EP2048198B1 - Composition de résine ignifuge - Google Patents
Composition de résine ignifuge Download PDFInfo
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- EP2048198B1 EP2048198B1 EP07791547A EP07791547A EP2048198B1 EP 2048198 B1 EP2048198 B1 EP 2048198B1 EP 07791547 A EP07791547 A EP 07791547A EP 07791547 A EP07791547 A EP 07791547A EP 2048198 B1 EP2048198 B1 EP 2048198B1
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- European Patent Office
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- resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 53
- 239000003063 flame retardant Substances 0.000 title claims abstract description 36
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 35
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 83
- 229920001577 copolymer Polymers 0.000 claims abstract description 82
- 239000000178 monomer Substances 0.000 claims abstract description 56
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 33
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 150000001993 dienes Chemical class 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims abstract description 16
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 229910052698 phosphorus Inorganic materials 0.000 claims description 11
- 239000011574 phosphorus Substances 0.000 claims description 11
- 229920000877 Melamine resin Polymers 0.000 claims description 10
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229920000388 Polyphosphate Polymers 0.000 claims description 8
- 239000001205 polyphosphate Substances 0.000 claims description 8
- 235000011176 polyphosphates Nutrition 0.000 claims description 8
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 abstract description 14
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 11
- 238000013508 migration Methods 0.000 abstract description 7
- 230000005012 migration Effects 0.000 abstract description 7
- -1 phosphate ester Chemical class 0.000 description 46
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 22
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 20
- 229920000642 polymer Polymers 0.000 description 19
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 17
- 239000004810 polytetrafluoroethylene Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 13
- 229910019142 PO4 Inorganic materials 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000010452 phosphate Substances 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 12
- 238000005984 hydrogenation reaction Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 239000004793 Polystyrene Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 239000003112 inhibitor Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OWICEWMBIBPFAH-UHFFFAOYSA-N (3-diphenoxyphosphoryloxyphenyl) diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1)(=O)OC1=CC=CC=C1 OWICEWMBIBPFAH-UHFFFAOYSA-N 0.000 description 3
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical group C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 0 Cc(c(C)c1*)c(C)c(*)c1OC Chemical compound Cc(c(C)c1*)c(C)c(*)c1OC 0.000 description 3
- 101100323621 Drosophila melanogaster Drip gene Proteins 0.000 description 3
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- 239000004254 Ammonium phosphate Substances 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000005662 Paraffin oil Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- ZJKCITHLCNCAHA-UHFFFAOYSA-K aluminum dioxidophosphanium Chemical compound [Al+3].[O-][PH2]=O.[O-][PH2]=O.[O-][PH2]=O ZJKCITHLCNCAHA-UHFFFAOYSA-K 0.000 description 2
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 2
- 235000019289 ammonium phosphates Nutrition 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 150000002431 hydrogen Chemical group 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 150000002642 lithium compounds Chemical class 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000012285 osmium tetroxide Substances 0.000 description 2
- 229910000489 osmium tetroxide Inorganic materials 0.000 description 2
- 150000008039 phosphoramides Chemical class 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000137 polyphosphoric acid Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- AWYVETCHVQGXMB-UHFFFAOYSA-N (3-hydroxyphenyl) diphenyl phosphate Chemical compound OC1=CC=CC(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)=C1 AWYVETCHVQGXMB-UHFFFAOYSA-N 0.000 description 1
- FJUJZGNQVISAPS-UHFFFAOYSA-N (4-methylphenyl) bis(2,5,5-trimethylhexyl) phosphate Chemical compound CC(C)(C)CCC(C)COP(=O)(OCC(C)CCC(C)(C)C)OC1=CC=C(C)C=C1 FJUJZGNQVISAPS-UHFFFAOYSA-N 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 125000006585 (C6-C10) arylene group Chemical group 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- ZMYIIHDQURVDRB-UHFFFAOYSA-N 1-phenylethenylbenzene Chemical group C=1C=CC=CC=1C(=C)C1=CC=CC=C1 ZMYIIHDQURVDRB-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- NCVFZIASVZHSOI-UHFFFAOYSA-N 2-chloroethyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCl)OC1=CC=CC=C1 NCVFZIASVZHSOI-UHFFFAOYSA-N 0.000 description 1
- QDLYDXLYPXBEKO-UHFFFAOYSA-N 2-ethylhexyl bis(4-methylphenyl) phosphate Chemical compound C=1C=C(C)C=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=C(C)C=C1 QDLYDXLYPXBEKO-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- MXRGSJAOLKBZLU-UHFFFAOYSA-N 3-ethenylazepan-2-one Chemical compound C=CC1CCCCNC1=O MXRGSJAOLKBZLU-UHFFFAOYSA-N 0.000 description 1
- DDTHMESPCBONDT-UHFFFAOYSA-N 4-(4-oxocyclohexa-2,5-dien-1-ylidene)cyclohexa-2,5-dien-1-one Chemical compound C1=CC(=O)C=CC1=C1C=CC(=O)C=C1 DDTHMESPCBONDT-UHFFFAOYSA-N 0.000 description 1
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Chemical group 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JXHGEIHXCLLHPI-UHFFFAOYSA-N benzene-1,3-diol;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC(O)=C1 JXHGEIHXCLLHPI-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- OFOXPUGNNSFGPE-UHFFFAOYSA-N bis(2,2-dimethylpropyl) phenyl phosphate Chemical compound CC(C)(C)COP(=O)(OCC(C)(C)C)OC1=CC=CC=C1 OFOXPUGNNSFGPE-UHFFFAOYSA-N 0.000 description 1
- XIMUORXKUCOUFY-UHFFFAOYSA-N bis(2-ethylhexyl) (4-methylphenyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OC1=CC=C(C)C=C1 XIMUORXKUCOUFY-UHFFFAOYSA-N 0.000 description 1
- ZXZYMQCBRZBVIC-UHFFFAOYSA-N bis(2-ethylhexyl) phenyl phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 ZXZYMQCBRZBVIC-UHFFFAOYSA-N 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- YMNCCEXICREQQV-UHFFFAOYSA-L cyclopenta-1,3-diene;titanium(4+);dichloride Chemical compound [Cl-].[Cl-].[Ti+4].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 YMNCCEXICREQQV-UHFFFAOYSA-L 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- YICSVBJRVMLQNS-UHFFFAOYSA-N dibutyl phenyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OC1=CC=CC=C1 YICSVBJRVMLQNS-UHFFFAOYSA-N 0.000 description 1
- RYSCVIAVOSESIU-UHFFFAOYSA-N didodecyl (4-methylphenyl) phosphate Chemical compound CCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCC)OC1=CC=C(C)C=C1 RYSCVIAVOSESIU-UHFFFAOYSA-N 0.000 description 1
- OHZIKCOBQFCTDM-UHFFFAOYSA-N didodecyl phenyl phosphate Chemical compound CCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCC)OC1=CC=CC=C1 OHZIKCOBQFCTDM-UHFFFAOYSA-N 0.000 description 1
- UDTNMDMYVIAQAH-UHFFFAOYSA-N dinaphthalen-2-yl phenyl phosphate Chemical compound C=1C=C2C=CC=CC2=CC=1OP(OC=1C=C2C=CC=CC2=CC=1)(=O)OC1=CC=CC=C1 UDTNMDMYVIAQAH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- JSPBAVGTJNAVBJ-UHFFFAOYSA-N ethyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCC)OC1=CC=CC=C1 JSPBAVGTJNAVBJ-UHFFFAOYSA-N 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011953 free-radical catalyst Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- FVZFCHKRLYMSEQ-UHFFFAOYSA-N naphthalen-1-yl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C2=CC=CC=C2C=CC=1)(=O)OC1=CC=CC=C1 FVZFCHKRLYMSEQ-UHFFFAOYSA-N 0.000 description 1
- JSJUBNHZCFKUKY-UHFFFAOYSA-N naphthalen-2-yl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C2C=CC=CC2=CC=1)(=O)OC1=CC=CC=C1 JSJUBNHZCFKUKY-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002900 organolithium compounds Chemical class 0.000 description 1
- 239000010690 paraffinic oil Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical class OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- OOZBTDPWFHJVEK-UHFFFAOYSA-N tris(2-nonylphenyl) phosphate Chemical compound CCCCCCCCCC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC OOZBTDPWFHJVEK-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003754 zirconium Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
Definitions
- the present invention relates to a flame-retardant resin composition that can be used for a coating material for electric wire and cable, and the like.
- Non-Patent Document 1 and Patent Document 1 proposes flame-retardant resin compositions comprising polyphenylene ether, which is rigid, low fluidity, high dimensional stability, and high flame retardancy; and a hydrogenated copolymer, which is high flexibility, and easily extrusion molded, containing an aromatic vinyl monomer unit and a conjugated diene monomer unit; and a phosphorus flame retardant.
- reducing a content of the polyphenylene ether in the composition is one tactic for responding to the requirements for flexibility and productivity for coating materials.
- the flame retardancy is reduced if the content of polyphenylene ether is reduced.
- a total content of the flame retardant is increased in order to improve the flame retardancy, the problem arises of bleed out of the flame retardant in the resin composition with elapsed time.
- the flame retardant and/or plasticizer migrate into the housing or casing. This causes a defective appearance.
- Patent Document 1 proposes a flame retardant comprising a mixture of ammonium phosphate, a metal hydroxide, and a phosphate ester.
- ammonium phosphate generally has a low heat resistance and a high hygroscopicity.
- phosphate esters are prone to bleed out to the surface of the composition.
- Patent Document 2 proposes a flame-retardant resin composition
- a flame-retardant resin composition comprising 15 parts by weight or more but less than 45 parts by weight of polyphenylene ether, from 0 to 30 parts by weight of a styrene polymer, from 10 to 60 parts by weight of a hydrogenated copolymer containing a copolymer block obtained by a hydrogenation of a copolymer comprising a conjugated diene monomer unit and an aromatic vinyl monomer unit, and from 3 to 40 parts by weight of a phosphorus-type flame retardant selected from phosphorus red, phosphate esters, phosphazene compounds, and phosphoramide compounds.
- the compositions proposed as examples exhibit a low flexibility, a distinct tendency for bleed out to occur, and a distinct tendency for component migration to occur upon contact with another resin such as ABS.
- Patent Document 3 discloses a flame-retardant resin composition that contains a phosphorus-containing compound, aromatic resin, a nitrogen-containing compound, a metal salt of an inorganic acid, and a compound having a functional group that is reactive with the active hydrogen atom or a water-repellent compound.
- a hydrogenated copolymer principally comprising an aromatic vinyl monomer unit and a conjugated diene monomer unit Therefore, the productivity and the flexibility are inadequate.
- An object of the present invention is to provide a flame-retardant resin composition that simultaneously (1) supports high productivities, (2) is resistant to bleed out by the flame retardant present in the composition, (3) is resistant to migration of its components to another resin, such as ABS, (4) exhibits a high flame retardancy, and (5) exhibits high flexibility.
- the present inventors carried out extensive and intensive study in order to accomplish the object described above and aimed at the present invention as a result.
- the present invention is as follows.
- a resin composition comprising components (A), (B), (C), and (D), wherein, based on a total content of components (A), (B), (C), and (D), a content ( ⁇ A>) of the component (A), which is a polyphenylene ether, is 10 % by weight or more but less than 45 % by weight, a content ( ⁇ B>) of the component (B), which is a hydrogenated copolymer principally comprising an aromatic vinyl monomer unit and a conjugated diene monomer unit, is 20 % by weight or more, a content ( ⁇ C>) of the component (C), which is a styrene resin and/or olefin resin, is 0 % by weight or more, and a content ( ⁇ D>) of the component (D), which is a metal phosphinate, is 2 % by weight or more, wherein the content ⁇ A> of the component (A) and the content ⁇ B> of the component (B) satisfy the following formula:
- the resin composition according to (5) comprising a melamine polyphosphate as the component (E).
- a coating material for electric wire and cable comprising the resin composition according to any one of (1) to (6). Further embodiments of the present invention are described in the appended claims.
- the flame-retardant resin composition of the present invention can simultaneously provide the following properties: the ability to support high productivities, resistance to bleed out by the flame retardant present in the composition, resistance to migration by its components into another resin (e.g., ABS), high flame retardancy, and high flexibility.
- the present invention relates to a resin composition
- a resin composition comprising components (A), (B), (C), and (D).
- a homopolymer or copolymer having the following general formula ⁇ a> and/or the following general formula ⁇ b> as a repeat unit or repeat units therein can be used as the component (A) of the present invention, which is a polyphenylene ether.
- R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 represent monovalent residues such as a C 1-4 alkyl group, aryl group, halogen, hydrogen and the like, wherein R 5 and R 6 are not simultaneously hydrogen.
- the typical examples of the polyphenylene ether homopolymer may include poly(2,6-dimethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-phenylene) ether, poly(2-ethyl-6-n-propyl-1,4-phenylene) ether, poly(2,6-di-n-propyl-1,4-phenylene) ether, poly(2-methyl-6-n-butyl-1,4-phenylene) ether, poly(2-ethyl-6-isopropyl-1,4-phenylene) ether, poly(2-methyl-6-chloroethyl-1,4-phenylene) ether, poly(2-methyl-6-hydroxyethyl-1,4-phenylene) ether, and the like.
- polyphenylene ether copolymer may include polyphenylene ether copolymers that are principally composed of the phenylene ether structure, such as copolymers of 2, 6-dimethylphenol with 2, 3, 6-trimethylphenol or o-cresol, copolymers of 2, 3, 6-trimethylphenol with o-cresol, and the like.
- the polyphenylene ether may incorporate various other phenylene ether structures which is previously proposed for possible inclusion in polyphenylene ethers.
- phenylene ether structures proposed for inclusion in small amounts may include the 2-(N-alkyl-N-phenylaminomethyl)-6-methylphenylene ether unit and 2-(dialkylaminomethyl)-6-methylphenylene ether unit described in Japanese Patent Application Laid-open No. S63-301222 and the like.
- the examples of the above copolymers may include a polyphenylene ether in which small amounts of diphenoquinone is bonded in the main chain.
- the examples of the above copolymers may include a polyphenylene ether that has been modified by a compound having a carbon-carbon double bond, as described in Japanese Patent Application Laid-open Nos. H2-276823 , S63-108059 , S59-59724 and the like.
- the examples of the above copolymers may include a copolymer obtained by grafting a styrene compound onto the aforementioned polyphenylene ethers.
- Examples of the above copolymers may include copolymers obtained by the graft polymerization of styrene, ⁇ -methylstyrene, vinyltoluene, chlorostyrene, and the like onto the polyphenylene ether.
- the polyphenylene ether may be modified by a modifying agent that contains a polar group.
- This modified polyphenylene ether refers to a polyphenylene ether that has been modified with at least one modifying agent having in its molecular structure at least one carbon-carbon double bond or triple bond and at least one carboxyl group, acid anhydride group, amino group, hydroxyl group, glycidyl group, or the like.
- the number-average molecular weight of the polyphenylene ether is preferably 2000 or more from the standpoint of the flame retardancy and heat resistance, and is preferably 40000 or less from the standpoint of a productivity.
- the range of from 10000 to 40000 is more preferable, and the range of from 20000 to 30000 is still more preferable.
- Two or more species that have different number-average molecular weights may be mixed in order to improve, for example, the processability, as long as the number-average molecular weight of the mixture is in the aforementioned range.
- the content ⁇ A> of the component (A), which is a polyphenylene ether, based on the total content of components (A), (B), (C), and (D), must be 10 % by weight or more from the standpoints of the flame retardancy, the heat resistance, and the bleed out resistance.
- the content ⁇ A> must be less than 45 % by weight from the standpoint of the productivity and the flexibility and low specific gravity.
- the range of from 15 % by weight to 40 % by weight is preferable, the range of from 15 % by weight to 30 % by weight is more preferable, and the range of from 15 % by weight to 25 % by weight is still more preferable. Weight reduction can be obtained when the specific gravity is low. As a result, the cost per volume may be reduced.
- the hydrogenated copolymer principally comprising an aromatic vinyl monomer unit and a conjugated diene monomer unit in the component (B) is the hydrogenate of a copolymer that principally comprises an aromatic vinyl monomer unit and a conjugated diene monomer unit.
- a content of the aromatic vinyl monomer unit and the conjugated diene monomer unit in the hydrogenated copolymer (B) is preferably 80 % by weight or more, and more preferably 90 % by weight or more.
- the examples of the aromatic vinyl monomer may include a monomer such as styrene, p-methylstyrene, tert-butylstyrene, ⁇ -methylstyrene,1,1-diphenylethylene, and the like. Among these materials, styrene is preferable.
- the examples of the conjugated diene monomer unit may include butadiene, isoprene, and the like. Among these materials, butadiene is preferable from the standpoint of the resistance to bleed out.
- the hydrogenation ratio for this hydrogenated copolymer (B) is preferably 50 % by mole or more of the double bonds in the conjugated diene, more preferably 70 % by mole or more, still more preferably 85 % by mole or more, and most preferably 95 % by mole.
- the weight-average molecular weight of the hydrogenated copolymer (B) is preferably 5 ⁇ 10 4 or more from the standpoint of the heat resistance, and is preferably 40 ⁇ 10 4 or less from the standpoint of the productivity and flexibility.
- the range from of 7 ⁇ 10 4 to 30 ⁇ 10 4 is more preferable and the range of from 12 ⁇ 10 4 to 25 ⁇ 10 4 is more preferable.
- the aromatic vinyl monomer unit is preferably 35 % by weight or more of the hydrogenated copolymer (B) from the standpoint of the flame retardancy, and is preferably 80 % by weight or less from the standpoint of achieving a high flexibility and a high productivity.
- the range of from 40 % by weight to 70 % by weight is more preferable, and the range of from 50 % by weight to 65 % by weight is still more preferable.
- the tan ⁇ peak in dynamic viscoelastic measurement on the hydrogenated copolymer (B) is preferably present in the range from -30°C to 30°C, and more preferably present in the range from -20°C to 20°C.
- the content ⁇ B> of the component (B), which is hydrogenated copolymer, based on the total content of components (A), (B), (C), and (D), must be 20 % by weight or more for the purposes of the flexibility, productivity and low specific gravity. It is preferably 85 % by weight or less from the standpoint of the flame retardancy, productivity, and resistance to bleed out. It is more preferably 30 % by weight or more and 80 % by weight or less, still more preferably 40 % by weight and 70 % by weight or less, and most preferably 50 % by weight or more.
- the relationship between the content ⁇ A> of polyphenylene ether and the content ⁇ B> of hydrogenated copolymer satisfies 1.5 x ⁇ A> ⁇ ⁇ B>.
- the relationship satisfies 2 x ⁇ A> ⁇ ⁇ B>, and more preferably, the relationship satisfies 2.5 x ⁇ A> ⁇ ⁇ B>.
- the example of a method of producing the hydrogenated copolymer (B) may include a method of polymerizing styrene by using an organic lithium compound as a polymerization initiator in an inert hydrocarbon solvent, followed by copolymerizing styrene with butadiene. Furthermore, depending on the particular case, these steps are repeated, or an appropriate coupling agent is added to the polymerization system in a prescribed amount with reference to the organic lithium compound. As a result, an unhydrogenated copolymer is obtained.
- Deactivation of the active species is brought about by the addition to the reaction solution of water, alcohol, acid or the like. Then, the unsaturated double bond in the conjugated diene is hydrogenated by a known method.
- the solution is, for example, steam stripped to separate the polymerization solvent and the hydrogenated copolymer (B) is obtained by drying.
- a optionally selected oxidation inhibitor may be added to the hydrogenated copolymer (B).
- the hydrogenated copolymer (B) preferably contains at least one polymer block (B1) principally comprising an aromatic vinyl monomer unit.
- the hydrogenated copolymer (B) more preferably contains at least two polymer blocks (B1).
- a content of the polymer block (B1) in the hydrogenated copolymer (B) is preferably 5 % by weight or more.
- the content of the polymer block (B1) is preferably 40 % by weight or less from the standpoint of the flexibility and productivity.
- the range of from 10 % by weight to 30 % by weight is more preferable, and the range of from 10 % by weight to 25 % by weight is still more preferable.
- the polymer block (B1) principally comprising an aromatic vinyl monomer unit refers to a polymer block that has a weight-average molecular weight of 2000 or more.
- the weight-average molecular weight of (B1) is preferably 4000 or more, from the standpoint of the resistance to bleed out, heat resistance, and mechanical strength exhibited by the resin composition, and is preferably no greater than 70000 from the perspective of the productivity and flexibility.
- the range of from 6000 to 50000 is more preferable, and the range of from 10000 to 20000 is still more preferable.
- the hydrogenated copolymer (B) preferably contains a hydrogenated copolymer block (B2) obtained by the hydrogenation of an aromatic vinyl monomer unit/conjugated diene monomer unit copolymer block.
- a content of the copolymer block (B2) in the hydrogenated copolymer (B) is preferably 20 % by weight or more. The content is more preferably 40 % by weight or more, and still more preferably 60 % by weight or more.
- a content of the aromatic vinyl monomer unit in the hydrogenated copolymer block (B2) is preferably 20 % by weight or more from the standpoint of the flame retardancy and flexibility, and is preferably 95 % by weight or less from the standpoint of the flexibility. From 35 % by weight to 90 % by weight is more preferable, and from 45 % by weight to 80 % by weight is more preferable.
- a method of producing the hydrogenated copolymer block (B2) portion may include, but not limited to, a method of copolymerization in which aromatic vinyl monomer and conjugated diene monomer are simultaneously added in an anionic polymerization.
- the examples of preferred structures for the hydrogenated copolymer (B) may include structures represented by the following general formulas.
- n B1-(B2-B1) n , B1-(B2-B1) n -B2, [(B1-B2) k ] m -X, [(B1-B2) k -B1] m -X X represents the residue from a coupling agent such as silicon tetrachloride, tin tetrachloride, epoxidized soy oil, a polyhalogenated hydrocarbon compound, a carboxylate ester compound, a polyvinyl compound, a bisphenol-based epoxy compound, an alkoxysilane compound, a halogenated silane compound, an ester-based compound, and the like; or the residue from an initiator such as a multifunctional organolithium compound.
- n, k, and m are each integers with values of 1 or more, and generally are from 1 to 5. Any structures represented by the above-mentioned general formulas may also be used in combination.
- a hydrogenated block principally comprising a conjugated diene monomer unit may also be present in the hydrogenated copolymer (B) in order to improve the flexibility and the like.
- a distribution of the aromatic vinyl monomer unit in the hydrogenated copolymer block (B2) in the above general formulas is not particularly limited and may be random, uniform, tapered, or stepped.
- the copolymer block (B2) may also contain a plurality of regions in which the aromatic vinyl monomer unit is uniformly distributed and/or a plurality of regions in which the aromatic vinyl monomer unit is present in a tapered distribution.
- the hydrogenated copolymer block (B2) may also contain a plurality of segments that have different aromatic vinyl monomer unit contents. There is no particular limitation on the distribution of the conjugated diene compound-derived double bonds that have not undergone hydrogenation.
- a styrene resin and/or an olefin resin can be added as component (C) in order to improve the heat resistance, productivity, or economics, as needs arises.
- the styrene resin refers to a polymer obtained by the polymerization, in the presence or absence of a rubbery polymer, of a styrene compound and possibly a compound that is copolymerizable with the styrene compound.
- the styrene compound refers to a compound represented by the following general formula (c).
- R represents hydrogen, lower alkyl, or halogen
- Z is selected from the group consisting of vinyl, hydrogen, halogen, and lower alkyl
- p is an integer from 0 to 5
- the examples of the styrene compound may include styrene, ⁇ -methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, ethylstyrene, and the like.
- the examples of the compound copolymerizable with the styrene compound may include methacrylate esters such as methyl methacrylate, ethyl methacrylate, and the like; unsaturated nitrile compounds such as acrylonitrile, methacrylonitrile, and the like; and acid anhydrides such as maleic anhydride and the like.
- the examples of the rubbery polymer may include conjugated diene-based rubbers, conjugated diene/aromatic vinyl compound copolymers and their hydrogenates, ethylene-propylene copolymer-based rubbers, and the like.
- the preferable examples of the styrene resins for the present invention may include polystyrene and rubber-reinforced polystyrene.
- the olefin resin is a known olefin resin.
- the examples thereof may include a homopolymer of an olefinic monomer such as polyethylene, polypropylene, polybutylene, polyisobutylene, and the like; and an ethylene-propylene-type copolymer, or a copolymer that contains olefinic monomer such as ethylene-ethyl acrylate copolymer and the like.
- Preferable olefin resins are low-crystallinity polypropylenes and ethylene-propylene-type copolymers.
- the styrene resin and/or the olefin resin may be a liquid component at an ambient temperature.
- a content ⁇ C> of the styrene resin and/or the olefin resin (C), based on the total content of components (A), (B), (C), and (D), is preferably 3 % by weight or more from the standpoint of the productivity, and is preferably 40 % by weight or less from the standpoint of the flame retardancy.
- the content ⁇ C> is preferably 5 % by weight or more and 30 % by weight or less, more preferably 8 % by weight or more and 30 % by weight or less.
- the metal phosphinate (D) refers to phosphinate salts represented by the following formula (I) and diphosphinate salts represented by the following formula (II).
- R 1 and R 2 represent straight-chain or branched C 1-6 alkyl and/or aryl, and may be the same or different from each other;
- R 3 represents straight-chain or branched C 1-10 alkylene, C 6-10 arylene, -alkylarylene, or -arylalkylene;
- M represents Mg, Ca, Al, Sb, Sn, Ge, Ti, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, K, and/or a protonated nitrogenous base;
- m is from 1 to 4;
- n is from 1 to 4; and
- x is from 1 to 4.
- Preferred among the preceding from the standpoint of ease of acquisition is any one selected from the group consisting of the zinc salt, aluminum salt, titanium salt, zirconium salt, and iron salt.
- the aluminum salt is more preferable from the standpoint of availability.
- auxiliary agent may be added to a aggregate and/or primary particles of the metal phosphinate (D); the auxiliary agent is a polymer or copolymer based on vinylpyrrolidone, vinyl acetate, or vinylcaprolactam, or a mixture thereof, and/or a polymer or copolymer based on epoxide, urethane, acrylate, ester, amide, stearate, olefin, a cellulose derivative, or a mixture thereof.
- An average particle size of the metal phosphinate (D) is preferably 0.2 ⁇ m or more from the standpoint of the handling characteristics, and is preferably 50 ⁇ m or less from the standpoint of the flame retardancy and the smoothness of the product surface.
- the average particle size is preferably 0.5 ⁇ m or more but 40 ⁇ m or less, more preferably 1 ⁇ m or more but 10 ⁇ m or less.
- a content ⁇ D> of the metal phosphinate (D), based on the total content of components (A), (B), (C), and (D), must be 2 % by weight or more from the standpoint of the flame retardancy. Meanwhile, 20 % by weight or less is preferable from the standpoint of the flexibility and productivity. The range of from 3 % by weight to 15 % by weight is more preferable, and the range of from 4 % by weight to 10 % by weight is still more preferable.
- the resin composition of the present invention may also comprise a phosphorus-based flame retardant other than non-metal-phosphinate (E) for the purpose of cost reduction or flame retardancy and productivity.
- a content of the phosphorus-based flame retardant other than metal phosphinate (E), based on the total quantity of components (A), (B), (C), (D), and (E), is preferably 2 % by weight or more but is preferably 25 % by weight or less from the standpoint of the resistance to bleed out.
- the range of from 2 % by weight to 10 % by weight is more preferable and the range of from 2 % by weight to 5 % by weight is still more preferable.
- the examples of the phosphorus-type flame retardant other than non-metal-phosphinate (E) may include phosphoramide compounds such as red phosphorus, phosphate esters, and the like; and compounds that contain the triazine ring and the like.
- triazine ring-containing melamine polyphosphate from the standpoint of the flame retardancy.
- Melamine polyphosphate is formed from melamine and phosphoric acid.
- the examples may include a cyclic polymetaphosphoric acid which is known as condensed phosphoric acids; and the equimolar addition salt between melamine and a straight-chain polyphosphoric acid.
- a degree of condensation n in these polyphosphoric acids is not particularly limited, and is generally in the range of from 3 to 50 and typically is from 5 to 30.
- a particle size of the melamine polyphosphate is preferably 0.5 ⁇ m or more but 40 ⁇ m or less.
- the examples of the phosphate ester may include triphenyl phosphate, phenyl bisdodecyl phosphate, phenyl bisneopentyl phosphate, phenyl bis(3,5,5'-trimethylhexyl phosphate), ethyl diphenyl phosphate, 2-ethylhexyl di(p-tolyl) phosphate, bis(2-ethylhexyl) p-tolyl phosphate, tritolyl phosphate, bis(2-ethylhexyl) phenyl phosphate, tri(nonylphenyl) phosphate, di(dodecyl) p-tolyl phosphate, tricresyl phosphate, dibutyl phenyl phosphate, 2-chloroethyl diphenyl phosphate, p-tolyl bis(2,5,5'-trimethylhexyl) phosphate, 2-ethyl
- triphenyl phosphate and resorcinol- or bisphenol A-based phosphate ester compounds such as a phosphate ester compound principally composed of bisphenol A bis(diphenyl phosphate) (CR741 manufactured by Daihachi Chemical Industry Co., Ltd.) and a phosphate ester compound principally composed of resorcinol bis(dixylenyl phosphate) (PX200 manufactured by Daihachi Chemical Industry Co., Ltd.).
- the total content of components (A), (B), (C), and (D) in the resin composition of the present invention is preferably 65 % by weight or more of the resin composition.
- the total content is more preferably 75 % by weight or more, still more preferably 85 % by weight or more; and still more preferably 90 % by weight.
- Other components can be a flame retardant auxiliary, vide infra, and other additives as described below.
- the resin composition of the present invention may comprise a flame retardant auxiliary agent in the form of a known drip inhibitor, which is present preferably in the range of from 0.1 % by weight to 5 % by weight in the composition and more preferably in the range of from 0.3 % by weight to 3 % by weight, as needs arises.
- a flame retardant auxiliary agent in the form of a known drip inhibitor, which is present preferably in the range of from 0.1 % by weight to 5 % by weight in the composition and more preferably in the range of from 0.3 % by weight to 3 % by weight, as needs arises.
- the drip inhibitor may include drip inhibitors that form a fibrillar structure in the polyphenylene ether, as represented by polytetrafluoroethylene (PTFE).
- PTFE polytetrafluoroethylene
- PTFEs the following highly dispersible PTFEs are preferable because they impart a good surface appearance to moldings made from modified polyphenylene ether: PTFE prepared by the emulsification and dispersion of PTFE in a solvent such as water; PTFE prepared by encapsulating PTFE with an acrylate ester resin, a methacrylate ester resin, a styrene-acrylonitrile copolymer resin, and the like.
- the PTFE preferably has an average particle size which is, but not limited to, preferably 1 ⁇ m or more and particularly preferably 0.5 ⁇ m or less
- the examples of commercially available products for the PTFE may include Teflon (registered trademark) 30J (manufactured by Mitsui-DuPont Fluorochemical Co., Ltd.), Polyflon (registered trademark) D-2C (manufacture by Daikin Industries, Ltd.), and Aflon (registered trademark) AD1 (manufactured by Asahi Glass Co., Ltd.), and the like.
- polytetrafluoroethylene can also be produced by known methods (refer to US Patent Specification No. 2,393,967 ).
- the polymerization of tetrafluoroethylene can be carried out at a temperature of from 0°C to 200°C and preferably from 20°C to 100°C under a pressure of from 0.7 MPa to 7 MPa in an aqueous solvent using a free-radical catalyst such as sodium peroxydisulfate, potassium, or ammonium.
- a free-radical catalyst such as sodium peroxydisulfate, potassium, or ammonium.
- the polytetrafluoroethylene desirably has a molecular weight of 10 ⁇ 10 4 or more, and preferably of approximately from 20 ⁇ 10 4 to 300 ⁇ 10 4 . This results in an inhibition of dripping when the polytetrafluoroethylene-containing resin composition undergoes burning.
- the combination use of polytetrafluoroethylene and a silicone resin enables an even better inhibition of dripping and a shorter burning time than for the addition of only polytetrafluoroethylene.
- thermoplastic resin such as polyamide, polyester, polycarbonate, and the like, and other additives may also be incorporated on an optional basis.
- additives that is typically incorporated into blends of rubbery polymers.
- additives described in "Chemicals for Incorporation in Rubbers and Plastics" (edited by the Rubber Digest Co.) can also be used.
- the examples thereof may include hydrocarbon oils (naphthenic oils, paraffinic oils, and the like), liquid conjugated dienes, liquid acrylonitrile-butadiene copolymers, liquid styrene-butadiene copolymers, liquid polybutenes, sebacate esters, and phthalate esters; metal oxide pigments such as iron oxides and the like; lubricants such as stearic acid, behenic acid, zinc stearate, calcium stearate, magnesium stearate, ethylenebisstearamide, and the like; release agents; organopolysiloxanes; oxidation inhibitors such as hindered phenol-based oxidation inhibitors and phosphorus-based heat stabilizers; hindered amine-based photostabilizers; benzotriazole-based ultraviolet absorbers, non-phosphorus flame retardants, flame retardant auxiliary agents, static inhibitors; reinforcing agents such as organic fibers, glass fibers, carbon black, and carbon fibers; reinforces
- additives may be used in combination.
- a proportion of each component in the resin composition can be determined by dissolving the resin composition in chloroform, fractionating on a polar column (silica gel), and measurement by nuclear magnetic resonance spectroscopy.
- the resin composition of the present invention is useful in particular in applications that require flexibility.
- a Shore A hardness thereof is used as a indicator for flexibility.
- the value measured according to JIS K 6253 is 95° or less, preferably 90° or less, and more preferably 85° or less.
- the strength is more preferably 150 kg/cm 2 or less, and still more preferably 90 kg/cm 2 or less.
- the hardness value can be reduced, for example, by increasing the content of the hydrogenated copolymer (B) principally comprising the aromatic vinyl monomer unit and the conjugated diene monomer unit in the resin composition, by increasing the content in the hydrogenated copolymer (B) of the conjugated diene monomer unit, or by adding a plasticizer.
- a melt mixing/kneading method can be used that employs a typical mixing device such as a Banbury mixer, single-screw extruder, twin-screw extruder, co-kneader, multiscrew extruder, and the like.
- the styrene resin and/or olefin resin (C) is preferably mixed in advance with the polyphenylene ether (A) during production of the resin composition.
- the mixing of styrene resin is more preferable from the standpoint of the resistance to bleed out.
- the metal phosphinate (D) and/or the phosphorus-based flame retardant other than metal-phosphinate (E) may be added during mixing of the polyphenylene ether (A) with the styrene resin and/or olefin resin (C).
- a masterbatch which is prepared by a preliminary mixing/kneading of the metal phosphinate (D), the phosphorus-based flame retardant other than metal-phosphinate (E), pigment, and the like, may be used.
- the resin composition of the present invention can be used in various applications where flame retardancy is required.
- it can be suitably used for the coating material for electric wire and cable for household electrical components, automotive components, and the like; for the coating material for power cables, communication cables, electrical transmission cables, and the like; and as a construction material.
- the resin composition of the present invention is particularly suitable for use in fields such as coating materials for electric wires and cables.
- the amounts of the styrene monomer unit, 1, 4-bonding unit from butadiene, 1, 2-bonding unit from butadiene, ethylene unit, and butylene unit were measured by nuclear magnetic resonance spectroscopic analysis (NMR) using the following conditions.
- measurement instrument JNM-LA400 (product name, manufactured by JEOL) solvent: deuterated chloroform sample concentration: 50 mg/mL measurement frequency: 400 MHz chemical shift standard: TMS (tetramethylsilane) pulse delay: 2.904 s number of scans: 64 pulse width: 45° measurement temperature: 26°C
- the content of the styrene polymer block was measured by the osmium tetroxide analytical method described by I. M. Kolthoff et al., J. Polym. Sci. 1, 429 (1946 ) using the unhydrogenated copolymer.
- a tert-butanol solution of osmium tetroxide with a concentration of 0.1 g/125 mL was used in this analysis of the unhydrogenated copolymer.
- the weight-average molecular weight (M w ) and the number-average molecular weight (M n ), each as the polystyrene-based molecular weight, and the molecular weight distribution (M w /M n ) were determined using the following conditions.
- Polyphenylene ether poly(2,6-dimethyl-1,4-phenylene) ether powder manufactured by Asahi Kasei Chemicals Corporation was used.
- the following method was used to prepare the hydrogenation catalyst that was employed for the hydrogenation of the copolymer principally comprising an aromatic vinyl monomer unit and conjugated diene monomer unit.
- the content of styrene in the obtained copolymer was 57 % by weight; the content of the polymer block principally comprising styrene in the copolymer was 15 % by weight; the content of styrene in the hydrogenated copolymer block principally comprising styrene and butadiene was 49 % by weight; and the 1,2-bonding unit was 22% of the butadiene.
- the hydrogenation catalyst described above was added to the obtained copolymer at 100 ppm as titanium based on 100 parts by weight of the polymer and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 75°C.
- Octadecyl 3-(3, 5-di-t-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to the resulting polymer solution at 0.3 parts by mass based on 100 parts by mass of the hydrogenated copolymer.
- the weight-average molecular weight of the obtained hydrogenated copolymer was 19 ⁇ 10 4 and the hydrogen addition ratio to the butadiene-originating double bonds present in the hydrogenated copolymer was 99%.
- the tan ⁇ peak obtained by viscoelastic measurement was present at 0°C.
- Batch polymerization was carried out using a jacketed and stirrer-equipped tank-type reactor with a capacity of 10 L. 6.4 L of cyclohexane and 80 g of styrene were first added; TMEDA was preliminarily added so as to provide 0.25 time mole based on Li of undermentioned n-buthyllithium; and n-butyllithium was added so as to provide 10 mmol of Li.
- the content of the styrene in the obtained copolymer was 51 % by weight; the content of the polymer block principally comprising styrene in the copolymer was 15 % by weight; the content of styrene in the hydrogenated copolymer block principally comprising styrene and butadiene was 42 % by weight; and the 1,2-bonding unit was 22% of the butadiene.
- the hydrogenation catalyst described above was added to the obtained copolymer at 100 ppm as titanium based on 100 parts by weight of the polymer and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 75°C.
- Octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to the resulting polymer solution at 0.3 part by mass based on 100 parts by mass of the hydrogenated copolymer.
- the weight-average molecular weight of the obtained hydrogenated copolymer was 16 ⁇ 10 4 and the hydrogen addition ratio to the butadiene-originating double bonds present in the hydrogenated copolymer was 99%.
- the tan ⁇ peak obtained by viscoelastic measurement was present at -13°C.
- styrene resin polystyrene (grade: PS1, product name, manufactured by Asahi Kasei)
- olefin resin polypropylene (grade: SA510, product name, manufactured by Japan Polyolefins)
- Paraffin Oil PW90 (product name, manufactured by Idemitsu Chemical)
- the smoothness of the surface of the coated wire obtained according to (3) was visually evaluated.
- sample a sample (2.5 ⁇ 50 ⁇ thickness 2.0 mm) obtained according to (4-2) by press-molding the pellets
- the sample was stacked on an injection molding of ABS resin, and, after 48 hours at 60°C under a load of 1 kg, the ABS surface of the contact area was visually examined.
- a VW-1 combustion test was carried out according to UL1581.
- the flexibility is good when the strength at a 100% pull is no greater than 350 kg/cm 2 .
- the flame-retardant resin composition of the present invention is well-adapted for use in the field of coating materials for electric wire and cable and the like.
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Claims (10)
- Composition de résine, comprenant les composants (A), (B), (C), et (D), dans laquelle, sur la base de la teneur totale des composants (A), (B), (C), et (D),
une teneur (<A>) du composant (A), qui est un éther de polyphénylène, est de 10 %en poids ou plus mais inférieure à 45 % en poids,
une teneur (<B>) du composant (B), qui est un copolymère hydrogéné comprenant principalement une unité de monomère vinylique aromatique et une unité de monomère de diène conjugué, est de 20 % en poids ou plus,
une teneur (<C>) du composant (C), qui est une résine styrène et/ou une résine oléfine, est de 0 % en poids ou plus, et
une teneur (<D>) du composant (D), qui est un phosphinate de métal est de 2 % en poids ou plus,
où la teneur <A> du composant (A) et la teneur <B> du composant (B) satisfont à la formule suivante :
et où la composition de résine a une dureté Shore A mesurée selon JIS K 6253 de 95° ou moins. - Composition de résine selon l'une quelconque des revendications 1 à 3, où la composition de résine a une dureté Shore A mesurée selon JIS K 6253 de 90° ou moins.
- Composition de résine selon l'une quelconque des revendications 1 à 3, où la composition de résine a une dureté Shore A mesurée selon JIS K 6253 de 85° ou moins.
- Composition de résine selon l'une quelconque des revendications 1 à 5, dans laquelle le composant (C) est une résine styrène et la teneur <C> est de 3 % en poids ou plus.
- Composition de résine selon l'une quelconque des revendications 1 à 6, dans laquelle une teneur de l'unité de monomère vinylique aromatique dans le composant (B) est de 35 % en poids ou plus.
- Composition de résine selon l'une quelconque des revendications 1 à 7, comprenant en outre un composé contenant un groupe azote en tant que composant (E), qui est un ignifugeant à base de phosphore autre qu'un phosphinate de métal.
- Composition de résine selon la revendication 8, comprenant un polyphosphate de mélamine en tant que composant (E).
- Matériau de revêtement pour fil et câble électrique, comprenant la composition de résine selon l'une quelconque des revendications 1 à 9.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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EP11182866A EP2404965A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182910A EP2404967A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182878A EP2404956A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182886A EP2404966A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11160082A EP2341103A1 (fr) | 2006-08-03 | 2007-07-30 | Composition de résine ignifuge |
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JP2006212645 | 2006-08-03 | ||
PCT/JP2007/064854 WO2008015991A1 (fr) | 2006-08-03 | 2007-07-30 | Composition de résine ignifuge |
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EP11182886.9 Division-Into | 2011-09-27 | ||
EP11182878.6 Division-Into | 2011-09-27 |
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EP2048198A1 EP2048198A1 (fr) | 2009-04-15 |
EP2048198A4 EP2048198A4 (fr) | 2010-09-15 |
EP2048198B1 true EP2048198B1 (fr) | 2012-01-04 |
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EP07791547A Active EP2048198B1 (fr) | 2006-08-03 | 2007-07-30 | Composition de résine ignifuge |
EP11182866A Withdrawn EP2404965A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182910A Withdrawn EP2404967A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182878A Withdrawn EP2404956A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182886A Withdrawn EP2404966A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11160082A Withdrawn EP2341103A1 (fr) | 2006-08-03 | 2007-07-30 | Composition de résine ignifuge |
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EP11182866A Withdrawn EP2404965A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182910A Withdrawn EP2404967A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182878A Withdrawn EP2404956A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11182886A Withdrawn EP2404966A1 (fr) | 2006-08-03 | 2007-07-30 | Composition en résine ignifuge |
EP11160082A Withdrawn EP2341103A1 (fr) | 2006-08-03 | 2007-07-30 | Composition de résine ignifuge |
Country Status (10)
Country | Link |
---|---|
US (2) | US20100022690A1 (fr) |
EP (6) | EP2048198B1 (fr) |
JP (1) | JP4330085B2 (fr) |
KR (6) | KR20090016638A (fr) |
CN (11) | CN102352083A (fr) |
AT (1) | ATE540084T1 (fr) |
ES (1) | ES2375169T3 (fr) |
HK (1) | HK1127850A1 (fr) |
TW (2) | TW200831593A (fr) |
WO (1) | WO2008015991A1 (fr) |
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ES2794000T3 (es) * | 2014-09-29 | 2020-11-17 | Kuraray Co | Método para producir complejo de Tebbe |
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2007
- 2007-07-30 KR KR1020097001880A patent/KR20090016638A/ko not_active Application Discontinuation
- 2007-07-30 EP EP07791547A patent/EP2048198B1/fr active Active
- 2007-07-30 EP EP11182866A patent/EP2404965A1/fr not_active Withdrawn
- 2007-07-30 CN CN2011102296001A patent/CN102352083A/zh active Pending
- 2007-07-30 CN CN2011102296181A patent/CN102321330A/zh active Pending
- 2007-07-30 CN CN2007800278570A patent/CN101495565B/zh active Active
- 2007-07-30 EP EP11182910A patent/EP2404967A1/fr not_active Withdrawn
- 2007-07-30 KR KR1020117030275A patent/KR20120005051A/ko not_active Application Discontinuation
- 2007-07-30 AT AT07791547T patent/ATE540084T1/de active
- 2007-07-30 KR KR1020117030279A patent/KR101223790B1/ko active IP Right Grant
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- 2007-07-30 JP JP2008527735A patent/JP4330085B2/ja active Active
- 2007-07-30 CN CN2011102303363A patent/CN102321333A/zh active Pending
- 2007-07-30 KR KR1020117019109A patent/KR20110104569A/ko not_active Application Discontinuation
- 2007-07-30 WO PCT/JP2007/064854 patent/WO2008015991A1/fr active Application Filing
- 2007-07-30 CN CN2010105229184A patent/CN101967263B/zh not_active Expired - Fee Related
- 2007-07-30 EP EP11182878A patent/EP2404956A1/fr not_active Withdrawn
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- 2007-07-30 CN CN2011102295812A patent/CN102321329A/zh active Pending
- 2007-07-30 CN CN2011102303325A patent/CN102352086A/zh active Pending
- 2007-07-30 KR KR1020117030277A patent/KR20120023108A/ko not_active Application Discontinuation
- 2007-07-30 EP EP11182886A patent/EP2404966A1/fr not_active Withdrawn
- 2007-07-30 CN CN2011102296196A patent/CN102352084A/zh active Pending
- 2007-07-30 EP EP11160082A patent/EP2341103A1/fr not_active Withdrawn
- 2007-08-01 TW TW096128260A patent/TW200831593A/zh unknown
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