EP3302997B1 - Procédé de fabrication d'un élément de sécurité, élément de sécurité, papier de sécurité et document de valeur obtenables par ce procédé - Google Patents

Procédé de fabrication d'un élément de sécurité, élément de sécurité, papier de sécurité et document de valeur obtenables par ce procédé Download PDF

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Publication number
EP3302997B1
EP3302997B1 EP16730682.8A EP16730682A EP3302997B1 EP 3302997 B1 EP3302997 B1 EP 3302997B1 EP 16730682 A EP16730682 A EP 16730682A EP 3302997 B1 EP3302997 B1 EP 3302997B1
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EP
European Patent Office
Prior art keywords
coating
regions
metallization
security element
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16730682.8A
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German (de)
English (en)
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EP3302997A1 (fr
Inventor
Winfried HOFFMÜLLER
Theodor Burchard
Maik Rudolf Johann Scherer
Ralf Liebler
Michael Rahm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
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Giesecke and Devrient Currency Technology GmbH
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Publication of EP3302997A1 publication Critical patent/EP3302997A1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29—Securities; Bank notes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/324—Reliefs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials

Definitions

  • the invention relates to a method for producing a security element for a security paper or a valuable item, in particular a value document.
  • the invention further relates to a security element obtainable by the method and to a security paper or value document provided therewith.
  • Security elements with in transmitted light, and possibly also in reflected light, visually recognizable characters are known.
  • the characters may have any shapes, such as numbers, letters, patterns, geometric or figurative representations, etc., and are generally referred to as "negative writing" regardless of their shape.
  • the security elements are e.g. prepared by providing a transparent substrate with a coating, generally a metallic coating (or metallization), which is then removed at certain points again. If you hold the security element against the light, the areas with metallic or other coating appear dark. The areas where the coating has been removed, however, appear bright or at least significantly lighter than the coated areas, depending on the transparency of the substrate. The more transparent, i. the more translucent a substrate is, the more pronounced is the contrast between coated and non-coated areas. For very transparent substrates, the negative writing is clearly visible not only in transmitted light but also in incident light.
  • metallic coatings are formed substantially over the entire surface.
  • the provision of recesses within the metallic coating can in the simplest case by the insertion a diaphragm or a shielding during the sputtering process done. This measure only leads to coarse-structured metallizations.
  • optically appealing security elements require fine structuring.
  • Finely structured metallizations can be provided, for example, by etching processes. In this case, the metal to be structured is applied in a first step over the entire surface of the substrate and coated in a second step in certain subject areas with a suitable resist. In a third step, the removal (or chemical conversion) of the metal in the areas not protected by resist is effected by means of an etching medium.
  • the resist can also be applied over the entire surface and selectively changed by exposure in such a way that certain areas of the resist are selectively removed and the metallization arranged below can be etched accordingly.
  • the use of photoresist coatings in the security element production is for example from EP 2 049 345 B1 known.
  • the fine structuring of a metallization can moreover take place by means of a so-called washing process.
  • a washing process in which a carrier film printed with a high pigment content in the form of characters, coated with a thin cover layer (eg aluminum) and then the ink is removed together with the cover layer above it by washing with a liquid to coating-free Create areas in the form of the characters.
  • the WO 92/11142 (equivalent to EP 0 516 790 ) or their German priority application DE 4 041 025 discloses heat-activatable inks, for example, wax-containing emulsions. at Heating soften these emulsions and thereby reduce the adhesion to the carrier film, so that in these poorly adhering areas, supported by mechanical treatment, such. As ultrasound, brushing or rubbing, both the softened ink and the overlying layers can be removed.
  • activatable inks with foaming additives such as are customary in the production of foams disclosed. These blowing agents split gas under the action of heat and produce foam structures. As a result, the volume of the ink increases, whereby the adhesion to the carrier film is reduced and the layers lying above the ink are arched outward, so that they offer a good point of attack for a mechanical removal.
  • the WO 97/23357 makes reference EP 0 516 790 and further discloses activatable inks which are activated by treatment with a suitable solvent, ie, washed out.
  • the present invention has for its object to overcome the disadvantages of the prior art.
  • a coating is initially applied to a film, which forms numerous cracks during drying. These cracks form a dense, coherent network. Upon subsequent vapor deposition of a material, the material is deposited both on (i.e., above) the coating and in the cracks. When removing the coating, e.g. Washing with suitable solvents also removes the material deposited above the coating. All that remains is the vapor-deposited material present in the crack lines.
  • the crack-forming coating used is preferably a dispersion, more preferably a colloidal dispersion.
  • dispersions of SiO 2 nanoparticles or of acrylic resin nanoparticles, as described on page 2090 in document D2 are particularly suitable.
  • the crack-forming coating may be based on a polymer in solution. The polymer solution is applied to the substrate, for example by means of printing, so that a thin polymer film is produced. The thin polymer film cracks during drying.
  • the crack formation depends on the choice of the raw materials and the choice of the substrate, the thickness of the crack-forming coating and the drying parameters.
  • the line thicknesses achievable at the end of the production process are e.g. in the case of silver in the range of 1 .mu.m to 50 .mu.m, the lines are usually so fine that they are recognizable as lines only when using a magnifying glass.
  • the human eye does not dissolve the individual lines, but one recognizes a difference both in the reflected light (or reflection) and in the transmitted light (or transmission) compared to the untreated or bare foil. Since the fine lines form an irregular, continuous network, unwanted diffraction effects do not occur.
  • the reflectance and the light transmittance, respectively can be adjusted appropriately.
  • the electrical conductivity can be regulated.
  • the security element according to the invention in terms of the essential higher chemical resistance pronouncedly advantageous.
  • the metal is in the "normal” layer thickness, while a conventional semitransparent metallization is very thin and therefore susceptible to corrosion, especially in the case of Al and Cu.
  • the metallization according to the invention in the form of a dense, coherent network shows an electrical conductivity and an optical transmission, which is comparable to a full-surface ITO layer.
  • the fine metallic lines can be advantageously used to provide a "transparent" hologram and other security elements based on embossed structures, with electrical conductivity.
  • the fine metallic lines can be used in combination with conventional embossing lacquers, customary primer compositions and customary heat sealing lacquers, and act as a reflector.
  • the fine metallic lines can also be used in combination with transparent holograms that rely on a refractive index jump between the embossing lacquer and the coating following the embossing lacquer.
  • a substrate in particular transparent
  • an embossing lacquer layer which is provided with a (hologram) embossing.
  • the embossing lacquer layer is coated over its entire area with the crack-forming coating.
  • the crack-forming coating is then dried. This forms fine cracks.
  • Metal is vapor-deposited on the substrate treated in this way (alternatively, the metal can also be applied wet-chemically).
  • the metal is deposited both above the cracked coating, as well as in the cracks.
  • the cracked coating is then removed, along with the metal deposited above the coating. The removal can be carried out, for example, by washing with a suitable solvent ("alternative 1").
  • the removal may be by means of a separately provided adhesive layered device, the device being fixed by means of the adhesive layer to the removed, cracked coating of the security element substrate and, after being fixed, with the torn coating of the security element Substrate is removed ("Alternative 2").
  • the security element provided with the embossing lacquer layer and the metallic mesh structure is optionally overcoated with a conventional primer composition or with a layer whose refractive index deviates significantly from the refractive index of the embossing lacquer layer.
  • An overcoating with a metal that has a different color than the metal of the metallic network structure could also take place. The viewer would see a mixed color in this case.
  • the process for removing the cracked coating according to the above "Alternative 1" is advantageously carried out by dissolution with a suitable solvent.
  • the choice of solvent is advantageously carried out in coordination with the coating.
  • the following solvents can be used: methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methoxypropyl acetate, acetone, Methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, methylene chloride, chloroform, toluene, xylene, methanol, ethanol, 2-propanol.
  • acetals or mixtures of the abovementioned solvents can be used.
  • a detachment of the crack-forming coating by infiltration can take place.
  • mixtures of solvents and water, optionally with surfactants, possibly with defoamers and other additives are used.
  • the separation or dissolution of the cracked coating can also be supported by spray nozzles or mechanically by brushing, rolling or by felts.
  • the method for removing the cracked coating according to the above "Alternative 2" is the peeling in the form of a kind of lamination and separation winding.
  • a second, separate substrate for example a film
  • a coating which is adhesive under the laminating conditions (or adhesive conditions) By the term “large area” is meant that the extent is at least as large as the area of the crack-forming layer to be removed.
  • the layer thickness of the adhesive coating is after a possibly occurring physical drying, for example, 0.4 microns to 4 microns.
  • the material lying on the crack-forming coating combines with the adhesive coating.
  • the crack-forming coating serves as a spacer to the film and the material deposited directly on the film (ie, metal). Depending on the choice of crack-forming coating occurs in the subsequent separation winding either to peel off the metal from the crack-forming coating or to completely peel off the crack-forming coating.
  • On the adhesively coated film ie the second, separate substrate
  • the film can be further processed if necessary.
  • the foil is metallic with very high reflection (eg higher than 85%), but not electrically conductive. It is therefore preferred to further process the film of the security element which originally carried the crack-forming coating.
  • a wash color is printed as a motif in a first step.
  • further motif elements are printed, eg lines within areas that are not covered with wash ink (the sequence can also be reversed, ie first applying the crack-forming lacquer and then applying the wash color).
  • the metallizing step for example by vapor deposition of metal.
  • a security element having the following ranges: first areas which form a "true" negative writing (ie recesses or areas without any metal), without electrical conductivity; second, metallic regions with electrical conductivity; third regions, which form a negative writing or a transparent region with electrical conductivity, generated by a metallic network structure.
  • the fine, Metallic lines of the third areas can serve as an optical, recognizable with the magnifying glass security feature.
  • the tear-forming coating is printed as a motif on a (in particular transparent) substrate, such as a foil, which may optionally have an embossing lacquer layer or embossed structures, in a first step. Thereafter, the surface coating with a metal, e.g. by vapor deposition. The crack-forming coating is then removed to obtain a security element having the following ranges: first regions each formed by a bare (i.e., continuous) metal layer; second areas, each formed by a metallic mesh structure with fine, metallic lines. Using a resist varnish, the first and / or second areas can be printed. In a subsequent etching process, removal or conversion of the non-resist-coated metal occurs.
  • a security element having the following ranges is obtained: first areas forming a "true" negative writing (i.e., recesses or areas without any metal) without electrical conductivity; second, metallic regions with electrical conductivity; third regions, which form a negative writing or a transparent region with electrical conductivity, generated by a metallic network structure.
  • the fine, metallic lines of the third areas can serve as an optical, with the magnifying glass recognizable security feature.
  • an embossing lacquer layer which is provided with a (hologram) embossment is applied to a (in particular transparent) substrate, such as a film is.
  • the embossing lacquer layer is coated over its entire area with the crack-forming coating.
  • the crack-forming coating is then dried. This forms fine cracks. Without targeted external action, the crack formation occurs at random.
  • Crack formation can be controlled by appropriate means such that crack formation preferably occurs in desired regions of the crack-forming layer. This can be done, for example, by a suitable structuring of the substrate, for example the embossing lacquer layer.
  • the metallization of the security element according to the invention can be based on a single metal.
  • a metal e.g. Aluminum, silver, copper, nickel, iron, chromium, cobalt, gold, titanium, tin, zinc or an alloy of one or more of the foregoing elements (e.g., an iron-silicon alloy).
  • the metallization may be based on a multilayer metallization, e.g. is obtainable by successive vapor deposition.
  • An advantageous multilayer metallization is e.g. a Cr layer followed by an Al layer. The adhesion of the Al layer to the layer structure is improved by the Cr layer.
  • the electrical conductivity of the metallization according to the invention in the form of a dense, coherent network can be improved by an additional coating with an electrically conductive polymer.
  • the electrically conductive polymer is, for example, an electrically conductive thiophene-based polymer such as poly-3,4-ethylenedioxythiophene (PEDOT or PEDT).
  • PEDOT or PEDT poly-3,4-ethylenedioxythiophene
  • inorganic, transparent and conductive layers for example metal oxides such as titanium dioxide, indium tin oxide or fluorine-tin oxide, can be applied. These additional layers can also serve to modify the electrical properties of the metallization according to the invention, such as the work function, in a controlled manner.
  • metal is deposited within the cracks of the cracked coating, metal may also be deposited above the cracked coating.
  • the cracked coating is then removed, along with any metal deposited above the coating.
  • the step of removing may e.g. by washing with a suitable solvent ("Alternative 1").
  • the removal step may be accomplished by means of a separately provided adhesive layer device, the device being affixed to the tear-resistant coating of the security element substrate to be removed by the adhesive layer, and after being fixed together with the cracked coating is subtracted from the security element substrate ("alternative 2").
  • the carrier substrate can be provided in certain areas with a crack-forming coating.
  • the carrier substrate can additionally be provided with a transparent lacquer in certain regions (which are arranged, in particular, outside the regions of the tear-forming coating) which forms no cracks.
  • the transparent, conductive metallization obtained in the production process according to the invention in the form of a dense, coherent network can be subsequently removed by means of laser radiation in certain areas (so-called laser demetallization).
  • laser demetallization a laser demetallization
  • the opaque or continuous, conductive metallization obtained in the manufacturing method according to the invention can be subsequently removed by laser radiation in certain areas. In this way structuring of the opaque, conductive metallization is possible, i. vacancies or demetallized areas can be provided.
  • FIG. 1 shows a document of value 1, in the present example a banknote with the denomination "50".
  • the banknote 1 is provided on the front with a strip-shaped security element 2.
  • the security element 2 has embossed structures 3, such as hologram embossing.
  • FIG. 2 shows the in the FIG. 1 with the letter "A" designated area of the security element 2 in magnification.
  • FIG. 3 shows the security element 2 of FIG. 2 in cross-sectional view along the line A-A '.
  • the security element 2 comprises a transparent carrier substrate 4, for example a film based on polyethylene terephthalate or another plastic.
  • the carrier substrate 4 is provided with an embossing lacquer layer 5.
  • embossing lacquer layer 5 has an embossed structure, such as a hologram embossing.
  • the embossing lacquer layer 5 is provided over its entire surface with a transparent, conductive metallization 6 in the form of a dense, coherent network.
  • FIG. 4 illustrates the individual manufacturing steps for obtaining a transparent, conductive metallization in the form of a dense, coherent network.
  • the carrier substrate 4 (which in the FIG. 3 embossing lacquer layer 5 has been omitted for the sake of simplicity) is provided in a first step with a crack-forming coating 7.
  • the crack-forming coating 7 is based, for example, on dispersions of SiO 2 nanoparticles or of acrylic resin nanoparticles.
  • the application of the crack-forming coating 7 is preferably carried out by printing technology, for example by gravure printing, flexographic printing or by means of an inkjet process.
  • the crack-forming coating 7 forms numerous cracks 8 during drying in the form of a dense, coherent network.
  • the metallization 9 is in the FIG. 4 shown schematically in the form of individual black dots.
  • the metallization 9 is deposited on the one hand above the cracked coating 7 and on the other hand is deposited within the cracks 8 of the coating 7.
  • the cracked coating 7 is removed, including the metallization 9 present above the coating 7.
  • On the carrier substrate 4 remains a transparent, conductive metallization 10 in the form of a dense, coherent network.
  • FIG. 5 shows the transparent, conductive metallization 10 in the form of a dense, coherent network schematically in plan view in an enlarged view.
  • FIGS. 6 to 8 illustrate the manufacture of a security element according to the second preferred embodiment described above.
  • a carrier substrate 4 is provided with an embossing lacquer layer 5.
  • the embossing lacquer layer 5 is printed with wash ink 11 in the form of a motif. Subsequently, 7 further motif elements are printed using a crack-forming lacquer.
  • the crack-forming coating 7 forms numerous cracks 8 during drying in the form of a dense, coherent network.
  • the step of metallizing for example by vapor deposition of metal 9.
  • the metallization 9 is reflected on the one hand above the cracked coating 7 and above the wash paint 11 and, on the other hand, is deposited within the cracks 8 of the coating 7.
  • the fine, metallic lines of the third regions 14 can serve as optical security feature recognizable by the magnifying glass.
  • FIGS. 9 to 13 illustrate the manufacture of a security element according to the third preferred embodiment described above.
  • a carrier substrate 4 is provided with an embossing lacquer layer 5.
  • the embossing lacquer layer 5 is printed with a tear-forming coating 7 in the form of a motif.
  • the crack-forming coating 7 forms numerous cracks 8 during drying in the form of a dense, coherent network.
  • the step of metallizing for example by vapor deposition of metal 9.
  • the metallization 9 is on the one hand above the cracked coating. 7 and above the embossing lacquer layer 5, and on the other hand, it is deposited inside the cracks 8 of the coating 7.
  • the fine, metallic lines of the third regions 14 can serve as optical security feature recognizable by the magnifying glass.
  • the resulting security element structure can be additionally leveled with a protective lacquer 18.
  • the formation of individual cracks 8 can be controlled by appropriate measures.
  • the formation of cracks in desired regions preferably occurs.
  • FIGS. 15 to 18 illustrate the preparation of a security element, wherein the removal of the cracked coating is not carried out by means of a solvent, but by a detachment in the form of a kind of lamination and separation winding (see the "alternative 2" described above).
  • a carrier substrate 4 (which may be provided with an embossing lacquer layer, not shown) is printed with a tear-forming coating 7 in the form of a motif.
  • the crack-forming coating 7 forms numerous cracks 8 during drying in the form of a dense, coherent network.
  • the metallization 9 is deposited on the one hand above the cracked coating 7 and above the carrier substrate 4 and on the other hand is deposited within the cracks 8 of the coating 7.
  • FIG. 16 Now is the bonding of the in the FIG. 15 shown security element precursor with a separate device 19, which has a provided with an adhesive coating 21 substrate 20 (eg, a film).
  • an adhesive coating 21 substrate 20 eg, a film
  • the metal provided on the cracked coating 7 combines with the adhesive coating 21.
  • the coating 7 provided with cracks serves as a spacer for the carrier substrate 4 and the metal deposited directly on the carrier substrate 4.
  • Figures 19-21 show a variant to that in the FIGS. 15, 16 and 18 shown manufacturing method, wherein additionally a transparent lacquer is used.
  • a carrier substrate 4 (which may be provided with an embossing lacquer layer, not shown) is printed with a tear-forming coating 7 in the form of a motif.
  • the crack-forming coating 7 forms numerous cracks 8 during drying in the form of a dense, coherent network.
  • the carrier substrate 4 (which may be provided with an embossing lacquer layer, not shown) is provided with areas 22 of a transparent lacquer.
  • the transparent paint 22 forms no cracks.
  • the metallizing for example by vapor deposition of metal 9.
  • the metallization 9 beats on the one hand above the cracked coating 7, above the transparent varnish 22 and above the carrier substrate 4 and on the other hand is deposited within the cracks 8 of the coating 7.
  • FIG. 20 Now is the bonding of the in the FIG. 19 shown security element precursor with a separate device 19, which has a provided with an adhesive coating 21 substrate 20 (eg, a film).
  • an adhesive coating 21 substrate 20 eg, a film.
  • the coating 7 provided on the cracks and the metal lying on the transparent lacquer 22 combine with the adhesive coating 21.
  • the metal is peeled off from the cracked coating 7 and from the transparent varnish 22 (see FIG FIG. 21 ).
  • the security element obtained in this way has no metallization in the region 22 of the transparent lacquer.
  • the transparent paint 22 can be chosen with respect to its objective nature so that it comes in the separation winding either for stripping the metal from the transparent paint 22 (see FIG. 21 ) or to completely peel off the transparent varnish 22 (similar to that in FIG FIG. 17 shown).

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Business, Economics & Management (AREA)
  • Accounting & Taxation (AREA)
  • Finance (AREA)
  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Printing Methods (AREA)

Claims (6)

  1. Procédé de fabrication d'un élément de sécurité (2) pour un papier de sécurité ou un objet de valeur (1), en particulier un document de valeur, comprenant les étapes suivantes :
    a) la mise à disposition d'un substrat porteur (4) transparent ;
    b) la mise à disposition d'une couche de vernis de gaufrage (5) présentant une structure gaufrée sur le substrat porteur (4) ;
    d) l'application d'un revêtement formant fissure (7) sur la couche de vernis de gaufrage (5) et séchage du revêtement formant fissure (7), cependant que le revêtement (7) engendre, lors du séchage, de nombreuses fissures (8) sous forme d'un réseau d'un seul tenant à ramification dense ;
    e) l'application d'une métallisation (9) sur le substrat porteur (4) obtenu à l'étape d), cependant que du métal est déposé à l'intérieur des fissures (8) du revêtement (7) pourvu de fissures (8), éventuellement aussi au-dessus du revêtement (7) pourvu de fissures (8) ;
    f) l'enlèvement du revêtement (7) pourvu de fissures (8) y compris éventuellement du métal se trouvant sur le revêtement (7), de telle sorte que, dans la zone du revêtement (7) pourvu de fissures (8) enlevé, il reste sur la couche de vernis de gaufrage (5) une métallisation transparente conductrice sous forme d'une réseau d'un seul tenant à ramification dense.
  2. Procédé selon la revendication 1, cependant que
    soit entre les étapes b) et d), soit entre les étapes d) et e), entre outre l'étape c) a lieu, à savoir l'application d'une encre lavable (11) sur la couche de vernis de gaufrage (5) dans des premières zones qui constituent un premier motif ;
    à l'étape d), le revêtement formant fissure (7) est appliqué dans des deuxièmes zones qui constituent un deuxième motif, cependant que les deuxièmes zones sont choisies indépendamment des premières zones, de telle sorte que des premières zones éventuellement garnies d'encre lavable (11) sont revêtues au moins partiellement avec un revêtement formant fissure (7) ; et
    après l'étape e) de l'application de la métallisation (9), l'étape f) a lieu de telle façon que d'une part l'encre lavable (11) se trouvant dans les premières zones et revêtue de métal et d'autre part le revêtement (7) pourvu de fissures (8) se trouvant dans les deuxièmes zones et portant éventuellement du métal sont enlevés, de telle sorte que le substrat porteur (4) obtenu est de telle nature que :
    - dans les premières zones, qui constituent un premier motif, il ne comporte pas de métallisation ;
    - dans les deuxièmes zones, qui constituent un deuxième motif, il comporte à l'extérieur de premières zones éventuellement existantes une métallisation transparente conductrice sous forme d'une réseau d'un seul tenant à ramification dense ;
    - dans les zones qui ne font pas partie des premières zones qui constituent un premier motif, ni des deuxièmes zones qui constituent un deuxième motif, il comporte une métallisation opaque conductrice.
  3. Procédé selon la "revendication 1 ou 2, comprenant en outre :
    g) l'application d'un vernis resist (17) au-dessus de la métallisation obtenue dans des troisièmes zones, qui constituent un troisième motif ;
    h) l'enlèvement de la métallisation qui n'est pas protégée par du vernis resist (17), de telle sorte qu'il reste sur la couche de vernis de gaufrage (5) les zones protégées par du vernis resist (17), sous forme d'un troisième motif.
  4. Procédé selon la revendication 3, comprenant en outre :
    i) la garniture et le nivellement du substrat porteur (4) obtenu à l'étape h), avec un vernis de protection (18) qui présente le même indice de réfraction que le vernis resist (17).
  5. Elément de sécurité (2) destiné à un papier de sécurité ou à un objet de valeur (1), en particulier à un document de valeur, pouvant être obtenu par le procédé selon une des revendications de 1 à 4, cependant que l'élément de sécurité comprend un substrat porteur (4) transparent sur lequel est agencée une couche de vernis de gaufrage (5) comportant un structure gaufrée, et que la couche de vernis de gaufrage (5) est pourvue d'une métallisation (10) transparente conductrice sous forme d'une réseau d'un seul tenant, irrégulier, à ramification dense, consistant en des lignes fines d'une épaisseur de ligne d'au maximum 50 µm.
  6. Papier de sécurité ou document de valeur (1), comprenant l'élément de sécurité (2) selon la revendication 5.
EP16730682.8A 2015-06-05 2016-06-02 Procédé de fabrication d'un élément de sécurité, élément de sécurité, papier de sécurité et document de valeur obtenables par ce procédé Active EP3302997B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015007233.1A DE102015007233A1 (de) 2015-06-05 2015-06-05 Verfahren zum Herstellen eines Sicherheitselements, daraus erhältliches Sicherheitselement, Sicherheitspapier und Wertdokument
PCT/EP2016/000909 WO2016192854A1 (fr) 2015-06-05 2016-06-02 Procédé de fabrication d'un élément de sécurité, élément de sécurité obtenu selon ledit procédé, papier sécurisé et document de valeur

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EP3302997B1 true EP3302997B1 (fr) 2019-05-22

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DE102017010744A1 (de) * 2017-11-21 2019-05-23 Giesecke+Devrient Currency Technology Gmbh Verfahren zum Herstellen eines Sicherheitselementes mit einer durch Laserstrahlung erzeugten Öffnung in einer metallischen Schicht

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DE4041025C2 (de) 1990-12-20 2003-04-17 Gao Ges Automation Org Magnetischer, metallischer Sicherheitsfaden mit Negativschrift
DE19548528A1 (de) 1995-12-22 1997-06-26 Giesecke & Devrient Gmbh Sicherheitsdokument mit einem Sicherheitselement und Verfahren zu dessen Herstellung
DE19739193B4 (de) 1997-09-08 2006-08-03 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitsfolien für Wertpapiere
DE102006037431A1 (de) 2006-08-09 2008-04-17 Ovd Kinegram Ag Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
DE102009033221A1 (de) * 2009-07-14 2011-01-27 Human Bios Gmbh Sicherheitselement zur Kennzeichnung oder Identifikation von Gegenständen und Lebewesen

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DE102015007233A1 (de) 2016-12-08
WO2016192854A1 (fr) 2016-12-08

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