EP2346072A4 - Vorrichtung und verfahren zur substraterkennung - Google Patents

Vorrichtung und verfahren zur substraterkennung

Info

Publication number
EP2346072A4
EP2346072A4 EP09817767A EP09817767A EP2346072A4 EP 2346072 A4 EP2346072 A4 EP 2346072A4 EP 09817767 A EP09817767 A EP 09817767A EP 09817767 A EP09817767 A EP 09817767A EP 2346072 A4 EP2346072 A4 EP 2346072A4
Authority
EP
European Patent Office
Prior art keywords
detection device
substrate detection
substrate
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09817767A
Other languages
English (en)
French (fr)
Other versions
EP2346072A1 (de
EP2346072B1 (de
Inventor
Masayuki Enomoto
Masao Takatori
Yohichi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Heavy Industries Ltd
Kawasaki Motors Ltd
Original Assignee
Kawasaki Heavy Industries Ltd
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Heavy Industries Ltd, Kawasaki Jukogyo KK filed Critical Kawasaki Heavy Industries Ltd
Publication of EP2346072A1 publication Critical patent/EP2346072A1/de
Publication of EP2346072A4 publication Critical patent/EP2346072A4/de
Application granted granted Critical
Publication of EP2346072B1 publication Critical patent/EP2346072B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP09817767.8A 2008-10-01 2009-09-29 Vorrichtung und verfahren zur substraterkennung Active EP2346072B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008256268A JP5185756B2 (ja) 2008-10-01 2008-10-01 基板検出装置および方法
PCT/JP2009/066938 WO2010038735A1 (ja) 2008-10-01 2009-09-29 基板検出装置および方法

Publications (3)

Publication Number Publication Date
EP2346072A1 EP2346072A1 (de) 2011-07-20
EP2346072A4 true EP2346072A4 (de) 2012-11-28
EP2346072B1 EP2346072B1 (de) 2016-05-25

Family

ID=42073496

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09817767.8A Active EP2346072B1 (de) 2008-10-01 2009-09-29 Vorrichtung und verfahren zur substraterkennung

Country Status (7)

Country Link
US (1) US9202732B2 (de)
EP (1) EP2346072B1 (de)
JP (1) JP5185756B2 (de)
KR (1) KR101298791B1 (de)
CN (1) CN102171806B (de)
TW (1) TWI414778B (de)
WO (1) WO2010038735A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5512350B2 (ja) * 2010-03-30 2014-06-04 川崎重工業株式会社 基板搬送ロボットの状態監視装置
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP5333408B2 (ja) * 2010-10-22 2013-11-06 東京エレクトロン株式会社 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体
US11880178B1 (en) 2010-11-16 2024-01-23 Ectoscan Systems, Llc Surface data, acquisition, storage, and assessment system
US9599461B2 (en) * 2010-11-16 2017-03-21 Ectoscan Systems, Llc Surface data acquisition, storage, and assessment system
TWI484160B (zh) * 2013-04-23 2015-05-11 Au Optronics Corp 基板檢測裝置與方法
JP5750472B2 (ja) * 2013-05-22 2015-07-22 株式会社安川電機 基板搬送ロボット、基板搬送システムおよび基板の配置状態の検出方法
CN105206550B (zh) * 2014-06-20 2018-08-24 北京北方华创微电子装备有限公司 反应腔室和半导体设备
CN104916573B (zh) * 2015-06-17 2018-07-06 北京北方华创微电子装备有限公司 半导体设备承载区域的硅片分布状态组合检测方法及装置
KR101701419B1 (ko) * 2016-08-17 2017-02-02 주식회사 오토닉스 반사형 이미지 검출 센서
US10784134B2 (en) * 2017-05-03 2020-09-22 Applied Materials, Inc. Image based substrate mapper
CA3084951A1 (en) 2017-12-06 2019-06-13 Ectoscan Systems, Llc Performance scanning system and method for improving athletic performance
TWI641073B (zh) * 2018-03-09 2018-11-11 創意電子股份有限公司 晶圓載運裝置
JP7346839B2 (ja) * 2019-02-15 2023-09-20 Tdk株式会社 ロードポート
JP7324667B2 (ja) 2019-09-20 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7447661B2 (ja) * 2020-04-23 2024-03-12 Tdk株式会社 板状対象物の配列検出装置およびロードポート
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
US11996308B2 (en) * 2021-03-03 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Method for mapping wafers in a wafer carrier
JP2023132455A (ja) * 2022-03-11 2023-09-22 シンフォニアテクノロジー株式会社 基板の検出方法及びロードポート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093964A (ja) * 1999-09-21 2001-04-06 Nikon Corp ウェハ検出装置
US20080211991A1 (en) * 2007-02-09 2008-09-04 Bright View Technologies, Inc. High contrast liquid crystal displays

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JPS60157230A (ja) * 1984-01-11 1985-08-17 Telmec Co Ltd 半導体ウエハ搬送方法
US4691999A (en) * 1986-04-04 1987-09-08 Hughes Aircraft Company Afocal beam expansion apparatus and method
JPS63131533A (ja) * 1986-11-21 1988-06-03 Canon Inc 斜め基板検出装置および方法
JPH03239344A (ja) * 1990-02-17 1991-10-24 Kokusai Electric Co Ltd ウェーハ検知装置
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
JPH06244268A (ja) * 1993-02-16 1994-09-02 Tokyo Electron Tohoku Ltd 移載装置
DE19535871C2 (de) * 1995-09-27 2000-02-10 Jenoptik Jena Gmbh Indexer für Magazinfächer eines Magazins und darin enthaltene scheibenförmige Objekte
JPH09283603A (ja) * 1996-04-10 1997-10-31 Metsukusu:Kk 半導体ウェハ検出装置
JP3977485B2 (ja) * 1997-04-24 2007-09-19 東京エレクトロン株式会社 アームアクセス位置検出方法及び真空処理装置
DE19814046C1 (de) * 1998-03-30 1999-11-18 Jenoptik Jena Gmbh Anordnung zur Detektion von scheibenförmigen Objekten in einer Kassette
JP3058615B2 (ja) * 1998-04-10 2000-07-04 株式会社山武 ウエハ検出装置
DE60033200T2 (de) 2000-12-01 2007-10-11 Wafermasters Inc., San Jose Verfahren und Vorrichtung zur Zuordnung von Wafern
JP2003017548A (ja) * 2001-06-28 2003-01-17 Sunx Ltd ウエハ検出装置
TWI288961B (en) * 2001-12-12 2007-10-21 Shinko Electric Co Ltd Substrate detection apparatus
JP2003273197A (ja) * 2002-03-14 2003-09-26 Sunx Ltd ウエハ飛び出し検出装置
JP4163435B2 (ja) * 2002-03-29 2008-10-08 株式会社日本マイクロニクス 被検査基板の検査装置
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
JP4276440B2 (ja) * 2003-01-06 2009-06-10 東京エレクトロン株式会社 基板検出方法及び装置並びに基板処理装置
JP4028814B2 (ja) * 2003-04-21 2007-12-26 川崎重工業株式会社 マッピング装置
JP4196335B2 (ja) 2003-06-10 2008-12-17 株式会社安川電機 薄型基板検出方法
JP2006170622A (ja) * 2004-12-10 2006-06-29 Olympus Corp 外観検査装置
CN109255924A (zh) * 2007-11-15 2019-01-22 爱克斯崔里斯科技有限公司 颗粒探测

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093964A (ja) * 1999-09-21 2001-04-06 Nikon Corp ウェハ検出装置
US20080211991A1 (en) * 2007-02-09 2008-09-04 Bright View Technologies, Inc. High contrast liquid crystal displays

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010038735A1 *

Also Published As

Publication number Publication date
EP2346072A1 (de) 2011-07-20
JP5185756B2 (ja) 2013-04-17
US9202732B2 (en) 2015-12-01
CN102171806B (zh) 2014-07-16
TW201028679A (en) 2010-08-01
CN102171806A (zh) 2011-08-31
KR20110049916A (ko) 2011-05-12
US20110205354A1 (en) 2011-08-25
JP2010087340A (ja) 2010-04-15
TWI414778B (zh) 2013-11-11
WO2010038735A1 (ja) 2010-04-08
EP2346072B1 (de) 2016-05-25
KR101298791B1 (ko) 2013-08-22

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