EP1828678B1 - Beleuchtungseinrichtung mit mindestens einer leuchtdiode und fahrzeugscheinwerfer - Google Patents

Beleuchtungseinrichtung mit mindestens einer leuchtdiode und fahrzeugscheinwerfer Download PDF

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Publication number
EP1828678B1
EP1828678B1 EP05823447A EP05823447A EP1828678B1 EP 1828678 B1 EP1828678 B1 EP 1828678B1 EP 05823447 A EP05823447 A EP 05823447A EP 05823447 A EP05823447 A EP 05823447A EP 1828678 B1 EP1828678 B1 EP 1828678B1
Authority
EP
European Patent Office
Prior art keywords
illumination device
light
heat sink
emitting diode
vehicle headlight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05823447A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1828678A1 (de
Inventor
Gerhard Behr
Peter Helbig
Thomas Reiners
Ralf Vollmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP1828678A1 publication Critical patent/EP1828678A1/de
Application granted granted Critical
Publication of EP1828678B1 publication Critical patent/EP1828678B1/de
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Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device according to the preamble of patent claim 1 and a vehicle headlight with at least one such lighting device.
  • Such a lighting device is for example in the EP-A 1 298 382 disclosed.
  • This document describes a lighting device with a plurality of light emitting diodes, which are arranged on a heat sink, and an optic and an electrical module for operating the light emitting diodes.
  • This lighting device is intended for use in a vehicle and as a replacement for a conventional light bulb.
  • the US 2004/0190285 A1 discloses a lighting device with a high-power light-emitting diode, which is arranged together with a metallic heat sink and a mounting board with electrical components for operating the light-emitting diodes in a common housing.
  • the US 2002/0125839 A1 discloses a lighting device with light-emitting diodes which are arranged on a mounting plate in a light-transmitting tube.
  • the mounting plate is arranged in a trough-like heat sink.
  • the illumination device has at least one light emitting diode and a heat sink for the at least one light emitting diode, wherein the heat sink has at least one recess in which a mounted with electrical components mounting plate is arranged.
  • the heat sink of the illumination device according to the invention serves both for cooling the light-emitting diodes arranged on it and for cooling the electrical components required for the operation of the light-emitting diodes, which are arranged on the mounting plate.
  • the arrangement of the electrical components on a mounting plate, such as a lead frame, has the advantage that the assembled mounting plate is mounted as a unit on the heat sink.
  • the heat sink in order to increase its surface to optimize the cooling effect cooling ribs, wherein the recess for the assembled with the electrical components mounting plate is arranged in the region of the cooling fins.
  • This ensures a greater spatial distance between the two heat sources on the heat sink, namely the light-emitting diodes and the electrical components.
  • the light-emitting diodes are not heated by the heat generated by the electrical components.
  • one of the cooling fins is provided with the at least one recess for the mounting plate equipped with the electrical components, or one of the cooling fins is replaced by the mounting plate fitted with the electrical components.
  • the mounting plate is thus aligned parallel between two cooling fins and thereby the cooling of the mounted on the mounting plate electrical components is optimized, especially when a cooling gas flow is passed between the cooling fins by means of a blower.
  • the electrical connection of the illumination device is also arranged on the mounting plate in order to ensure a compact construction.
  • the electrical connection is the Lighting device disposed in a further recess of the heat sink to absorb the mechanical stress caused by the use of the electrical contact through the heat sink and not to transfer to the underlying mounting plate with the electrical components mounted thereon.
  • the heat sink of the lighting device according to the invention is provided with means for the correct position mounting of the lighting device in a vehicle headlight.
  • an adjustment of the arranged on the heat sink at least one light emitting diode relative to the optical system of the vehicle headlight is made possible because the at least one light emitting diode is preferably arranged and aligned in a defined position and orientation with respect to the heat sink on the heat sink, as in the German patent application with the Official Gazette 10 2004 052 687.7.
  • the aforementioned means for the correct installation of the illumination device are preferably formed as part of a bayonet closure between the illumination device and the vehicle headlight.
  • the bayonet lock ensures due to the required locking for plug-in rotation movement secure fixation of the lighting device in Anlagenscheinwerter.
  • the stops for the aforementioned plug-in rotary movement ensure the correct orientation of the at least one light emitting diode with respect to the vehicle headlight reflector.
  • the illumination device is located on the bayonet closure in contact with the vehicle headlight reflector, so that this also contributes to heat dissipation.
  • the electrical connection of the illumination device has at least one contact web, which extends perpendicular to the axis of rotation of the bayonet closure, so that by the rotational movement when locking or unlocking the bayonet closure of the electrical contact between the at least one contact web and his Mating contact is made or released on the vehicle headlight.
  • the actuation of the bayonet closure and the electrical contacting of the illumination device in the vehicle headlight It is therefore not an additional handle, such as Example plugging a plug, etc., required for electrical contacting of the lighting device.
  • the illumination device according to the invention is preferably provided for use as a light source in a headlight of a motor vehicle.
  • a plurality of the illumination devices according to the invention are arranged, each of the illumination devices interacting with a specific part of the optical system of the vehicle headlight, by switching on a specific combination of these arranged in the vehicle headlights lighting devices corresponding light distributions, such as the light distribution for parking lights, low beam, To produce high beam or fog light.
  • This lighting device has a heat sink 1 with a circular disk-shaped mounting surface 10 and parallel cooling fins 11, 12, 13, 14, 15, 16, which extend perpendicular to the mounting surface 10.
  • the heat sink 1 is formed as a one-piece die-cast aluminum part.
  • the outer contour of the heat sink 1 substantially corresponds to that of a circular cylinder, apart from the cavities between the cooling fins 11 to 16 and the locking tabs 17, 18, 19, which are part of a bayonet between the lighting device and a vehicle headlight.
  • the three locking tabs 17, 18, 19 are arranged equidistantly along the circumference of the circular cylindrical mounting surface 10 at a distance of 120 degrees. They are directed radially outward.
  • the two locking tabs 17, 18 have the same shape, but mirror-symmetrically with respect to.
  • the diameter of the mounting surface 10 are arranged, which extends centrally through the third locking tab 19.
  • the locking tab 19 has a different shape than the first 17 and second locking tab 18 to ensure a clear orientation and installation position of the illumination device in the vehicle headlight.
  • the two outer cooling fins 11 and 16 have on their outer surface a profile 11a and 16a, respectively, in order to ensure a better grip when operating the bayonet closure.
  • the mounting surface 10 has a recess 102 to provide space for mounting a lateral, acting perpendicular to the axis of rotation of the bayonet fitting pressure spring 103.
  • the pressure spring 103 is disposed between the locking tab 19 and the spring ring 101. She is in the presentation of FIG. 1 covered by the locking tab 19.
  • the metal core board 2 is a metal plate, which is provided with an electrical insulation, such as ceramic. On the electrical insulation of the metal core board 2 printed conductors 21 are arranged for electrical contacting of the LED chips 3.
  • the support plate or metal core plate 2 ensures electrical insulation between the metallic heat sink 1 the LED chips 3.
  • the support plate 2 is mechanically, for example, by clamping fit in a recess of the heat sink 1 or by means of a snap connection or with the aid of an adhesive on the mounting surface 10 of Heatsink 1 anchored.
  • two holes in the mounting surface 10 may be mounted, in each of which engages a properly shaped pin on the underside of the support plate 2. These holes can also define the orientation and mounting position of the carrier plate 2 with respect to the locking tabs 17-19.
  • the five light-emitting diode chips 3 are arranged in a row on the carrier plate 2 and surrounded by the walls of a so-called potting trough 4, so that the row consisting of the five light-emitting diode chips 3 is arranged at the bottom of the potting pan 4.
  • the Vergusswanne 4 is partially filled with a translucent, the light-emitting diode chips 3 covering potting compound, which contains, for example, two different phosphors to convert the wavelength of a portion of the generated by the LED chips 3 electromagnetic radiation, so that the illumination device emits white light during their operation. Such phosphors are for example in the WO 98/12757 described.
  • the light emitting diode chips 3 facing surface 4a of the walls of Vergusswanne 4 are formed light-reflecting.
  • the light-emitting diode chips 3 are, for example, thin-film light-emitting diode chips whose basic principle is described, for example, in US Pat Reference I. Schnitzer et al., Appl. Phys. Lett. 63 (16), 18 October 1993, 2174-2176 is described.
  • the five light-emitting diode chips 3, together with the potting compound and the phosphors integrated therein, form five light-emitting diodes.
  • the support plate 2 has four holes 22, in each of which a suitably matched thereto pin 52 a primary optics 5 (in FIG. 4 shown) or a holder for the primary optics 5 engages.
  • a primary optics 5 in FIG. 4 shown
  • the primary optics 5 fixed to the support plate 2 and their installation position and orientation with respect to the support plate 2 and thus also with respect to the locking tabs 17 to 19 fixed.
  • the bores 22 are arranged in a fitting manner via corresponding bores in the mounting surface 10 of the heat sink 1, so that the pins 52 of the primary optics 5 are passed through the bores 22 of the carrier plate 2 and engage in the aforementioned holes in the heat sink 1.
  • the carrier plate 2 is also fixed and aligned on the heat sink 1 by means of the dowel pins 52.
  • the support plate 2 In this case, no separate means for mounting on the mounting surface 10 of the heat sink 1 are required for the support plate 2.
  • one or more spacers may be provided between the primary optics 5 and the support plate 2 or the mounting surface 10, which limit the penetration depth of the pins 52 in the holes 22.
  • Primary optics is a composite optical concentrator similar to the optical concentrator 5 of in FIG. 4 imaged embodiment of the invention is formed.
  • This optical concentrator 5 engages in the Vergusswanne 4 and is optically coupled to the LED chips 3, for example by means of Canada balm.
  • the optical concentrator 5 concentrates the light generated by the light-emitting diode chips 3, so that it emerges from the end face 51 of the concentrator 5 facing away from the light-emitting diode chips 3 with reduced divergence.
  • the optical concentrator 5 is, for example, a Compound Parabolic Concentrator (CPC) or a Compound Ellyptic Concentrator (CEC) or a Compound Hyperbolic Concentrator (CHC).
  • CPC Compound Parabolic Concentrator
  • CEC Compound Ellyptic Concentrator
  • CHC Compound Hyperbolic Concentrator
  • the primary optics 5 are arranged with respect to the LED chips 3 in a well-defined position and orientation on the heat sink 1 or on the carrier plate 2.
  • the primary optics 5 is matched to the optics of the vehicle headlight (secondary optics).
  • the electrical components required for the operation of the LED chips 3 are arranged on a mounting plate 6 designed as a lead frame.
  • the assembled with the aforementioned electrical components (not shown) mounting plate 6 is arranged a matching recess of the central fin 14 and fixed.
  • the mounted on the mounting plate 6 electrical components protrude into the space between the mounting plate 6 and the adjacent cooling fins 13 and / or 15.
  • On the mounting plate 6, the electrical connection 7 of the lighting device is also mounted.
  • the electrical terminal 7 is formed as a socket with contact pins 71, which is provided for receiving a connector adapted thereto.
  • the arranged on the mounting plate 6 electrical components are supplied with electrical energy.
  • the consisting of the aforementioned electrical components power supply circuit of the LED chips 3 by means of power supply lines (not shown), which are passed through the opening 100 in the mounting surface 10 and contacted with the conductors 21 on the support plate 2, electrically connected to the LED chips 3.
  • FIG. 3 schematically is a holder 30 for in the FIGS. 1 . 2 . 5 and 6 illustrated embodiments of the illumination device according to the invention.
  • This holder 30 is part of the vehicle headlight and is located for example on the side facing away from the light exit opening of the vehicle headlight reflector back of the vehicle headlight reflector.
  • a holder 30 with the in FIG. 3 can be provided 300 shown assembly opening.
  • the edge of the mounting opening 300 is provided with matching recesses 301, 302, 303 for the locking tabs 17, 18, 19 of the lighting device.
  • a stop 304 for the locking tab 19 and a ramp 305 are further arranged.
  • the illumination device with its mounting surface 10 which forms the projecting into the reflector of the vehicle headlight front of the illumination device, attached to the holder 30, wherein the locking tab 19 in the recess 303, the locking tab 17 in the recess 301 and the locking tab 18 engage in the recess 302 and the front 10 of the illumination device including the locking tabs 17 to 19 protrude through the mounting hole 300, so that the back of the holder 30 abuts the spring ring 101 on the heat sink 1.
  • the illumination device By means of a rotary movement, the illumination device is rotated relative to the section 30 by approximately one quarter turn, so that the locking tab 19 slides over the ramp 305 and bears against the stop 304.
  • the stopper 304 prevents further rotational movement in the screwing direction.
  • the ramp 305 complicates a rotational movement in the direction of rotation and prevents an automatic unlocking of the bayonet lock.
  • the pressure spring 103 is in the region between the stopper 304 and the ramp 305 at the edge of the mounting hole 300 with a press fit.
  • the illumination device Due to the spring action of the pressure spring 103, the illumination device is pressed against the obliquely extending edge regions 306, 307 of the mounting opening, so that the illumination device is supported on three sections of the edge of the mounting opening 300 and thus secured against movements in the flange plane.
  • the holder 30 or the edge of the mounting opening 300 is arranged in the locked state of the bayonet lock with a press fit between the locking tabs 17 to 19 and the spring ring 101.
  • the three locking tabs 17 to 19 lie in a common plane, which forms a reference plane for the alignment of the LED chips 3 and the primary optics 5 with respect to the reflector of the vehicle headlight.
  • the alignment of the LED chips 3 and the primary optics 5 on the heat sink 1 ensures in conjunction with the above-described bayonet between the holder 30 and the illumination device according to the invention a clearly defined mounting position of the light source or light sources in the vehicle headlight.
  • FIG. 4 a lighting device according to a second embodiment of the invention is shown.
  • This illumination device has a heat sink 400 with a circular disk-shaped mounting surface 401 and parallel cooling fins 402, which extend perpendicular to the mounting surface 401.
  • the heat sink 400 is formed as a one-piece die-cast aluminum part.
  • the outer contour of the heat sink 400 substantially corresponds to that of a circular cylinder, apart from the cavities between the cooling fins 402.
  • the mounting surface 401 three recesses 403 in the surface of the heat sink 400 at an angular distance of 120 degrees. These recesses 403 are part of a bayonet closure between the illumination device and the vehicle headlight, in which the illumination device is used.
  • the carrier plates 404, 405, 406 are fixed for each five LED chips (also called LED chips).
  • the carrier plates 404, 405, 406 are arranged in a row, so that a total of fifteen light-emitting diode chips are arranged in a row on the front side 401 of the heat sink 400.
  • the two outer support plates 404, 406 are each mounted on a slope of the mounting surface 401 of the heat sink 400.
  • the LED chips are as described in the first embodiment ( FIG. 1 ), arranged in a Vergusswanne 407 and are in the representation of FIG. 4 obscured by primary optics 5.
  • the primary optics 5 has a plurality of molded pins or dowel pins 52, by means of which it is anchored in holes in the heat sink 400.
  • the primary optics 5 engages in the Vergusswannen 407, is optically coupled to the arranged in the Vergusswannen 407 LED chips and their spatial position and orientation is adjusted by means of the pins or dowel pins 52 with respect to the support plate 404-406.
  • the light generated by the LEDs exits the light exit opening 51 of the primary optics 5 with reduced divergence.
  • the electrical components for operating the light-emitting diode chips are mounted on a mounting plate 408 designed as a lead frame, which is arranged in a recess of the heat sink 400 in the region of the mounting surface 401.
  • the mounting plate 408 covers the aforementioned recess in the heat sink 400. It is practically designed as a cover for this recess.
  • the electrical components are mounted on the underside of the mounting plate 408, so that the electrical components protrude into the recess. In the presentation of the FIG. 4 the top of the mounting plate 408 is visible. The depth of the aforementioned recess is matched to the height of the mounted on the mounting board 408 electrical components.
  • a second recess on the edge of the mounting surface 401 designed as a socket 409 electrical connection of the lighting device is arranged. Via the contact pins of the socket 409, the electrical components mounted on the mounting plate 408 are supplied with electrical energy.
  • the formed by the electrical components on the mounting plate 408 Circuit arrangement is used to power the LED chips.
  • 405, 406, electrical contacts 410 are provided for contacting the light-emitting diode chips arranged on the support plates 404 to 406.
  • the primary optics 5 of the illumination device is tuned to the downstream secondary optics of the vehicle headlight.
  • the secondary optics can be a reflector, for example a free-form surface reflector, an optical lens system or a combination of an optical lens system with a reflector.
  • FIGS. 1 and 2 a third embodiment of the illumination device according to the invention is shown.
  • This lighting device is largely identical to the lighting device according to the first embodiment, which in the FIGS. 1 and 2 is shown. Therefore, in the corresponding Figures 1 and 2 such as 5 and 6 for identical parts of the two embodiments also uses the same reference numerals. For the description of these parts, reference is made to the description of the corresponding parts of the first embodiment.
  • the illumination device according to the third embodiment differs from that according to the first embodiment only by the different design of the electrical connection 7 '.
  • the electrical connection 7 'of the illumination device is mounted on the mounting plate 6.
  • the contact webs 71 ' extendend parallel to the cooling ribs 11 to 16 and project beyond the cooling ribs 11 to 16 so that the free ends of the contact webs 71' protrude from the heat sink 1.
  • colored light-emitting light-emitting diodes can also be used in order to use the lighting device as a light source in rear lights of the vehicle, for example as a brake light, tail light or flashing light.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
EP05823447A 2004-12-22 2005-12-01 Beleuchtungseinrichtung mit mindestens einer leuchtdiode und fahrzeugscheinwerfer Active EP1828678B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004062989A DE102004062989A1 (de) 2004-12-22 2004-12-22 Beleuchtungseinrichtung mit mindestens einer Leuchtdiode und Fahrzeugscheinwerfer
PCT/DE2005/002171 WO2006066531A1 (de) 2004-12-22 2005-12-01 Beleuchtungseinrichtung mit mindestens einer leuchtdiode und fahrzeugscheinwerfer

Publications (2)

Publication Number Publication Date
EP1828678A1 EP1828678A1 (de) 2007-09-05
EP1828678B1 true EP1828678B1 (de) 2010-03-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP05823447A Active EP1828678B1 (de) 2004-12-22 2005-12-01 Beleuchtungseinrichtung mit mindestens einer leuchtdiode und fahrzeugscheinwerfer

Country Status (9)

Country Link
US (1) US7806562B2 (es)
EP (1) EP1828678B1 (es)
JP (1) JP4608553B2 (es)
CN (1) CN100572906C (es)
AT (1) ATE462932T1 (es)
DE (2) DE102004062989A1 (es)
ES (1) ES2342549T3 (es)
TW (1) TWI388767B (es)
WO (1) WO2006066531A1 (es)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
DE102010048594A1 (de) 2010-10-15 2012-04-19 Hella Kgaa Hueck & Co. Scheinwerfer für ein Fahrzeug mit einem LED-Hauptlichtmodul

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JP5414274B2 (ja) * 2005-09-22 2014-02-12 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄ照明モジュール
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
EP1898144A3 (de) * 2006-09-08 2010-08-25 Robert Bosch Gmbh Leuchtaggregat mit mehreren LED-Bauelementen und Verfahren zu seiner Herstellung
JP4669459B2 (ja) * 2006-09-22 2011-04-13 スタンレー電気株式会社 照明器具構造
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