EP2536549A1 - Integrale bestrahlungseinheit - Google Patents
Integrale bestrahlungseinheitInfo
- Publication number
- EP2536549A1 EP2536549A1 EP11701849A EP11701849A EP2536549A1 EP 2536549 A1 EP2536549 A1 EP 2536549A1 EP 11701849 A EP11701849 A EP 11701849A EP 11701849 A EP11701849 A EP 11701849A EP 2536549 A1 EP2536549 A1 EP 2536549A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- light
- irradiation unit
- curing
- transparent
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920000642 polymer Polymers 0.000 claims abstract description 109
- 239000000203 mixture Substances 0.000 claims abstract description 106
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 238000001723 curing Methods 0.000 claims description 78
- 230000005855 radiation Effects 0.000 claims description 47
- 238000002347 injection Methods 0.000 claims description 28
- 239000007924 injection Substances 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 17
- 238000000016 photochemical curing Methods 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 238000011049 filling Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 59
- -1 aromatic epoxides Chemical class 0.000 description 52
- 229910052697 platinum Inorganic materials 0.000 description 30
- 239000003054 catalyst Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 17
- FALJXSPLMPMHEL-UHFFFAOYSA-N C[Pt](C)C Chemical compound C[Pt](C)C FALJXSPLMPMHEL-UHFFFAOYSA-N 0.000 description 16
- QTZBUMQAAGVMBG-UHFFFAOYSA-N C(C=C)(=O)[Pt](C)C Chemical compound C(C=C)(=O)[Pt](C)C QTZBUMQAAGVMBG-UHFFFAOYSA-N 0.000 description 14
- 238000007493 shaping process Methods 0.000 description 14
- 239000004926 polymethyl methacrylate Substances 0.000 description 13
- URHURAUXXZJQAP-UHFFFAOYSA-N C=1C=CC=CC=1[Pt]C1=CC=CC=C1 Chemical compound C=1C=CC=CC=1[Pt]C1=CC=CC=C1 URHURAUXXZJQAP-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 12
- 229920002379 silicone rubber Polymers 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000006459 hydrosilylation reaction Methods 0.000 description 10
- 239000004945 silicone rubber Substances 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 238000004132 cross linking Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 238000001228 spectrum Methods 0.000 description 8
- 230000004913 activation Effects 0.000 description 7
- 239000003112 inhibitor Substances 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 230000009969 flowable effect Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 5
- VYXHVRARDIDEHS-QGTKBVGQSA-N (1z,5z)-cycloocta-1,5-diene Chemical compound C\1C\C=C/CC\C=C/1 VYXHVRARDIDEHS-QGTKBVGQSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 238000013022 venting Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 229920005372 Plexiglas® Polymers 0.000 description 3
- WYUIWUCVZCRTRH-UHFFFAOYSA-N [[[ethenyl(dimethyl)silyl]amino]-dimethylsilyl]ethene Chemical compound C=C[Si](C)(C)N[Si](C)(C)C=C WYUIWUCVZCRTRH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000012763 reinforcing filler Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MGRRGKWPEVFJSH-UHFFFAOYSA-N 10-(10-oxoanthracen-9-ylidene)anthracen-9-one Chemical compound C12=CC=CC=C2C(=O)C2=CC=CC=C2C1=C1C2=CC=CC=C2C(=O)C2=CC=CC=C21 MGRRGKWPEVFJSH-UHFFFAOYSA-N 0.000 description 2
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KBSDLBVPAHQCRY-UHFFFAOYSA-N 307496-19-1 Chemical group C1CC=CCC1CC[Si](O1)(O2)O[Si](O3)(C4CCCC4)O[Si](O4)(C5CCCC5)O[Si]1(C1CCCC1)O[Si](O1)(C5CCCC5)O[Si]2(C2CCCC2)O[Si]3(C2CCCC2)O[Si]41C1CCCC1 KBSDLBVPAHQCRY-UHFFFAOYSA-N 0.000 description 2
- GNKZMNRKLCTJAY-UHFFFAOYSA-N 4'-Methylacetophenone Chemical compound CC(=O)C1=CC=C(C)C=C1 GNKZMNRKLCTJAY-UHFFFAOYSA-N 0.000 description 2
- JVVRCYWZTJLJSG-UHFFFAOYSA-N 4-dimethylaminophenol Chemical compound CN(C)C1=CC=C(O)C=C1 JVVRCYWZTJLJSG-UHFFFAOYSA-N 0.000 description 2
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- NZYSQTRFLJKIHY-UHFFFAOYSA-N C(C)[Pt](C)CC Chemical compound C(C)[Pt](C)CC NZYSQTRFLJKIHY-UHFFFAOYSA-N 0.000 description 2
- GUBRRQRTCOELEI-UHFFFAOYSA-N CC[Pt](C)C Chemical compound CC[Pt](C)C GUBRRQRTCOELEI-UHFFFAOYSA-N 0.000 description 2
- VNHZUQBHRUURNX-UHFFFAOYSA-N C[Pt](C)C(C)=O Chemical compound C[Pt](C)C(C)=O VNHZUQBHRUURNX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- KDUIUFJBNGTBMD-DLMDZQPMSA-N [8]annulene Chemical compound C/1=C/C=C\C=C/C=C\1 KDUIUFJBNGTBMD-DLMDZQPMSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000003868 ammonium compounds Chemical class 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 2
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 125000005624 silicic acid group Chemical class 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920006352 transparent thermoplastic Polymers 0.000 description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- VMFJVWPCRCAWBS-UHFFFAOYSA-N (3-methoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 VMFJVWPCRCAWBS-UHFFFAOYSA-N 0.000 description 1
- OZDCBKYPNBVRSA-UHFFFAOYSA-N (4,4-dimethoxycyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound C1=CC(OC)(OC)CC=C1C(=O)C1=CC=CC=C1 OZDCBKYPNBVRSA-UHFFFAOYSA-N 0.000 description 1
- KKVBXYFFCPVJIV-UHFFFAOYSA-N (4-benzyl-4-chlorocyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound C1C=C(C(=O)C=2C=CC=CC=2)C=CC1(Cl)CC1=CC=CC=C1 KKVBXYFFCPVJIV-UHFFFAOYSA-N 0.000 description 1
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- USVVENVKYJZFMW-ONEGZZNKSA-N (e)-carboxyiminocarbamic acid Chemical compound OC(=O)\N=N\C(O)=O USVVENVKYJZFMW-ONEGZZNKSA-N 0.000 description 1
- JYAQYXOVOHJRCS-UHFFFAOYSA-N 1-(3-bromophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(Br)=C1 JYAQYXOVOHJRCS-UHFFFAOYSA-N 0.000 description 1
- SKBBQSLSGRSQAJ-UHFFFAOYSA-N 1-(4-acetylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(C(C)=O)C=C1 SKBBQSLSGRSQAJ-UHFFFAOYSA-N 0.000 description 1
- HDMHXSCNTJQYOS-UHFFFAOYSA-N 1-(4-prop-2-enylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(CC=C)C=C1 HDMHXSCNTJQYOS-UHFFFAOYSA-N 0.000 description 1
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- NFWRFLYAYHHUBT-UHFFFAOYSA-N 2-ethyl-9,10-dimethylanthracene Chemical compound C1=CC=CC2=C(C)C3=CC(CC)=CC=C3C(C)=C21 NFWRFLYAYHHUBT-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 125000004204 2-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C(OC([H])([H])[H])C([H])=C1[H] 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- GQOJBPMQQJCPFQ-UHFFFAOYSA-N 2-tert-butylperoxy-4-chlorobenzoic acid Chemical compound CC(C)(C)OOC1=CC(Cl)=CC=C1C(O)=O GQOJBPMQQJCPFQ-UHFFFAOYSA-N 0.000 description 1
- FMYREMJSVBWKAB-UHFFFAOYSA-N 2-tert-butylperoxy-4-methylbenzoic acid Chemical compound CC1=CC=C(C(O)=O)C(OOC(C)(C)C)=C1 FMYREMJSVBWKAB-UHFFFAOYSA-N 0.000 description 1
- 125000004179 3-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(Cl)=C1[H] 0.000 description 1
- LEUJIOLEGDAICX-UHFFFAOYSA-N 3-chloroxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=C(Cl)C=C3OC2=C1 LEUJIOLEGDAICX-UHFFFAOYSA-N 0.000 description 1
- KMSYDDGPKBBSNA-UHFFFAOYSA-N 3-ethyl-1-phenylpentan-1-one Chemical compound CCC(CC)CC(=O)C1=CC=CC=C1 KMSYDDGPKBBSNA-UHFFFAOYSA-N 0.000 description 1
- 125000004207 3-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(OC([H])([H])[H])=C1[H] 0.000 description 1
- 125000004800 4-bromophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Br 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- 125000001255 4-fluorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1F 0.000 description 1
- 125000004199 4-trifluoromethylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C(F)(F)F 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- DLGLWFGFEQRRCP-UHFFFAOYSA-N 6-chloro-1-nonylxanthen-9-one Chemical compound O1C2=CC(Cl)=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCC DLGLWFGFEQRRCP-UHFFFAOYSA-N 0.000 description 1
- BRUOAURMAFDGLP-UHFFFAOYSA-N 9,10-dibromoanthracene Chemical compound C1=CC=C2C(Br)=C(C=CC=C3)C3=C(Br)C2=C1 BRUOAURMAFDGLP-UHFFFAOYSA-N 0.000 description 1
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- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
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- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0277—Apparatus with continuous transport of the material to be cured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0075—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping curing or polymerising by irradiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
Definitions
- the invention relates to an integral irradiation unit with UV light sources with selected UV light spectrum for curing light-curing polymer compositions.
- the integral irradiation unit of the invention allows the highly efficient production of polymer moldings or polymer-coated bodies optionally in a continuous or in a batch process.
- the integral irradiation unit can be used for the production of moldings from photocurable polymers, in particular for the production of elastomer moldings, thermoset moldings, thermoplastic moldings or moldings of thermoplastic elastomers.
- quartz glass on the one hand is ideal as a UV light-permeable material, which is also thermally resistant and scratch-resistant, but it is difficult to reshape using surface-processing methods and has a high price.
- transparent elements made of quartz glass can certainly also be used as a mold nesting wall or entrance window in a mold in such a way that reduces the mechanical stress and reduces the risk of breakage, but the use of certain conditions is bound.
- thermoplastic UV-light-transmissive elements can be used, without these up to the limit of heat resistance burden, but at the same time enter a large light output per unit time in the polymer composition to be cured.
- the transparent elements can be adapted to the compatibility of the photocurable polymers with respect to their compatibility (interaction with the light-curing polymers). As a result, shortened production cycles are achieved with the device according to the invention with a significantly higher UV light yield relative to the energy or radiation power used.
- the integral irradiation device according to the invention also allows the production of smaller and larger components in the injection molding process and the control and the control of Vernetzungsbeginns and -Verlaufes over long periods.
- the device leads to processing methods with a low mold temperature, which offers advantages, for example, for 2-component injection molding, if the composite component is sensitive to heat, or if the encapsulation of inserts made of plastics with low heat resistance is to take place.
- the invention further allows the manufacture and use of compact, integral molds for producing photohardened shaped articles by producing selected UV transparent mold materials with sufficient UV light resistance and heat resistance with new UV light sources which produce less heat radiation per incident light power. combine.
- the present invention thus provides an integral irradiation unit (sometimes also referred to as apparatus of the invention) for curing photocuring polymer compositions comprising: one or more UV light sources wherein the proportion in the range of> 700 nm is less than 15% and in the range ⁇ 300 nm is less than 15% of the total radiation,
- Polymer compositions one or more elements transparent to the generated ultraviolet light which are in contact with the photocuring polymer composition,
- injection channels for the light-curing polymer compositions.
- the present invention further provides an integral radiation unit for curing light-curing polymer compositions, comprising: one or more UV light sources selected from UV lamps having wavelength-selective filters and / or mirrors, UV LED and UV laser light sources, wherein the Proportion in the range of> 700 nm is less than 15% and in the range ⁇ 300 nm less than 15% of the total radiation. one or more mold cavities for receiving the light-curing polymer compositions,
- injection channels for the light-curing polymer compositions.
- the integral irradiation unit of the invention is characterized in that it comprises a connected unit of mold nest or nest and certain UV light source (s). It thus constitutes an integral irradiation and molding unit. This may include forming a mold cavity and UV light source in a rigid unit. This may well include that the connection between the mold nest and UV light source can be variable or movable. Furthermore, the integral irradiation unit may have an area for accommodating changing shape nests.
- the integral irradiation unit of the invention also includes the possibility that the UV Light source (s), although connected directly or indirectly to the mold cavity, can be moved relative thereto or an areal limited light beam can be directed one or more times over a larger area of a transparent element by targeted change of direction Alternatively, the transparent element may also be moved and the UV light source may be rigidly arranged, such as a movable array being particularly large he preferred dimensioned axial shapes, wherein the UV light source can be guided, for example, along the longitudinal axis of the mold cavity.
- the integral irradiation unit according to the invention allows even large-volume moldings or molded articles having a high number of cycles in a common curing reaction to produce it were in one portion ', since prob- lems of the heat transfer in the mold cavity, as in thermosetting or activatable systems usually do not occur ,
- any photocurable or photocurable compositions for example various acrylates, acrylate derivatives, aliphatic or aromatic epoxides as in EP 0826431 A1 also discloses vinyloxy derivatives, mercaptan-substituted aliphatic or aromatic monomers or oligomers unsaturated polyesters, bisallyl-substituted ammonium compounds as disclosed in EP 548826 A2 or EP 1265942 A2, including their mixtures with one another or mixtures with transparent fillers and silicone rubber compositions, etc.
- the components (A1) and (A2) can be used, for example, various Acrylates, acrylate derivatives, aliphatic or aromatic epoxides as disclosed in EP 0826431 A1, furthermore vinyloxy derivatives, mercaptan-substituted aliphatic or aromatic monomers or oligomers, unsaturated polyesters, bisallylubstituted ammonium compounds as disclosed in EP 548826 A2 or EP 1265942 A2 including their mixtures among themselves.
- light-curing polymer compositions such as photocurable, flowable polymer, oligomer and / or monomer compositions, such as, for example, those comprising:
- the component (A) can in particular be selected from flowable polyorganosiloxanes having photoreactive or photocurable functional groups.
- component (A) is selected from polyorganosiloxanes (A1) containing siloxy units of the formula:
- the monovalent hydrocarbon groups represented by R are preferably those having 1 to 10 carbon atoms, especially 1 to 8 carbon atoms, such as alkyl groups selected from the group consisting of methyl -, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, hexyl, octyl and decyl, cycloalkyl units, such as. B. cyclopentyl and cyclohexyl, Arylariien, such as. As phenyl and tolyl, and aralkyl groups, such as. B. benzyl and phenylethyl.
- alkoxy groups are present as those having 1 to 8 carbon atoms, in particular 1 to 4 carbon atoms, such as. Methoxy, ethoxy, propoxy and butoxy.
- R is not limited to unsubstituted, monovalent hydrocarbon (and optionally alkoxy) groups, but also includes substituted forms of these groups wherein some or all of the hydrogen atoms attached to carbon atoms are replaced by halogen atoms, cyano groups, alkoxy groups or the like, for example, substituted ones Hydrocarbon groups such. For example, chloromethyl, 3,3,3-trifluoropropyl and cyanoethyl and substituted alkoxy.
- R 1 is a photoreactive group selected from alkenyl groups, methacryloyl-containing groups, alkenyloxyalkyl-containing, such as vinyloxyalkyl-containing, cyclohexenyl-ethyl, limonyl, dicyclopentadienyl, norbornenyl and epoxyalkyl-containing groups.
- the (meth) acryloyl-containing groups include, for example, (meth) acryloxyalkyl groups in which the alkyl moiety has 2 to 14 carbon atoms, such as. Gamma-acryloxypropyl and y-methacryloxypropyl.
- the vinyloxyalkyl groups include, for example, those groups in which the alkyl group has 3 to 8 carbon atoms, such as. B. vinyloxypropyl.
- the epoxy-containing groups include, for example, glycidyloxyalkyl groups in which the alkyl moiety has 3 to 14 carbon atoms, such as. Y-glycidyloxypropyl, and (3,4-epoxycyclohexyl) alkyl groups.
- photoreactive groups represented by R 1 should be present per molecule. With less than two photoreactive groups represented by R 1 , polyorganosiloxanes are not fully curable. It should be noted that R 1 may be attached to a silicon atom at the end or in the middle of a molecular chain.
- the photoreactive groups R 1 can be assigned to groups essentially according to their reaction mechanism, such as those of the radically activatable groups, the groups which are capable of free radical activation and groups capable of hydrosilylation.
- the branched polyorganosiloxane (A2) which can preferably be used optionally, is a silicone resin, which preferably has an increased amount of reactive groups R ', thus can contribute to an increased crosslinking density, if it is included in appropriate amounts.
- Component (A2) increases strength, tear propagation resistance and hardness.
- a similar effect is also achieved by a component (A1) if it has a high concentration of 1 to 50 mol.% Of the reactive groups R 1 , based on all Si atoms, and is present in an amount of 0.2 to 90% by weight. %, preferably 1 to 40 wt.% Based on the total amount of components (A1), for example with a further component ⁇ ) (A1), which preferably has only 0.01 to 0.9 mol.% Reactive groups used.
- the use of reinforcing fillers can be avoided in whole or in part, whereby the transparency of the composition can be maintained at a high level.
- High transparency of the photocuring polymer compositions facilitates the deep penetration of the photoactivating UV radiation into the mold cavity in a process for the production of molded articles from photohardenable polymers.
- the silicone resin (A2) is synthesized, for example, by mixing vinyldimethylmethoxysilane and tetramethoxysilane in a desired molar ratio, hydrolyzed, condensed to a polymer and optionally equilibrated. In other syntheses, vinyltrimethoxysilane and tetramethoxysilane are co-hydrolyzed in the desired ratio to the introduction of trifunctional T or Q groups. In place of the alkoxysilanes, corresponding chlorosilanes or mixtures of chlorosilanes and alkoxysilanes can also occur. Instead of tetramethoxysilane, for example, water glass can also be used.
- component (A2) can also be used, for example, with up to 90% by weight (based on the total amount of the components (A1) and (A2)), if thermoset, brittle properties of the cured composition are desired or accepted.
- Component (B) is selected from one or more catalysts which can effect the curing of the photoreactive groups in the component.
- the catalysts include, for example:
- R 1 is an alkenyl, methacryloyl, alkenyl such as vinyl, allyl, hexenyl, cyclohexenylethyl, limonyl, functional polyorganosiloxane ( A), these are:
- Photoinitiators such as acylphosphine oxides, acetophenone, propiophenone, benzophenone, xanthol, fluorene, benzaldehyde, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, 4-methylacetophenone, 3-pentylacetophenone, 4-methoxyacetophenone, 3-bromoacetophenone, 4-allylacetophenone , p-diacetylbenzene, 3-methoxybenzophenone, 4-methylbenzophenone, 4-chlorobenzophenone, 4,4-dimethoxybenzophenone, 4-chloro-4-benzylbenzophenone, 3-chloro-xanthone, 3,9-dichloro-xanthone, 3-chloro-8 nonylxanthone, benzoin, benzoin ethers, such as benzoin methyl ether and benzoin butyl ether, bis (4-di
- A is an alkyl or aryl group and B is hydrogen, alkyl, halogen, nitro, amino, or amido, such as t-butyl perbenzoate and para-substituted derivatives thereof, such as t-butyl peroxy p-nitrobenzoate, t-butyl peroxy-p-methoxybenzoate, t-butylperoxy-p-methylbenzoate and t-butylperoxy-p-chlorobenzoate, azo compounds such as azodicarboxylic ester, azodicarboxylic acid amide or azodiisobutyronitrile.
- cationic curing such as for epoxy-functional or alkenyl ether-functional ie vinyloxy-, propenoxy-functional polydiorganosiloxanes, these are:
- R 5 may be the same or different and is selected from organic radicals having up to 30 carbon atoms, such as aromatic hydrocarbon radicals, the onium anion being selected from the group MX n , where MX n is an anion, such as BF 4 " , PF 6 “ , AsF 6 “ , SbF 6 “ , SbCl 6 “ , HSO 4 " , CIO 4 " , etc.
- MX n is an anion, such as BF 4 " , PF 6 “ , AsF 6 “ , SbF 6 “ , SbCl 6 “ , HSO 4 " , CIO 4 " , etc.
- onium catalysts are known from EP 703236 or US 5,866,261, such as B (C 6 F 5 ) 4 "salts.
- onium catalysts include diazonium salts such as. for example, 4-morpholino-2,5-dimethoxy-phenyldiazonium fluoroborate a.
- the catalysts (B) are selected from the group of photoactivatable hydrosilylation catalysts, in particular metal compounds, such as Ag, Co, Fe, Ir, Os, Ni, Pd, Pt, Rh and Ru ,
- photoactivatable platinum catalysts (B) are the (n, -diolefin) ( ⁇ -aryl) -platinum complexes as disclosed in US 4,530,879 A: (wherein “COD” is cyclooctadiene, “COT” is cyclooctatetraene, and “NBD” is norbornadiene ): (1,5-COD) diphenylplatin
- photoactivatable catalysts include ( ⁇ -diolefin) (sigma-alkyl) -platinum complexes, such as
- Trimethylplatin-cyclopentadienyl-terminated polysiloxanes Most preferred are alkyl or trialkylsilyl substituted cyclopentadienyl-tris-alkyl-platinum compounds, cyclopentadienyl-tris (triorganosilyl) alkyl-platinum compounds, especially alkylcyclopentadienyl-trimethyl-platinum, such as methylcyclopentadienyl-trimethyl- platinum.
- the amount of component (B) for the hydrosilylation reaction-curing systems is desirably about 0.1-1000 ppm, preferably 0.5-500 ppm, more preferably 1-100 ppm, more preferably 2-50 ppm, even more preferably 2-20 ppm calculated as metal and based on the weight of component (A).
- the rate of crosslinking is determined, inter alia, by the selected catalyst compound, its amount, and also the type and amount of optional additional component (D), the hydrosilylation reaction inhibitor used.
- the catalyst concentration for the radically curable compositions for the photoactivatable catalyst (B) is 0.01 to 5 parts by weight, more preferably 0.01 to 0.5 parts by weight per 100 parts by weight of the component (A).
- the amounts of photoactivatable catalyst (B) are selected from up to 5 parts by weight per 100 parts by weight of component (A).
- the catalyst (B) is added in the smallest possible amount by which the composition can be cured. Less than 0.01 part of the photoactivatable catalyst (B) in free radically or cationically curable compositions is often insufficient to cure the silicone rubber composition. With more than 5 parts of the photoinitiator (B), the light transmittance may be reduced, so that the curing reaction may take too long.
- the photocurable compositions based on component (A) comprising polymers, oligomers and / or monomers which have one or more photoreactive groups, in particular flowable silicone rubber compositions comprising, for example, (A1) and / or (A2), optionally contain one or more Sensitizers (C).
- Sensitizers (C) are those compounds which can absorb electromagnetic radiation within the visible range of the light spectrum, ie 400 nm to 800 nm, and can transfer this energy to the catalyst. They should suitably have an energy of the triplet term of at least 130 kJ / mol.
- Representative examples include, for example, polycyclic aromatic sensitizers such as anthracene, 9-vinylanthracene, 9,10-dimethylanthracene, 9,10-dichloroanthracene, 9,10-dibromoanthracene, 9,10-diethylanthracene, 9,10-di-ethoxyanthracene, 2- Ethyl 9,10-dimethylanthracene, naphthacene, pentacene, benzene [a] Anthracene, 7, 12-dimethylbenz [ajanthracene, azulene, aromatic ketones such as 2-chlorothioxanthone, 2-isopropylthioxanthone, thioxanthone, anthraquinone, benzophenone, 1-chloroanthraquinone, bianthrone, and the like.
- polycyclic aromatic sensitizers such as anthracene, 9-vin
- hydrosilylation reaction-curing silicone rubber compositions containing, for example, components (A1) and / or (A2), these optionally contain one or more inhibitors (D) which influence the rate of the hydrosilylation reaction.
- D inhibitors which influence the rate of the hydrosilylation reaction. This makes it possible to influence the crosslinking rate and to ensure, for example, that the hydrosilylation reaction does not begin to harden prematurely, in particular outside the mold-nested silicone rubber compositions.
- inhibitors examples include, for example, ethylenically unsaturated amides (US 4,337,332); acetylenic compounds (US 3 445 420, US 4 347 346), isocyanates (US 3 882 083); unsaturated siloxanes, (US 3,989,667); unsaturated diesters (US 4,256,870, US 4,476,166 and US 4,562,096), hydroperoxides (US 4 061 609), ketones (US 3 418 731); Sulfoxides, amines, phosphines, phosphites, nitriles (US Pat. No. 3,344,111), diaziridines (US Pat. No.
- 4,774,111 such as diethyl fumarate, diallyl fumarate or bis (methoxyisopropyl) maleate, furthermore vinylsiloxanes, such as 1,3-divinyltetramethyldisiloxane or Tetravinyltetramethyltetracyclosiloxane.
- the amount of inhibitor component is selected so that the desired cure time under the selected processing conditions, particularly in coordination with the catalyst (B) and the other components, is appropriate, i. Time and temperature can be adjusted.
- the amount of inhibitor component is preferably from 0.0001 to 2% by weight of one or more inhibitors based on the amount of component (A).
- the photohardenable, flowable polymer, oligomer and / or monomer composition contains one or more components (A). reactive component (s) (E) which builds up (A) chemical bonds in the sense of a polymerization, oligomerization or crosslinking.
- the photo-curing silicone rubber compositions necessarily comprise SiH-functional polyorganosiloxanes as component (E).
- SiH-functional polyorganosiloxanes (E) for example, the SiH-functional polyorganohydrogensiloxanes are selected from the group of linear, cyclic or branched SiH-containing polyorganosiloxanes, such as
- n 0.001 to 4
- R 2 0i 2 is an alkoxy radical on the silicon
- R 3 hydrogen or R as defined above, preferably C-
- the ratio of component (E) to component (A) is preferably selected such that a molar ratio of Si-H to Si-alkenyl units of about 0.5 to 20: 1, preferably from 1 to 3: 1 is present.
- the preferred amount of the polyorganohydrosiloxanes used as component (E) is from 0.1 to 200 parts by weight based on 100 parts by weight of component (A).
- the molar ratio of SiH to Si-alkenyl units can be used to influence many properties, such as rubber properties, rate of crosslinking, stability, and surface tack.
- the polyorganohydrogensiloxanes (E) may be linear, branched, cyclic.
- the polyorganohydrogensiloxane has a viscosity of about 5 to 1000 mPa ⁇ s at 25 ° C.
- polyfunctional mercapto compounds such as those mentioned in EP 832936 A1
- crosslinker (E) Compounds, in particular mercaptosilanes or mercaptopolysiloxanes having 2 to 50 mercapto groups.
- polyfunctional free-radically crosslinkable monomers, oligomers or polymers may also be used without restriction, such as polyalkenyl compounds, such as glycerol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate or pentaerythritol tetra (meth) acrylate.
- polyalkenyl compounds such as glycerol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate or pentaerythritol tetra (meth) acrylate.
- the photohardenable compositions used in the present invention may contain one or more fillers as component (F) as commonly used in photohardenable compositions, such as silicone rubbers, provided they pass sufficient photoactivating UV light.
- component (F) as commonly used in photohardenable compositions, such as silicone rubbers, provided they pass sufficient photoactivating UV light.
- Reinforcing fillers (F) which fulfill this requirement are for example selected from the group which contains, at 25 ° C., solid orga- niche and inorganic resins, such as silsesquioxanes, metal oxides or metal oxide hydroxide gels, for example of Al, B, Ce, Ga, In, Si, Zn, Ti, Sn, Sb.
- silicic acids or silica gels having an average primary particle size in the range from 5 to 20 nm and BET specific surface areas of 150 to 400 m 2 / g, which are prepared by various methods, such as flame hydrolysis, precipitation methods, sol-gel methods, etc.
- fumed silicas such as Aerosil (U.S. Degussa), HDK (Wacker), Cab-O-Sil (Cabot).
- filler (F) also includes fillers with surface-bound hydrophobizing agents or dispersants or process aids, which preferably reduce the interaction of the filler with the polymer, such as the thickening effect.
- the known silicon compounds are preferably used in order to achieve this hydrophobization.
- the surface treatment can be done, for example, ' in situ ' by the addition of silazanes, such as hexamethyldisilazane and / or 1, 3-divinyltetramethyldisilazane, with the addition of water.
- Examples of commercially available silicas hydrophobized in advance with various silanes are: Aerosil R 972, R 974, R 976 or R 812 or, for example, HDK 2000 or H30.
- Exemplary trade names for so-called hydrophobized precipitated silicas, in English ' Wet Silicas ' are Sipernat D10 or D15 from Degussa. These pre-hydrophobized silicas are less preferred than the in-situ '-with silanes Zanen hydrophobized silicas.
- the selection of the amount of filler type, its amount and the type of hydrophobization can influence the rubber-mechanical properties and the rheological, ie processing properties of the silicone rubber mixtures.
- Preferred fillers are the highly transparent silicas which are prepared from hydrolysis and condensation of tetraalkoxysilanes and hexamethyldisilazane and / or 1,3-divinyltetramethyldisilazane.
- US Pat. No. 4,344,800 is cited here, which defines these silicic acids by way of example.
- compositions comprising: a) 100 parts by weight of at least one alkenyl group-containing polyorganosiloxane (A) having a viscosity range of 0.01 and 100 Pa.s (25 ° C.; from 1 s "1 ),
- d) optionally 0.0001 to 2 wt.% Of one or more inhibitors based on the amount of components (A) to (E), and optionally further auxiliaries.
- polyorganosiloxane compositions can be cured in large thicknesses or volumes with UV light in the integral irradiation and shaping apparatus according to the invention in a short time and remove without major adhesion problems from the mold.
- the integral irradiation unit according to the invention for curing the aforementioned light-curing polymer compositions comprises one or more UV light sources.
- UV light in the context of the present invention means electromagnetic (actinic) radiation which can cure flowable, photocurable polymer compositions, in particular silicone rubber compositions.
- the term ' photoactivatable ' is used in the sense of ' light-activatable ' .
- ultraviolet light having a maximum of the spectral distribution of wavelengths in the range of 300 to 500 nm, especially ultraviolet light of wavelength in the range of 300 to 400 nm, is used.
- the UV light sources according to the invention are, in particular, those in which the proportion of the total radiation in the range of> 700 nm is less than 15% and in the range ⁇ 300 nm less than 15%.
- the total radiation mentioned here refers to the amount of radiation which strikes the transparent element of the integral irradiation unit.
- the term UV light source therefore includes all elements of the irradiation unit, including any wavelength-sensitive filter or dichroic mirror elements.
- UV light sources in which the proportion of the total radiation in the range of> 700 nm is less than 15% and in the range ⁇ 300 nm less than 15% are therefore characterized by providing radiation substantially in the region of the spectrum in which activation of the curing of the light-curing polymer compositions takes place.
- This wavelength range is the wavelength range in which the activation of the light-curing polymer compositions or the reaction rate of the curing is maximal. This wavelength range depends on the light-curing polymer composition used, the catalysts used for this purpose, initiators, sensitizers etc.
- the range of maximum activation or highest curing rate is generally about 345 to 385 nm
- the use of UV light sources with a particularly low proportion of radiation in the range of> 700 nm or ⁇ 300 nm is detrimental to some materials for transparent elements (transparent materials) reduced high-energy UV component and at the same time avoided the harmful both for the transparent materials and for the light-curing polymer compositions proportion of thermal radiation.
- the high-energy UV radiation (wavelength range ⁇ 300 nm) leads, in particular, to the premature aging of the transparent plastic molding materials, such as PMMA, which manifests itself, for example, in yellowing, embrittlement and deformation and ultimately by the failure of the mold cavity, and leads to high production costs.
- excessive heat radiation of the UV light sources in the wavelength range of> 700 nm leads to possible deformations of the transparent elements or the mold nests, which also renders them unusable, or the heat has to be expensively removed from the irradiation unit, resulting in a compact design of the irradiation unit prevented.
- UV light sources which inherently have a proportion of the total radiation in the range of> 700 nm of less than 15% and in the range ⁇ 300 nm of less than 15%, such as UV LED lamps with a maximum of the radiation in the range between 300 and 450 nm and narrow width of the radiation distribution, for example, of +/- 25 nm, moreover, the energy used is maximally converted into a radiation serving for activation, which makes the method particularly energy-efficient.
- the determination of the proportions of the total radiation of the UV light source in the range of> 700 nm and ⁇ 300 nm, can be done for example by irradiation of a corresponding measuring device, in particular a (spectral) photometer, photocells or a bolometer.
- UV light sources that meet these requirements include, in particular, UV lamps with wavelength-selective filters and / or mirrors, UV LED and UV laser light sources.
- all conventional UV lamps are therefore suitable as UV light sources, in which the amount of radiation in the wavelength range of ⁇ 300 and> 700 nm is suitably limited, or such UV lamps, which due to their system UV radiation.
- UV lamps examples include: UV fluorescent lamps, high pressure mercury vapor lamps, UV arc lamps, metal halide lamps, xenon lamps, flash lamps, non-doped or Fe or gallium doped mercury lamps, black light lamps, their radiation in particular through the use of wavelength-selective filters and / or mirrors, in the range of ⁇ 300 nm and> 700 nm is suppressed.
- UV lamps which already produce their UV radiation in a narrow wavelength range due to the system, include, for example, UV LED lamps or UV lasers, such as excimer lasers. These are preferred because of their low heat development.
- light sources whose absorbed energy is converted as completely as possible into a UV light which can be used for light curing are selected in accordance with the invention.
- These light sources have almost no share of heat radiation more.
- the proportion of heat radiation with the wavelength between 700-10000 nm is below 10% of the total radiation. Fade-out by wavelength-selective mirrors or filters can also reduce the proportion of heat radiation by up to 85%, but this effect is not always sufficient to prevent the undesirably high heating of the heat-sensitive, transparent shaping elements and is paid for with increased space requirements.
- the entire device does not always fit in an injection molding machine. Also, the energy losses are greater.
- UV light sources with a selected, limited wavelength spectrum, ie with only low heat radiation greater than 700 nm and UV radiation of less than 300 nm and with compact dimensions. These are preferably used as UV light source for providing the integral irradiation unit with transparent elements as part of a mold nest, in particular if these consist of thermoplastic materials and are attached at a small distance to these UV light sources.
- the light sources are therefore preferably selected from the group of UV LED lamps and UV lasers. Examples of such light sources are UV LED lamps, such as LED Powerline and LED PowerPen the company Hönle, LED lamps by Dr. Ing.
- UV lasers for example of the type FDSS 355-300 plus or types of corresponding power in the UV wavelength range of Microoptik LIMO Lissotschenko Mikrooptik GmbH in Dortmund, are also particularly suitable, for example.
- the laser light sources preferably require a micro-optics for the areal distribution or expansion of the tightly bundled laser beam in front of the transparent element in the integral shaping and irradiation unit.
- the radiation sources mentioned generate UV light with a maximum in the wavelength range of 300-500 nm, preferably the range of 250-400 nm, more preferably 320-385 nm.
- UV lamps in which the selected UV light spectrum is generated by using suitable filters and dichroic mirrors, include, for example, the UV-Print HPL from Hönle in Gräfeling / Kunststoff.
- the sigma-platinum catalysts (B) can be activated preferably with LED UV light sources in the range 365 ⁇ 20 nm.
- the UV light sources used expediently have a power of 0.1-12000 mWatt / cm 2 .
- several such irradiation sources can be arranged in an integral irradiation unit to form an irradiation panel in a planar manner, if necessary.
- the mold nests present in the integral radiation unit of the present invention may be partially transparent, complete or non-transparent to the UV light.
- non-transparent mold nests may occur when irradiating the photo-curing polymer compositions outside the mold nest, for example in an injection channel, which requires a sufficiently long pot life or gel time of the photocuring polymer composition to convert the irradiated polymer composition into the mold cavity without previously curing to such an extent that prevents its transfer to the mold cavity.
- the mold cavity may be formed of common materials such as ceramic, metal, plastic and / or glass, the surfaces of which, either by themselves or by appropriate equipment, prevent adhesion of the cured polymer composition.
- the selection of the mold nesting material therefore depends in particular on the adhesive properties or mutual limited solubility of the polymer composition to be cured.
- non-stick mold nests of transparent materials such as poly (meth) acrylates and / or non-transparent materials such as optional coated metals are used.
- a mold nest based on transparent silicones and / or optionally coated metals or transparent plastics may be used.
- the mold nests are partially or completely constructed of transparent elements, they are preferably made of transparent plastics as listed below for the transparent elements.
- the non-transparent elements are preferably made of metal.
- the size of the mold nests depends on the shape to be created.
- the integral irradiation unit of the invention can be dimensioned in any size, as long as the chosen dimensions allow sufficient radiation curing of the photocurable polymer composition.
- the mold cavities may have a longest dimension of up to 10 meters and a volume of up to 300 liters.
- the longest dimension of the shaped body can be more than 0.5 m, preferably more than 1 m. At high volumes, at least about 0.5 liter, more preferably at least about 3 liters, even more preferably at least about 10 liters are preferred.
- the integral irradiation unit of the invention achieves optimum results because the required high radiant power can be provided with low heat generation without sacrificing shape nests or transparent elements, i. thermal deformation, stress cracks or adhesion.
- the shortest diameter is generally at least about 1 cm, preferably at least about 5 cm, more preferably at least about 10 cm.
- these molded articles have a volume of between 0.001-500 mL and a smallest thickness of 0.01-10 mm.
- the use of the compact integral irradiation and molding unit is advantageous, because injection molding machines which permit the largely automated production of UV-light-cured molded articles can be used advantageously in this dimensional range.
- the mold nests must be open to remove the cured articles.
- the integral irradiation unit has one or more UV transparent elements in contact with the photocuring polymer composition.
- the UV-light transparent elements can, as stated above, partially or completely form the mold cavity. However, they can also be arranged exclusively or additionally outside the mold nest. If they are arranged exclusively outside the mold cavity, in particular at the injection channel, then the pot life for transferring the light-curing polymer composition into the mold cavity must be sufficient.
- the materials for the transparent elements or window materials are selected, for example, from the following group: acrylates, in particular polymethacrylate (PMMA), such as Plexiglas® Roehm & Haas Evonik, polyethylene dicyclopentadiene polymer (COC ) such as Apel® Mitsui Chemicals Topas® COC, Crystal® DEW, quartz glass, polymethacrylic imide (PMMI) so partially imidized methacrylic polymers such.
- PMMA polymethacrylate
- COC polyethylene dicyclopentadiene polymer
- PMMI polymethacrylic imide
- PMMA of common industrial quality can not be used because of excessive absorption of UV light. Rather, suitable are those PMMA types which have a high UV permeability, in which UV stabilizers in particular are essentially excluded during production. Examples of such PMMA types, for example, Plexiglas ® 0Z18.
- UV absorbing additives in other materials used to make the transparent elements preferably must be avoided or replaced with suitable low absorbing additives or avoided altogether.
- the UV light transparent elements are sized to withstand the internal mold pressure (such as those having a thickness of at least about 1 mm, preferably at least 5 mm, more preferably at least about 25 mm). At the same time, a sufficiently large passage area for the UV light to be irradiated must be provided in order to allow a sufficiently rapid curing.
- the required passage area depends on the required UV radiation energy, the desired curing time and the available power of the UV light sources in order to be able to produce 1 - 600 s / molded article in economically reasonable cycle times. It is expedient to offer radiation powers of up to 12 W / cm 2 and transparent passage areas for the UV light of 0.1 to 1 ⁇ 10 4 cm 2 , preferably 1 -100 cm 2 per lamp or per lamp panel.
- the light of several UV light sources can be bundled in particular by means of suitable mirrors and / or lenses. This may be necessary in particular for small transparent elements, since their area is too small to accommodate the light of several UV light sources. In other words, bundling is useful in cases where the irradiation area of the UV light source is larger than the area of the transparent element.
- the transparent elements can be used as such for the construction of the complete mold cavity, or only parts of the mold cavity are opened by the transparent element for the light entrance.
- the integral irradiation unit of the invention may optionally have one or more light-conducting and / or light-reflecting elements.
- Suitable photoconductive and / or light-reflecting elements include, for example: mirrored elements, such as spherical mirrored elements which produce a concave reflection of light, or planar mirrored elements, optical fibers, such as fiber optic bundles, etc.
- the light-conducting and / or light-reflecting elements can be used outside as well as inside Be arranged inside the mold nest so that they are part of the shaping. For example, in the presence of a spherical cavity in the mold cavity, a correspondingly shaped spherical reflective element may be arranged in the interior of the mold cavity.
- the integral irradiation unit has one or more injection channels for the light-curing polymer composition, by means of which the light-curing polymer composition can optionally be injected into the mold cavity after prior or simultaneous irradiation.
- the injection channels have a diameter of, for example, about 0.5-8 mm.
- the dimensions of the gate or gate are preferably in the range of 0.2 to 10 mm.
- the mold cavity must preferably have, in cooperation with the injection channels, a pressure difference to the external pressure in order to allow, in particular, a bubble-free filling of the mold cavity.
- the pressure difference may be, for example, at least about 0.1 bar, preferably at least about 0.5 bar.
- the integral irradiation and shaping unit can have venting channels that receive the vent when filling the mold nests to a bubble-free cured article. Such venting channels have for example a diameter of at least about 1 mm.
- the parting lines of the mold nests can be used for venting.
- Preferred embodiments of the integral irradiation and shaping unit according to the invention have one or more of the following features: a) the distance between the UV light sources and the elements transparent to the UV light is fixed or variable, preferably fixed,
- the irradiation direction of the UV light is variable in order, if appropriate, to be able to irradiate a larger area within the mold cavity or surfaces which are larger than the area of the emitting light source.
- the distance between the UV light sources and the UV light source Light transparent elements is less than 150 mm, preferably less than 100 mm, more preferably less than 50 mm, even more preferably less than 40 mm, more preferably less than 25 mm, even more preferably less than 10 mm, even more preferably less than 7 mm,
- the transparent elements are selected from quartz glass or from a polymer material, which is preferably selected from the group consisting of acrylic polymers, in particular PMMA,
- the integral irradiation unit consists of several subcomponents, such as the UV light source, a plurality of optionally exchangeable mold nest segments, injection elements, including injection channels, valves, mixing elements, etc., which form the irradiation unit during assembly,
- the integral irradiation unit has one or more injection channels, of which possibly at least one transparent element has, which is irradiated by at least one UV light source, g)
- the mold nests have no transparent to the UV light sources sections, the irradiation takes place outside the mold cavity prior to injection into the mold cavity,
- the mold nests are partially or completely constructed of transparent elements
- the integral irradiation unit has several UV light sources, j) the UV light source is an LED light source,
- the UV light source has a power of at least 0.1 mW / cm 2
- the integral irradiation unit is suitable for the continuous or discontinuous production of cured polymer moldings or
- the light-curing polymer compositions are light-curing silicone compositions, preferably hydrosilylation reaction-curing silicone compositions which preferably comprise platinum complex compounds as catalysts, in particular sigma-alkyl-platinum complex compounds,
- the UV light source is selected from UV lamps with wavelength-selective filters and / or mirrors, UV LED and UV laser light sources.
- the invention further relates to a process for the production of shaped articles from cured polymers or bodies coated with cured polymers, wherein one or more light-curing polymer compositions are cured using the integral irradiation unit according to the invention.
- the method expediently comprises the following steps:
- the invention further relates to a process for the preparation of cured polymer moldings or bodies coated with cured polymers, wherein one or more light-curing polymer compositions using the integral irradiation unit according to the invention, comprising the steps of: a) determining the wavelength range effective to activate curing;
- the wavelength range effective to activate the cure is the wavelength range in which the activation of the photohardening polymer compositions or the rate of reaction of the cure is maximal. This wavelength range depends on the light-curing polymer composition used, the catalysts used for this purpose, initiators, sensitizers etc. In the hydrosilylation-curing polymer compositions preferred according to the invention, the range of maximum activation or highest curing rate is generally about 345 to 385 nm.
- the invention further relates to the use of the integral irradiation and shaping unit according to the invention for the production of shaped polymer bodies or polymers coated bodies, such as seals, large-volume electrical insulators, such as high-voltage insulators, field control elements te, thyristors, cable insulation, cable sleeves, optical couplers of optical fibers, cable connectors, encapsulation composites, cable terminations, which may optionally consist of several materials, such as conductive, non-transparent elastomers, thermoplastics, which are previously inserted into the mold cavity, active substance-containing substrates, laminates, cable insulation, Seals on food containers made of metal or plastics, etc.
- seals such as seals, large-volume electrical insulators, such as high-voltage insulators, field control elements te, thyristors, cable insulation, cable sleeves, optical couplers of optical fibers, cable connectors, encapsulation composites, cable terminations, which may optionally consist of several materials, such as conductive
- polymer molded articles or polymer coatings which are produced by means of the integral irradiation unit according to the invention, are preferably made of silicone materials.
- FIGS. 1 to 3 show preferred embodiments of the integral irradiation unit according to the invention.
- the UV light sources (2) are positioned in a base mold / housing (1) such that the mold cavity / cavity (4) is positioned in the UV -transparent mold inserts (3) can be fully exposed.
- the distance (a) of the UV light source / s (2) from the UV-transparent mold inserts (3) can be variable or fixed and is for example 5-150 mm.
- the light-curing polymer can be injected into the integral irradiation and shaping unit via an injection molding machine or, if appropriate, directly via a feed pump, if required, additional static mixers.
- the light-curing polymer via at least one injection channel (6), the diameter in the distribution channel preferably 0.5 to 15 mm and in the gate or gate land range preferably 0.2 to 12 mm, in the cavity or mold cavity (4) brought in.
- the injection channels may be incorporated in the UV light-impermeable base mold or mold housing (1) so that undesired crosslinking does not occur in the injection channel, or they are integrated in the UV-transparent mold inserts or mold nest wall (3) to form the material in the injection channel with networking (it may possibly later by deburring be removed).
- the cavity (4) can be evacuated by vacuum, such as 10 - 300 mbar, prior to filling, or venting channels (7), such as 0.1-2 mm diameter, are introduced into the mold insert (3) when filled with crosslink.
- the filling rate is for example 1 - 1500 cnrVsec. In this case, pressures of, for example, 0.5 to 150 bar are achieved in the cavity.
- the material pressure in the cavity (4) can be raised again by the conveyor unit, such as 5-150 bar, in order to produce bubble-free articles.
- the UV light source (2) is switched on for a duration of preferably 1-600 seconds with a UV intensity such as from 0.1 to 12000 mW / cm 2 in order to crosslink the light-curing polymer.
- the tool can be opened by the injection molding machine or the clamping unit in holding device and the article be removed from the mold.
- the UV light sources (2) are positioned so that the mold cavity / cavity (4) in the UV transparent mold walls / inserts (9) can be exposed from the outside.
- the shadow area (12) between the UV-transparent cylindrical cavity wall (8) (core) and non-UV-transparent insert (11) can preferably be irradiated more adequately with UV light by mirror elements in spherical or even small area Reflector elements (10) guide the UV light through the UV-transparent mold nesting wall (8) or core to the shadow area (12).
- this region can be irradiated by UV light sources (2) via movable light guides (13).
- These optical fibers (12) can be constructed on the basis of glass fibers, polymeric optical fibers or liquid optical fibers.
- the elements (2) to (12) are an integral part in a housing (1).
- the operation of the integral exposure and shaping unit described in FIG. 2 can be carried out as described with reference to FIG.
- a UV light source (2) is incorporated in a metal injection mold (15) such that the photo-curing polymer to be injected is exposed in the injection channel (6) before it enters the cavity (4).
- a UV-transparent insert (14) is introduced in the injection channel (6).
- the distance (b) of the light source to the transparent mold insert (14) may be in particular 0.2 to 15 mm.
- the UV-curing polymer is activated during the filling phase in this channel, with a width of, for example, 1 - 20 mm, a height of for example 0.1 - 20 mm, a length above UV light source (14), for example 1 - 200 mm and hardens only when entering the cavity (4).
- this method is particularly suitable for the encapsulation of plastics with lower heat resistance such as polyolefins, styrenes, polycarbonates and others as insert / insert (16) in 2-component injection molding with silicone rubber.
- the mold cavity (4) of course without use (16) for producing one-component molded articles such as such completely made of silicone moldings, such as baby suckers, O-rings, insulators or extrudates like cable insulation, ie a continuous strand drawn continuously through the chamber (4), for example a wire, as is customary in a cross-spray head for the production of a cable insulation, coated optical fibers, coated profiles of thermoplastics or the like can be used.
- Such moldings may be, for example: seals, such as gaskets with carrier layer, O-rings, cable insulation, insulators or other molded parts.
- Catalyst mixture (B) To 10,000 parts by weight of a linear vinyl-stopped polydimethylsiloxane (A1) having a viscosity of 1 Pa.s at 25 ° C. with a vinyl content of 0.13 mmol / g, 1 part by weight of trimethyl (III) methyl) -cyclopentadienyl-platinum as component (B) from Fa. Strem with a platinum content of 61, 1% if necessary. With heating to 32 ° C dissolved. The catalyst mixture with 0.006 wt. Pt metal must be stored in the dark.
- F pyrogenic silica
- the partial mixtures 2-1 and 2-2 of Example 2 are fed in a volume ratio 90: 1 10 with a Kolbendosierpumpe the company 2KM a static mixer, mixed together there. Subsequently, the mixture is transferred to the mold nests of the respective molds.
- Example 2 The mixture of Example 2 is injected into a mold according to FIG. 1 at a temperature of 20-30 ° C. above the injection channel 6, filled in approximately 300 seconds, and a pressure of 3 bar is maintained by the piston conveyor unit.
- the mold cavity (4) has a volume of 3000 ml.
- the mold cavity outer wall (3) is completely formed of PMMA type Plexiglas® GS colorless type 0Z18 from the company Evonik Röhm GmbH (thickness 10 mm, height 250 mm).
- the transparent mold inserts (3) are bolted to the metallic base mold.
- the metallic mold wall (1) encloses the elements (2) to (7) and together with them forms the envelope of the integral irradiation and molding unit.
- UV lamp each with selected UV light spectrum (proportion of the total radiation in the range of> 700 nm less than 15% and in the range ⁇ 300 nm less than 15%) of the type UVAPRINT 500 HPL.
- Fa. Hönle (2) equipped with H 1 quartz jacket and dichroic reflector mirror and a UV filter is at a distance (a) of 20 mm to the transparent mold nesting wall (3) over 120 s light with a maximum of radiation in the wavelength range of 345-385 nm with an intensity of 40-80 W / cm 2 - from 2 UV lamps perpendicular to each segment of the transparent mold nesting wall (3) of PMMA irradiated.
- the UV lamps are air-cooled.
- the molded body in the mold cavity (4) is crosslinked so far after 120 seconds that a hardness of 25 ° Shore A is measured on the surface.
- the molded body has neither bubbles nor a sticky surface.
- the transparent mold cavity wall (3) transparent element made of PMMA type 0Z18 only heated up to approx. 35-45 ° C during 2 min in the process.
- Example 3b comparative experiment
- experiment 3a with a standard UVA PRINT 500 HPL light source without dichroic reflector mirror leads within 2 min to a heating of the transparent element (3), of more than 90 ° C and is thus close to the softening temperature (glass transition temperature) of the acrylate material. After approx. 100 cycles, the acrylic material yellows, the UV transparency drops by approx. 40% and micro-cracks develop on the surface.
- the partial mixtures 2-1 and 2-2- of Example 2 are in the ratio 90: 1 10 with a metering machine.
- 2KM company with piston delivery as in Example 3 injected into a mold according to FIG. 1 at a temperature of 20-25 ° C and maintained at a pressure of 3 bar.
- UV-lamp with selected UV-light spectrum UVA Print 300 HPL
- UVA Print 300 HPL 2 LED panels to each 300 cm 2 of the company Phoseon consisting of single- NEN LED lamps perpendicular to the acrylic-type window 0Z18 (as described above) on each Side of the mold nest attached.
- the distance between the UV light source and the transparent element was 50 mm.
- 600 W are emitted as UV light in the wavelength range from 345 to 385 nm (with a fraction of the total radiation in the range of> 700 nm of less than 15% and in the range of ⁇ 300 nm less than 15%) Impact mold wall (3).
- the molded body is crosslinked so far after 120 seconds that a hardness of 25 ° Shore A is measured on the surface.
- the molded body has neither bubbles nor one sticky surface.
- the mold cavity wall (3) (PMMA transparent element) has not warmed to more than 25 ° C in the process. This temperature for the heating of the mold cavity outer wall (3) (transparent element) is below the heating in Example 3a.
- Example 4b Example 4a is repeated with the lamp fixed at a distance of 5 mm perpendicular to the acrylic window.
- the molding of the photocurable silicone part mixtures of Example 2 is crosslinked so far after less than 120 s that a hardness of 25 ° Shore A can be measured on the surface.
- the molded body has neither bubbles nor a sticky surface.
- the mold cavity wall (3) transparent element made of PMMA
- Examples 4a and 4b show that, in particular, the replacement of conventional UV lamps by LED UV lamps is possible in particular for curing light-curing silicone compositions and allows curing in the same or shorter time than with conventional UV light sources.
- the heating of the transparent mold nesting wall (3) made of PMMA is much lower or remains completely off.
- the selected LED UV light sources can be mounted at a closer distance to, for example, a transparent mold wall than conventional light sources.
- the use of the UV-LED lamps or other UV light sources with selected UV light spectrum used in the invention thus allows the construction of a compact integral irradiation and shaping device in which the radiation sources can be installed at a small distance to a transparent thermoformable mold nest wall without stressing the mold nest wall to the limit of heat resistance.
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Applications Claiming Priority (2)
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DE102010002141A DE102010002141A1 (de) | 2010-02-19 | 2010-02-19 | Integrale Bestrahlungseinheit |
PCT/EP2011/051743 WO2011101269A1 (de) | 2010-02-19 | 2011-02-07 | Integrale bestrahlungseinheit |
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EP (1) | EP2536549A1 (ja) |
JP (1) | JP5960610B2 (ja) |
KR (1) | KR20130031243A (ja) |
CN (1) | CN102933366B (ja) |
DE (1) | DE102010002141A1 (ja) |
WO (1) | WO2011101269A1 (ja) |
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DE102010002141A1 (de) | 2011-08-25 |
US20130026682A1 (en) | 2013-01-31 |
CN102933366B (zh) | 2016-12-21 |
JP5960610B2 (ja) | 2016-08-02 |
JP2013519547A (ja) | 2013-05-30 |
US9731435B2 (en) | 2017-08-15 |
CN102933366A (zh) | 2013-02-13 |
WO2011101269A1 (de) | 2011-08-25 |
KR20130031243A (ko) | 2013-03-28 |
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