JP2016504726A - コンタクト要素およびその製造のための方法 - Google Patents
コンタクト要素およびその製造のための方法 Download PDFInfo
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- JP2016504726A JP2016504726A JP2015546877A JP2015546877A JP2016504726A JP 2016504726 A JP2016504726 A JP 2016504726A JP 2015546877 A JP2015546877 A JP 2015546877A JP 2015546877 A JP2015546877 A JP 2015546877A JP 2016504726 A JP2016504726 A JP 2016504726A
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- 238000000034 method Methods 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000008021 deposition Effects 0.000 claims abstract description 11
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 3
- 238000001459 lithography Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000004020 conductor Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 14
- 238000000151 deposition Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000005469 synchrotron radiation Effects 0.000 description 3
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- 238000010521 absorption reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000012868 Overgrowth Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012822 chemical development Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
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- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
Claims (13)
- 互いに離間した要素のコンタクト領域の導電接続のためのコンタクト点(9)を有するコンタクト要素(7)であって、前記コンタクト要素は1つ以上の堆積材料から完全に形成され、その堆積材料の少なくとも1つは導電性であることを特徴とするコンタクト要素(7)。
- 前記2つのコンタクト領域に接触がなされたときに弾性的に変形されるばね区分(11,12)を特徴とする請求項1に記載のコンタクト要素(7)。
- 前記ばね区分(11,12)は2つの剛性の支持区分(8)の間に配置されることを特徴とする請求項2に記載のコンタクト要素(7)。
- 前記ばね区分(11,12)は設計上蛇行形状であることを特徴とする請求項2または3に記載のコンタクト要素(7)。
- 前記ばね区分(11,12)はいくつかの同軸に配置された彎曲したばねタブ(19)を有し、隣接するばねタブ(19)は前記2つのコンタクト領域に接触がなされたときに接触することを特徴とする請求項2または3に記載のコンタクト要素(7)。
- 前記コンタクト要素(7)を前記ばね区分(11,12)が部分的に変形される位置に保持するスナップロック結合を特徴とする請求項2に記載の、または、請求項3から5のいずれか一項に記載のコンタクト要素(7)。
- 前記ばね区分(11,12)がさらに変形すると、前記スナップロック結合を形成する区分が相互に滑動することを特徴とする請求項6に記載のコンタクト要素(7)。
- 前記スナップロック結合は前記支持区分(8)によって形成されることを特徴とする請求項3および6に記載の、または、請求項3および7に記載のコンタクト要素(7)。
- 前記ばね区分(11,12)をバイパスする前記コンタクト点(9)間の信号または電流経路を特徴とする請求項2に記載の、または、請求項3から8のいずれか一項に記載のコンタクト要素(7)。
- LiGA製法を用いた請求項1から9のいずれか一項に記載のコンタクト要素(7)の製造のための方法。
- LiGA製法において、複数の連結されたコンタクト要素(7)が作成され、そのコンタクト要素は次いで分離されることを特徴とする請求項10に記載の方法。
- 請求項6に記載の、または、請求項7または8に記載の1つ以上のコンタクト要素(7)の製造のための、請求項10または11に記載の方法であって、前記コンタクト要素(7)は、製造に引き続いて、また可能性としては分離に引き続いて、前記スナップロック結合を係合するために変形されることを特徴とする方法。
- 複数の貫通開口を有するマウント(18)を有するとともに、請求項1から9のいずれか一項に記載のいくつかのコンタクト要素(7)を有し、前記コンタクト要素(7)は前記貫通開口内に配置され、前記コンタクト点(9)を含む前記コンタクト要素の区分は前記マウント(18)を越えて突出するコンタクトデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012024185.2 | 2012-12-11 | ||
DE102012024185.2A DE102012024185A1 (de) | 2012-12-11 | 2012-12-11 | Kontaktelement und Verfahren zu seiner Herstellung |
PCT/EP2013/003276 WO2014090356A1 (de) | 2012-12-11 | 2013-10-30 | Kontaktelement und verfahren zu seiner herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016504726A true JP2016504726A (ja) | 2016-02-12 |
JP6126236B2 JP6126236B2 (ja) | 2017-05-10 |
Family
ID=49513901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015546877A Active JP6126236B2 (ja) | 2012-12-11 | 2013-10-30 | コンタクト要素およびその製造のための方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9755345B2 (ja) |
EP (1) | EP2932565B1 (ja) |
JP (1) | JP6126236B2 (ja) |
KR (1) | KR101933891B1 (ja) |
CN (1) | CN104838544B (ja) |
CA (1) | CA2887694C (ja) |
DE (1) | DE102012024185A1 (ja) |
TW (1) | TWM484814U (ja) |
WO (1) | WO2014090356A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017157336A (ja) * | 2016-02-29 | 2017-09-07 | 株式会社エンプラス | コンタクトピンおよび電気部品用ソケット |
KR102700792B1 (ko) * | 2022-01-26 | 2024-08-30 | 신용섭 | 컨택터 및 그를 갖는 테스트용 소켓 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6404008B2 (ja) * | 2014-06-23 | 2018-10-10 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
DE102015001926B4 (de) | 2015-02-13 | 2023-03-09 | Feinmetall Gmbh | Elektrisches Kontaktelement |
DE102015004150A1 (de) * | 2015-03-31 | 2016-10-06 | Feinmetall Gmbh | Verfahren zur Herstellung eines Kontaktabstandswandlers sowie Kontaktabstandswandler |
DE102015004151B4 (de) | 2015-03-31 | 2022-01-27 | Feinmetall Gmbh | Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften |
CN109962390A (zh) * | 2017-12-22 | 2019-07-02 | 泰科电子(上海)有限公司 | 导电端子的制备方法以及导电端子 |
DE102021130901A1 (de) | 2021-11-25 | 2023-05-25 | Vat Holding Ag | Verbindungseinrichtung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0388290A (ja) * | 1989-08-18 | 1991-04-12 | Amp Inc | 電気コンタクト |
JP2008546164A (ja) * | 2005-06-10 | 2008-12-18 | デラウェア キャピタル フォーメーション インコーポレイテッド | 可撓性のある内部相互接続部を備えた電気コンタクトプローブ |
JP2011146295A (ja) * | 2010-01-15 | 2011-07-28 | Omron Corp | 電気コネクタ、電子機器および導電接触方法。 |
JP2012049083A (ja) * | 2010-08-30 | 2012-03-08 | Yazaki Corp | 接続端子及びそれを備えたコネクタ |
Family Cites Families (14)
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DE3440110C1 (de) * | 1984-11-02 | 1986-05-28 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zur Herstellung mechanisch trennbarer Vielfach-Verbindungen fuer den elektrischen Anschluss mikroelektronischer Bauelemente |
JPH043329A (ja) * | 1990-04-19 | 1992-01-08 | Matsushita Electric Ind Co Ltd | 磁気記録媒体の評価方法及び評価装置 |
US6506082B1 (en) * | 2001-12-21 | 2003-01-14 | Interconnect Devices, Inc. | Electrical contact interface |
EP1460434A4 (en) | 2001-12-25 | 2008-12-03 | Sumitomo Electric Industries | CONTACT PROBE |
GB2388468B (en) | 2002-02-08 | 2005-05-04 | Microsaic Systems Ltd | Microengineered electrical connectors |
US7021610B2 (en) * | 2002-09-30 | 2006-04-04 | Barnes Group Inc. | Ring shaped spring device |
US6776668B1 (en) | 2003-08-01 | 2004-08-17 | Tyco Electronics Corporation | Low profile coaxial board-to-board connector |
US6855010B1 (en) * | 2004-01-26 | 2005-02-15 | Chuan Yi Precision Industry Co., Ltd. | Terminal for electric connector for communication apparatus |
CN201000993Y (zh) | 2006-12-18 | 2008-01-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
TWM373022U (en) * | 2009-07-14 | 2010-01-21 | Hon Hai Prec Ind Co Ltd | Electrical contact |
JP5394309B2 (ja) * | 2010-04-19 | 2014-01-22 | 富士通コンポーネント株式会社 | プローブ及びプローブの製造方法 |
TWM398701U (en) * | 2010-07-16 | 2011-02-21 | Hon Hai Prec Ind Co Ltd | Electrical contact |
JP5693266B2 (ja) * | 2011-01-31 | 2015-04-01 | 富士通コンポーネント株式会社 | コネクタ |
JP4803329B1 (ja) | 2011-03-15 | 2011-10-26 | オムロン株式会社 | コンタクト及びその製造方法 |
-
2012
- 2012-12-11 DE DE102012024185.2A patent/DE102012024185A1/de not_active Withdrawn
-
2013
- 2013-10-30 US US14/441,968 patent/US9755345B2/en active Active
- 2013-10-30 EP EP13783859.5A patent/EP2932565B1/de active Active
- 2013-10-30 WO PCT/EP2013/003276 patent/WO2014090356A1/de active Application Filing
- 2013-10-30 JP JP2015546877A patent/JP6126236B2/ja active Active
- 2013-10-30 CA CA2887694A patent/CA2887694C/en active Active
- 2013-10-30 KR KR1020157012423A patent/KR101933891B1/ko active IP Right Grant
- 2013-10-30 CN CN201380063280.4A patent/CN104838544B/zh active Active
- 2013-11-29 TW TW102222460U patent/TWM484814U/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0388290A (ja) * | 1989-08-18 | 1991-04-12 | Amp Inc | 電気コンタクト |
JP2008546164A (ja) * | 2005-06-10 | 2008-12-18 | デラウェア キャピタル フォーメーション インコーポレイテッド | 可撓性のある内部相互接続部を備えた電気コンタクトプローブ |
JP2011146295A (ja) * | 2010-01-15 | 2011-07-28 | Omron Corp | 電気コネクタ、電子機器および導電接触方法。 |
JP2012049083A (ja) * | 2010-08-30 | 2012-03-08 | Yazaki Corp | 接続端子及びそれを備えたコネクタ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017157336A (ja) * | 2016-02-29 | 2017-09-07 | 株式会社エンプラス | コンタクトピンおよび電気部品用ソケット |
KR102700792B1 (ko) * | 2022-01-26 | 2024-08-30 | 신용섭 | 컨택터 및 그를 갖는 테스트용 소켓 |
Also Published As
Publication number | Publication date |
---|---|
DE102012024185A1 (de) | 2014-06-12 |
EP2932565B1 (de) | 2016-09-21 |
US20150280346A1 (en) | 2015-10-01 |
CA2887694A1 (en) | 2014-06-19 |
KR20150093659A (ko) | 2015-08-18 |
JP6126236B2 (ja) | 2017-05-10 |
CA2887694C (en) | 2018-12-04 |
KR101933891B1 (ko) | 2019-03-25 |
EP2932565A1 (de) | 2015-10-21 |
US9755345B2 (en) | 2017-09-05 |
TWM484814U (zh) | 2014-08-21 |
WO2014090356A1 (de) | 2014-06-19 |
CN104838544A (zh) | 2015-08-12 |
CN104838544B (zh) | 2017-07-18 |
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