EP2527151B1 - Method for manufacturing inkjet head - Google Patents

Method for manufacturing inkjet head Download PDF

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Publication number
EP2527151B1
EP2527151B1 EP11734546.2A EP11734546A EP2527151B1 EP 2527151 B1 EP2527151 B1 EP 2527151B1 EP 11734546 A EP11734546 A EP 11734546A EP 2527151 B1 EP2527151 B1 EP 2527151B1
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EP
European Patent Office
Prior art keywords
adhesive
ink
epoxy resin
head
mass
Prior art date
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EP11734546.2A
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German (de)
English (en)
French (fr)
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EP2527151A1 (en
EP2527151A4 (en
Inventor
Akihisa Yamada
Tadashi Hirano
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Konica Minolta IJ Technologies Inc
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Konica Minolta IJ Technologies Inc
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Publication of EP2527151A1 publication Critical patent/EP2527151A1/en
Publication of EP2527151A4 publication Critical patent/EP2527151A4/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection

Definitions

  • the present invention relates to a method for manufacturing an inkjet head, for detail, a method for manufacturing an inkjet head using an adhesive having both of ultraviolet curable and thermosetting properties.
  • a liquid injection head which can eject liquid in a state of fine droplet is spreading widely, for example, as an inkjet head used for an inkjet printer which records image by ejecting ink droplet onto a recording paper.
  • a typical ink ejecting method of an inkjet head there is a method for ejecting ink in which electrical current is applied to electric resistor arranged at a pressure chamber, water in ink is vaporized and expanded by generated heat, and the ink is ejected by the pressure, or a method for ejecting liquid from nozzle in which a part of a flow path component which constitutes a pressure chamber is made of piezoelectric element or piezoelectric element is arranged at the flow path component, piezoelectric element corresponding to a plurality of nozzles is selectively driven and the pressure chamber is distorted according to dynamic pressure of each piezoelectric element.
  • an interval between adjacent nozzles becomes still narrower due to provide an inkjet head with high density.
  • the interval between adjacent nozzles is 140 ⁇ m.
  • partition of pressure chamber has thickness of 70 ⁇ m in this 140 ⁇ m
  • a width of the pressure chamber will be 70 ⁇ m.
  • Bonding of a flow path component and a nozzle plate is performed by applying adhesive thinly to the flow path component by transferring, and by positioning and putting the nozzle plate on the applied adhesive side. In that case, the void between adhesive and the nozzle plate disappears with time when adhesive wets a nozzle plate.
  • Patent Document 1 since the adhesive of Patent Document 1 had the slow speed for disappearance of void, it had to take a long time until the void disappears, thereby there was a problem of working efficiency.
  • Patent Document 2 it was disclosed that an adhesive property can be improved with the 1 liquid type epoxy adhesive in which the microcapsule of a photo-cationic polymerization initiator and a polyaddition type amine curing agent were used in combination and thermal curing is carried out after a temporary bonding by photo curing.
  • the resistance over ink was inadequate.
  • high resistance was needed, but there was no disclosure about the resistance over such highly caustic ink.
  • Patent Document 3 it was disclosed that the epoxy composite which has a liquid epoxy resin containing a naphthalene based liquid epoxy, an inorganic filler, a photo-cationic polymerization initiator, and a microencapsulated thermal polymerization initiator can be cured only by low-temperature heating after irradiating a low energy ultraviolet radiation.
  • fully curing can be achieved only by light irradiation.
  • One of objects of the present invention is to provide a method for manufacturing an inkjet head, which has no void of adhesive at a bonding portion of materials, has high work efficiency and excellent bonding characteristics due to no adhesive flow into an unnecessary portion, and has excellent adhesive strength to a solvent resistance.
  • the inkjet head which eliminates a jet failure due to having the adhesive flow into a flow path, has a high work efficiency and excellent bonding characteristics, eliminates ink leakage from an ink flow path caused by peeling of the members and the adhesive, and has excellent resistance also to a solvent ink.
  • a method for manufacturing an inkjet head comprising a process of bonding a plurality of members with an adhesive containing an epoxy resin containing a novolac type epoxy resin, a photo-cationic polymerization initiator and a microcapsulated thermosetting agent, wherein the process of bonding comprises sequential steps of applying the adhesive to one of the members; bonding a plurality of the members; irradiating a protruding portion of the adhesive with light; and heating and 5 to 50% by mass is the novolac type epoxy resin among the epoxy resins.
  • the inkjet head of the present invention it has become possible to provide the inkjet head, which eliminates a jet failure due to having the adhesive flow into a channel, has a high work efficiency and excellent bonding characteristics, eliminates ink leakage from an ink channel, and has excellent resistance also to a solvent ink.
  • FIG. 1 is a perspective view showing an example of the inkjet recording head of the present invention.
  • FIG. 2 is a rear side view showing a rear surface of the head chip.
  • 1 is a head chip
  • 2 is a nozzle plate connected to the front surface of head chip
  • 3 is a wiring substrate connected to the rear surface of head chip 1.
  • head chip 1 corresponds to a flow path component of the present invention. In FIG. 1 , the ink flows in the direction from bottom to top.
  • flow path component 11 made of a piezoelectric element and pressure chamber (ink supply path) 12 are arranged alongside alternately in each array of channels.
  • the walls on both sides of the pressure chamber12 are formed in parallel each other.
  • Outlet port and inlet port of each pressure chamber 12 are arranged on the front surface and rear surface of head chip 1.
  • Each pressure chamber 12 is a straight type channel wherein the size and shape remain almost unchanged in the direction from the inlet to the outlet ports.
  • each pressure chamber 12 constitutes two arrays of pressure chambers.
  • Each pressure chamber array is composed of 8 pressure chambers 12, however there is no limitation to the number of pressure chambers 12 constituting the pressure chamber array in head chip 1.
  • Head chip 1 is formed by bonding piezoelectric element 101 which has a plurality of channels with lid material 102.
  • the drive electrode is formed on the surface of the channels of piezoelectric element 101, which comprises metal layer 13 shown with hatching in FIG. 1 .
  • Metal layer 13 is preferably covered with the transparent insulating layer in view of preventing from corrosion by an ink.
  • Connecting electrode 14 (electrode for applying voltage) pulled out from metal layer 13 of each pressure chamber 12 is formed in the rear surface of head chip 1.
  • Connecting electrode 14 can be formed by vapor deposition or sputtering.
  • Nozzle plate 2 is provided with nozzle 21 at the position corresponding to outlet port of each pressure chamber 12 of head chip 1.
  • An adhesive is used to bond nozzle plate 2 to the front surface of head chip 1 with connecting electrode 14 formed thereon. Therefore, inlet port, outlet port and nozzle 21 of each pressure chamber 12 are arranged linearly.
  • Wiring substrate 3 is a plate-formed member to connect a wire which applies driving voltage from the driving circuit (not illustrated) to each metal layer 13 of head chip 1.
  • a substrate made of a ceramic material such as non-polarized PZT, AlN-BN and AlN, a substrate made of plastic or glass of low thermal expansion, and a substrate produced by depolarization of the same substrate material as that of the piezoelectric element used in head chip 1 can be used as the substrate used in this wiring substrate 3. So as to reduce the distortion of head chip 1 caused by the difference in thermal expansion coefficient, it is preferred to select the material having the difference in thermal expansion within the range of ⁇ 3 ppm based on that of un-polarized PZT.
  • the substrate constituting wiring substrate 3 is not restricted to a single plate-formed substrate. It is possible to produce a substrate having a predetermined thickness by lamination of a plurality of sheet-like substrate materials
  • Wiring substrate 3 has the larger area than rear surface of head chip 1. It extends in the direction (B direction in FIG.) perpendicular to the direction wherein pressure chambers 12 of head chip 1 are arranged (direction of pressure chamber array), and heavily extends from each surface ofhead chip 1. The ends of the extension are used as wiring connections 33 for connection of the FPCs (not illustrated). Further, wiring substrate 3 heavily extends in the direction of pressure chamber array 12 (A direction in FIG.) of head chip 1.
  • Opening 32 is formed by penetration through the center of wiring substrate 3. This opening 32 is formed to have such a size as to expose the inlet port side of all pressure chambers 12 facing the rear surface of head chip 1.
  • opening 32 can be formed by a method of using a dicing saw for processing, a method of using an ultrasonic processing machine, a method of molding a ceramic and sintering, or a method of forming by a sandblast.
  • Wiring electrodes 33 are formed on the surface side of wiring substrate 3 where head chip 1 is connected to in the same number and at the same pitch (W1+W2) as those of connection electrode 14 formed on the rear surface of head chip 1. These electrodes extend to reach from the peripheral of an opening 32 to the outer edge of the wiring substrate 3. When bonded with the FPC, this wiring electrode 33 is electrically connected with each wire formed on the FPC, and works as an electrode for applying the driving voltage from driving circuit to metal layer 13 located inside of pressure chamber 12 through connection electrode 14.
  • Pattern 38 for positioning is also formed for positioning head chip 1. In the case of bonding with the head chip 1, this pattern 38 for positioning is used to fit in the pattern 39 for positioning formed in the rear surface of the head chip 1, and positioning the head chip 1.
  • head chip 1 and wiring substrate 3 formed as described above are positioned to overlap as shown in FIG. 1 , so that each connection electrode 14 of head chip 1 and each wiring electrode 33 of wiring substrate 3 may be connected electrically, and heated and pressurized by predetermined temperature and predetermined time to cure the adhesive.
  • nozzle plate 2 with nozzle 21 is bonded on the front surface of head chip 1 with the above-mentioned adhesive. Thereby, an inkjet recording head is obtained.
  • the adhesive concerning the present invention is applicable to an adhesion of a circuit board to a head chip, and an adhesion of manifold.
  • FIG. 3 is a sectional view showing a state where a nozzle plate and a head chip were bonded with adhesive, as one example of the present invention.
  • FIG. 3 shows a state where head chip 1 in the inkjet recording head shown in FIG. 1 and nozzle plate 2 bonded to the front surface of head chip 1 was bonded with the adhesive concerning the present invention.
  • predetermined amount of the above-mentioned adhesive 15 is applied to the surface where the nozzle plate of head chip 1 is bonded to by using a transfer method.
  • an applied amount of adhesive there is no limitation in particular as an applied amount of adhesive, but it is preferable that thickness of applied wetting film is 1.0 ⁇ m or more and 25.0 ⁇ m or less.
  • the applied amount of adhesive is 1.0 ⁇ m or more, the durability of adhesion between head chip 1 and nozzle plate 2 can be improved.
  • it is 25.0 ⁇ m or less, since the applied amount of adhesive does not exceed, whereby an inflow of adhesive and a protrusion of adhesive to the nozzle area can be prevented.
  • the applied amount of adhesives can be determined as follows: the mass of the adhesive is calculated by deducting the mass of the chip from the mass of the chip having applied adhesive, the volume of adhesives is calculated by dividing the mass of the adhesives by the specific gravity of adhesive, and further the result is divided by the bonding area of the adhesion side of the chip.
  • Flow path component 11 may comprise any material, for example, such as piezoelectric material or silicone, however, in the present invention, it is preferable that an ink supply route including a flow path component comprises the piezoelectric element (piezoelectric ceramics).
  • any well-known ceramics may be employable.
  • ceramics such as PZT and PLZT which contains a small amount of metal oxide known as a softening agent or a hardening agent, for example, oxide of Nb, Zn, Mg, Sn, Ni, La, and Cr in a mixed microcrystalline mainly made of PbO x , ZrO x , and TiO x .
  • PZT is lead zirconate titanate and is preferably used due to its high packing density, large piezoelectric constant and good workability.
  • crystal structure of PZT suddenly changes and atom shifts resulting in aggregate of fine crystals in the form of dipole having plus on one side and minus on the opposite side. Since directions of such intrinsic polarization are random and polarity is negated mutually, a poling process is further needed.
  • thin plate of PZT is sandwiched with electrodes, soaked into silicone oil, and polarized by applying a high electric field of about 10 - 35 kV/cm.
  • the piezoelectricity of PZT disappears by applying temperature exceeding Curie point which is generally about 200 °C.
  • Plasma treatment is a treatment in which a nozzle plate and a head tip are placed into a vacuum chamber, by pouring at least one gas selected from Ar, N 2 and O 2 , or mixed gas thereof, and treated in a state of plasma by applying electromagnetic field from outside. It may use the fluorine based hydrocarbon gas such as CF 4 so as to increase surface etching effect.
  • Acid treatment can be carried out by immersing an adhesion side in aqueous solution of such as hydrochloric acid.
  • UV treatment is a treatment in which UV is directly irradiated to a nozzle plate or a flow path component by ultraviolet radiation lamp. It may be carried out under O 2 atmosphere so as to use a cleaning effect by ozone.
  • plasma treatment, acid treatment, and UV treatment on the adhesion surface as above organic contamination can be washed and removed, wetting ability of the adhesive to the entire adhesion surface is enhanced, and adhesion problem such as remaining minute bubbles can be eliminated, thereby ink leakage and poor adhesion are prevented and a stable inkjet recording head can be manufactured.
  • minute channel portion for example, length: 3mm, height: 360 ⁇ m, width: 70 ⁇ m
  • minute channel portion is processed on the one surface of the substrate having thickness of 1 mm.
  • pressure chamber (length: 3mm, height: 360 ⁇ m, width: 70 ⁇ m) is formed at channel portion which are used as ink flow path.
  • One end of a pressure chamber is connected with an ink storage member through manifold containing a circuit board and a filter unit, and the other end is connected with an ink outlet (nozzle plate).
  • flow path component 11 which forms an ink chamber has metal layer 13 on the ink supply route side.
  • Metal layer 13 acts as a drive electrode of the flow path component (piezoelectric element).
  • Metal materials to form the metal layer are Ni, Co, Cu, Al, Sn and Cr. While Al and Cu are preferred from the viewpoint of electric resistance, Ni is preferably used in terms of corrosion, strength and cost. Also, a laminated structure where Au is laminated on Al can be employed.
  • a vacuum device such as an evaporation coating method, a sputtering method, a plating method and a CVD (chemical vapor deposition method) are listed as forming methods of metal layer 13, the plating method is preferred and the nonelectrolytic plating is particularly preferred.
  • a metal coating layer can be formed which is free from pin holes and uniform in thickness.
  • a thickness of the plating layer is preferable in the range of 0.5 - 5 ⁇ m.
  • nozzle plate material material which can be ablated by laser light or which can be anisotropic etched.
  • resin sheet such as polyimide, polyethylene terephthalate, polyamide, and polysulfone and silicone can be used preferably. It is specifically preferable to be constituted by polyimide which can bear high temperature during preparation of an ink repellency layer on the surface, and precise nozzle processing by a laser can be available.
  • the first cure process is performed by irradiating optical energy to the adhesive.
  • ink supply route 12 is formed by metal layer 13.
  • ink supply route 12 equipped with such a metal surface as shown in FIG. 3 , when light is irradiated from the light source from the direction of ink supply side shown by arrow A, since the irradiated light reflects on the metal surface and attenuation is low until it reaches to adhesive layer 15 located deeply, whereby it can supply light energy required for curing.
  • the source is constituted by an ultraviolet radiation lamp which can emit light in the ultraviolet radiation of the specific wavelength region with stable exposure energy, and a filter which penetrates the ultraviolet radiation of specific wavelength.
  • an ultraviolet radiation lamp a mercury lamp, a metal halide lamp, an excimer laser, an ultraviolet laser, a cold cathode pipe, a hot cathode pipe, a black light, LED (light emitting diode) are applicable.
  • the high-pressure mercury lamp which emits ultraviolet radiation in the wavelength of 365 nm is especially preferable.
  • the second cure process is performed by applying thermal energy so as to obtain firmer adhesive layer and to cure a portion where light did not reach.
  • adhesive can have the predetermined solvent resistance.
  • the inkjet head keeps a narrow gap between the recording media and moves relatively to the recording medium.
  • the nozzle plate may contact with the recording medium during the inkjet head moves.
  • the nozzle plate may be separated by such contact. In order to resolve such a problem, it is effective to enhance the adhesive strength and to reduce swelling of adhesive when the adhesive is immersed in solvent ink for a long term.
  • Heating temperature for curing adhesive may be suitably chosen by a kind of the adhesives and unless a constituting component of the inkjet recording head is impaired.
  • the highest temperature of the heating process is in the range of 60 °C to 150 °C.
  • an electric oven or a heating implement which can heat the inkjet recording head by pressure-contacting, for example, such as a hot plate, and a ribbon heater.
  • a mean for cooling at least to a piezoelectric element, which cools by circulating cold water through an aluminum block. Since it is difficult to measure the temperature of the adhesive itself in this invention, temperature of the oven and the pressurization implement is measured and used as a substitute for the temperature of the heating process.
  • the adhesive applied in manufacturing the inkjet recording head of the present invention is characterized by comprising an epoxy resin, a photo-cationic polymerization initiator and a thermal curing agent, the above-mentioned epoxy resin comprising a novolac based epoxy resin, and the above mentioned thermal curing agent is microencapsulated.
  • thermal curing agents according to the present invention include a primary or a secondary polyamine, a thermal-cationic polymerization initiator, and a thermal-anionic polymerization initiator for polyaddition or thermal polymerization of epoxy monomer.
  • the thermal-cationic polymerization initiator and the thermal-anionic polymerization initiator are preferable, and the thermal-anionic polymerization initiator is still more preferable.
  • the addition amount of the above mentioned thermal curing agent is represented by part by mass of the added quantity to 100parts by mass of the epoxy resin.
  • thermal-cationic polymerization initiator boron trifluoride amine complex, sulfonium salt, and aluminum complex are used. Of these, boron trifluoride amine complex is preferable, and the compound represented by Formula (I) is specifically preferable due to having the adhesive with high solvent resistance.
  • R represents a hydrogen atom or an alkyl group, and preferably represents a hydrogen atom.
  • R 1 , R 2 , and R 3 represent a hydrogen atom, an alkyl group, an alkoxy group, an aryloxy group, or a halogen atom respectively.
  • an alkyl group represented by R, R 1 to R 3 include: methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert-butyl group, isobutyl group, sec-butyl group, pentyl group , tert-pentyl group, hexyl group, 2-methyl pentyl group, isohexyl group, heptyl group, isoheptyl group, 1-propyl butyl group, octyl group, 2-ethyl hexyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, and dodecyl group.
  • alkoxy group represented by R 1 to R 3 include: methoxy group, ethoxy group, n-propoxy group, iso-propoxy group, n-butoxy group, and tert-butoxy group.
  • aryloxy group include phenoxy group and naphthyloxy group.
  • halogen atom include: chlorine atom, bromine atom, and fluorine atom.
  • thermal-cationic polymerization initiators represented by Formula (I) according to the present invention will be exemplified, however the present invention is not limited to the exemplified compound thereof
  • Preferable thermal-cationic polymerization initiators according to the present invention include aniline derivatives listed below and a complex compound with boron trifluoride.
  • thermal-cationic polymerization initiator represented by Formula (I) can be synthesized by a well-known synthetic method by a person skilled in the art. Moreover, a complex of Compound 35: aniline and the boron trifluoride is marketed as polyethylene glycol solution by the brand name of BAK1171 by PTI Japan.
  • Addition amount of the thermal-cationic polymerization initiator represented by Formula (I) is preferable 0.1 - 30 parts by mass based on 100 parts by mass of epoxy resin, and more preferable 0.5 - 5 parts by mass.
  • thermal-cationic polymerization initiators are microencapsulated and added in the above-mentioned adhesive. Addition amount of the microencapsulated thermal-cationic polymerization initiator is preferable 1 - 50 parts by mass based on 100 parts by mass of epoxy resin, and more preferable 2 - 25 parts by mass.
  • imidazoles and tertiary amines are used. Of these, imidazole is preferably used. Specific examples of imidazoles include: 1-methyl imidazole, 1-benzyl-2-methyl imidazole, 1,2-dimethyl imidazole, 1-isobutyl-2-methyl imidazole, 1-methyl-2-ethyl imidazole, 1-ethyl imidazole, 1-cyanoethyl-2-ethyl-4-methyl imidazole, 1-cyanoethyl-2-methyl imidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methyl imidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-methyl imidazole, 2-methyl imidazole, and 2-ethyl-4-methyl imidazole.
  • HXA-3932 imidazole based thermal-polymerization initiator microencapsulated with MMA, average particle diameter of 2 ⁇ m, produced by Asahi Kasei Chemicals Corp.
  • HX-3741 imidazole based thermal-polymerization initiator microencapsulated with MMA, average particle diameter of 5 ⁇ m,, produced by Asahi Kasei Chemicals Corp.
  • HX-3722 imidazole based thermal-polymerization initiator microencapsulated with MMA, average particle diameter of 2 ⁇ m, produced by Asahi Kasei Chemicals Corp.
  • Addition amount of the microencapsulated thermal-cationic polymerization initiator is preferable 1 - 100 parts by mass based on 100 parts by mass of epoxy resin, and more preferable 10 - 80 parts by mass.
  • photo-cationic polymerization initiator for photopolymerizing the cationic polymerizable monomer
  • photo-acid generator any compound used, for example, for chemical sensitization-type photoresists and compound for photo-cationic polymerization is used (refer to pages 187-192 of "Imaging Yo Yuki Zairyo (Organic Materials Used for Imaging Applications)" edited by Yuki Electronics Zairyo Kenkyukai published by Bunshin Shuppan (1993 )).
  • aromatic onium compounds such as diazonium, ammonium, iodonium, sulfonium, and phosphonium
  • sulfonated compounds generating sulfonic acid can be listed.
  • halides photolytically generating hydrogen halides are usable.
  • iron-arene complexes can be listed.
  • hexafluoro phosphate hexafluoro antimonate or pentafluoro phenyl borate salts of diaryliodonium or triaryl sulfonium.
  • They are marketed by brand names, such as the IRUGACURE-261 (produced by BASF Japan), SP-150, SP-170 (above, produced by ADEKA), PI2074 or UVI-6992 (produced by the Dow Chemical).
  • Addition amount of the photo-cationic polymerization initiator is preferably 0.1 - 10 parts by mass based on 100 parts by mass of epoxy resin, and more preferably 2 - 6 parts by mass.
  • epoxy compounds epoxy resin
  • any monomers, oligomers, and polymers having epoxy group are usable.
  • well-known aromatic epoxides, alicyclic epoxides, and aliphatic epoxides are listed.
  • the epoxides refer to monomers or oligomers thereof.
  • epoxy compound in the present invention contains 70 - 99 % by mass of an aromatic epoxy compound in the epoxy compound.
  • aromatic epoxides listed are di- or polyglycidyl ethers produced via reaction of a polyphenol having at least one aromatic nucleus or an alkylene oxide adduct thereof with epichlorohydrin.
  • the aromatic epoxides include novolac type epoxy resins and further include at least one of di- or polyglycidyl ethers of bisphenol A or an alkylene oxide adduct thereof, di- or polyglycidyl ethers of hydrogenated bisphenol A or an alkylene oxide adduct thereof, and bisphenol F type epoxy resins.
  • polyalkylene oxide polyethylene oxide and polypropylene oxide can be listed.
  • the epoxy compound in the present invention contains 70 - 99 % by mass of an aromatic epoxy compound in the epoxy compound in view of resistance for ink.
  • the above-mentioned novolac type epoxy resin is a compound which has a plurality of glycidyl groups in one molecule generated by a reaction of hydroxyl group of novolac resin and epichlorohydrin.
  • the number of the epoxy groups in one molecule has distribution. Although the average of the number of epoxy groups in one molecule changes with synthetic conditions, 3 or more are preferable.
  • jER152 phenol novolac epoxy resin, produced by Japan Epoxy Resin
  • jER154 phenol novolac epoxy resin, produced by Japan Epoxy Resin
  • EPICLON N-660 cresol novolac epoxy resin, produced by DIC
  • 5 - 50% by mass is the novolac type epoxy resin among the above-mentioned epoxy resins.
  • the novolac type epoxy resin is more than 5% by mass, resistance for ink is excellent as well as void disappears easily.
  • the novolac type epoxy resin is 50% or less by mass, void disappears easily.
  • the epoxy resin containing the above-mentioned novolac type epoxy resin further contains an alicyclic epoxy compound in view that high photosensitivity can be obtained.
  • alicyclic epoxides listed are compounds containing cyclohexene oxide or cyclopentene oxide obtained by epoxidizing compounds having at least one cycloalkane ring such as cyclohexene or cyclopentene by using an appropriate oxidant such as a hydrogen peroxide or a peracid.
  • an appropriate oxidant such as a hydrogen peroxide or a peracid.
  • Specific examples thereof include: (3, 4-epoxy cyclohexyl) methyl-3', 4'-epoxy cyclohexyl carboxylate and bis-(2, 3-epoxy cyclopentyl) ether.
  • the addition amount of the alicyclic epoxy compound is preferably 1 - 50% by mass based on the entire epoxy resins. In case of more than 1% by mass, photo sensitivity will be high, resulting in suppressing inflow in short-time irradiation. In case of the same irradiation level, the inflow will be further prevented compared to the adhesive without containing the alicyclic epoxy compound. In case of 50% or less, high resistance will be acquired.
  • the above-mentioned adhesive contains silane coupling agent in view of enhancing resistance of adhesive strength.
  • Preferable examples of compounds for silane coupling agent include: ⁇ -(3,4-epoxy cyclohexyl) ethyltrimethoxy silane, ⁇ -glycidoxypropyl trimethoxy silane, ⁇ -glycidoxypropylmethyl dimethoxy silane, and ⁇ -glycidoxypropylmethyldiethoxy silane.
  • the addition amount of silane coupling agent is preferably 0.5 - 5 parts by mass based on 100 parts by mass of the epoxy resin. In case of more than 0.5 parts by mass, excellent resistance of the adhesive strength is obtained, and in case of 5 parts by mass or less, the viscosity rise will be small at room temperature preservation, and the work life can be lengthened.
  • an aqueous inkjet ink, a non-aqueous inkjet ink, a wax ink or an actinic energy curable inkjet ink are applicable as the inkjet ink without being particularly limited thereto.
  • the inkjet ink to the image formation which contains organic solvents more than 30% by mass and 100% or less based on all organic solvents, which have high dissolution ability to a resin component represented by solubility parameter (SP value) of 16.0 or more and 21.0 or less.
  • SP value solubility parameter
  • an inkjet recording method has increased for various uses (for example, an outdoor signboard or electronic components manufacture).
  • the inkjet ink containing the solvent is used which dissolves vinyl chloride used as a material for a receiving sheet.
  • a solvent having high solubility to resin is used for the inkjet ink. Therefore, it is required to maintain strength as the inkjet recording head, even when it uses a solvent having such high resin solubility.
  • the inkjet recording equipment concerning the present invention preferably complies with the inkjet ink comprising organic solvent of 50% or more and 100% or less based on all solvents.
  • solubility parameter of solvent (SP value) refers to a value indicated by the square root of the molecular cohesion energy, and is determined via a method described in " R. F. Fedors, Polymer Engineering Science, 14, p. 147 (1974 )". The unit thereof is (MPa) 1/2 , and the value is determined at 25 °C.
  • An organic solvent which has SP value specified by the present invention is also indicated in VII/526-539 pages in J. Brandup and E. H. Immergu jointly edited "Polymer Handbook” 3rd edition (John Wily & Sons), 1989 , for example.
  • organic solvents having a solubility parameter (SP value) of 16.0 (MPa) 1/2 or more and 21.0 (MPa) 1/2 or less are listed below, however it is not limited to these exemplified compound.
  • SP value solubility parameter
  • the numerical value in a parenthesis represents SP value ((MPa) 1/2 ).
  • the inkjet ink concerning the present invention may contain various additives other than the above-mentioned organic solvent
  • the ink concerning the present invention may contain a colorant. It is preferable to use the ink forming color of yellow, magenta, cyan, black, blue, green and red as hue of the colorant, for example.
  • various inkjet inks are applicable such as a dye ink whose colorant is a dye, or a pigment ink which forms a dispersion containing fine pigment particles in which colorant is not dissolved in the solvent constituting the inkjet ink, or a dispersed ink which comprises dispersion of polymer colored by colorant.
  • Head chips having constitution shown in FIG. 1 to FIG. 3 were prepared according to the following method.
  • PZT lead zirconate titanate, thickness: 700 ⁇ m, Curie temperature: 210 °C
  • PZT thickness: 150 ⁇ m, Curie temperature: 210°C
  • channels with a depth of 300 ⁇ m from the surface, a width of 70 ⁇ m and a length of 30mm were provided in 140 ⁇ m pitch, and 512 channels for pressure chamber were formed.
  • the 1 ⁇ m thickness of nickel layer was formed on the surface of the channels by the plating method.
  • the resist at summit of the pressure chamber and at the back side were removed together with the nickel plating layer on the resist
  • each drive electrode was pulled out on the external surface of the chip. That is, on the rear surface of the above-mentioned cutting planes, after transferring the resist and forming a pattern by exposure and development, aluminum was vapor deposited and the electrode was formed by removing the resist.
  • a wiring substrate was prepared as a tabular component for connecting a wiring which applies the drive voltage from the drive circuit which is not illustrated to each drive electrode of the head chip.
  • the substrate used for this wiring substrate selected was a glass board so that the difference of a coefficient of thermal expansion with the head chip may be set to less than ⁇ 1 ppm, in order to suppress generating of distortion of the head chip caused by the difference between coefficients of thermal expansion.
  • an opening was formed to penetrate through at mostly center of the wiring substrate. This opening was formed in the size which can expose an entrance side of all the channels of the head chip. By preparing this opening, all the drive walls, all the channels, and all the drive electrodes of the head chip can be looked into, in a state ofbonding the wiring substrate to the rear surface of the head chip.
  • the wiring electrode were formed in the same number and the same pitch as those formed in the rear surface of the head chip and extended to each wiring connecting area.
  • these connecting electrodes connected to each wiring formed on FPC electrically, and functioned as electrodes for applying the drive voltage from the drive circuit supplied through wiring of FPC to the drive electrode in the channel through the connection electrode.
  • the wiring substrate was positioned and bonded to the rear surface of the chip via the adhesive with anisotropy conductivity so that each wiring electrode may connect electrically with each connecting electrode of the chip and the opening may expose all the flow path of chip. Thereafter, the wiring electrode where FPC will be bonded later was protected with the masking tape, a protective layer comprising polyparaxylylene was formed on the inside of the pressure chamber including the drive electrode and an exposed cross section including extraction electrode. Thus, the head chip was produced.
  • the following adhesive 1 was transfer coated by thickness of 5 ⁇ m.
  • the nozzle plate (a nozzle hole of 30 ⁇ m in diameter was formed on polyimide of 100 ⁇ m thickness) was bonded to the predetermined position on the surface of head chip1 where the adhesive was applied under observing with an optical microscope.
  • adhesive 1 were cured by the following curing condition 1.
  • this irradiation amount is a value calculated as follows: before applying adhesive to the head chip, an actinometer which can measure a light of 365 nm was placed in front of the chip, the amount of light was determined by irradiating via the high-pressure mercury lamp from the rear surface of the head chip, and the determined amount of light was divided by the open area ratio of the chip. This value corresponds to the irradiation amount which is received by the nozzle plate at the time of bonding of the nozzle plate.
  • Inkjet recording head 1 was prepared. Ink was introduced into the pressure chamber of the chip through the opening of the wiring substrate from the common ink chamber, and it enabled to apply the drive voltage through FPC from the external drive circuit
  • jER807 Bisphenol F type epoxy resin; produced by Japan epoxy resin
  • jER152 Novolac type epoxy resin; produced by Japan epoxy resin
  • UVI6992 Photo-cationic polymerization initiator; produced by Dow Chemical
  • Microcapsule 1 Microcapsule type thermal-anionic polymerization initiator 40 parts by mass
  • the adhesive was supplied to an oven of 100 °C for 1 hour and heat-cured.
  • the adhesive was coated on PET film by the same thickness as coated on the front surface of the above mentioned head chip, and ultraviolet radiation was irradiated by the high-pressure mercury lamp with changing an irradiation time. Stainless spatula was pushed to the adhesive and a required irradiation amount for curing was determined by the minimum time whose tackiness was lost.
  • Adhesive 1 In preparation of Adhesive 1, the kind and the addition amount of epoxy resin, photo-cationic polymerization initiator, thermal curing agent and silane coupling agent were changed as shown in Tables 1 and 2, and Adhesives 2 to 21 were prepared. Herein, the addition amount listed in Tables 1 and 2 represents part by mass.
  • Inkjet recording heads 2 to 24 were prepared in the same manner as the preparation of the above-mentioned Inkjet recording head 1, except for changing the adhesives and the coating thickness as shown in Tables 1 and 2.
  • Adhesives 21 was used to Inkjet recording head 24 and after irradiation of ultraviolet radiation, it was heated at 110 °C for 3 hours.
  • Epoxy resin, polymerization initiator, and silane coupling agent used for Adhesives 2 to 21 are described below.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
EP11734546.2A 2010-01-22 2011-01-08 Method for manufacturing inkjet head Active EP2527151B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010011662 2010-01-22
PCT/JP2011/050225 WO2011089939A1 (ja) 2010-01-22 2011-01-08 インクジェットヘッドの製造方法

Publications (3)

Publication Number Publication Date
EP2527151A1 EP2527151A1 (en) 2012-11-28
EP2527151A4 EP2527151A4 (en) 2015-07-22
EP2527151B1 true EP2527151B1 (en) 2019-03-13

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WO (1) WO2011089939A1 (ja)

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JP6187126B2 (ja) * 2013-10-15 2017-08-30 デクセリアルズ株式会社 電気接続材料
JP7110126B2 (ja) * 2019-01-10 2022-08-01 東芝テック株式会社 インクジェットヘッド、インクジェット装置、及びインクジェットヘッドの製造方法
WO2021084649A1 (ja) * 2019-10-30 2021-05-06 コニカミノルタ株式会社 インクジェットヘッド及びインクジェットヘッドの製造方法

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JP3501555B2 (ja) * 1995-07-11 2004-03-02 キヤノン株式会社 液体噴射記録ヘッドの製造方法
JP3986000B2 (ja) * 2002-02-21 2007-10-03 株式会社リコー インクジェットヘッド製造用エポキシ樹脂組成物及びインクジェットヘッド製造方法
WO2006115231A1 (ja) * 2005-04-22 2006-11-02 Three Bond Co., Ltd. 硬化性樹脂組成物およびそれを用いた接着部品の製造方法
JP4996097B2 (ja) * 2006-01-10 2012-08-08 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP2008149521A (ja) * 2006-12-15 2008-07-03 Canon Inc 液体吐出ヘッド及びその製造方法
JP2009148965A (ja) * 2007-12-20 2009-07-09 Konica Minolta Holdings Inc インクジェット記録ヘッド

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EP2527151A1 (en) 2012-11-28
EP2527151A4 (en) 2015-07-22
WO2011089939A1 (ja) 2011-07-28
JPWO2011089939A1 (ja) 2013-05-23

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