EP2294618A1 - Circuit electronique - Google Patents

Circuit electronique

Info

Publication number
EP2294618A1
EP2294618A1 EP09757233A EP09757233A EP2294618A1 EP 2294618 A1 EP2294618 A1 EP 2294618A1 EP 09757233 A EP09757233 A EP 09757233A EP 09757233 A EP09757233 A EP 09757233A EP 2294618 A1 EP2294618 A1 EP 2294618A1
Authority
EP
European Patent Office
Prior art keywords
layer
electronic circuit
protective layer
circuit according
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09757233A
Other languages
German (de)
English (en)
Inventor
Alexander Knobloch
Walter Fix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PolyIC GmbH and Co KG
Original Assignee
PolyIC GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PolyIC GmbH and Co KG filed Critical PolyIC GmbH and Co KG
Publication of EP2294618A1 publication Critical patent/EP2294618A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the invention relates to an electronic circuit, comprising at least two, interconnected by means of interconnects organic components with a common carrier substrate.
  • Such electronic circuits are known from DE 101 51 440 Cl.
  • various electronic components are connected to an electronic component or a circuit, wherein similar components are bundled on a substrate or in an encapsulation to form a group, which are then interconnected electronically.
  • they are arranged protected between a substrate film and an encapsulation film.
  • Such an encapsulation is required in particular for organic components, since these are particularly susceptible to contamination, light irradiation or mechanical stress.
  • an electronic circuit which comprises at least two interconnected organic interconnects by means of organic components with a common carrier substrate, wherein it is provided that the components and the interconnects are formed from layer layers that a carrier substrate facing away from uppermost layer position of the electronic circuit is formed and made of an electrically conductive material that the pattern-shaped top layer is provided on its side facing away from the carrier substrate with at least one congruent to the top layer layer arranged protective layer that the at least two organic components at least a first component of a first type of component and at least a second Component of a different second type of component include, and that components of the same type of component in each case by a protective layer of the same composition and / or the same structure mar are used.
  • a "congruent" arrangement of the at least one protective layer to the pattern-like uppermost layer layer is understood here to mean that the at least one protective layer is as large in its surface extent as the patterned uppermost layer layer and has the same shape pattern-shaped layer layer and the at least one protective layer on the same shape and position, wherein the outlines of top layer layer and protective layer in this view coincide or lie exactly above each other.
  • Such a circuit enables a particularly cost-effective and efficient production.
  • the at least one protective layer covers the patterned uppermost layer layer of the electrical circuit and reliably protects underlying components and the connections between individual components in the form of conductor tracks.
  • the electrically conductive uppermost layer layer usually forms a large number of electrode surfaces, for example top-gate electrodes of OFETs, the sensitive regions of the components are usually located directly underneath.
  • a mechanical protection especially against compressive forces, shear forces or abrasion, provided, however, depending on the composition and / or structure of the at least one protective layer also as an alternative or in combination with the mechanical protection protection in terms of chemical pollution, in particular by Water vapor, oxygen, impurities, etc., and / or optical loads, in particular by visible radiation, UV radiation, etc., and / or thermal stress, in particular by IR radiation, etc. possible.
  • the protective layer remains even after production of the electronic circuit and this protects reliable.
  • a stabilization of the layer package of the circuit and a reduction of unwanted detachments or lifts between individual layers of the layer package, which may occur due to lack of or poor interlayer adhesion, is due to the inventive arrangement of Protective layer possible.
  • an organic component is understood to mean an electrical component which consists predominantly of organic material, in particular of at least 90% by weight of organic material.
  • a single organic component is composed of different layers with an electrical function, in particular in the form of non-self-supporting, thin layers, and further at least from the areas of a carrier substrate, which can be assigned to the layer layers, on which the layer layers are located.
  • the individual layer layers can be formed from organic or inorganic material, it being possible to use only organic, only inorganic, or organic and inorganic layer layers in combination for forming an organic component.
  • an electrical component comprising an organic carrier substrate and only inorganic layer layers with electrical function due to the usually large mass of the carrier substrate in comparison to the mass of
  • An organic component is also referred to here in particular as having at least one layer of an organic, organometallic and / or organo-inorganic material.
  • organic, organometallic and / or organic-inorganic polymers or plastics hybrids
  • plastics ie all types of materials except semiconductors, which are the classical ones Forming diodes (germanium, silicon) and the typical metallic conductor
  • a restriction in the dogmatic sense to organic material as carbon containing material is therefore not provided, but is also thought of the widespread use of eg silicones.
  • the term organic or organic material should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but the use of "small molecules" is quite possible Statement about the actual presence of a polymeric compound.
  • layer layers are preferably carried out by printing, vapor deposition, sputtering, spraying, spraying, casting, knife coating, and the like, further coating methods.
  • the layer layers with an electrical function are preferably applied from a solution, vapor-deposited, sputtered on, laminated or embossed onto the carrier substrate by means of a transfer film. From a solution applied layer layers with electrical function are applied, for example, by printing, pouring, spraying or knife coating on the carrier substrate.
  • a layer layer of a component may be an electrically conductive layer layer, a semiconducting layer layer or an electrically insulating layer layer.
  • Components of the electronic circuit each comprise at least one layer layer formed by means of one of the abovementioned coating methods, in particular printed.
  • organic layer layers which are formed by an organic material, which is dissolved in particular in a solvent
  • printing methods such as gravure printing, screen printing, offset printing, thermal transfer printing or flexographic printing are particularly suitable.
  • a layer layer can be applied to the carrier substrate or carrier substrate already provided with layer layers in a pattern-shaped or full-surface manner. Full-surface applied layer layers can be partially removed in a row, for example, by etching, laser treatment, washing with water, solvent release, etc., to form a pattern-like shape.
  • layer layers of an organic semiconductor material are preferably provided over the entire surface.
  • Layer layers of electrically conductive materials are usually patterned to form electrode surfaces and / or conductor tracks.
  • Layer layers of electrically insulating material are patterned or fully formed as needed.
  • the individual layer layers of a component on the carrier substrate usually have a total layer thickness in the range from 500 nm to 2000 nm. In general, all layer layers are preferably thin layers with a layer thickness of less than 10 ⁇ m. In this case, an electrically conductive
  • Layer layer preferably has a layer thickness in the range of 5 nm to about 100 nm
  • a layer of semiconducting material preferably has a layer thickness in the range of 10 nm to 300 nm
  • an electrically insulating layer layer preferably has a layer thickness in the range of 50 nm to 2000 nm
  • a component can still have protective and / or auxiliary layers.
  • Their layer thickness is preferably 100 nm to several microns.
  • the electronic circuit can have a first subset of organic components of a first component type, for example, OFETs, and at least one further subset of organic components of a different component type, different in the first component type, for example organic diodes.
  • a first component type for example, OFETs
  • a different component type different in the first component type
  • An organic device is in particular one of the following type of device: field effect transistor (OFET), organic diode, capacitor,
  • Resistor Resistor, IC chip, vertical electrically conductive connection (via), etc., as well as additional horizontal electrically conductive connections.
  • the electronic circuit may not only comprise the at least two organic components, but also have inorganic components which do not have an organic layer layer.
  • inorganic components are, for example, field effect transistors, diodes, capacitors, resistors, IC chips, horizontal electrically conductive
  • the at least one protective layer in the area of the electronic circuit has the same composition and / or the same structure everywhere. Such a design is rational and inexpensive to produce.
  • the at least one protective layer has a different composition and / or a different structure in different regions of the electronic circuit.
  • the effect of the protective layer on its precise effect coordinate protective components and their requirements while achieving a rational training of as many as possible the same protective layer areas.
  • components of different types of components are each protected by at least one protective layer whose composition and / or structure differs.
  • components of different types of components make very different demands on the required protective layer.
  • a targeted application of a first protective layer to only components of a first type of component and a second, different protective layer to only components of a second type of component is advantageously possible, etc.
  • the at least one protective layer may at least in some areas have a construction of at least two individual layers, which are arranged stacked on top of one another. This allows the protective effects to be combined with different protective layers.
  • Conductive or nonconductive polymers are generally suitable as materials for forming a protective layer. Resins, polymer mixtures, etc.
  • the organic materials are in particular additives added, such as plasticizers, which provide a sufficiently high flexibility of the protective layer, or chemically active redox systems, or particles as radiation absorber, such as ZnO or TiO. 2 Nanoparticles as UV absorbers, or colorants, or conductive particles such as graphite or carbon black, or non-conductive particles that act as reflectors, etc.
  • the at least one protective layer is a printed protective layer.
  • a protective layer of an organic material, in particular a crosslinked organic material is suitable for this purpose.
  • at least one organic material in particular a crosslinked organic material
  • Paint layer used to form the at least one protective layer.
  • the protective layer material is preferably applied in pattern form by gravure printing, screen printing, offset printing, thermal transfer printing or flexographic printing.
  • the at least one protective layer can first be applied over a large area and then selectively removed again.
  • a layer thickness of the at least one protective layer is preferably in the range of 50 nm to 10 ⁇ m, in particular in the range of 100 nm to 2 ⁇ m. If a protective layer is made up of several individual layers, this is the total layer thickness, ie the sum of the layer thicknesses of all individual layers. Particularly advantageous is an embodiment in which the at least one protective layer is patterned at the same time as the uppermost layer layer immediately adjacent thereto, which is shaped in particular in the form of an electrode plane. As a result, the critical active or sensitive areas of the various components are usually automatically protected, such as the current channel area in a OFET with top-gate structure, since the structuring of the electrically conductive uppermost layer layer to form the gate electrode simultaneously Structuring the
  • Protective layer can be done. Also, the vertical current channel of a diode is optimally protected, since the structuring of the electrically conductive uppermost layer layer to form the anode or cathode of the diode can be carried out simultaneously with the structuring of the protective layer.
  • the outline or the form of the uppermost layer layer can be seen perpendicular to the carrier substrate plane, provided that the uppermost layer layer forms electrode surfaces and / or printed conductors, largely independently of one below, i.e., below. be formed in the direction of the carrier substrate, arranged in the layer stack electrically conductive layer layer, the counter electrodes to the electrodes of the uppermost layer layer and / or further conductor tracks formed.
  • electrodes and counterelectrodes present at different levels in the component may be arranged congruently one above the other or only overlapping one another in partial areas.
  • the at least one protective layer for visible radiation and / or for ultraviolet radiation and / or for IR radiation impermeable or at least substantially impermeable is formed.
  • substantially impermeable is meant a protective layer which, for at least 30%, preferably at least 90%, the incident radiation, in particular the component damaging radiation or radiation components, impermeable, since these are reflected from the protective layer and / or absorbed.
  • the respectively protected component is optimally protected from optical and / or thermal stress.
  • a protective layer material containing UV absorber and / or opaque colorant is preferred.
  • Protective layer has an E-modulus in the range of 0.5 to 5000 N / mm 2 and thus has a sufficiently high flexibility or flexibility to protect the thus covered components or device areas.
  • the at least one protective layer is resistant to at least one organic solvent. Furthermore, it has proven useful if the at least one protective layer is insoluble in water.
  • At least one protective layer which is impermeable to water vapor and / or oxygen or at least acts as a diffusion barrier, which significantly reduces the access of water vapor and / or oxygen in the direction of the layer layers of the component with electrical function. This can effectively prevent a chemical influence of organic layers.
  • the carrier substrate is formed by a flexible film.
  • the film is formed by at least one film layer of plastic, glass, paper, metal or a laminate of at least two different film layers of such material.
  • rigid Support substrates such as ceramic, glass, etc., are usable.
  • the carrier substrate preferably has a thickness in the range of 12 ⁇ m to 1 mm.
  • Ribbon-shaped flexible carrier substrates are preferably processed from roll to roll in a cost-effective continuous process.
  • the electronic circuit according to the invention can, if necessary, also be provided with an already known from the prior art encapsulation in order to protect the circuit even more effectively against harmful influences.
  • the application of at least one full-surface covering layer and / or at least one film on the side facing away from the carrier substrate of the circuit has proven itself.
  • FIGS Ia to 5 are intended to illustrate the invention by way of example. So shows
  • FIG. 2 shows a second electronic circuit in cross section
  • Figure 3 is a third electronic circuit in cross section
  • FIG. 4 shows a fourth electronic circuit in cross section
  • Figure 5 is a fifth electronic circuit in cross section
  • Figures Ia to Id show the manufacture of an electronic circuit 1 in cross section.
  • a carrier substrate 2 made of polyester film with a thickness of 36 microns or alternatively of 50 microns two interconnected organic components I, II (see Figure Id) are formed, wherein the device I is a first OFET and the device II is an identical second OFET.
  • an electrically conductive first layer layer 3a which is formed from an electrically conductive polymer or from metal, is pattern-shaped on the carrier substrate 2.
  • the first layer layer 3a has a layer thickness in the range from 20 nm to 50 nm and is here in particular formed from polyaniline, PEDOT / PSS, gold, aluminum, copper or silver.
  • the first layer layer 3a forms the source and drain electrodes of the two components I, II or of the OFETs.
  • a second layer layer 3b of an organic semiconductor material here of zinc oxide or polyalkylthiophene
  • a third layer layer 3 c of an electrically insulating material here of polymethyl methacrylate, PHS or polyhydroxystyrene, is applied over the entire surface to the second layer layer 3 b in a layer thickness in the range from 400 nm to 600 nm.
  • a fourth layer layer 3d which in this case forms a topmost layer layer 3d '(see FIG. 1d) of the electrical circuit 1, is made of an electrically conductive material, in particular an electrically conductive polymer or of metal, on the third layer layer 3c. formed over the entire surface.
  • the fourth layer layer 3d has a layer thickness of 50 nm or alternatively 100 nm and is here formed in particular from polyaniline, PEDOT / PSS, gold, aluminum, copper, silver or titanium.
  • a protective layer 4a is applied pattern-shaped on the fourth layer layer 3d.
  • the protective layer 4a is formed here by means of a lacquer which has dissolved at least one of the following constituents in an organic solvent, in particular an alcohol:
  • the protective layer 4a present after curing of the lacquer is designed such that it is resistant to a solvent or etchant with which the fourth layer layer 3d can be removed.
  • the protective layer 4a is now congruent to a patterned formed from the fourth layer layer 3d formed uppermost layer layer 3d '.
  • the uppermost layer layer 3d ' forms the top gate electrode of the OFETs and not shown in detail conductors for their interconnection.
  • the sensitive areas of the two components I, II and the two OFETs as well as the conductor tracks of the electronic circuit 1 formed by the uppermost layer layer 3d ' are optimally protected by the protective layer 4a against harmful environmental influences, in particular against mechanical damage.
  • Figure 2 shows in cross section a second electronic circuit 10, in which also two interconnected components I, II, in the form of. OFETs are present.
  • the second layer layer 3 b and the third layer layer 3 c are pattern-shaped.
  • FIG. 3 shows in cross-section a third electronic circuit 100, in which two different components I, III are present.
  • the component I an OFET
  • the component III is protected with the protective layer 4a according to FIG.
  • the component III is a capacitor which is protected by a further protective layer 4b.
  • a first capacitor plate formed by the layer layer 3a, an organic semiconductor layer formed from the second layer layer 3b, an electrically insulating layer formed by the third layer layer 3c, a second capacitor plate formed from the on the carrier substrate 2 in this order top layer layer 3d 'and the further protective layer 4b available.
  • the protective layers 4a, 4b are different in their composition and designed to be adapted directly to the component to be protected.
  • the protective layer 4a is, As described above for Figure Ic, formed from a pigmented with carbon black paint layer.
  • the further protective layer 4b is formed by a thermal transfer varnish based on wax.
  • Figure 4 shows in cross section a fourth electronic circuit 101, in which on a common carrier substrate 2, the components I, II, in the form of OFETs according to Id, a component III 'in the form of a capacitor similar to Figure 3, a device IV in the form of a organic diode and a device V in the form of a vertical electrically conductive connection or a plated through the second and third layer layer 3b, 3c, a so-called "via” are arranged.
  • a first electrode of the organic diode of the first layer layer 3 a, an organic semiconductor layer of the second layer layer 3 b, a second electrode of the organic diode of the uppermost layer layer 3 d 'and the protective layer 4 a are arranged on the carrier substrate 2.
  • a conductor track of the first layer layer 3a which is connected via an opening in the second and the third layer layer 3b, 3c with the pattern-shaped uppermost layer layer 3d 'electrically conductive.
  • the arrangement of the electrically conductive layer layers 3a, 3b forms the via, which is likewise covered by the protective layer 4a.
  • an electrically conductive connection is formed between the first layer layer 3a and the pattern-shaped uppermost layer layer 3d ', conductor tracks being provided for electrically interconnecting at least part of the components I, II, III, IV, V.
  • a protective layer 4a which precisely covers the uppermost layer layer 3d 'and protects the components I to V from environmental influences.
  • FIG. 5 shows a fifth electronic circuit 102 according to the invention in cross-section. On the common
  • Support substrate 2 are in this case essentially the same components as shown in Figure 4.
  • the component III in the form of the capacitor is covered with a second protective layer 4b according to FIG.
  • the component IV in the form of the organic diode is covered with a third protective layer, which is composed of two individual protective layers 4c and 4a (according to FIG.
  • the component V in the form of the via is provided with a fourth protective layer 4d.
  • the protective layers 4a differ; 4b; 4c, 4a; 4d in composition and structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Circuit électronique (1, 10, 100, 101, 102) comportant au moins deux composants organiques (I, II, III, IV, V) qui sont connectés les uns aux autres à l'aide de pistes conductrices et qui sont pourvus d'un substrat de support commun (2). Les composants (I, II, III, IV, V) et les pistes conductrices sont composés de couches (3a, 3b, 3c, 3d). Une couche supérieure (3d') du circuit électronique (1, 10, 100, 101, 102), située à l'opposé du substrat de support (2), présente des motifs et est constituée d'un matériau électro-conducteur. Cette couche supérieure (3d') présentant des motifs est pourvue, sur sa face située à l'opposé du substrat de support (2), d'au moins une couche de protection (4a, 4b, 4c, 4d) dont la surface correspond exactement à celle de la première couche supérieure (3d'). Les deux composants organiques (I, II, III, IV, V) comportent au moins un premier composant (I, II) d'un premier type et au moins un deuxième composant (III, IV, V) d'un deuxième type différent du premier type. Les composants (I, II) du même type sont protégés par une couche de protection (4a) de même composition et/ou de même structure.
EP09757233A 2008-05-30 2009-05-29 Circuit electronique Withdrawn EP2294618A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008026216A DE102008026216B4 (de) 2008-05-30 2008-05-30 Elektronische Schaltung
PCT/EP2009/003844 WO2009146850A1 (fr) 2008-05-30 2009-05-29 Circuit électronique

Publications (1)

Publication Number Publication Date
EP2294618A1 true EP2294618A1 (fr) 2011-03-16

Family

ID=41021018

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09757233A Withdrawn EP2294618A1 (fr) 2008-05-30 2009-05-29 Circuit electronique

Country Status (5)

Country Link
US (1) US8350259B2 (fr)
EP (1) EP2294618A1 (fr)
KR (1) KR101590509B1 (fr)
DE (1) DE102008026216B4 (fr)
WO (1) WO2009146850A1 (fr)

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KR20110022628A (ko) 2011-03-07
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KR101590509B1 (ko) 2016-02-01
US8350259B2 (en) 2013-01-08
US20110115101A1 (en) 2011-05-19

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