EP2066497A4 - Herstellungsverfahren für metallkaschierte laminate - Google Patents

Herstellungsverfahren für metallkaschierte laminate

Info

Publication number
EP2066497A4
EP2066497A4 EP07807946.4A EP07807946A EP2066497A4 EP 2066497 A4 EP2066497 A4 EP 2066497A4 EP 07807946 A EP07807946 A EP 07807946A EP 2066497 A4 EP2066497 A4 EP 2066497A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing methods
metal clad
clad laminates
laminates
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07807946.4A
Other languages
English (en)
French (fr)
Other versions
EP2066497A1 (de
EP2066497B1 (de
Inventor
Kwang Choon Chung
Hyun Nam Cho
Seong Yong Uhm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
InkTec Co Ltd
Original Assignee
InkTec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060074388A external-priority patent/KR100832002B1/ko
Priority claimed from KR1020060074311A external-priority patent/KR100776180B1/ko
Application filed by InkTec Co Ltd filed Critical InkTec Co Ltd
Publication of EP2066497A1 publication Critical patent/EP2066497A1/de
Publication of EP2066497A4 publication Critical patent/EP2066497A4/de
Application granted granted Critical
Publication of EP2066497B1 publication Critical patent/EP2066497B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
EP07807946.4A 2006-08-07 2007-08-02 Herstellungsverfahren für metallkaschierte laminate Not-in-force EP2066497B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020060074388A KR100832002B1 (ko) 2006-08-07 2006-08-07 저저항 금속 패턴 형성방법
KR1020060074311A KR100776180B1 (ko) 2006-08-07 2006-08-07 금속적층판의 제조방법
PCT/KR2007/003737 WO2008018719A1 (en) 2006-08-07 2007-08-02 Manufacturing methods for metal clad laminates

Publications (3)

Publication Number Publication Date
EP2066497A1 EP2066497A1 (de) 2009-06-10
EP2066497A4 true EP2066497A4 (de) 2014-12-10
EP2066497B1 EP2066497B1 (de) 2018-11-07

Family

ID=39033210

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07807946.4A Not-in-force EP2066497B1 (de) 2006-08-07 2007-08-02 Herstellungsverfahren für metallkaschierte laminate

Country Status (6)

Country Link
US (1) US8764960B2 (de)
EP (1) EP2066497B1 (de)
JP (1) JP5139429B2 (de)
AR (1) AR062235A1 (de)
TW (1) TWI357447B (de)
WO (1) WO2008018719A1 (de)

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KR100922810B1 (ko) * 2007-12-11 2009-10-21 주식회사 잉크테크 흑화 전도성 패턴의 제조방법
KR101675493B1 (ko) * 2008-03-18 2016-11-14 주식회사 잉크테크 복합 기능 코팅액 조성물
CN104894538A (zh) * 2008-10-17 2015-09-09 Ncc纳诺责任有限公司 还原低温基底上的薄膜的方法
KR101180475B1 (ko) * 2009-02-05 2012-09-07 주식회사 엘지화학 전도성 패턴의 형성방법 및 이에 의하여 제조된 전도성 패턴을 갖는 기판
RU2494201C2 (ru) * 2009-03-31 2013-09-27 Андрей Виленович Любомирский Облицовочная панель (варианты)
RU2494202C2 (ru) * 2009-03-31 2013-09-27 Андрей Виленович Любомирский Облицовочная панель (варианты)
JP5609290B2 (ja) * 2010-06-15 2014-10-22 コニカミノルタ株式会社 太陽光反射用ミラー、フィルムミラー及びその製造方法
KR101487342B1 (ko) * 2010-07-30 2015-01-30 주식회사 잉크테크 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막
KR101420115B1 (ko) 2010-07-30 2014-07-21 주식회사 잉크테크 투명 도전막의 제조방법 및 이로부터 제조되는 투명 도전막
KR101531891B1 (ko) 2011-04-20 2015-06-29 주식회사 잉크테크 은 잉크 조성물
KR102050029B1 (ko) * 2011-08-26 2019-11-29 삼성디스플레이 주식회사 도너 기판, 도너 기판의 제조 방법, 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
JP2013112848A (ja) * 2011-11-28 2013-06-10 Shikoku Chem Corp 銀被膜の形成剤及び形成方法
JP2016536566A (ja) * 2013-11-22 2016-11-24 シリコーン バリー カンパニー，リミテッド 金属薄板を積層した半導体検査パッド及び製造方法
US10076032B2 (en) * 2014-03-20 2018-09-11 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
JP6585032B2 (ja) 2014-03-27 2019-10-02 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
US10076028B2 (en) 2015-01-22 2018-09-11 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board
CN107427354A (zh) 2015-03-30 2017-12-01 C·R·巴德股份有限公司 向医疗装置施加抗微生物剂
JP6819983B2 (ja) * 2015-06-23 2021-01-27 地方独立行政法人東京都立産業技術研究センター めっき付き樹脂成形体
JP6564282B2 (ja) * 2015-08-28 2019-08-21 国立大学法人大阪大学 金属含有膜付き誘電体基材の製造方法
CN107474724B (zh) * 2016-06-07 2019-10-18 鹏鼎控股(深圳)股份有限公司 覆铜基板的制备方法
KR101871068B1 (ko) * 2016-12-01 2018-06-25 서울대학교산학협력단 축전식 탈염공정 또는 유가 이온 추출 공정용 은 코팅 전극 제조방법 및 이를 이용한 축전식 탈염공정 또는 유가 이온 추출 공정용 전극
KR102188997B1 (ko) * 2017-02-28 2020-12-09 동우 화인켐 주식회사 투명 필름 안테나
JP7340179B2 (ja) * 2018-05-24 2023-09-07 学校法人 芝浦工業大学 導体の製造方法、配線基板の製造方法及び導体形成用組成物
EP3817785A4 (de) 2018-07-02 2022-07-20 C. R. Bard, Inc. Antimikrobielle katheteranordnungen und verfahren dafür

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US2699424A (en) * 1949-10-07 1955-01-11 Motorola Inc Electroplating process for producing printed circuits
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US20030171003A1 (en) * 2002-03-07 2003-09-11 Lg. Philips Lcd Co., Ltd. Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
US20030180448A1 (en) * 2002-03-21 2003-09-25 T.L.M. Advanced Laser Technology Ltd. Method for fabrication of printed circuit boards
WO2006083153A1 (en) * 2005-02-07 2006-08-10 Inktec Co., Ltd. Organic silver complexes, their preparation methods and their methods for forming thin layers

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US2699424A (en) * 1949-10-07 1955-01-11 Motorola Inc Electroplating process for producing printed circuits
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US20030171003A1 (en) * 2002-03-07 2003-09-11 Lg. Philips Lcd Co., Ltd. Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
US20030180448A1 (en) * 2002-03-21 2003-09-25 T.L.M. Advanced Laser Technology Ltd. Method for fabrication of printed circuit boards
WO2006083153A1 (en) * 2005-02-07 2006-08-10 Inktec Co., Ltd. Organic silver complexes, their preparation methods and their methods for forming thin layers

Also Published As

Publication number Publication date
EP2066497A1 (de) 2009-06-10
JP2010500476A (ja) 2010-01-07
AR062235A1 (es) 2008-10-22
JP5139429B2 (ja) 2013-02-06
TWI357447B (en) 2012-02-01
WO2008018719A1 (en) 2008-02-14
EP2066497B1 (de) 2018-11-07
US8764960B2 (en) 2014-07-01
US20100261031A1 (en) 2010-10-14
TW200813257A (en) 2008-03-16

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