EP2932565B1 - Kontaktelement und verfahren zu seiner herstellung - Google Patents

Kontaktelement und verfahren zu seiner herstellung Download PDF

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Publication number
EP2932565B1
EP2932565B1 EP13783859.5A EP13783859A EP2932565B1 EP 2932565 B1 EP2932565 B1 EP 2932565B1 EP 13783859 A EP13783859 A EP 13783859A EP 2932565 B1 EP2932565 B1 EP 2932565B1
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EP
European Patent Office
Prior art keywords
contact
contact element
spring
elements
spring section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13783859.5A
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German (de)
English (en)
French (fr)
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EP2932565A1 (de
Inventor
Bernd Rosenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
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Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP2932565A1 publication Critical patent/EP2932565A1/de
Application granted granted Critical
Publication of EP2932565B1 publication Critical patent/EP2932565B1/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Definitions

  • the invention relates to a contact element having contact points for the electrically conductive connection of contact areas of spaced elements, e.g. Printed circuit boards.
  • the invention further relates to a method for producing such a contact element and to a contact device comprising a plurality of such contact elements.
  • Generic contact elements are used for example for the formation of so-called board-to-board (B2B) connector, with which two spaced-apart printed circuit boards are electrically connected.
  • B2B board-to-board
  • the contact elements are intended to ensure a loss-free transmission of the high-frequency signals in a defined tolerance range with respect to the parallelism, the distance and a lateral offset of the two circuit boards or its contact areas. Other requirements are cost-effective production and easy installation.
  • the axial and radial dimensions of the contact elements should be as small as possible, as a result of the further progressing miniaturization of the printed circuit boards or the printed conductors applied thereto, the number of side by side in a limited space to be arranged contact elements steadily increases.
  • spring contact pins in single-conductor and / or multiple-conductor construction.
  • Such spring contact pins include a sleeve and a partially guided within the sleeve head and a coil spring which is supported between the head and the sleeve.
  • Required for the coil spring properties with respect to spring force and block length require relatively large spring lengths, which have a correspondingly detrimental effect on the axial height of the spring contact pins.
  • an inner conductor which is designed in the form of a spring contact pin, serves as a signal conductor, while a peripheral conductor surrounding the inner conductor has the function of a return conductor and a shield for the inner conductor.
  • the outer conductor comprises a sleeve-shaped base body, which is slotted multiple times in the longitudinal direction. The non-slotted end of the base body forms the front side of a contact point for contacting a contact region of the circuit boards.
  • a sleeve of the outer conductor is displaceably guided, which forms at one end of the end face a contact point for contacting a contact region of the other printed circuit board.
  • a prestressed spring is supported between the base body and the sleeve.
  • Bias of the respective springs are among others Bias of the respective springs displaced, whereby despite possible tolerances in the distance of the contact areas of the circuit boards from each other a secure contact pressure can be provided.
  • the slit of the body this also has a certain flexibility in the lateral direction, which is to be achieved that even relatively large non-parallelism between the two contact areas can be compensated.
  • the known contact elements on relatively large dimensions, which are also due to their construction and the resulting function, not arbitrarily reduced.
  • the reduction of the diameter of male-female connections, as used, inter alia, in said SMP connectors only up to a certain limit possible because otherwise in the materials commonly used strength problems of plug and socket, especially in Mating the connector, would result.
  • the EP0184608 A2 discloses a contact element according to the preamble of claim 1.
  • the present invention seeks to provide a generic contact element, which is characterized by extremely small dimensions and thereby allows the formation of a contact device in which the largest possible number of these contact elements are housed in a given space.
  • a contact element according to independent claim 1 A method for producing such a contact element is the subject of independent claim 10.
  • a contact device comprising a plurality of such contact elements is the subject of independent claim 13.
  • Advantageous embodiments of the contact element according to the invention are the subject of the dependent claims and will become apparent from the following description of the invention ,
  • the basic idea of the invention is a miniaturization of a generic contact element by the use of alternative, for the production of such contact elements previously unused manufacturing process to achieve.
  • This basic idea was based on the finding that pure miniaturization of the known contact elements, inter alia due to the already mentioned strength problems, can not lead to success, but rather a change in the functional configuration would have to be associated with the miniaturization.
  • Another finding was then that such a functional redesign in conjunction with the desired dimensions probably can only be achieved by the contact element is formed in one piece.
  • the sought alternative manufacturing processes thus had to make it possible to produce highly complex geometries in extremely small dimensions at a reasonable cost, whereby a material would have to be processable which enables the integration of the functionalities required for generic contact elements.
  • This principle of the invention is implemented in a (three-dimensional) contact element with contact points for electrically conductive and space bridging connection of contact areas spaced elements, in particular printed circuit boards, which is formed entirely of one or more deposited materials, of which at least one is electrically conductive.
  • the "deposition" of (precipitation of) materials allows the design of extremely small yet highly complex geometries.
  • the further intended, preferred use of a metal for deposition and thus for the formation of the contact elements allows the integration of the essential, required for generic contact elements functionalities, namely the electrical conductivity and the generation of a contact pressure due to the electrical conductivity properties and the good elasticity of many metals the good contact of the contact points with the contact areas of the elements to be connected can be ensured in the miniaturized contact element.
  • plastics can also be used for a plurality of deposited metals. For this purpose, they should preferably have the required elasticity and / or be electrically conductive.
  • any suitable, known from the prior art method can be provided.
  • Particularly preferred methods for depositing and thus producing a contact element according to the invention are the so-called LiGA methods.
  • the term “ligand” is a compound from which the essential steps of this method descriptive terms “lithography”, “G alvanik” and “A bformung”.
  • the LiGA process (many variations are possible) is characterized by the ability to produce microstructures of extremely small dimensions of e.g. 0.2 ⁇ m, structural heights up to 3 mm, and aspect ratios of e.g. 50 (for detail structures as high as 500) of e.g. the materials plastic, metal or ceramic allows.
  • a contact element For producing a contact element by means of a LiGA process, provision can be made in particular to apply to a planar substrate, for example a silicon wafer or a polished disk of, for example, beryllium, copper, titanium, a photo- or X-ray-sensitive resist layer of, in particular, polymethylmethacrylate (PMMA) Negative, but preferably can be provided as a positive resist. If the substrate is not itself electrically conductive, this can be provided with a metallic seed layer. This can be done in particular by "sputter deposition" or vapor deposition. Thereafter, the resist layer is exposed and developed, whereby a negative mold of the contact element to be produced is formed.
  • a planar substrate for example a silicon wafer or a polished disk of, for example, beryllium, copper, titanium
  • PMMA polymethylmethacrylate
  • a deposition process is a material, preferably metal (or more materials or metals layer by layer) deposited on the substrate in the negative mold.
  • it can be provided to deposit the material (s) galvanically, although other deposition methods, such as PVD or CVD, are also possible.
  • the substrate, the seed layer and the deposited material remain first. This may already be the contact element, if an electrically conductive material, in particular a metal, has been deposited in at least one layer.
  • the contact element can then be detached from the substrate by, for example, etching the seed layer.
  • the finally deposited structure can also be provided to provide the finally deposited structure as a mold of an impression tool.
  • a further deposition with, in particular, a "overgrowth" (of a part) of the remaining resist layer and a subsequent removal of substrate and seed layer can be provided.
  • the contact element to be produced can then be produced by, for example, injection molding or hot stamping. This is particularly suitable for the production of the contact element or a main body of the contact element made of plastic. If the plastic is not electrically conductive, can then be provided to deposit an electrically conductive material, in particular a metal in the form of a coating
  • deposited structures with a greater thickness are required, it may be provided to use the described method for forming a mask, which in turn is then used for the targeted exposure of a thicker resist layer.
  • gold is often deposited in the mask, which is characterized by a strong absorption of X-radiation.
  • X-rays or ultraviolet (UV) light can be used to expose the resist layer, whereby the use of X-radiation tends to promise higher precision and the use of UV light reduces costs.
  • UV light ultraviolet
  • a contact element according to the invention In order to achieve the most cost-effective possible production of a contact element according to the invention by means of a method according to the invention, it can preferably be provided that a plurality of directly or indirectly contiguous contact elements are generated during the implementation of a LiGA process, which are then separated.
  • the contact element according to the invention (at least) have a spring portion which is elastically deformed when contacting the contact areas.
  • This spring portion extending from the one or more portions of the contact element by a lower spring stiffness with respect to the connection direction, i. the connecting line of the contact points, is distinguished, can serve in particular for the compensation of shape and position tolerances of the contact element and the contact areas to be connected and to ensure a defined contact pressure.
  • the spring section is arranged between two rigid support sections, which do not become relevant or not functionally deformed in the case of the forces regularly occurring during the contacting of the contact areas.
  • the support sections can in particular ensure a good (kink) stability of the contact element.
  • the spring portion may preferably be meander-shaped. Such a spring section can be easily produced by means of the method according to the invention.
  • the spring section can have a plurality of coaxially arranged, have arcuate spring tabs. Even such spring tabs can be produced according to the invention well. Particularly preferably, it can then be provided that adjacent spring tabs contact each other during the contacting of the two contact areas as a result of the deformation of the spring section. Thereby, the spring portion, if provided that this is part of the signal or current path, have a relatively low electrical resistance.
  • a latching connection can be provided, which holds the contact element in a spring portion partially deformed position.
  • the spring section can already be prestressed in an unloaded neutral position of the contact element, as a result of which it can already produce a relatively large contact pressure even with only slight further deformation during the contacting of the contact areas.
  • the sections forming the latching connection slide off one another.
  • the latching connection forming portions (this may preferably be the support portions) may thus guide the relative movement of the sections connected by the spring portion and thereby positively influence the stability of the contact element.
  • contact element In order to produce such a contact element, provision may be made for the contact element or elements to be deformed only after production and, if appropriate, after separation for latching the latching connection (s).
  • a signal or current path is formed, which bypasses the or the spring sections.
  • This embodiment is based on the idea that the spring section regularly by relatively small cross sections of the deposited, electrically conductive material and thus by a characterized by relatively high electrical resistance. A signal or current path should therefore extend without the inclusion of the spring section over the remaining sections of the contact element, which preferably have larger cross-sectional areas.
  • a contact device comprises a (preferably at least partially electrically insulating) receptacle having a plurality of through holes arranged side by side, and a plurality of contact elements according to the invention, wherein the contact elements are arranged in the through holes of the receptacle, which project beyond the receptacle with the contact points having sections.
  • the contact elements can be supported by the receptacle in the through holes in the lateral direction.
  • a first embodiment of a contact element 7 according to the invention is shown.
  • the one-piece, formed from an electrically conductive metal contact element 7 has been prepared according to the invention by means of a LiGA process whose basic process steps in the FIGS. 23 to 26 are shown by way of example.
  • a resist layer 2 of PMMA arranged on a substrate 1 is irradiated through a mask with synchrotron radiation 5.
  • the mask has a membrane 3 (for example of titanium) which is largely permeable to the synchrotron radiation and on which an absorber structure 4 made of a material which absorbs the synchrotron radiation (eg gold) is applied.
  • an absorber structure 4 made of a material which absorbs the synchrotron radiation (eg gold) is applied.
  • the resulting on the substrate 1 free spaces are then filled by electrodeposition of a metal 6 (see. Fig. 25 ).
  • a metal 6 see. Fig. 25 .
  • the desired structure of the deposited metal 6 is obtained.
  • the metal structure has the shape of one or more contact elements 7, which are connected to defined connection points, as shown in FIG Fig. 12 is shown by way of example for an embodiment of a contact element 7 according to the invention.
  • Connected contact elements 7 can be separated by a separation at joints 8, for example by means of a laser.
  • contact element 7 comprises two support sections 8, each forming a contact point 9, which are formed for contacting a contact region of an element (not shown).
  • the contact areas of the elements are thus to be connected in an electrically conductive manner in order in particular to transmit high-frequency signals.
  • the contact point 9 of the one, in the Fig. 1 and 2 Supporting section 8 shown above comprises a contact surface arranged obliquely with respect to a longitudinal axis 10 of the contact element 7 and a tip extending from this contact surface at the edge. The tip serves to penetrate a possibly existing oxide layer on the contact region to be contacted and if necessary to remove it as a result of a relative movement to the contact region. This should ensure a good contact with the lying below the oxide layer metal of the contact area.
  • the two relatively rigid support sections 8 are connected to one another via a meandering (main) spring section 11.
  • a displacement of the support elements 8 relative to each other with respect to the longitudinal axis 10 of the contact element leads to a deformation and bias of the (main) spring portion eleventh
  • Support section 8 shown below has at its lower end two more, parallel to each other and also meandering extending spring portions 12. These are connected at their one end in each case with the lower end of the support section 8 and with the other end in each case with the transverse part of a T-shaped piston 13.
  • the spring sections 12 facing away, slightly curved outer surface of the cross member forms the one contact point 9 of the contact element 7.
  • the two support sections 8 further each form a latching lug 14, which together form a latching connection, which limits a relative displacement of the support sections due to the then biased to train (main) spring section 11 after snapping.
  • the contact element 7 is still shown with released latching connection, as it is produced during the production by means of the method according to the invention.
  • the lower support portion 8 further includes a clamping portion 15 which extends slightly inclined relative to the longitudinal axis 10 of the contact element 7. As a result of this inclined course, the free end of the clamping portion 15 is pressed by the upper support portion 8 in its relative movement to the lower support portion 8 to the outside and thus elastically deflected.
  • This serves to fix the contact element 7 in a passage opening of a support plate 16 frictionally, as shown in the Fig. 7 is shown.
  • the non-positive fixation is intended in particular against a pressing out of the contact element 7 down Secure from the passage opening, wherein due to the configuration of the clamping portion 15 of the laterally directed pressure is proportional to the application of force from above to the contact element 7. This allows a secure non-positive fixation even at high forces (from above, with the corresponding counter-forces from below) can be achieved while the contact element 7 can be removed after the discharge of the upper support section 8 without significant effort from the through hole.
  • fixation of the contact element in the passage opening at a load upward is achieved form-fitting by striking a shoulder 16 of the lower support section 8 at a complementary paragraph 17 in the passage opening.
  • a contact element 7 can be made, with respect to the in the Fig. 2 to 7 Dimensions shown have the following dimensions: a: 5.61 mm; b: 0.424 mm; c: 0.008 mm; d: 0.012 mm; e: 0.012 mm; f: 0.018 mm; g: 0.013 mm; h: 0.028 mm; i: 0.042 mm; j: 0.015 mm; k: 0.01 mm; l: 0.01 mm; m: 0.018 mm; n: 0.01 mm; o: 0.018 mm; p: 0.12 mm (diameter); q: 5.02; r: 5.46 mm; s: 5.11 mm; t: 0.42 mm.
  • the (constant) thickness of this contact element 7 is 0.15 mm.
  • a section of a contact device according to the invention is shown.
  • This comprises a receptacle 18 with a plurality of through holes arranged in parallel, in each of which a contact element is arranged and fixed in the manner described.
  • a contact element 7 is arranged in only two of the three through holes.
  • a contact element 7 is shown in its held by the latching connection neutral position and the other with almost maximum stroke. This is intended to illustrate the tolerance-compensating function of the (main) spring section 11 of the contact elements 7.
  • a first exemplary arrangement is shown in which a total of nine contact elements 7 in a square arrangement with diagonal orientation of the individual contact elements 7 disclosed. It can be provided via the central contact element 7 (radio frequency) to transmit signals, while the others are connected to ground and serve as a counter-pole. This results in a shielded arrangement of the signal contact element 7, which corresponds functionally to the inner conductor of a conventional Koaxial giftedelements and is characterized at the same time by extremely small dimensions.
  • the in the Fig. 8 The arrangement shown may have the following dimensions according to the dimensions there: a: 0.4 mm; b: 0.566; c: 0.15 mm; d: 0.24 mm.
  • the signal and current path between the two contact points 9 of the contact element 7 is primarily formed by the two support sections 8 and connected to the lower support section 8 piston 13, which faces the spring sections 11, 12 by a larger cross-sectional area and thus a lower electrical resistance distinguished.
  • FIGS. 9 and 10 show a second embodiment of a contact element according to the invention 7.
  • This comprises a relatively stiff support section 8 and two spring sections 11.
  • the spring sections 11 each comprise three arcuate spring tabs 19, of which the respective outer is angled at its free end. In the region of the bend, the outer spring tabs 19 form on the outside each a contact point 9.
  • the free end of the bent portion also forms in each case a detent 14, which in conjunction with the locking lug 14th one of two locking arms 20 of the support section 8 forms a latching connection.
  • the support portion 8 forms on one side of a contact surface 21, via which the contact element 7 is supported in a through hole of a receptacle 18.
  • On the opposite side of the support portion 8 also forms a spring tab 22 which prints in the passage opening under bias against the adjacent opening wall and thereby increases the friction between the contact surface 21 and the opening wall. The contact element 7 is thereby frictionally held in the passage opening (see. Fig. 10 ).
  • the Fig. 9 shows the contact element in the mold, as it is produced in a method according to the invention.
  • neither the locking connections are engaged, nor contact the three spring tabs 19 of the two spring sections 11 each other.
  • Such contact and the engagement of the latching connections is effected by the exertion of compressive forces on the two contact points 9 and a deformation of the spring sections 11 effected thereby.
  • Contact element 7 shown for example, according to the dimensions there have the following dimensions: a: 1.3 mm; b: 1.0 mm; c: 0.39 mm; d: 0.72 mm.
  • the (constant) thickness of the contact element 7 can be 0.15 mm.
  • the Fig. 11 shows a possible arrangement a plurality of in the FIGS. 9 and 10 Shown is a parallel arrangement in a total of five rows. In this case, an arrangement for a symmetrical signal transmission (100 ⁇ impedance) is selected in the top row.
  • the contact elements 7 are provided for the signal transmission in pairs, with each connected to ground on each side of each pair of contact element 7.
  • a single-ended signal transmission 50 ⁇ impedance
  • the electrical insulation of all signal contact elements 7 is achieved by means of dielectric receiving elements 23, each receiving a signal contact element 7 and are themselves integrated into a receptacle 18.
  • the in the Fig. 11 The arrangement shown may have the following dimensions according to the dimensions there: a: 1.8 mm; b: 0.8 mm; c: 0.15 mm; d: 0.2 mm; e: 1.0 mm; f: 0.5 mm; g: 0.95 mm; h: 1.6 mm.
  • FIG. 12 to 14 Such an arrangement of the contact elements 7 in a board-to-board contact device 24 according to the invention for the connection of two printed circuit boards 25.
  • the connection is fixed via two pressure plates 26 and 27 screwed.
  • FIG. 15 a third embodiment of a contact element 7 according to the invention is shown. This corresponds largely to that of FIGS. 9 and 10 However, wherein the non-positive fixation in a through hole serving spring tab 22 merges into a terminal block 28. As a result, an improved fixation of the contact element 7 in a passage opening of a receptacle 18 can be realized.
  • the Fig. 16 again illustrates the simultaneous production of a plurality of inventive contact elements 7 in a process passage.
  • the metallic structure produced in the method according to the invention is shown, which comprises the contact elements 7, and a frame 29 holding the contact elements 7 via a respective connection point 8. Shown are a total of 95 contact elements 7, which were generated on a surface with the dimensions 16.1 mm x 9.4 mm.
  • the 17 to 19 show a fourth embodiment of a contact element according to the invention 7. This corresponds largely (also in terms of dimensions) of the embodiment according to the Fig. 1 to 6 , An essential difference is the design of the lower spring portion 12, which is formed here in the form of a curved, double spring tab.
  • the 17 to 19 show this contact element 7 in different positions.
  • the contact element 7 is shown as it is directly after the preparation by means of a method according to the invention.
  • the locking connection was already engaged and thereby biased the (main) spring section 11. This represents a neutral position of the prepared for use contact element 7.
  • the contact elements 7 are installed in the through hole of a receptacle 18 of a contact device according to the invention, as shown in the FIGS. 20 and 21 is shown.
  • the pushed-together contact element 9 is shown with use of the total of the (main) spring section 11 provided travel.
  • the spring force of the biased in the neutral position (main) spring portion 11 of the in Fig. 17 to 21 shown contact element 7 only about 0.04 N and in the fully collapsed position about 0.1 N.
  • the Fig. 22 shows a fifth embodiment of a contact element 7 according to the invention special feature in this Contact element 7 is that the two support sections 8 do not touch directly, but are exclusively connected to each other via the (main) spring section 11.
  • this contact element 7 thus represents the (main) spring portion 11 is a part of the signal and current path.
  • the fixation of the contact element 7 in a through hole of a receptacle 18 is effected by two spring-mounted clamping portions 31.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
EP13783859.5A 2012-12-11 2013-10-30 Kontaktelement und verfahren zu seiner herstellung Active EP2932565B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012024185.2A DE102012024185A1 (de) 2012-12-11 2012-12-11 Kontaktelement und Verfahren zu seiner Herstellung
PCT/EP2013/003276 WO2014090356A1 (de) 2012-12-11 2013-10-30 Kontaktelement und verfahren zu seiner herstellung

Publications (2)

Publication Number Publication Date
EP2932565A1 EP2932565A1 (de) 2015-10-21
EP2932565B1 true EP2932565B1 (de) 2016-09-21

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EP13783859.5A Active EP2932565B1 (de) 2012-12-11 2013-10-30 Kontaktelement und verfahren zu seiner herstellung

Country Status (9)

Country Link
US (1) US9755345B2 (ja)
EP (1) EP2932565B1 (ja)
JP (1) JP6126236B2 (ja)
KR (1) KR101933891B1 (ja)
CN (1) CN104838544B (ja)
CA (1) CA2887694C (ja)
DE (1) DE102012024185A1 (ja)
TW (1) TWM484814U (ja)
WO (1) WO2014090356A1 (ja)

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JP5394309B2 (ja) * 2010-04-19 2014-01-22 富士通コンポーネント株式会社 プローブ及びプローブの製造方法
TWM398701U (en) * 2010-07-16 2011-02-21 Hon Hai Prec Ind Co Ltd Electrical contact
JP2012049083A (ja) * 2010-08-30 2012-03-08 Yazaki Corp 接続端子及びそれを備えたコネクタ
JP5693266B2 (ja) * 2011-01-31 2015-04-01 富士通コンポーネント株式会社 コネクタ
JP4803329B1 (ja) 2011-03-15 2011-10-26 オムロン株式会社 コンタクト及びその製造方法

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CA2887694A1 (en) 2014-06-19
EP2932565A1 (de) 2015-10-21
US20150280346A1 (en) 2015-10-01
JP2016504726A (ja) 2016-02-12
CA2887694C (en) 2018-12-04
TWM484814U (zh) 2014-08-21
WO2014090356A1 (de) 2014-06-19
KR20150093659A (ko) 2015-08-18
DE102012024185A1 (de) 2014-06-12
CN104838544A (zh) 2015-08-12
JP6126236B2 (ja) 2017-05-10
US9755345B2 (en) 2017-09-05
CN104838544B (zh) 2017-07-18

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