EP3017082A1 - An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte - Google Patents
An eine indirekte kühlvorrichtung angepasstes target mit kühlplatteInfo
- Publication number
- EP3017082A1 EP3017082A1 EP14737147.0A EP14737147A EP3017082A1 EP 3017082 A1 EP3017082 A1 EP 3017082A1 EP 14737147 A EP14737147 A EP 14737147A EP 3017082 A1 EP3017082 A1 EP 3017082A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- target
- cooling
- self
- thermally conductive
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 29
- 239000012528 membrane Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000110 cooling liquid Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000006506 Brasenia schreberi Nutrition 0.000 description 1
- 244000267222 Brasenia schreberi Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013011074.2A DE102013011074A1 (de) | 2013-07-03 | 2013-07-03 | An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte |
PCT/EP2014/001782 WO2015000577A1 (de) | 2013-07-03 | 2014-06-30 | An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3017082A1 true EP3017082A1 (de) | 2016-05-11 |
Family
ID=51167845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14737147.0A Pending EP3017082A1 (de) | 2013-07-03 | 2014-06-30 | An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte |
Country Status (16)
Country | Link |
---|---|
US (1) | US10636635B2 (de) |
EP (1) | EP3017082A1 (de) |
JP (1) | JP6652485B2 (de) |
KR (1) | KR102274485B1 (de) |
CN (1) | CN105283577B (de) |
BR (1) | BR112015032156B1 (de) |
CA (1) | CA2916770C (de) |
DE (1) | DE102013011074A1 (de) |
HK (1) | HK1214309A1 (de) |
IL (1) | IL243137B (de) |
MX (1) | MX2015016869A (de) |
MY (1) | MY186272A (de) |
PH (1) | PH12015502733B1 (de) |
RU (1) | RU2016103234A (de) |
SG (1) | SG11201510190YA (de) |
WO (1) | WO2015000577A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2019131010A1 (ja) * | 2017-12-27 | 2020-12-17 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
CN108130516A (zh) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | 一种使用泡沫金属增强冷却的真空镀阴极靶 |
CN112599446A (zh) * | 2020-12-15 | 2021-04-02 | 华能新能源股份有限公司 | 一种真空蒸镀用基片辅助降温装置 |
CN113667947B (zh) * | 2021-07-23 | 2023-04-21 | 镇江市德利克真空设备科技有限公司 | 一种应用于阴极平台的智能温控装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5082595A (en) * | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3381593D1 (de) * | 1982-10-05 | 1990-06-28 | Fujitsu Ltd | Zerstaeubungsvorrichtung. |
DE4015388C2 (de) * | 1990-05-14 | 1997-07-17 | Leybold Ag | Kathodenzerstäubungsvorrichtung |
DE59208623D1 (de) * | 1991-05-08 | 1997-07-24 | Balzers Hochvakuum | Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer |
WO1998007565A1 (en) * | 1996-08-23 | 1998-02-26 | Tosoh Smd, Inc. | Bonding with a conductive adhesive sheet material |
US5985115A (en) * | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
EP0951049A1 (de) * | 1998-04-16 | 1999-10-20 | Balzers Aktiengesellschaft | Haltering sowie Target und Verfahren zu seiner Herstellung |
KR100291330B1 (ko) | 1998-07-02 | 2001-07-12 | 윤종용 | 반도체장치제조용스퍼터링설비및이를이용한스퍼터링방법 |
JP2001164361A (ja) * | 1999-12-09 | 2001-06-19 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット冷却構造 |
JP2005537391A (ja) | 2002-09-03 | 2005-12-08 | ユミコア・マテリアルズ・アクチェンゲゼルシャフト | スパッタ陰極、製造方法およびこれに関する陰極 |
DE102004058280A1 (de) | 2004-12-02 | 2006-06-08 | Tesa Ag | Doppelseitige Haftklebebänder zur Herstellung bzw. Verklebung von LC-Displays mit lichtabsorbierenden Eigenschaften |
PL1752556T3 (pl) * | 2005-08-02 | 2008-03-31 | Applied Mat Gmbh & Co Kg | Katoda cylindryczna do napylania jonowego |
JP5236400B2 (ja) * | 2008-09-04 | 2013-07-17 | 太陽ホールディングス株式会社 | 導電ペーストおよびそれを用いた電極 |
DE102008060113A1 (de) | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
CN201778106U (zh) | 2010-07-27 | 2011-03-30 | 上海北玻镀膜技术工业有限公司 | 真空镀膜设备中的矩形平面磁控阴极结构 |
-
2013
- 2013-07-03 DE DE102013011074.2A patent/DE102013011074A1/de not_active Withdrawn
-
2014
- 2014-06-30 CN CN201480033082.8A patent/CN105283577B/zh active Active
- 2014-06-30 MY MYPI2015704722A patent/MY186272A/en unknown
- 2014-06-30 WO PCT/EP2014/001782 patent/WO2015000577A1/de active Application Filing
- 2014-06-30 KR KR1020167002290A patent/KR102274485B1/ko active IP Right Grant
- 2014-06-30 SG SG11201510190YA patent/SG11201510190YA/en unknown
- 2014-06-30 BR BR112015032156-9A patent/BR112015032156B1/pt active IP Right Grant
- 2014-06-30 JP JP2016522328A patent/JP6652485B2/ja not_active Expired - Fee Related
- 2014-06-30 US US14/902,577 patent/US10636635B2/en active Active
- 2014-06-30 RU RU2016103234A patent/RU2016103234A/ru not_active Application Discontinuation
- 2014-06-30 CA CA2916770A patent/CA2916770C/en active Active
- 2014-06-30 EP EP14737147.0A patent/EP3017082A1/de active Pending
- 2014-06-30 MX MX2015016869A patent/MX2015016869A/es unknown
-
2015
- 2015-12-07 PH PH12015502733A patent/PH12015502733B1/en unknown
- 2015-12-15 IL IL243137A patent/IL243137B/en active IP Right Grant
-
2016
- 2016-02-29 HK HK16102317.4A patent/HK1214309A1/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5082595A (en) * | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
Also Published As
Publication number | Publication date |
---|---|
WO2015000577A1 (de) | 2015-01-08 |
PH12015502733A1 (en) | 2016-03-07 |
HK1214309A1 (zh) | 2016-07-22 |
CA2916770C (en) | 2022-06-07 |
PH12015502733B1 (en) | 2016-03-07 |
JP6652485B2 (ja) | 2020-02-26 |
CN105283577B (zh) | 2018-11-20 |
CA2916770A1 (en) | 2015-01-08 |
CN105283577A (zh) | 2016-01-27 |
BR112015032156A2 (pt) | 2017-07-25 |
MY186272A (en) | 2021-07-01 |
DE102013011074A1 (de) | 2015-01-08 |
BR112015032156B1 (pt) | 2021-07-06 |
US10636635B2 (en) | 2020-04-28 |
US20160172166A1 (en) | 2016-06-16 |
IL243137B (en) | 2021-03-25 |
KR102274485B1 (ko) | 2021-07-09 |
RU2016103234A (ru) | 2017-08-08 |
KR20160029081A (ko) | 2016-03-14 |
SG11201510190YA (en) | 2016-01-28 |
JP2016523315A (ja) | 2016-08-08 |
MX2015016869A (es) | 2016-09-23 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20160118 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: KRASSNITZER, SIEGFRIED Inventor name: KURAPOV, DENIS |
|
DAX | Request for extension of the european patent (deleted) | ||
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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17Q | First examination report despatched |
Effective date: 20180712 |
|
17Q | First examination report despatched |
Effective date: 20181214 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON |