EP2373726A1 - Préparation conductrice et procédé de fabrication - Google Patents

Préparation conductrice et procédé de fabrication

Info

Publication number
EP2373726A1
EP2373726A1 EP09768052A EP09768052A EP2373726A1 EP 2373726 A1 EP2373726 A1 EP 2373726A1 EP 09768052 A EP09768052 A EP 09768052A EP 09768052 A EP09768052 A EP 09768052A EP 2373726 A1 EP2373726 A1 EP 2373726A1
Authority
EP
European Patent Office
Prior art keywords
preparation
conductive
additive
conductivity
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09768052A
Other languages
German (de)
English (en)
Inventor
Stefan Forero
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Future Carbon GmbH
Original Assignee
Futurecarbon GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Futurecarbon GmbH filed Critical Futurecarbon GmbH
Publication of EP2373726A1 publication Critical patent/EP2373726A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/026—Heaters specially adapted for floor heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/036—Heaters specially adapted for garment heating

Definitions

  • the present invention relates to a conductive preparation and a process for producing such a conductive preparation.
  • the present invention also relates to a process for producing a plastic preparation.
  • the invention also relates to a plastic preparation.
  • the plastic preparation may be, for example, a polymer preparation.
  • the invention relates to preparations which are thermally and / or electrically conductive. Most preferably, the invention relates to an electrically conductive preparation.
  • Present electroconductive polymer formulations include, for example, graphite, carbon black, silver, carbon fibers, metal-coated conductive and non-conductive particles, or mixtures thereof. In these cases, achieving a conductivity of, for example, 1 mS / cnn combined with a drastic increase in the viscosity due to the required high filler content, depending on the additive 5-80w-%. Thus, the currently available electrically conductive preparations are difficult to process.
  • thermally conductive polymer formulations contain metals such as silver or ceramics such as Al 2 O 3, AlN, SisN 4 , SiO 2 , BN, metal-coated conductive and non-conductive particles, or mixtures thereof.
  • metals such as silver or ceramics such as Al 2 O 3, AlN, SisN 4 , SiO 2 , BN, metal-coated conductive and non-conductive particles, or mixtures thereof.
  • achieving a thermal conductivity of, for example, 3W / mK is associated with a drastic increase in viscosity due to the required high filler content, depending on the additive 50-80w-%.
  • the currently available thermally conductive formulations are also difficult to process.
  • the object of the invention is to provide a process for producing a conductive preparation and a conductive preparation which does not have the aforementioned disadvantages.
  • a conductive preparation in particular an electrically and / or thermally conductive preparation, comprising a first, at least temporarily liquid phase and at least one conductivity additive provided in the first phase. It does not matter when the first phase is in the liquid state. This may be the case during the entire manufacturing and processing process or in one or more process steps, for example during a mixing operation or during the application. Thus, powder coatings and the like are also included.
  • liquid is to be understood here in particular in the physical sense, so that, of course, viscous and / or non-Newtonian liquids and melts and the like are included.
  • a conductive preparation according to the invention in particular an electrically and / or thermally conductive preparation, is obtainable, obtainable by A) providing a first, at least temporarily, liquid phase;
  • any mixing sequences are possible.
  • an additive alone or two or more premixed additives can be mixed with the first, at least temporarily liquid phase. Further additives can then be added without this being absolutely necessary for the invention.
  • Such a preparation can be used in a variety of ways.
  • a preparation can be used as a heatable coating, as a heatable form or in heatable coatings or in heatable forms, and the like.
  • the invention is not mentioned on these Examples limited. Some further advantageous, but not exclusive applications are given in the further course of the description.
  • At least one further conductivity additive may be provided in the first phase.
  • the first and / or second carbon-based conductivity additive may be formed.
  • the invention is not limited to certain materials. Some advantageous, but non-exclusive examples will be explained in more detail later in the description.
  • the preparation may preferably have at least one binder and / or at least one further additive.
  • a binder is generally a binder that holds together materials and materials.
  • the invention is not limited to specific binder materials, which may advantageously be formed organic or inorganic. Depending on the configuration, other additives may also be admixed, and the invention is not limited to certain additives in this regard either.
  • the preparation may have electrical contacts or means for attaching electrical contacts
  • the preparation may be formed as a coating.
  • the coating may be a paint.
  • the coating can advantageously be coated on a substrate.
  • the lacquer can then represent the outermost coating of the substrate, wherein further coatings can already be applied under the lacquer.
  • the paint acts as a kind of primer.
  • further coatings for example further paint layers, protective layers or the like, are applied to the lacquer which is the conductive preparation and is applied to the substrate can be.
  • a product containing the preparation according to the invention may comprise, for example, one or more coatings, wherein the coating according to the invention may be the lowest, the highest or a coating lying between other layers.
  • the conductive preparation may be formed as a heating element or for a heating element.
  • the conductive preparation may preferably be applied to a substrate or designed to be applicable to a substrate.
  • the invention is not limited to specific forms or substances.
  • smooth or rough surfaces are possible, which can be coated for example by one of the methods described below.
  • an adhesion promoter can be used, for example.
  • all types of textiles and fibers can serve as a substrate, for example, fabrics, nonwovens, threads, natural and synthetic fibers and the like.
  • a conductive preparation of the invention can be used and used for a variety of purposes.
  • the preparation can be used wherever something needs to be preheated or heated, for example in connection with heatable mirrors, heated tarpaulins, in particular truck tarpaulins, wall coatings, wallpapers, floors and the like, defrosting devices for machines, pipelines, aircraft, in particular aircraft wings in the field of textiles, heating mats, heating jackets, heating tarpaulins, and the like.
  • an application can be provided both indoors and outdoors.
  • a corresponding preparation for example a lacquer, can be provided as a constituent of substrates which are formed, for example, in the form of films, textiles, flexible matehals and the like.
  • the preparation may be provided as a coating on the substrate, but also as a material component within the substrate.
  • the preferred field of use of the present invention can be the heating of devices, in particular of medical devices. Medical devices, for example, think of blood glucose meters. Glucose meters only work properly and accurately when they are appropriately tempered. This is important, for example, in the outdoor area for athletes. With the conductive preparation according to the invention, it is possible to heat such devices. Of course it is also possible to warm only the test strip.
  • the conductive preparation can be applied to a substrate or designed to be applied to a substrate.
  • Such a configuration has the particular advantage that the preparation, and thus the substrate can be heated evenly.
  • such a heating device is structurally simple to implement, since the previously required turns of heating wires, coils, lines, structured heating layers and the like can be dispensed with.
  • a conductive preparation is provided, which is applied to a substrate or formed in a substrate which is provided with electrical contacts, via which an electrical voltage can be applied to the conductive preparation.
  • the conductive preparation can then be heated in the desired manner via the electrical current flowing through the preparation.
  • the conductive preparation may be formed as a heating element.
  • the conductive preparation may be designed for a heating element.
  • the conductive preparation itself provides the
  • the conductive preparation is a component of a heating element, such as that provided in the heating element element for generating the heat.
  • a conductive preparation in particular a plastic preparation, which is preferably in the manner described above is formed according to the invention and which is characterized by at least one base material, in particular a plastic material and at least two admixed additives, wherein at least one additive is preferably formed as a conductivity additive.
  • a conductive preparation according to the invention as described above, in particular a plastic preparation is obtainable in that at least one base material, in particular a plastic material, at least two additives are added, wherein at least one additive is formed as a conductivity additive, and that the individual components to a preparation, in particular a plastic preparation, are mixed.
  • a process for producing a conductive preparation in particular an electrically and / or thermally conductive preparation, in particular a conductive preparation according to the invention as described above, which is characterized by the following steps:
  • any mixing sequences are possible.
  • an additive alone or two or more premixed additives can be mixed with the first, at least temporarily liquid phase. Further additives can then be added without this being absolutely necessary for the invention.
  • a mixture for a conductive, in particular electrically conductive, and / or heatable coating, for example in the form of a lacquer can be produced in this way.
  • a first phase is used, which is characterized in that it is at least temporarily liquid.
  • the invention is not limited to specific phases.
  • the phase can be formed on an aqueous basis, for example in the form of water.
  • other types of phases are possible, such as plastic-based phases, which may be aqueous, solvent-based, or the like, for example.
  • the first phase may be formed in the form of a resin or the like.
  • combinations of the examples mentioned are possible. The examples mentioned are purely exemplary in nature and are not an exclusive list, so that the invention is not limited to the examples mentioned.
  • At least one conductivity additive is added to the first phase.
  • at least one further conductivity additive can be added.
  • Non-exclusive examples of such conductivity additives have already been mentioned above and will also be described in more detail later in the description.
  • At least one binder and / or at least one further additive can be added.
  • the conductive preparation can be applied to a substrate.
  • the process preferably produces a conductive preparation in the form of a coating, for example in the form of a lacquer.
  • the method can produce a conductive preparation in the form of a heating element or in the form of an element for a heating element.
  • a solution is prepared, in which then the aforementioned fillers in the form of conductivity additive (s), and / or binders and / or other additives are added.
  • the first phase is a plastic, it may be necessary for the plastic to be dissolved first. Then, a mixture or mixture is prepared which has a homogeneous state. Possibly further dilution can be realized here by further additives.
  • the resulting conductive preparation may be applied to a substrate in a variety of ways, for example by doctoring, spraying, brushing, rolling, dipping, soaking, brushing, trowelling and the like, or also in a direct or indirect printing process, for example screen printing, in mask printing , Pad printing, gravure and the like.
  • a first additive in particular a conductivity additive, preferably based on carbon
  • a base material in particular a plastic material
  • a second additive in particular a conductivity additive, preferably based on carbon
  • a plastic material is mixed, and that the two sub-mixtures are mixed to form a preparation, in particular a plastic preparation.
  • At least one further material and / or at least one further substance is added to the base material and / or the preparation.
  • the conductive preparations may advantageously be formed thermally and / or electrically conductive. It is preferably provided that the preparation is electrically conductive. Such a preparation is low-resistance through the use of the at least one conductivity additive, which leads to a good electrical conductivity, since only a low electrical resistance is present. As a result, a homogeneous heatability can be realized. The low resistance also ensures that only low voltages have to be applied to the preparation in order to achieve good heating.
  • the invention relates, provided that the first phase or the base material is formed of plastic base, electrically and / or thermally conductive polymers.
  • the present invention provides polymer compositions having excellent electrical / thermal conductivity and low viscosity.
  • other plastics are possible.
  • the invention relates in particular to all types of polymers (in particular
  • the invention advantageously relates to a process for the preparation of a conductive preparation, in particular a polymer preparation, which in addition to the base material, for example a base polymer to contain at least two conductivity additives of which at least one consists of carbon, and the preparation prepared according to the invention and their use ,
  • the conductive formulations may, but need not necessarily, contain further adjuvants such as dispersants, solvents, stabilizers, etc.
  • the conductivity additives may advantageously be formed on a carbon basis.
  • some advantageous but not exclusive examples of preferred conductivity additives will be described, each of which may be used individually or in any combination.
  • Graphite is a very common mineral and belongs to the order of semi-metals and non-metals. In addition to diamond and fullerenes, it is the third stable form (modification) of carbon under terrestrial normal conditions and crystallizes mostly in the hexagonal, very rarely also in the trigonal crystal system. Graphite develops opaque, gray to black crystals in hexagonal, tabular, scaly, or stem-like shapes with metallic luster on the crystal surfaces.
  • a layer consists of covalently linked hexagons whose carbon atoms are sp 2 -hybhdized. Within these levels, the binding energy between the carbon atoms is 4.3eV, but only 0.07eV between them. Out of this extreme
  • the conductivity within a plane is made possible by the delocalization of the pi-electrons. If the planes do not have a fixed correlation with each other, this is called turbostatic carbon.
  • Carbon Nanotubes consist of rolled-up, closed graphene layers. Single tubes are called “single wall carbon nanotubes” (SWCNT), particles of concentrically stacked tubes of increasing diameter are called “multiwall carbon nanotubes” (MWCNT).
  • CNT can be produced by various methods. The best known are the arc process, the laser ablation process and the catalytically assisted vapor deposition (CCVD). The latter method is suitable for large-scale production of CNT.
  • the CNTs are produced from gaseous carbon sources (hydrocarbons, alcohols, CO, CO2) on metallic, catalytically active substrates.
  • SWCNT Small Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular size.
  • MWCNT Small Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cellular Cell
  • CNT The physical properties of CNT largely correspond to those of graphite along basal planes.
  • CNTs are used today as a mechanical reinforcement, as an electrically and thermally conductive additive in polymers, ceramics and metals.
  • the CNTs are often chemically modified on their surface in order to meet the requirements of good dispersibility and connection to the matrix.
  • the CNTs are added to the matrix material. Due to the high aspect ratio and the high specific surface area, only composites with a relatively low CNT content can be produced.
  • Carbon nanofibers consist of graphene layers stacked along the filament axis.
  • the angle (orientation) of the graphene planes with respect to the filament axis is taken as a rough distinction.
  • So-called 'herringbone' CNF have graphene planes which are arranged at an angle ⁇ 90 °.
  • These CNFs are usually manufactured via CVD. Their applications are found primarily in catalysis as catalyst supports and as active additives in Li-ion batteries or in gas storage.
  • Carbon black is a black, powdered solid that is 80% or more carbon, depending on its quality and use.
  • carbon blacks Depending on their field of application, carbon blacks have special property profiles that are specifically influenced by the type of manufacturing process and by variation of the process parameters.
  • the first phase or the base material may advantageously be formed on a plastic basis.
  • Some advantageous but not exclusive examples of preferred plastic materials will be described below, each of which may be used individually or in any combination.
  • Polymers are chemical compounds that are composed of one or a few types of similar units (monomers). Such molecules are usually chain-like or branched and have covalent bonds between the monomers. Reactive systems
  • the Kunststoffmatehalien in which the additives are mixed, it is, for example, epoxy group-containing monomeric, oligomeric and polymeric. They are based e.g. on bisphenol-A, -F, novolac and others. In addition to aromatic, it continues to be aliphatic derivatives.
  • the epoxy resins can be mono-, di-, tri-, tetra- and polyfunctional and include all molecular weights.
  • cycloaliphatic epoxy resins such as e.g. 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylates, bis ((3,4-epoxycyclohexyl) methyl) adipates and other derivatives of higher or lower molecular weight.
  • Another group of base resins includes cyanate esters and isocyanates, e.g. 2,4-diisocyanato-1-methylbenzenes, 1-isocyanato-4 - [(4-isocyanatophenyl) methyl] benzene, 1, 1-bis (4-cyanatophenyl) ethane, 2,2-bis (4-cyanatophenyl) propane, oligo (3-methylene-1, 5-phenyl-cyananate) and other derivatives of higher or lower molecular weight.
  • cyanate esters and isocyanates e.g. 2,4-diisocyanato-1-methylbenzenes, 1-isocyanato-4 - [(4-isocyanatophenyl) methyl] benzene, 1, 1-bis (4-cyanatophenyl) ethane, 2,2-bis (4-cyanatophenyl) propane, oligo (3-methylene-1, 5-phenyl-cyananate) and other derivatives of higher or
  • Another group of base resins includes linear and branched diols and polyfunctional alcohols, oligo- and polyester and polyether polyols of all molecular weights.
  • Another group of base resins includes reactive polyimide systems. These may include: monofunctional monomers, e.g. N-phenylmaleimide, 2,6-
  • Xylylmaleimide, N-cyclohexylmaleimide, etc. and difunctional monomers such as 4,4'-diphenylmethane bismaleimide, N, N '- (4-methyl-m-phenylene) -bismaleimide, N, N'-m-phenylenebismaleimide, bisphenol-A diallyl ether , o, o '-Diallylbisphenol-A, Polyphenylmethanbismaleimide, polybenzimidazoles, etc.
  • Another group of base resins includes phenolic resins, such as novolac or resole based.
  • Another group of base resins includes unsaturated polyester and vinyl ester resins.
  • Another group of base resins includes alkyd resins. Another group of base resins includes melamine resins. Another group of base resins includes polysilanes and silicones. Another group of base resins includes acrylates. Another group of base resins includes polyquionoxaline. Another group of base resins includes pitches and bitumen.
  • hardener substances and accelerators such as amines, amides, amidoamines, amino alcohols, amino acids, anhydrides, imidazoles, cyanamides, alcohols, phenols, polyols, cyanates, mercaptans, carboxylic acids, metal complexes etc. in low, medium and high molecular weights.
  • accelerators such as amines, amides, amidoamines, amino alcohols, amino acids, anhydrides, imidazoles, cyanamides, alcohols, phenols, polyols, cyanates, mercaptans, carboxylic acids, metal complexes etc. in low, medium and high molecular weights.
  • the basic substances are e.g. polyolefins such as polypropylene, polyethylene, polybutylene, polyisobutylene, etc.
  • Another group of base polymers includes polyamides such as e.g. Polyamide-66, polyamide-12, polyamide-11, polyamide-6, etc.
  • polyacrylic polymers such as polymethylmethacrylate, polyacrylonitrile, polyacrylic acid and derivatives, etc.
  • base polymers include fluoropolymers such as polytetrafluoroethylene, polyvinylidene fluoride, etc.
  • base polymers includes aliphatic and aromatic polyesters such as polyglycols, polyethylene terephthalate, etc.
  • Another group of base polymers includes polyimides, e.g. Polyetherimide.
  • Another group of base polymers includes poly (aryl) ether ketones, e.g. Polyether ketones, polyetheretherketones, etc.
  • Another group of base polymers includes polysulfides, e.g. Polyphenylene sulfide, polyphenylene sulfone, polysulfone, polyethersulfone, etc.
  • Another group of base polymers includes polyacetals.
  • Another group of base polymers includes cellulose and derivatives such as e.g. nitrates, acetates, acetate butyrates, etc.
  • Another group of base polymers includes vinyl polymers such as e.g. Polyvinyl chloride, polyvinyl acetate, polyvinyl alcohol, polyvinyl butyral, polyvinyl pyrrolydone, etc.
  • thermoplastic dispersions are also included.
  • the basic substances are e.g. to natural, isoprene, butadiene, and other rubbers, which may include chlorine, styrene, nitrile, sulfur, oxygen.
  • Another group of base polymers includes silicone elastomers.
  • electrically and thermally conductive polymer preparations can be provided with the present invention.
  • Inorganic Systems These are substances such as gypsum, mortar, sand, cement preparations, e.g. Concrete, and others that can be rendered conductive by the addition of the above additives. Furthermore, it is ceramic materials such as AIO, AIN, SiO, SiC, SiN, etc.
  • the addition of the conductivity additives is advantageously carried out in an aqueous or solvent-containing phase and with the addition of suitable organic and / or inorganic binders.
  • a special position is occupied by the systems, which are initially produced via an organic intermediate stage.
  • these are formulations with phenolic, cyanate ester resins, pitch, bitumen that can be converted to carbon, and polysilanes, siloxanes, silazanes that can be converted to SiO, SiC, SiN, SiCN.
  • Plastic systems for example, in polymer systems, a suspension state of two conductivity additives, including at least one of carbon, (eg graphite and CNT or graphite / carbon black and CNT, or graphite / silver and CNT, or graphite / AIN and CNT) can be generated which leads to excellent electrical / thermal conductivity and the mechanical and chemical properties of the polymers influenced much less than is the case with a conventionally filled polymer system.
  • the polymer compositions produced using filler combinations according to the invention are distinguished by comparatively low viscosities and are thus easier to process.
  • the peculiarity of the invention is that the combination of conventional thermally / electrically conductive particles with CNT and / or graphite makes it possible to reduce the individual concentrations of the components and thus also the total concentration of the fillers and thus to influence the viscosity to a lesser extent.
  • an electrical conductivity of about 1 mScm -1 can be achieved in unmodified polymers with the addition of 5-20% by weight.
  • metallic fillers for example silver, makes it possible to add 50-80% by weight in to penetrate the area 10kScm "1 .
  • values are obtained 1 mS cm "1 at additions of about 30wt .-%.
  • the achievable thermal conductivities silver-filled systems are in the range 1 -3W / mK, the use of ceramic particles such as BN, Al2O3, SiO2, AlN, BN, etc. alone generally results in values for the thermal conductivity in the range 1 -5W / mK.
  • the latter systems are not electrically conductive.
  • compositions in which the base materials or the first phases, for example polymers, are chemically optimized and adapted to the respective fillers are chemically optimized and adapted to the respective fillers.
  • the optimization sees one actual chemical change and / or the mixing of various components, such as polymer components, before.
  • annealed or graphitized CNT / graphites are particularly advantageous. Further advantages may result from the use of mixtures of different graphites and / or the use of mixtures of different CNTs and / or the use of mixtures of different metal particles and / or the use of mixtures of different ceramic particles as well as the use of other conductivity additives, eg carbon black, metal-coated silicates, etc.
  • auxiliaries can advantageously be added to the preparations, for example in coatings or in casting or kneading compositions. However, this is not necessarily necessary for improving the conductivity and is not desirable in all cases.
  • adhesion promoters such as e.g. Silanes, titanates or zirconates, etc. improve the adhesion between fillers and matrix and between preparation and substrate.
  • the viscosity can be increased to the desired level by means of rheological additives to prevent or slow settling of the CNT and other additives, for example, resulting in an increase in storage stability.
  • the invention includes 1-component systems as well as 2-component and multi-component systems. This is understood in the sense that in the case of 1K systems, the user of the formulations described herein must introduce heat to cause cross-linking and in the case of 2K and 2K
  • Multicomponent systems said components must first mix together to achieve networking at RT or via the introduction of heat.
  • the invention includes any type of dosage form.
  • the invention includes preparations of different forms, e.g. Granules, powders, dispersions, masterbatches, etc.
  • the viscosity for example of reactive resin, melt, solution, etc., is only slightly higher than the base resin or hardener or the polymer melt, etc., due to the relatively low filler contents.
  • the preparations are in principle the same or similar to handle as the unfilled polymers. This allows broader fields of application for the respective preparations.
  • CNT and graphite allows a significant cost savings over conventional electrically conductive formulations due to the saving of e.g. Carbon black, silver or AlN.
  • the low filler concentration allows, if necessary, a pigmentation with conventional dyes.
  • an electrically / thermally conductive preparation based on conventional conductivity additives it is fundamentally possible to reduce a significant proportion of the additives and to replace them with a significantly smaller proportion of CNT and graphite without reducing the corresponding conductivity.
  • a reduction in the level of conventional conductivity additive, e.g. Graphite, carbon black, silver or AIN at 75%, 50%, 30%, 20% compared to the original content is added by addition of 0.05-1.5% CNT and 1-15% graphite, in particular 0.3- 0.6% CNT or 5% 10% graphite compensated in relation to the total preparation.
  • the effect is also transferable to the combination with metal-coated silicates, titanium oxide and fibers of carbon and metal, etc.
  • the new preparations are easy to handle and apply because the total filler content and thus the viscosity is reduced.
  • CNT and graphite allow novel formulations that cost less than conventional formulations.
  • the graphite / CNT combination outperforms any other combination of carbons in terms of electrical and thermal conductivity and workmanship, resulting in significant cost savings.
  • Filled epoxy resins in particular standard bisphenol A based Graphite is mixed with the base epoxy to form a highly concentrated masterbatch. Also, the CNT become a highly concentrated with the basic epoxy Mixed masterbatch. Both masterbatches are mixed together and with base resin in the desired concentrations.
  • the preparation has a viscosity ⁇ 10 Pas (plate / plate) and a resistance of ⁇ 1 k ⁇ (electrodes immersed in a multimeter, distance ⁇ 1 cm).
  • Filled hardener especially amine-based
  • Graphite is mixed with the base hardener to form a MB. Also, the CNT are mixed with the base hardener to a MB. Both MB are mixed together and with base hardener in the desired concentration.
  • the preparation has a viscosity ⁇ 1 Pas (plate / plate) and a resistance of ⁇ 100 ⁇ (electrodes immersed in a multimeter, distance ⁇ 1 cm).
  • the resin After mixing the resin and hardener components in the correct ratio, the resin is crosslinked.
  • the hardened sample (flat bar: 4x10x80) is contacted by means of conductive silver on the smallest opposing surfaces and the resistance is determined with a multimeter. Taking into account the geometry of the sample, a specific resistance of ⁇ 100 ⁇ cm results at a CNT concentration ⁇ 0.6% and a graphite concentration ⁇ 10%.
  • the resin / hardener mixture is easy to pour.
  • the present invention is particularly suitable for heatable coatings and heatable molds. Further advantageous uses and applications for the present invention are, for example:
  • CFRP carbon fiber reinforced plastic
  • GRP glass fiber reinforced plastic
  • SFK synthetic fiber reinforced plastic
  • Reactive systems that can be heated and networked via microwaves and / or electric fields
  • Hot melt adhesives Rubber, and the like.
  • Graphite is mixed with the base epoxy to form a highly concentrated masterbatch.
  • the CNTs are also mixed with the base epoxy to form a highly concentrated masterbatch.
  • AIN powder is mixed with the base epoxy to a highly concentrated masterbatch. All masterbatches are mixed together and with base resin in the desired concentrations.
  • the preparation has a viscosity of ⁇ 25Pas (plate / plate) and a resistance of ⁇ 10k ⁇ (electrodes immersed in a multimeter, distance ⁇ 1 cm).
  • additive of latent hardener especially anhydride based Graphite is mixed with the base hardener to form a MB.
  • the CNT are mixed with the base hardener to a MB.
  • AIN powder is mixed with the base hardener to a MB. All MB are mixed together and with base hardener in the desired concentrations.
  • the preparation has a viscosity ⁇ 10 Pas (plate / plate) and a resistance of ⁇ 1 k ⁇ (electrodes immersed in a multimeter, distance ⁇ 1 cm).
  • a 1-K system After mixing the resin, hardener and accelerator components in the correct ratio, a 1-K system is obtained which can be stored at RT for several weeks to months.
  • the resin is cured at elevated temperature.
  • the specific resistance of an adhesive layer is in the range 1 -10k ⁇ cm and the thermal conductivity in the range 5-6W / m.K.
  • the CNT concentration is ⁇ 0.6%, the graphite concentration ⁇ 10% and the AIN concentration ⁇ 40%.
  • the resin / hardener mixture (paste) is easy to apply.
  • Filled Polvole Graphite is mixed with the base polyol to form a highly concentrated masterbatch.
  • the CNTs are also mixed with the base polyol to form a highly concentrated masterbatch. Both masterbatches are mixed together and with base polyol in the desired concentrations.
  • the preparation has a viscosity ⁇ 10 Pas (plate / plate) and a resistance of ⁇ 1 k ⁇ (electrodes immersed in a multimeter, distance ⁇ 1 cm).
  • Graphite is mixed with the base hardener to form a MB. Also, the CNT are mixed with the base hardener to a MB. Both MB are mixed together and with base hardener in the desired concentrations.
  • the preparation has one Viscosity ⁇ 10Pas (plate / plate) and a resistance of ⁇ 1 k ⁇ (electrodes immersed in multimeter, distance ⁇ 1 cm).
  • the crosslinked sample has a surface resistance of 1 -1 Ok ⁇ and a resistance inside of 0.5-5M ⁇ .
  • Graphite is mixed with the base silicone to form a highly concentrated masterbatch.
  • the CNTs are also mixed with the base silicone to form a highly concentrated masterbatch. Both masterbatches are mixed together and with base silicone in the desired concentrations.
  • the preparation has a viscosity ⁇ 50Pas (plate / plate) and a resistance of ⁇ 10 ⁇ (electrodes immersed in a multimeter, distance ⁇ 1 cm).
  • the silicone resin After mixing the resin and crosslinker component in the proper ratio, the silicone resin is crosslinked.
  • the crosslinked sample has a surface resistance of 100-1000 ⁇ . In general, the material loses flexibility but still remains sufficiently elastic.
  • the coating has a surface resistance of ⁇ 10 5 ohms.
  • All preparations with resistances in the range 1 k ⁇ can advantageously be heated by applying a voltage of 30-50V.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne une préparation conductrice, notamment une préparation électroconductrice et/ou thermoconductrice, caractérisée en ce qu'elle contient une première phase au moins temporairement liquide, et au moins un, de préférence au moins deux additifs de conductivité prévus dans la première phase. L'invention concerne également un procédé de fabrication d'une telle préparation conductrice, caractérisé par les étapes suivantes: A) préparation d'une première phase au moins temporairement liquide; B) addition d'au moins un additif de conductivité, de préférence d'au moins deux additifs de conductivité dans la première phase; et C) mélange de la première phase et du ou des additifs de conductivité dans un état homogène.
EP09768052A 2008-12-11 2009-12-08 Préparation conductrice et procédé de fabrication Withdrawn EP2373726A1 (fr)

Applications Claiming Priority (3)

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DE102008061834 2008-12-11
DE102009015493 2009-03-30
PCT/EP2009/066626 WO2010066730A1 (fr) 2008-12-11 2009-12-08 Préparation conductrice et procédé de fabrication

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EP2373726A1 true EP2373726A1 (fr) 2011-10-12

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US (1) US20120025131A1 (fr)
EP (1) EP2373726A1 (fr)
JP (2) JP2012511799A (fr)
KR (1) KR101670912B1 (fr)
CN (2) CN106167602A (fr)
WO (1) WO2010066730A1 (fr)

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Also Published As

Publication number Publication date
WO2010066730A1 (fr) 2010-06-17
KR20110111401A (ko) 2011-10-11
JP2012511799A (ja) 2012-05-24
JP2015165501A (ja) 2015-09-17
US20120025131A1 (en) 2012-02-02
KR101670912B1 (ko) 2016-10-31
CN106167602A (zh) 2016-11-30
CN102317360A (zh) 2012-01-11

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