JP5087914B2 - 積層型圧電素子 - Google Patents
積層型圧電素子 Download PDFInfo
- Publication number
- JP5087914B2 JP5087914B2 JP2006329719A JP2006329719A JP5087914B2 JP 5087914 B2 JP5087914 B2 JP 5087914B2 JP 2006329719 A JP2006329719 A JP 2006329719A JP 2006329719 A JP2006329719 A JP 2006329719A JP 5087914 B2 JP5087914 B2 JP 5087914B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- piezoelectric element
- region
- multilayer
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims description 39
- 150000004706 metal oxides Chemical class 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 24
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 18
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 18
- 238000005245 sintering Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 85
- 230000005684 electric field Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- -1 ZrO 2 Chemical compound 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Fuel-Injection Apparatus (AREA)
Description
Pb0.999[(Zn1/3Nb2/3)0.11 Ti0.425 Zr0.465]O3+0.2wt%Fe2O3+0.2wt%Sb2O3
Claims (4)
- 複数の圧電体と第1電極及び第2電極を含む複数の内部電極とを交互に積層し焼結してなる積層体を備えた積層型圧電素子であって、
前記積層体には、前記圧電体の焼結温度よりも融点が高い材料で形成された金属酸化物層が設けられており、
前記積層体は、前記第1電極と前記第2電極とが前記積層体の積層方向に重なり合うように構成されてなる活性部と、前記活性部の両側に設けられ、前記第1電極と前記第2電極とが前記積層体の積層方向に重なり合わないように構成されてなる不活性部とを有し、
前記金属酸化物層は、前記不活性部における前記内部電極と同一の層に形成された第1領域と、前記第1領域から前記活性部側に延びて前記内部電極に対して重なるように形成された第2領域とを有することを特徴とする積層型圧電素子。 - 前記第2領域は、前記内部電極の一部に対して重なるように形成されていることを特徴とする請求項1記載の積層型圧電素子。
- 前記第2領域は、前記内部電極全体に対して重なるように形成されていることを特徴とする請求項1記載の積層型圧電素子。
- 前記圧電体は、チタン酸ジルコン酸鉛を主成分とする圧電材料で形成され、
前記金属酸化物層は、ZrO2、MgO、Nb2O5、Ta2O5、CeO2、Y2O3の少なくとも一種を含む材料で形成されていることを特徴とする請求項1〜3のいずれか一項記載の積層型圧電素子。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006329719A JP5087914B2 (ja) | 2006-12-06 | 2006-12-06 | 積層型圧電素子 |
DE200710049576 DE102007049576A1 (de) | 2006-12-06 | 2007-10-16 | Piezoelektrisches Mehrschichtelement |
US11/907,904 US7518295B2 (en) | 2006-12-06 | 2007-10-18 | Multilayer piezoelectric element |
CN2007101970880A CN101197421B (zh) | 2006-12-06 | 2007-12-06 | 层叠型压电元件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006329719A JP5087914B2 (ja) | 2006-12-06 | 2006-12-06 | 積層型圧電素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008147247A JP2008147247A (ja) | 2008-06-26 |
JP5087914B2 true JP5087914B2 (ja) | 2012-12-05 |
Family
ID=39363336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006329719A Expired - Fee Related JP5087914B2 (ja) | 2006-12-06 | 2006-12-06 | 積層型圧電素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7518295B2 (ja) |
JP (1) | JP5087914B2 (ja) |
CN (1) | CN101197421B (ja) |
DE (1) | DE102007049576A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4358220B2 (ja) * | 2006-11-21 | 2009-11-04 | Tdk株式会社 | 積層型圧電素子 |
EP1978568B1 (en) * | 2007-02-19 | 2011-10-12 | Siemens Aktiengesellschaft | Piezoceramic multilayer actuator and method of manufacturing the same |
EP1978567B1 (en) * | 2007-02-19 | 2014-06-25 | Continental Automotive GmbH | Piezoceramic multilayer actuator and method of manufacturing a piezoceramic multilayer actuator |
ATE535946T1 (de) * | 2007-02-19 | 2011-12-15 | Siemens Ag | Piezokeramischer mehrschichtaktor und verfahren zur herstellung eines piezokeramischen mehrschichtaktors |
JP5141046B2 (ja) * | 2007-02-27 | 2013-02-13 | Tdk株式会社 | 積層型圧電素子 |
JP2010097083A (ja) * | 2008-10-17 | 2010-04-30 | Hoya Corp | 光ファイバスキャナおよび内視鏡装置 |
JP5836754B2 (ja) * | 2011-10-04 | 2015-12-24 | 富士フイルム株式会社 | 圧電体素子及びその製造方法 |
JP5836755B2 (ja) * | 2011-10-04 | 2015-12-24 | 富士フイルム株式会社 | 圧電体素子及び液体吐出ヘッド |
JP2013101020A (ja) * | 2011-11-08 | 2013-05-23 | Seiko Epson Corp | センサー素子、力検出装置およびロボット |
JP5842635B2 (ja) * | 2012-01-27 | 2016-01-13 | Tdk株式会社 | 積層型圧電素子 |
DE102012105517B4 (de) * | 2012-06-25 | 2020-06-18 | Tdk Electronics Ag | Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung |
DE102012109250B4 (de) * | 2012-09-28 | 2020-07-16 | Tdk Electronics Ag | Elektrisches Bauelement und Verfahren zur Herstellung einer Kontaktierung eines Elektrischen Bauelements |
KR20150110126A (ko) * | 2014-03-24 | 2015-10-02 | 삼성전기주식회사 | 압전소자 및 이를 포함하는 압전진동자 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5163209A (en) * | 1989-04-26 | 1992-11-17 | Hitachi, Ltd. | Method of manufacturing a stack-type piezoelectric element |
US5175465A (en) * | 1991-10-18 | 1992-12-29 | Aura Systems, Inc. | Piezoelectric and electrostrictive actuators |
JPH05243635A (ja) | 1992-02-28 | 1993-09-21 | Nec Corp | 電歪効果素子の製造方法 |
JP4470504B2 (ja) * | 2004-02-03 | 2010-06-02 | 株式会社デンソー | 積層型圧電素子及びその製造方法 |
JP4736422B2 (ja) * | 2004-12-24 | 2011-07-27 | 株式会社デンソー | 積層型圧電素子の製造方法 |
JP4843948B2 (ja) * | 2005-01-21 | 2011-12-21 | Tdk株式会社 | 積層型圧電素子 |
JP5200331B2 (ja) * | 2006-04-17 | 2013-06-05 | Tdk株式会社 | 積層型圧電素子 |
JP4973077B2 (ja) * | 2006-09-08 | 2012-07-11 | 株式会社デンソー | セラミック積層体の製造方法 |
JP4358220B2 (ja) * | 2006-11-21 | 2009-11-04 | Tdk株式会社 | 積層型圧電素子 |
-
2006
- 2006-12-06 JP JP2006329719A patent/JP5087914B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-16 DE DE200710049576 patent/DE102007049576A1/de not_active Withdrawn
- 2007-10-18 US US11/907,904 patent/US7518295B2/en not_active Expired - Fee Related
- 2007-12-06 CN CN2007101970880A patent/CN101197421B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102007049576A1 (de) | 2008-06-12 |
CN101197421B (zh) | 2010-12-15 |
CN101197421A (zh) | 2008-06-11 |
US20080136293A1 (en) | 2008-06-12 |
JP2008147247A (ja) | 2008-06-26 |
US7518295B2 (en) | 2009-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5087914B2 (ja) | 積層型圧電素子 | |
JP4358220B2 (ja) | 積層型圧電素子 | |
JP4843948B2 (ja) | 積層型圧電素子 | |
JP4967239B2 (ja) | 積層型圧電素子 | |
CN111509118A (zh) | 层叠型压电元件 | |
JP2001267646A (ja) | 積層型圧電アクチュエータ | |
JP5141046B2 (ja) | 積層型圧電素子 | |
JP5200331B2 (ja) | 積層型圧電素子 | |
JP2007019420A (ja) | 積層型圧電素子 | |
JP5068936B2 (ja) | 積層型圧電素子の製造方法 | |
JP2005223014A (ja) | 積層型圧電素子及びその製造方法 | |
JP4670260B2 (ja) | 積層型電子部品 | |
JP5674768B2 (ja) | 圧電多層コンポーネント | |
JP2004274029A (ja) | 圧電アクチュエータ | |
JP4468510B2 (ja) | 圧電素子及び積層型圧電アクチュエータ | |
JP5409703B2 (ja) | 積層型圧電アクチュエータの製造方法 | |
JP5087822B2 (ja) | 圧電素子 | |
JP6035773B2 (ja) | 積層型圧電アクチュエータおよびその製造方法 | |
JP5205852B2 (ja) | 圧電装置 | |
JPH04273183A (ja) | 圧電効果素子および電歪効果素子並びにその製造方法 | |
JP2019040948A (ja) | 積層型圧電素子 | |
JP5066785B2 (ja) | 圧電素子 | |
JP4373904B2 (ja) | 積層型圧電素子 | |
JP2855709B2 (ja) | 積層圧電セラミックス素子の製造方法 | |
JPH0864881A (ja) | 積層型圧電アクチュエータ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090908 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120814 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120816 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120827 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150921 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |