EP2752498A4 - Material aus kupferlegierung und herstellungsverfahren dafür - Google Patents

Material aus kupferlegierung und herstellungsverfahren dafür

Info

Publication number
EP2752498A4
EP2752498A4 EP12828596.2A EP12828596A EP2752498A4 EP 2752498 A4 EP2752498 A4 EP 2752498A4 EP 12828596 A EP12828596 A EP 12828596A EP 2752498 A4 EP2752498 A4 EP 2752498A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
copper alloy
alloy material
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12828596.2A
Other languages
English (en)
French (fr)
Other versions
EP2752498A1 (de
Inventor
Ryosuke Matsuo
Hiroshi Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2752498A1 publication Critical patent/EP2752498A1/de
Publication of EP2752498A4 publication Critical patent/EP2752498A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP12828596.2A 2011-08-29 2012-08-29 Material aus kupferlegierung und herstellungsverfahren dafür Withdrawn EP2752498A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011186253 2011-08-29
PCT/JP2012/071857 WO2013031841A1 (ja) 2011-08-29 2012-08-29 銅合金材料およびその製造方法

Publications (2)

Publication Number Publication Date
EP2752498A1 EP2752498A1 (de) 2014-07-09
EP2752498A4 true EP2752498A4 (de) 2015-04-08

Family

ID=47756321

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12828596.2A Withdrawn EP2752498A4 (de) 2011-08-29 2012-08-29 Material aus kupferlegierung und herstellungsverfahren dafür

Country Status (6)

Country Link
EP (1) EP2752498A4 (de)
JP (1) JP5307305B1 (de)
KR (1) KR101914322B1 (de)
CN (1) CN103534370B (de)
TW (1) TWI571518B (de)
WO (1) WO2013031841A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5802150B2 (ja) 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
JP5795030B2 (ja) * 2013-07-16 2015-10-14 株式会社古河テクノマテリアル 耐応力腐食性に優れるＣｕ−Ａｌ−Ｍｎ系合金材料からなる展伸材
JP5668814B1 (ja) * 2013-08-12 2015-02-12 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子およびバスバー
JP6133178B2 (ja) * 2013-09-06 2017-05-24 古河電気工業株式会社 銅合金板材およびその製造方法
WO2015034071A1 (ja) * 2013-09-06 2015-03-12 古河電気工業株式会社 銅合金線材及びその製造方法
JP6266354B2 (ja) * 2014-01-15 2018-01-24 株式会社神戸製鋼所 電気電子部品用銅合金
JP6201815B2 (ja) * 2014-02-28 2017-09-27 株式会社オートネットワーク技術研究所 銅合金撚線の製造方法
JP6696895B2 (ja) 2014-03-31 2020-05-20 古河電気工業株式会社 圧延銅箔、圧延銅箔の製造方法、フレキシブルフラットケーブル、フレキシブルフラットケーブルの製造方法
KR101932828B1 (ko) * 2014-03-31 2018-12-26 후루카와 덴키 고교 가부시키가이샤 구리합금선재 및 그 제조방법
JP6053959B2 (ja) * 2014-05-29 2016-12-27 古河電気工業株式会社 銅合金板材及びその製造方法、前記銅合金板材からなる電気電子部品
JP6358340B2 (ja) * 2014-12-12 2018-07-18 新日鐵住金株式会社 配向銅板、銅張積層板、可撓性回路基板、及び電子機器
JP6056876B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導安定化材
JP6056877B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
DE102015001293B4 (de) 2015-02-02 2022-11-17 Isabellenhütte Heusler Gmbh & Co. Kg Stromschienenanordnung
JP6299802B2 (ja) * 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
JP6299803B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
ITUA20163211A1 (it) * 2016-05-06 2017-11-06 De Angeli Prod S R L Conduttore elettrico per avvolgimenti elettrici, specialmente per cavo trasposto continuo
CN108913932B (zh) * 2018-07-19 2020-05-01 江西理工大学 一种max相增强铜基复合材料及其制备方法
CN108754218B (zh) * 2018-09-10 2019-09-10 江西理工大学 一种高强高导Cu-Cr-Fe-Mg-P合金线材及其制备方法
CN112030032B (zh) * 2020-09-09 2022-07-29 中铝洛阳铜加工有限公司 一种Cu-Cr-Ti-Zr系合金及铜带制备方法
CN114672688A (zh) * 2022-03-23 2022-06-28 中南大学 一种铜合金及其制备方法和应用
WO2024014091A1 (ja) * 2022-07-13 2024-01-18 古河電気工業株式会社 銅合金板材および絞り加工部品
US20240116110A1 (en) * 2022-10-04 2024-04-11 Iowa State University Research Foundation, Inc. Oxidation resistant high conductivity copper alloys

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179606A2 (de) * 2000-08-09 2002-02-13 Olin Corporation Silber enthaltende Kupfer-Legierung
JP2005029857A (ja) * 2003-07-09 2005-02-03 Nikko Metal Manufacturing Co Ltd 延性に優れた高力高導電性銅合金
EP2343388A1 (de) * 2009-12-23 2011-07-13 Mitsubishi Shindoh Co., Ltd. Cu-Mg-P-basiertes Kupferlegierungsmaterial und Herstellungsverfahren dafür
EP2610359A1 (de) * 2010-08-27 2013-07-03 Furukawa Electric Co., Ltd. Kupferlegierungsblech und herstellungsverfahren dafür

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162553A (ja) * 1989-11-22 1991-07-12 Nippon Mining Co Ltd 曲げ加工性の良好な高強度高導電銅合金の製造方法
JP3353324B2 (ja) 1992-02-10 2002-12-03 三菱伸銅株式会社 スタンピング金型を摩耗させることの少ない銅合金冷間圧延条材およびその製造法
US5486244A (en) 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys
JPH11323463A (ja) 1998-05-14 1999-11-26 Kobe Steel Ltd 電気・電子部品用銅合金
JP4756197B2 (ja) 2005-08-23 2011-08-24 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金およびその製造法
JP5075447B2 (ja) * 2006-03-30 2012-11-21 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｆｅ−Ｐ−Ｍｇ系銅合金および製造法並びに通電部品
JP4968533B2 (ja) 2007-11-30 2012-07-04 日立電線株式会社 電気・電子部品用銅合金材
WO2009123140A1 (ja) * 2008-03-31 2009-10-08 日鉱金属株式会社 導電性ばね材に用いられるＣｕ－Ｎｉ－Ｓｉ系合金
CN102105610B (zh) * 2008-06-03 2013-05-29 古河电气工业株式会社 铜合金板材及其制造方法
JP5045783B2 (ja) 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179606A2 (de) * 2000-08-09 2002-02-13 Olin Corporation Silber enthaltende Kupfer-Legierung
JP2005029857A (ja) * 2003-07-09 2005-02-03 Nikko Metal Manufacturing Co Ltd 延性に優れた高力高導電性銅合金
EP2343388A1 (de) * 2009-12-23 2011-07-13 Mitsubishi Shindoh Co., Ltd. Cu-Mg-P-basiertes Kupferlegierungsmaterial und Herstellungsverfahren dafür
EP2610359A1 (de) * 2010-08-27 2013-07-03 Furukawa Electric Co., Ltd. Kupferlegierungsblech und herstellungsverfahren dafür

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013031841A1 *

Also Published As

Publication number Publication date
JPWO2013031841A1 (ja) 2015-03-23
KR20140052997A (ko) 2014-05-07
CN103534370A (zh) 2014-01-22
CN103534370B (zh) 2015-11-25
TW201311913A (zh) 2013-03-16
JP5307305B1 (ja) 2013-10-02
KR101914322B1 (ko) 2018-11-01
EP2752498A1 (de) 2014-07-09
TWI571518B (zh) 2017-02-21
WO2013031841A1 (ja) 2013-03-07

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