EP2865026A2 - Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung - Google Patents

Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung

Info

Publication number
EP2865026A2
EP2865026A2 EP13720418.6A EP13720418A EP2865026A2 EP 2865026 A2 EP2865026 A2 EP 2865026A2 EP 13720418 A EP13720418 A EP 13720418A EP 2865026 A2 EP2865026 A2 EP 2865026A2
Authority
EP
European Patent Office
Prior art keywords
layer
silver
multilayer component
electrode layers
internal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13720418.6A
Other languages
German (de)
English (en)
French (fr)
Inventor
Markus Weiglhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2865026A2 publication Critical patent/EP2865026A2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Definitions

  • the device is a piezoelectric actuator, which is used to actuate an injection valve in a
  • the multilayer component for example, a
  • the invention relates to a multilayer component with a main body which has a stack of dielectric layers and internal electrode layers.
  • the multilayer component has an external contact
  • the first and second layers may comprise a metallic material or may consist of a metallic material.
  • the first layer preferably comprises copper or consists of copper.
  • the first layer comprises silver-palladium or consists of silver-palladium.
  • the second layer is preferably silver or silver.
  • the second layer comprises silver-palladium or consists of silver-palladium.
  • the dielectric layers and the internal electrode layers are stacked along a stacking direction.
  • the stacking direction preferably corresponds to the longitudinal direction of the main body.
  • the internal electrode layers contain
  • the internal electrode layers contain silver-palladium or consist of silver-palladium.
  • the dielectric layers may be a piezoelectric
  • the dielectric layers may be a ceramic material, in particular a
  • the main body green sheets can be used, on which for the formation of internal electrode layers, for example, a metal paste is applied.
  • a metal paste is applied.
  • the metal paste applied in a screen printing process.
  • the metal paste may contain copper.
  • the Metal paste silver or silver-palladium included.
  • the films are preferably stacked, pressed and sintered together to form a monolithic sintered body.
  • the main body of the device is a monolithic
  • the multilayer component is as
  • piezoelectric component for example as a piezoelectric actuator, formed.
  • a piezoelectric actuator when a voltage is applied to the internal electrode layers, piezoelectric layers are arranged between the internal electrode layers, so that a stroke of the piezoactuator is generated.
  • the multilayer component can also be used as another
  • Component be formed, for example as
  • the external contact is preferably used for applying a voltage between adjacent in the stacking direction internal
  • Electrode layers For example, two outer electrodes are on opposite outer sides of the main body
  • Electrode layers in the stacking direction alternately electrically connected to one of the outer electrodes and electrically isolated from the other outer electrode.
  • the electrode paste is applied so that the electrode layers, when viewed in the stacking direction, alternately extend to an outer side of the stack and are spaced from the opposite outer side of the stack. In this way, the electrode layers can alternately be electrically connected to one of the outer contacts.
  • the multilayer component may be a fully active multilayer component.
  • a fully active multilayer component In a fully active
  • Multilayer component extend the internal
  • Electrode layers with an external contact become the internal electrode layers on an outside
  • the internal electrode layers are in
  • Stacking direction alternately electrically connected to one of the outer electrodes and electrically isolated from the other outer electrode.
  • the external contact is preferably strip-shaped.
  • the external contact runs along the stacking direction of the main body.
  • the external contact has a first layer and a second layer or consists of a first or second layer.
  • the first and second layers can be one
  • the first layer may comprise copper or consist of copper.
  • the first layer may comprise silver-palladium or silver-palladium
  • the second layer may have silver or consist of silver.
  • the second layer of silver Have palladium or consist of silver-palladium.
  • the external contact has a first copper-containing layer and a second silver-containing layer or consists of a first copper-containing and a second silver-containing layer.
  • the external contact has a first copper-containing layer and a second silver-containing layer or consists of a first copper-containing and a second silver-containing layer.
  • the first layer contains a different material than the second
  • the first layer is by screen printing on an outside of the first layer
  • the second layer may also be screen printed on an outside of the screen
  • the second layer is disposed on the first layer.
  • the first layer is as a base layer and the second layer as
  • the first layer is completely covered by the second layer.
  • the first layer is only partially covered by the second layer.
  • the first layer is covered at least in a region of the second layer, in which a solder joint is arranged.
  • the first layer is in terms of
  • the second layer is optimized for good solderability.
  • an oxide formation can be reduced.
  • oxide formation often occurs in copper.
  • a reduced oxide formation is the
  • Solderability facilitates and increases the reliability of the solder joint. Furthermore, the use of activating
  • the first layer is in direct contact with the internal electrode layers
  • the first layer is arranged directly on an outer surface of the base body.
  • the first layer has the same material as the internal electrode layers or is made of the same material as the internal electrode layers.
  • the materials of the first layer and the internal electrode layers may be different.
  • Electrode layers and the first layer to be adapted to each other.
  • a further contact for contacting the external contact is present.
  • the further contact is, for example, as a wire harp or as a metal screen
  • the further contact is soldered to the external contact.
  • the further contact is soldered to the external contact.
  • Multilayer device specified, wherein on a base body comprising a stack of dielectric layers and internal electrode layers an external contact
  • first a first layer is applied, and then a second layer is applied, and wherein the first layer and the second layer are baked.
  • the method is preferably used to produce a multilayer component as described above.
  • the first and second layers comprise a different material or consist of a different material.
  • the first layer comprises copper or consists of copper.
  • the first layer comprises silver-palladium or consists of silver-palladium.
  • the second layer comprises silver or consists of silver.
  • the second layer comprises silver-palladium or consists of silver-palladium.
  • the first layer and the second layer are applied by screen printing.
  • the first layer is first applied and baked, and then the second layer is applied and baked.
  • the first layer is applied first and then the second layer is applied.
  • subsequent step will be the two
  • FIG. 1 is a side view of a multilayer component
  • Figure 2 is a plan view of a multilayer component.
  • FIG. 1 shows a multilayer component with a basic body 1 with internal electrode layers 3a, 3b and a
  • First internal electrode layers 3a and second internal electrode layers 3b are alternating along a stacking direction S.
  • the internal electrode layers 3b are not visible in this side view, but they are shown in dashed lines for better understanding.
  • the first internal electrode layers 3a extend up to a first outer side 2a of the main body.
  • the second internal electrode layers 3b extend to a second one
  • Electrode layers 3a, 3b have, for example, copper or consist of copper.
  • the internal electrode layers 3a, 3b comprise silver or silver-palladium or consist of silver or silver-palladium.
  • the external contact 4a is arranged on the outer side 2a of the main body 1. On the opposite
  • the first external contact 4a is in direct contact with the first internal electrode layers 3a.
  • the second external contact 4b is in direct contact with the second internal electrode layers 3b.
  • Electrode layers 3a, 3b contacted electrically.
  • the external contact 4a on the outside 2a the first internal electrode layers 3a are contacted.
  • a further contact 5 is provided.
  • FIG. 2 shows the multilayer component from FIG. 1 in a plan view. Here it can be seen that the outer contacts 4a, 4b each consist of two layers. A first, copper-containing layer 6 is in direct contact with the
  • Electrode layers 3a, 3b (not shown) arranged.
  • a second, silver-containing layer 7 is on the
  • the copper-containing layer 6 applied.
  • the copper-containing layer 6 comprises copper or consists of Copper.
  • the silver-containing layer 7 comprises silver or consists of silver.
  • a further contact 5 (see FIG. 1) is soldered to the silver-containing layer 7.
  • silver-containing layer 7 are applied by means of screen printing and baked. For example, the copper-containing layer 6 is first applied and baked, and then the silver-containing layer 7 is applied and baked.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Contacts (AREA)
  • Thermistors And Varistors (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Ceramic Capacitors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
EP13720418.6A 2012-06-25 2013-05-06 Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung Ceased EP2865026A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012105517.3A DE102012105517B4 (de) 2012-06-25 2012-06-25 Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung
PCT/EP2013/059384 WO2014000930A2 (de) 2012-06-25 2013-05-06 Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung

Publications (1)

Publication Number Publication Date
EP2865026A2 true EP2865026A2 (de) 2015-04-29

Family

ID=48289209

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13720418.6A Ceased EP2865026A2 (de) 2012-06-25 2013-05-06 Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung

Country Status (5)

Country Link
US (1) US20150146342A1 (ja)
EP (1) EP2865026A2 (ja)
JP (1) JP6064044B2 (ja)
DE (1) DE102012105517B4 (ja)
WO (1) WO2014000930A2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018123594B4 (de) * 2018-09-25 2022-06-09 Tdk Electronics Ag Verfahren zur Herstellung eines keramischen Bauelements

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050803A (ja) * 2000-07-31 2002-02-15 Tokin Ceramics Corp 積層型圧電セラミックス

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19945934C1 (de) 1999-09-24 2001-03-22 Epcos Ag Verfahren zur Herstellung einer Außenkontaktierung eines elektrokeramischen Bauelementes, insbesondere eines Piezoaktors
JP2001307947A (ja) * 2000-04-25 2001-11-02 Tdk Corp 積層チップ部品及びその製造方法
JP4158338B2 (ja) 2000-06-06 2008-10-01 株式会社デンソー インジェクタ用圧電体素子
JP4506084B2 (ja) * 2002-04-16 2010-07-21 株式会社村田製作所 非還元性誘電体セラミックおよびその製造方法ならびに積層セラミックコンデンサ
DE10234787C1 (de) * 2002-06-07 2003-10-30 Pi Ceramic Gmbh Keramische Tec Verfahren zur Herstellung eines monolithischen Vielschichtaktors, monolithischer Vielschichtaktor aus einem piezokeramischen oder elektrostriktiven Material
JP4593911B2 (ja) * 2003-12-18 2010-12-08 京セラ株式会社 積層型圧電素子及び噴射装置
DE10345500B4 (de) * 2003-09-30 2015-02-12 Epcos Ag Keramisches Vielschicht-Bauelement
JP2006303045A (ja) 2005-04-18 2006-11-02 Denso Corp 積層型圧電体素子
JP4720425B2 (ja) * 2005-10-18 2011-07-13 株式会社村田製作所 電子部品
JP4154538B2 (ja) * 2006-03-31 2008-09-24 株式会社村田製作所 圧電アクチュエータ
JP5087914B2 (ja) * 2006-12-06 2012-12-05 Ｔｄｋ株式会社 積層型圧電素子
JP5132972B2 (ja) * 2007-04-09 2013-01-30 太陽誘電株式会社 誘電体セラミックス及びその製造方法並びに積層セラミックコンデンサ
JP5282634B2 (ja) * 2008-06-25 2013-09-04 株式会社村田製作所 積層セラミック電子部品およびその製造方法
SI2359419T1 (sl) * 2008-11-20 2013-06-28 Ceramtec Gmbh Večplasten vzbujevalnik z zunanjimi elektrodami iz kovinske, porozne in raztegljive prevodne plasti
DE102009013125A1 (de) 2009-03-13 2010-09-23 Epcos Ag Piezoaktor in Vielschichtbauweise und Verfahren zum Befestigen einer Außenelektrode bei einem Piezoaktor
JP2011176187A (ja) * 2010-02-25 2011-09-08 Kyocera Corp 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム
JP5699819B2 (ja) * 2010-07-21 2015-04-15 株式会社村田製作所 セラミック電子部品
KR101153573B1 (ko) * 2010-11-25 2012-06-11 삼성전기주식회사 이중 전극 구조를 갖는 적층형 세라믹 캐패시터

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050803A (ja) * 2000-07-31 2002-02-15 Tokin Ceramics Corp 積層型圧電セラミックス

Also Published As

Publication number Publication date
US20150146342A1 (en) 2015-05-28
DE102012105517A1 (de) 2014-01-02
WO2014000930A3 (de) 2014-03-06
JP2015529967A (ja) 2015-10-08
DE102012105517B4 (de) 2020-06-18
WO2014000930A2 (de) 2014-01-03
JP6064044B2 (ja) 2017-01-18

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