage to the film during assembly. Therefore graphite foils with a thickness not less than 0.5mm are used.
  • the invention is based on a further development of the above-sketched indirect cooling device.
  • the object is achieved in that at the Rear side of the target body is attached a self-adhesive carbon film in fixed association with the target body. If the target body is not mounted, the film can be adhesively bonded to the back of the target body uniformly and without gaps. A very good thermal contact between the back of the target body and the carbon foil is thus ensured.
  • the target body can then be mounted in a simple manner on the source holder.
  • the carbon foil fixed to the target now has the effect of a contact foil between the surface of the cooling plate and the rear side of the target body.
  • the use of such a self-adhesive carbon film is not common in the field of vacuum technology. Since the adhesive used for the production of the self-adhesive carbon foil strongly outgas under vacuum conditions and thus have a negative influence on the vacuum and the corresponding volatile constituents lead to the contamination of the substrates to be treated under vacuum, such substances are not used.
  • Figure 1 shows a conventional coating source with direct cooling.
  • Figure 2 shows a conventional coating source with indirect cooling.
  • FIG. 3 shows the limited thermal contact in the case of a coating source with cooling according to FIG. 2.
  • Figure 4 shows in cross section an embodiment of the inventive target with attached self-adhesive carbon film.
  • FIG. 5 shows the inventive target integrated into a coating source with indirect cooling in a first embodiment.
  • FIG. 6 shows the inventive target integrated into a coating source in a second embodiment.
  • FIG. 4 a shows a target 401, on the rear side of the target 403 of which a one-sidedly self-adhesive carbon foil 407 with a thickness of between 0.1 mm and less than 0.5 mm is applied.
  • the preferred thickness of the carbon foil selected in the example is 0.125 mm.
  • a contact film from Kunze with the product identification number KU-CB1205-AV was used.
  • the carbon film comprises an adhesive film 409 which makes the carbon film the self-adhesive film, as well as a carbon film 411.
  • the target according to FIG. 4 can be integrated well into a coating source with indirect cooling, as shown in FIG. 5:
  • the target 501 with self-adhesive carbon foil 507 is fixed with the screws 513 to the front side of a source holder 505, wherein a cooling plate with cooling channel into the source holder 509 is integrated and the carbon foil 507 is pressed onto the back 503 of the cooling plate, whereby a good thermal contact with the cooling plates is formed. Due to the inventive fact that the carbon foil is adhered to the Tar Wegückseite a target change is very easy, even if the target is mounted vertically in a coating chamber.
  • An improved variant of the indirect cooling is indirect cooling by means of a movable membrane, as shown in FIG.
  • the structure is similar to the outlined in Figure 5 with target 601 with self-adhesive carbon film 607, source holder 605,dekanai 609, although that wall of the Cooling plate, which separates the cooling channel 609 of the carbon film 607, is formed in this preferred embodiment as a flexible membrane 603.
  • the coolant may be, for example, water. When changing the target, no release of a water seal is necessary.
  • the membrane 603 is uniformly pressed against the target rear side and thus against the self-adhesive carbon foil 607 and due to the hydrostatic pressure prevailing in the cooling channel 609 very good, flat heat contact.
  • a target without inventive self-adhesive carbon foil as in measurement no. 1 of Table 1 can be safely operated for mechanical reasons only up to a sputtering power of 2.5 kW.
  • the performance compatibility is more than doubled.
  • target materials ie for other AITi or AlCr ratios and also for pure aluminum, titanium and / or chromium targets, there is a qualitative indication similar picture.
  • the present invention shows a particularly good effect when target thicknesses between 6 mm and 18 mm are used.
  • the target thickness is between 6 mm and 12 mm.
  • the target 701 is designed as a target with self-adhesive carbon foil 705 on the back of the target 703 and bayonet profiling 707 according to FIG.
  • a preferred coating source according to this embodiment has the indirect cooling with membrane described in connection with FIG. 6 and the counterparts necessary for the bayonet fixing. This allows a high and homogeneous contact pressure.
  • This preferred embodiment is particularly advantageous in connection with powder metallurgy targets because they are mechanically weakened from a temperature of 150 ° C. and the thermal expansion increases. Due to the reduction of the target temperature and the mechanical clearance given by the bayonet fixation, this thermal stress is considerably reduced. For chrome targets, for example, power densities up to 100 W / cm 2 are possible.
  • a target has been disclosed, which is designed as a material source for a gas phase deposition method with a front side and a rear side, which is characterized in that a self-adhesive carbon foil is glued to the rear side.
  • the target may be formed as a material source for a sputtering process and / or for a spark evaporation process.
  • the thickness of the self-adhesive carbon film may be, for example, between 0.25 mm and 0.5 mm and preferably have a thickness of 0.125 mm.
  • a coating source comprising a target as described above, which is arranged on a source holder, in which an indirect cooling with cooling channel is integrated, has been disclosed.
  • That wall which separates the cooling channel from the self-adhesive carbon foil is preferably formed as a flexible membrane, whereby the self-adhesive carbon foil makes surface contact with the membrane forms.
  • the circumference of the target of the coating source is preferably designed to cooperate with the source holder in the form of a bayonet closure, whereby a high and homogeneous contact pressure is realized.
  • a further plate with high thermal conductivity is provided between the target and the component which comprises a cooling channel for removing the heat.
  • This may be for example a molybdenum plate or a copper plate.
  • the further plate may be in detachable contact with the component comprising the cooling channel. Again, it is important that there is a very good thermal contact over a large area.
  • a self-adhesive carbon foil may be provided on that side of the further plate. In this case, it is favorable if a self-adhesive carbon foil is also provided on the rear of the tar as described above.
  • a self-adhesive carbon film is provided on both sides of the further plate.
  • both the target side is taken care of over a large area for a good thermal contact and it is provided for a good thermal contact with the cooling channel comprehensive component.
  • the thus formed further plate is thus covered on both sides with self-adhesive carbon film.
  • This additional plate can easily be chosen so thick that it has sufficient stability so that the handling when changing target no problem.
  • This embodiment also has the advantage that no expensive components such as the cooling channel component or the target must be covered with foil. At least if copper is used as a further plate, this is a very cost-effective variant. If one of the two self-adhesive carbon foils is damaged, it will only cost a small amount to replace this additional plate.
  • Figure 8 shows schematically the corresponding structure of this embodiment. Shown is the component 805 with the cooling channel 807 through which the heat is ultimately dissipated. On the other, thermally conductive plate 803 is located on one side of a first self-adhesive carbon film 811 and on the other side a second self-adhesive carbon film 809 is glued. On this turn, the target 801 is arranged.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP14737147.0A 2013-07-03 2014-06-30 An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte Pending EP3017082A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013011074.2A DE102013011074A1 (de) 2013-07-03 2013-07-03 An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte
PCT/EP2014/001782 WO2015000577A1 (de) 2013-07-03 2014-06-30 An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte

Publications (1)

Publication Number Publication Date
EP3017082A1 true EP3017082A1 (de) 2016-05-11

Family

ID=51167845

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14737147.0A Pending EP3017082A1 (de) 2013-07-03 2014-06-30 An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte

Country Status (16)

Country Link
US (1) US10636635B2 (pt)
EP (1) EP3017082A1 (pt)
JP (1) JP6652485B2 (pt)
KR (1) KR102274485B1 (pt)
CN (1) CN105283577B (pt)
BR (1) BR112015032156B1 (pt)
CA (1) CA2916770C (pt)
DE (1) DE102013011074A1 (pt)
HK (1) HK1214309A1 (pt)
IL (1) IL243137B (pt)
MX (1) MX2015016869A (pt)
MY (1) MY186272A (pt)
PH (1) PH12015502733A1 (pt)
RU (1) RU2016103234A (pt)
SG (1) SG11201510190YA (pt)
WO (1) WO2015000577A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210079514A1 (en) * 2017-12-27 2021-03-18 Ulvac, Inc. Sputtering Method and Sputtering Apparatus
CN108130516A (zh) * 2018-01-03 2018-06-08 梧州三和新材料科技有限公司 一种使用泡沫金属增强冷却的真空镀阴极靶
CN112599446A (zh) * 2020-12-15 2021-04-02 华能新能源股份有限公司 一种真空蒸镀用基片辅助降温装置
CN113667947B (zh) * 2021-07-23 2023-04-21 镇江市德利克真空设备科技有限公司 一种应用于阴极平台的智能温控装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive

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EP0106623B1 (en) * 1982-10-05 1990-05-23 Fujitsu Limited Sputtering apparatus
DE4015388C2 (de) * 1990-05-14 1997-07-17 Leybold Ag Kathodenzerstäubungsvorrichtung
DE59208623D1 (de) * 1991-05-08 1997-07-24 Balzers Hochvakuum Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer
WO1998007565A1 (en) 1996-08-23 1998-02-26 Tosoh Smd, Inc. Bonding with a conductive adhesive sheet material
US5985115A (en) * 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
EP0951049A1 (de) * 1998-04-16 1999-10-20 Balzers Aktiengesellschaft Haltering sowie Target und Verfahren zu seiner Herstellung
KR100291330B1 (ko) 1998-07-02 2001-07-12 윤종용 반도체장치제조용스퍼터링설비및이를이용한스퍼터링방법
JP2001164361A (ja) 1999-12-09 2001-06-19 Mitsui Mining & Smelting Co Ltd スパッタリングターゲット冷却構造
AU2003250728A1 (en) * 2002-09-03 2004-03-29 Umicore Materials Ag Sputtering cathode, production method and corresponding cathode
DE102004058280A1 (de) 2004-12-02 2006-06-08 Tesa Ag Doppelseitige Haftklebebänder zur Herstellung bzw. Verklebung von LC-Displays mit lichtabsorbierenden Eigenschaften
ATE377098T1 (de) * 2005-08-02 2007-11-15 Applied Materials Gmbh & Co Kg Rohrkathode für die verwendung bei einem sputterprozess
JP5236400B2 (ja) * 2008-09-04 2013-07-17 太陽ホールディングス株式会社 導電ペーストおよびそれを用いた電極
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CN201778106U (zh) 2010-07-27 2011-03-30 上海北玻镀膜技术工业有限公司 真空镀膜设备中的矩形平面磁控阴极结构

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive

Also Published As

Publication number Publication date
PH12015502733B1 (en) 2016-03-07
KR20160029081A (ko) 2016-03-14
CA2916770A1 (en) 2015-01-08
US10636635B2 (en) 2020-04-28
JP2016523315A (ja) 2016-08-08
RU2016103234A (ru) 2017-08-08
WO2015000577A1 (de) 2015-01-08
CN105283577B (zh) 2018-11-20
MY186272A (en) 2021-07-01
IL243137B (en) 2021-03-25
KR102274485B1 (ko) 2021-07-09
PH12015502733A1 (en) 2016-03-07
US20160172166A1 (en) 2016-06-16
CA2916770C (en) 2022-06-07
BR112015032156A2 (pt) 2017-07-25
JP6652485B2 (ja) 2020-02-26
DE102013011074A1 (de) 2015-01-08
SG11201510190YA (en) 2016-01-28
CN105283577A (zh) 2016-01-27
HK1214309A1 (zh) 2016-07-22
BR112015032156B1 (pt) 2021-07-06
MX2015016869A (es) 2016-09-23

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Owner name: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON