EP2677050A4 - Cu-zr-basierte kupferlegierungsplatte und verfahren zu ihrer herstellung - Google Patents

Cu-zr-basierte kupferlegierungsplatte und verfahren zu ihrer herstellung

Info

Publication number
EP2677050A4
EP2677050A4 EP12747430.2A EP12747430A EP2677050A4 EP 2677050 A4 EP2677050 A4 EP 2677050A4 EP 12747430 A EP12747430 A EP 12747430A EP 2677050 A4 EP2677050 A4 EP 2677050A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy plate
manufacturing same
based copper
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12747430.2A
Other languages
English (en)
French (fr)
Other versions
EP2677050A1 (de
EP2677050B1 (de
Inventor
Takeshi Sakurai
Yoshio Abe
Naotake Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Publication of EP2677050A1 publication Critical patent/EP2677050A1/de
Publication of EP2677050A4 publication Critical patent/EP2677050A4/de
Application granted granted Critical
Publication of EP2677050B1 publication Critical patent/EP2677050B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP12747430.2A 2011-02-18 2012-02-10 Cu-zr-basierte kupferlegierungsplatte und verfahren zu ihrer herstellung Active EP2677050B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011033097A JP5060625B2 (ja) 2011-02-18 2011-02-18 Ｃｕ−Ｚｒ系銅合金板及びその製造方法
PCT/JP2012/053158 WO2012111567A1 (ja) 2011-02-18 2012-02-10 Ｃｕ－Ｚｒ系銅合金板及びその製造方法

Publications (3)

Publication Number Publication Date
EP2677050A1 EP2677050A1 (de) 2013-12-25
EP2677050A4 true EP2677050A4 (de) 2014-08-20
EP2677050B1 EP2677050B1 (de) 2015-08-26

Family

ID=46672491

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12747430.2A Active EP2677050B1 (de) 2011-02-18 2012-02-10 Cu-zr-basierte kupferlegierungsplatte und verfahren zu ihrer herstellung

Country Status (7)

Country Link
US (1) US9644251B2 (de)
EP (1) EP2677050B1 (de)
JP (1) JP5060625B2 (de)
KR (1) KR101838550B1 (de)
CN (1) CN103380221B (de)
TW (1) TWI431128B (de)
WO (1) WO2012111567A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5955718B2 (ja) * 2012-09-20 2016-07-20 三菱伸銅株式会社 Ｃｕ−Ｚｒ−Ｃｏ銅合金板及びその製造方法
JP5525101B2 (ja) * 2012-10-22 2014-06-18 Ｊｘ日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP5470483B1 (ja) * 2012-10-22 2014-04-16 Ｊｘ日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP5632063B1 (ja) * 2013-11-19 2014-11-26 Jx日鉱日石金属株式会社 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品
JP6370692B2 (ja) * 2013-11-26 2018-08-08 三菱伸銅株式会社 Ｃｕ−Ｚｒ系銅合金板及びその製造方法
SE542101C2 (en) * 2014-04-02 2020-02-25 Jfe Steel Corp Iron powder for iron powder cores and method for selecting iron powder for iron powder cores
JP6207539B2 (ja) 2015-02-04 2017-10-04 Ｊｘ金属株式会社 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品
JP2017057476A (ja) 2015-09-18 2017-03-23 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP6012834B1 (ja) * 2015-10-15 2016-10-25 東京特殊電線株式会社 サスペンションワイヤ
JP6680042B2 (ja) * 2016-03-30 2020-04-15 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
EP3633072A4 (de) * 2017-06-01 2021-02-17 Mitsubishi Materials Corporation Hochreines elektrolytisches kupfer
CN107607383A (zh) * 2017-07-26 2018-01-19 国核锆铪理化检测有限公司 一种锆合金ebsd试样制备方法
JP6617313B2 (ja) * 2017-08-03 2019-12-11 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
CN109136634B (zh) * 2018-08-21 2020-10-27 南京理工大学 一种高性能铜合金材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268573A (ja) * 1994-03-25 1995-10-17 Nikko Kinzoku Kk 電子機器用高力高導電性銅合金の製造方法
EP0681035A2 (de) * 1994-04-25 1995-11-08 Olin Corporation Verfahren zur Verbesserung der Biegverformbarkeit von Kupfer-Legierungen
EP1586667A1 (de) * 2004-04-14 2005-10-19 Mitsubishi Shindoh Co., Ltd. Kupfer legierung und Verfahren zu deren Herstellung
JP2010242177A (ja) * 2009-04-07 2010-10-28 Hitachi Cable Ltd 電気・電子部品用銅合金材
EP2343388A1 (de) * 2009-12-23 2011-07-13 Mitsubishi Shindoh Co., Ltd. Cu-Mg-P-basiertes Kupferlegierungsmaterial und Herstellungsverfahren dafür

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270540A (ja) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材
US4749548A (en) 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
CN101568658B (zh) * 2007-12-21 2012-01-04 三菱伸铜株式会社 高强度、高导热铜合金管及其制造方法
JP4550148B1 (ja) * 2009-03-13 2010-09-22 三菱伸銅株式会社 銅合金及びその製造方法
JP4642119B2 (ja) 2009-03-23 2011-03-02 三菱伸銅株式会社 銅合金及びその製造方法
JP5320642B2 (ja) * 2009-04-17 2013-10-23 株式会社Ｓｈカッパープロダクツ 銅合金の製造方法及び銅合金
JP4563495B1 (ja) 2009-04-27 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268573A (ja) * 1994-03-25 1995-10-17 Nikko Kinzoku Kk 電子機器用高力高導電性銅合金の製造方法
EP0681035A2 (de) * 1994-04-25 1995-11-08 Olin Corporation Verfahren zur Verbesserung der Biegverformbarkeit von Kupfer-Legierungen
EP1586667A1 (de) * 2004-04-14 2005-10-19 Mitsubishi Shindoh Co., Ltd. Kupfer legierung und Verfahren zu deren Herstellung
JP2010242177A (ja) * 2009-04-07 2010-10-28 Hitachi Cable Ltd 電気・電子部品用銅合金材
EP2343388A1 (de) * 2009-12-23 2011-07-13 Mitsubishi Shindoh Co., Ltd. Cu-Mg-P-basiertes Kupferlegierungsmaterial und Herstellungsverfahren dafür

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KUAA 3/4 EL R ET AL: "Microstructure of Equal-Channel Angular Pressed Cu and Cu-Zr Samples Studied by Different Methods", METALLURGICAL AND MATERIALS TRANSACTIONS A, SPRINGER-VERLAG, NEW YORK, vol. 41, no. 5, 26 June 2009 (2009-06-26), pages 1174 - 1190, XP019796806, ISSN: 1543-1940 *
See also references of WO2012111567A1 *

Also Published As

Publication number Publication date
KR20140045920A (ko) 2014-04-17
EP2677050A1 (de) 2013-12-25
CN103380221A (zh) 2013-10-30
WO2012111567A1 (ja) 2012-08-23
JP2012172168A (ja) 2012-09-10
TWI431128B (zh) 2014-03-21
US9644251B2 (en) 2017-05-09
EP2677050B1 (de) 2015-08-26
TW201247906A (en) 2012-12-01
KR101838550B1 (ko) 2018-03-14
US20130319584A1 (en) 2013-12-05
JP5060625B2 (ja) 2012-10-31
CN103380221B (zh) 2015-05-20

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