BR112015032156A2 - alvo adaptado a um dispositivo de resfriamento indireto tendo uma placa de resfriamento e fonte de revestimento - Google Patents

alvo adaptado a um dispositivo de resfriamento indireto tendo uma placa de resfriamento e fonte de revestimento

Info

Publication number
BR112015032156A2
BR112015032156A2 BR112015032156A BR112015032156A BR112015032156A2 BR 112015032156 A2 BR112015032156 A2 BR 112015032156A2 BR 112015032156 A BR112015032156 A BR 112015032156A BR 112015032156 A BR112015032156 A BR 112015032156A BR 112015032156 A2 BR112015032156 A2 BR 112015032156A2
Authority
BR
Brazil
Prior art keywords
cooling
cooling device
indirect
component
target adapted
Prior art date
Application number
BR112015032156A
Other languages
English (en)
Other versions
BR112015032156B1 (pt
Inventor
Kurapov Denis
Krassnitzer Siegfried
Original Assignee
Oerlikon Surface Solutions Ag Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Truebbach filed Critical Oerlikon Surface Solutions Ag Truebbach
Publication of BR112015032156A2 publication Critical patent/BR112015032156A2/pt
Publication of BR112015032156B1 publication Critical patent/BR112015032156B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Abstract

resumo "alvo adaptado a um dispositivo de resfriamento indireto tendo uma placa de resfriamento e fonte de revestimento", por tratar a invenção de um dispositivo para o resfriamento de um alvo tendo um componente que compreende um duto de resfriamento e uma placa termicamente condutiva adicional que é conectada de modo liberável ao lado de resfriamento do componente, sendo que o lado de resfriamento é o lado sobre o qual o duto de resfriamento desenvolve o seu efeito, caracterizado pelo fato de que, entre a placa termicamente condutiva adicional e o lado de resfriamento do componente encontra-se localizada uma primeira película autoadesiva de carbono, que se encontra colada extensivamente e de modo autoadesivo em um lado da placa termicamente condutiva adicional, voltada para o lado de resfriamento. 1/1
BR112015032156-9A 2013-07-03 2014-06-30 dispositivo para o resfriamento de um alvo, alvo com um dispositivo de resfriamento e fonte de revestimento BR112015032156B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013011074.2 2013-07-03
DE102013011074.2A DE102013011074A1 (de) 2013-07-03 2013-07-03 An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte
PCT/EP2014/001782 WO2015000577A1 (de) 2013-07-03 2014-06-30 An eine indirekte kühlvorrichtung angepasstes target mit kühlplatte

Publications (2)

Publication Number Publication Date
BR112015032156A2 true BR112015032156A2 (pt) 2017-07-25
BR112015032156B1 BR112015032156B1 (pt) 2021-07-06

Family

ID=51167845

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015032156-9A BR112015032156B1 (pt) 2013-07-03 2014-06-30 dispositivo para o resfriamento de um alvo, alvo com um dispositivo de resfriamento e fonte de revestimento

Country Status (16)

Country Link
US (1) US10636635B2 (pt)
EP (1) EP3017082A1 (pt)
JP (1) JP6652485B2 (pt)
KR (1) KR102274485B1 (pt)
CN (1) CN105283577B (pt)
BR (1) BR112015032156B1 (pt)
CA (1) CA2916770C (pt)
DE (1) DE102013011074A1 (pt)
HK (1) HK1214309A1 (pt)
IL (1) IL243137B (pt)
MX (1) MX2015016869A (pt)
MY (1) MY186272A (pt)
PH (1) PH12015502733A1 (pt)
RU (1) RU2016103234A (pt)
SG (1) SG11201510190YA (pt)
WO (1) WO2015000577A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210079514A1 (en) * 2017-12-27 2021-03-18 Ulvac, Inc. Sputtering Method and Sputtering Apparatus
CN108130516A (zh) * 2018-01-03 2018-06-08 梧州三和新材料科技有限公司 一种使用泡沫金属增强冷却的真空镀阴极靶
CN112599446A (zh) * 2020-12-15 2021-04-02 华能新能源股份有限公司 一种真空蒸镀用基片辅助降温装置
CN113667947B (zh) * 2021-07-23 2023-04-21 镇江市德利克真空设备科技有限公司 一种应用于阴极平台的智能温控装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106623B1 (en) * 1982-10-05 1990-05-23 Fujitsu Limited Sputtering apparatus
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
DE4015388C2 (de) * 1990-05-14 1997-07-17 Leybold Ag Kathodenzerstäubungsvorrichtung
EP0512456B1 (de) * 1991-05-08 1997-06-18 Balzers Aktiengesellschaft Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer
WO1998007565A1 (en) * 1996-08-23 1998-02-26 Tosoh Smd, Inc. Bonding with a conductive adhesive sheet material
US5985115A (en) * 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
EP0951049A1 (de) * 1998-04-16 1999-10-20 Balzers Aktiengesellschaft Haltering sowie Target und Verfahren zu seiner Herstellung
KR100291330B1 (ko) 1998-07-02 2001-07-12 윤종용 반도체장치제조용스퍼터링설비및이를이용한스퍼터링방법
JP2001164361A (ja) * 1999-12-09 2001-06-19 Mitsui Mining & Smelting Co Ltd スパッタリングターゲット冷却構造
WO2004023515A1 (de) * 2002-09-03 2004-03-18 Umicore Materials Ag Zerstäubungskatode, herstellverfahren sowie katode hierzu
DE102004058280A1 (de) 2004-12-02 2006-06-08 Tesa Ag Doppelseitige Haftklebebänder zur Herstellung bzw. Verklebung von LC-Displays mit lichtabsorbierenden Eigenschaften
DE502005001840D1 (de) * 2005-08-02 2007-12-13 Applied Materials Gmbh & Co Kg Rohrkathode für die Verwendung bei einem Sputterprozess
JP5236400B2 (ja) * 2008-09-04 2013-07-17 太陽ホールディングス株式会社 導電ペーストおよびそれを用いた電極
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CN201778106U (zh) 2010-07-27 2011-03-30 上海北玻镀膜技术工业有限公司 真空镀膜设备中的矩形平面磁控阴极结构

Also Published As

Publication number Publication date
KR102274485B1 (ko) 2021-07-09
BR112015032156B1 (pt) 2021-07-06
JP2016523315A (ja) 2016-08-08
CA2916770C (en) 2022-06-07
PH12015502733B1 (en) 2016-03-07
EP3017082A1 (de) 2016-05-11
WO2015000577A1 (de) 2015-01-08
US10636635B2 (en) 2020-04-28
DE102013011074A1 (de) 2015-01-08
JP6652485B2 (ja) 2020-02-26
MX2015016869A (es) 2016-09-23
RU2016103234A (ru) 2017-08-08
CN105283577A (zh) 2016-01-27
CA2916770A1 (en) 2015-01-08
KR20160029081A (ko) 2016-03-14
US20160172166A1 (en) 2016-06-16
PH12015502733A1 (en) 2016-03-07
MY186272A (en) 2021-07-01
IL243137B (en) 2021-03-25
SG11201510190YA (en) 2016-01-28
HK1214309A1 (zh) 2016-07-22
CN105283577B (zh) 2018-11-20

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Legal Events

Date Code Title Description
B25F Entry of change of name and/or headquarter and transfer of application, patent and certif. of addition of invention: change of name on requirement

Owner name: OERLIKON SURFACE SOLUTIONS AG, TRUEBBACH (CH)

B25E Requested change of name of applicant rejected

Owner name: OERLIKON SURFACE SOLUTIONS AG, TRUEBBACH (CH)

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B25D Requested change of name of applicant approved

Owner name: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON (CH)

B25G Requested change of headquarter approved

Owner name: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON (CH)

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 30/06/2014, OBSERVADAS AS CONDICOES LEGAIS.