WO2014000930A3 - Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung - Google Patents
Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung Download PDFInfo
- Publication number
- WO2014000930A3 WO2014000930A3 PCT/EP2013/059384 EP2013059384W WO2014000930A3 WO 2014000930 A3 WO2014000930 A3 WO 2014000930A3 EP 2013059384 W EP2013059384 W EP 2013059384W WO 2014000930 A3 WO2014000930 A3 WO 2014000930A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer component
- external contacting
- layer
- producing
- contacting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Contacts (AREA)
- Thermistors And Varistors (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Ceramic Capacitors (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015518913A JP6064044B2 (ja) | 2012-06-25 | 2013-05-06 | 外部接続部を有する多層デバイス、および外部接続部を有する多層デバイスの製造方法 |
US14/405,127 US20150146342A1 (en) | 2012-06-25 | 2013-05-06 | Multi-Layer Component Having an External Contact and Method for Producing a Multi-Layer Component Having an External Contact |
EP13720418.6A EP2865026A2 (de) | 2012-06-25 | 2013-05-06 | Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012105517.3A DE102012105517B4 (de) | 2012-06-25 | 2012-06-25 | Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung |
DE102012105517.3 | 2012-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014000930A2 WO2014000930A2 (de) | 2014-01-03 |
WO2014000930A3 true WO2014000930A3 (de) | 2014-03-06 |
Family
ID=48289209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/059384 WO2014000930A2 (de) | 2012-06-25 | 2013-05-06 | Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150146342A1 (de) |
EP (1) | EP2865026A2 (de) |
JP (1) | JP6064044B2 (de) |
DE (1) | DE102012105517B4 (de) |
WO (1) | WO2014000930A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018123594B4 (de) * | 2018-09-25 | 2022-06-09 | Tdk Electronics Ag | Verfahren zur Herstellung eines keramischen Bauelements |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1156498A2 (de) * | 2000-04-25 | 2001-11-21 | TDK Corporation | Vielschicht- Keramikbauteil und Herstellungsverfahren |
DE102007049576A1 (de) * | 2006-12-06 | 2008-06-12 | Tdk Corp. | Piezoelektrisches Mehrschichtelement |
US20080305944A1 (en) * | 2007-04-09 | 2008-12-11 | Yaiyo Yuden Co., Ltd. | Dielectric ceramics and manufacturing method thereof, as well as multilayer ceramic capacitor |
EP2410540A1 (de) * | 2010-07-21 | 2012-01-25 | Murata Manufacturing Co. Ltd. | Keramisches Elektronikbauteil |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19945934C1 (de) | 1999-09-24 | 2001-03-22 | Epcos Ag | Verfahren zur Herstellung einer Außenkontaktierung eines elektrokeramischen Bauelementes, insbesondere eines Piezoaktors |
JP4158338B2 (ja) | 2000-06-06 | 2008-10-01 | 株式会社デンソー | インジェクタ用圧電体素子 |
JP2002050803A (ja) * | 2000-07-31 | 2002-02-15 | Tokin Ceramics Corp | 積層型圧電セラミックス |
JP4506084B2 (ja) * | 2002-04-16 | 2010-07-21 | 株式会社村田製作所 | 非還元性誘電体セラミックおよびその製造方法ならびに積層セラミックコンデンサ |
DE10234787C1 (de) * | 2002-06-07 | 2003-10-30 | Pi Ceramic Gmbh Keramische Tec | Verfahren zur Herstellung eines monolithischen Vielschichtaktors, monolithischer Vielschichtaktor aus einem piezokeramischen oder elektrostriktiven Material |
JP4593911B2 (ja) * | 2003-12-18 | 2010-12-08 | 京セラ株式会社 | 積層型圧電素子及び噴射装置 |
DE10345500B4 (de) * | 2003-09-30 | 2015-02-12 | Epcos Ag | Keramisches Vielschicht-Bauelement |
JP2006303045A (ja) | 2005-04-18 | 2006-11-02 | Denso Corp | 積層型圧電体素子 |
JP4720425B2 (ja) * | 2005-10-18 | 2011-07-13 | 株式会社村田製作所 | 電子部品 |
JP4154538B2 (ja) * | 2006-03-31 | 2008-09-24 | 株式会社村田製作所 | 圧電アクチュエータ |
JP5282634B2 (ja) * | 2008-06-25 | 2013-09-04 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
SI2359419T1 (sl) * | 2008-11-20 | 2013-06-28 | Ceramtec Gmbh | Večplasten vzbujevalnik z zunanjimi elektrodami iz kovinske, porozne in raztegljive prevodne plasti |
DE102009013125A1 (de) | 2009-03-13 | 2010-09-23 | Epcos Ag | Piezoaktor in Vielschichtbauweise und Verfahren zum Befestigen einer Außenelektrode bei einem Piezoaktor |
JP2011176187A (ja) * | 2010-02-25 | 2011-09-08 | Kyocera Corp | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
KR101153573B1 (ko) * | 2010-11-25 | 2012-06-11 | 삼성전기주식회사 | 이중 전극 구조를 갖는 적층형 세라믹 캐패시터 |
-
2012
- 2012-06-25 DE DE102012105517.3A patent/DE102012105517B4/de active Active
-
2013
- 2013-05-06 WO PCT/EP2013/059384 patent/WO2014000930A2/de active Application Filing
- 2013-05-06 US US14/405,127 patent/US20150146342A1/en not_active Abandoned
- 2013-05-06 EP EP13720418.6A patent/EP2865026A2/de not_active Ceased
- 2013-05-06 JP JP2015518913A patent/JP6064044B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1156498A2 (de) * | 2000-04-25 | 2001-11-21 | TDK Corporation | Vielschicht- Keramikbauteil und Herstellungsverfahren |
DE102007049576A1 (de) * | 2006-12-06 | 2008-06-12 | Tdk Corp. | Piezoelektrisches Mehrschichtelement |
US20080305944A1 (en) * | 2007-04-09 | 2008-12-11 | Yaiyo Yuden Co., Ltd. | Dielectric ceramics and manufacturing method thereof, as well as multilayer ceramic capacitor |
EP2410540A1 (de) * | 2010-07-21 | 2012-01-25 | Murata Manufacturing Co. Ltd. | Keramisches Elektronikbauteil |
Also Published As
Publication number | Publication date |
---|---|
US20150146342A1 (en) | 2015-05-28 |
DE102012105517A1 (de) | 2014-01-02 |
JP2015529967A (ja) | 2015-10-08 |
EP2865026A2 (de) | 2015-04-29 |
DE102012105517B4 (de) | 2020-06-18 |
WO2014000930A2 (de) | 2014-01-03 |
JP6064044B2 (ja) | 2017-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013051875A3 (ko) | 유기 발광 소자 및 이의 제조방법 | |
WO2013028693A3 (en) | Capacitors, apparatus including a capacitor and methods for forming a capacitor | |
WO2015175558A3 (en) | Energy storage device and method of production thereof | |
WO2013049042A3 (en) | Coalesced nanowire structures with interstitial voids and method for manufacturing the same | |
WO2014195482A3 (en) | Organic electronic device | |
WO2013085839A3 (en) | Semiconductor modules and methods of forming the same | |
WO2012138903A3 (en) | Dual active layers for semiconductor devices and methods of manufacturing the same | |
EP3089184A4 (de) | Kohlenstoffmaterial für eine elektrode, verfahren zur herstellung davon und elektrischer doppelschichtkondensator | |
WO2012143784A3 (en) | Semiconductor device and manufacturing method thereof | |
WO2012028279A9 (en) | Gate insulator layer for electronic devices | |
WO2012031963A3 (de) | Widerstandsbauelement und verfahren zur herstellung eines widerstandsbauelements | |
MX2015010827A (es) | Sustrato revestido con una multicapa de baja emisividad. | |
IN2014DN09305A (de) | ||
WO2013167338A3 (de) | Keramischer vielschichtkondensator | |
EP2631960A3 (de) | Nanopiezoelektrischer Generator und Herstellungsverfahren dafür | |
WO2012091487A3 (ko) | 전극 및 이를 포함하는 전자소자 | |
GB201204670D0 (en) | Optoelectronic device | |
EP3418428A4 (de) | Keramisches laminat, keramisches isolationssubstrat und verfahren zur herstellung eines keramischen laminats | |
GB201319175D0 (en) | Electrical fuse and method of making the same | |
WO2013011127A3 (de) | Thermoelektrisches modul, verfahren zur herstellung eines thermoelektrischen moduls und verwendung eines metallischen glases oder eines gesinterten werkstoffes | |
WO2013167643A3 (de) | Verfahren zum elektrischen kontaktieren eines elektronischen bauelements als stapel und elektronisches bauelement mit einer kontaktierungsstruktur | |
MY165848A (en) | Parallel stacked symmetrical and differential inductor | |
EP2955733A4 (de) | Mehrschichtige struktur, kondensatorelement und verfahren zur herstellung davon | |
WO2013167270A8 (fr) | Dispositif photonique organique | |
WO2009093873A3 (ko) | 유기 발광 소자 및 이의 제작 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13720418 Country of ref document: EP Kind code of ref document: A2 |
|
REEP | Request for entry into the european phase |
Ref document number: 2013720418 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013720418 Country of ref document: EP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13720418 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14405127 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 2015518913 Country of ref document: JP Kind code of ref document: A |