EP1828678B1 - Lighting device comprising at least one light-emitting diode and vehicle headlight - Google Patents

Lighting device comprising at least one light-emitting diode and vehicle headlight Download PDF

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Publication number
EP1828678B1
EP1828678B1 EP05823447A EP05823447A EP1828678B1 EP 1828678 B1 EP1828678 B1 EP 1828678B1 EP 05823447 A EP05823447 A EP 05823447A EP 05823447 A EP05823447 A EP 05823447A EP 1828678 B1 EP1828678 B1 EP 1828678B1
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EP
European Patent Office
Prior art keywords
illumination device
light
heat sink
emitting diode
vehicle headlight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05823447A
Other languages
German (de)
French (fr)
Other versions
EP1828678A1 (en
Inventor
Gerhard Behr
Peter Helbig
Thomas Reiners
Ralf Vollmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of EP1828678A1 publication Critical patent/EP1828678A1/en
Application granted granted Critical
Publication of EP1828678B1 publication Critical patent/EP1828678B1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device according to the preamble of patent claim 1 and a vehicle headlight with at least one such lighting device.
  • Such a lighting device is for example in the EP-A 1 298 382 disclosed.
  • This document describes a lighting device with a plurality of light emitting diodes, which are arranged on a heat sink, and an optic and an electrical module for operating the light emitting diodes.
  • This lighting device is intended for use in a vehicle and as a replacement for a conventional light bulb.
  • the US 2004/0190285 A1 discloses a lighting device with a high-power light-emitting diode, which is arranged together with a metallic heat sink and a mounting board with electrical components for operating the light-emitting diodes in a common housing.
  • the US 2002/0125839 A1 discloses a lighting device with light-emitting diodes which are arranged on a mounting plate in a light-transmitting tube.
  • the mounting plate is arranged in a trough-like heat sink.
  • the illumination device has at least one light emitting diode and a heat sink for the at least one light emitting diode, wherein the heat sink has at least one recess in which a mounted with electrical components mounting plate is arranged.
  • the heat sink of the illumination device according to the invention serves both for cooling the light-emitting diodes arranged on it and for cooling the electrical components required for the operation of the light-emitting diodes, which are arranged on the mounting plate.
  • the arrangement of the electrical components on a mounting plate, such as a lead frame, has the advantage that the assembled mounting plate is mounted as a unit on the heat sink.
  • the heat sink in order to increase its surface to optimize the cooling effect cooling ribs, wherein the recess for the assembled with the electrical components mounting plate is arranged in the region of the cooling fins.
  • This ensures a greater spatial distance between the two heat sources on the heat sink, namely the light-emitting diodes and the electrical components.
  • the light-emitting diodes are not heated by the heat generated by the electrical components.
  • one of the cooling fins is provided with the at least one recess for the mounting plate equipped with the electrical components, or one of the cooling fins is replaced by the mounting plate fitted with the electrical components.
  • the mounting plate is thus aligned parallel between two cooling fins and thereby the cooling of the mounted on the mounting plate electrical components is optimized, especially when a cooling gas flow is passed between the cooling fins by means of a blower.
  • the electrical connection of the illumination device is also arranged on the mounting plate in order to ensure a compact construction.
  • the electrical connection is the Lighting device disposed in a further recess of the heat sink to absorb the mechanical stress caused by the use of the electrical contact through the heat sink and not to transfer to the underlying mounting plate with the electrical components mounted thereon.
  • the heat sink of the lighting device according to the invention is provided with means for the correct position mounting of the lighting device in a vehicle headlight.
  • an adjustment of the arranged on the heat sink at least one light emitting diode relative to the optical system of the vehicle headlight is made possible because the at least one light emitting diode is preferably arranged and aligned in a defined position and orientation with respect to the heat sink on the heat sink, as in the German patent application with the Official Gazette 10 2004 052 687.7.
  • the aforementioned means for the correct installation of the illumination device are preferably formed as part of a bayonet closure between the illumination device and the vehicle headlight.
  • the bayonet lock ensures due to the required locking for plug-in rotation movement secure fixation of the lighting device in Anlagenscheinwerter.
  • the stops for the aforementioned plug-in rotary movement ensure the correct orientation of the at least one light emitting diode with respect to the vehicle headlight reflector.
  • the illumination device is located on the bayonet closure in contact with the vehicle headlight reflector, so that this also contributes to heat dissipation.
  • the electrical connection of the illumination device has at least one contact web, which extends perpendicular to the axis of rotation of the bayonet closure, so that by the rotational movement when locking or unlocking the bayonet closure of the electrical contact between the at least one contact web and his Mating contact is made or released on the vehicle headlight.
  • the actuation of the bayonet closure and the electrical contacting of the illumination device in the vehicle headlight It is therefore not an additional handle, such as Example plugging a plug, etc., required for electrical contacting of the lighting device.
  • the illumination device according to the invention is preferably provided for use as a light source in a headlight of a motor vehicle.
  • a plurality of the illumination devices according to the invention are arranged, each of the illumination devices interacting with a specific part of the optical system of the vehicle headlight, by switching on a specific combination of these arranged in the vehicle headlights lighting devices corresponding light distributions, such as the light distribution for parking lights, low beam, To produce high beam or fog light.
  • This lighting device has a heat sink 1 with a circular disk-shaped mounting surface 10 and parallel cooling fins 11, 12, 13, 14, 15, 16, which extend perpendicular to the mounting surface 10.
  • the heat sink 1 is formed as a one-piece die-cast aluminum part.
  • the outer contour of the heat sink 1 substantially corresponds to that of a circular cylinder, apart from the cavities between the cooling fins 11 to 16 and the locking tabs 17, 18, 19, which are part of a bayonet between the lighting device and a vehicle headlight.
  • the three locking tabs 17, 18, 19 are arranged equidistantly along the circumference of the circular cylindrical mounting surface 10 at a distance of 120 degrees. They are directed radially outward.
  • the two locking tabs 17, 18 have the same shape, but mirror-symmetrically with respect to.
  • the diameter of the mounting surface 10 are arranged, which extends centrally through the third locking tab 19.
  • the locking tab 19 has a different shape than the first 17 and second locking tab 18 to ensure a clear orientation and installation position of the illumination device in the vehicle headlight.
  • the two outer cooling fins 11 and 16 have on their outer surface a profile 11a and 16a, respectively, in order to ensure a better grip when operating the bayonet closure.
  • the mounting surface 10 has a recess 102 to provide space for mounting a lateral, acting perpendicular to the axis of rotation of the bayonet fitting pressure spring 103.
  • the pressure spring 103 is disposed between the locking tab 19 and the spring ring 101. She is in the presentation of FIG. 1 covered by the locking tab 19.
  • the metal core board 2 is a metal plate, which is provided with an electrical insulation, such as ceramic. On the electrical insulation of the metal core board 2 printed conductors 21 are arranged for electrical contacting of the LED chips 3.
  • the support plate or metal core plate 2 ensures electrical insulation between the metallic heat sink 1 the LED chips 3.
  • the support plate 2 is mechanically, for example, by clamping fit in a recess of the heat sink 1 or by means of a snap connection or with the aid of an adhesive on the mounting surface 10 of Heatsink 1 anchored.
  • two holes in the mounting surface 10 may be mounted, in each of which engages a properly shaped pin on the underside of the support plate 2. These holes can also define the orientation and mounting position of the carrier plate 2 with respect to the locking tabs 17-19.
  • the five light-emitting diode chips 3 are arranged in a row on the carrier plate 2 and surrounded by the walls of a so-called potting trough 4, so that the row consisting of the five light-emitting diode chips 3 is arranged at the bottom of the potting pan 4.
  • the Vergusswanne 4 is partially filled with a translucent, the light-emitting diode chips 3 covering potting compound, which contains, for example, two different phosphors to convert the wavelength of a portion of the generated by the LED chips 3 electromagnetic radiation, so that the illumination device emits white light during their operation. Such phosphors are for example in the WO 98/12757 described.
  • the light emitting diode chips 3 facing surface 4a of the walls of Vergusswanne 4 are formed light-reflecting.
  • the light-emitting diode chips 3 are, for example, thin-film light-emitting diode chips whose basic principle is described, for example, in US Pat Reference I. Schnitzer et al., Appl. Phys. Lett. 63 (16), 18 October 1993, 2174-2176 is described.
  • the five light-emitting diode chips 3, together with the potting compound and the phosphors integrated therein, form five light-emitting diodes.
  • the support plate 2 has four holes 22, in each of which a suitably matched thereto pin 52 a primary optics 5 (in FIG. 4 shown) or a holder for the primary optics 5 engages.
  • a primary optics 5 in FIG. 4 shown
  • the primary optics 5 fixed to the support plate 2 and their installation position and orientation with respect to the support plate 2 and thus also with respect to the locking tabs 17 to 19 fixed.
  • the bores 22 are arranged in a fitting manner via corresponding bores in the mounting surface 10 of the heat sink 1, so that the pins 52 of the primary optics 5 are passed through the bores 22 of the carrier plate 2 and engage in the aforementioned holes in the heat sink 1.
  • the carrier plate 2 is also fixed and aligned on the heat sink 1 by means of the dowel pins 52.
  • the support plate 2 In this case, no separate means for mounting on the mounting surface 10 of the heat sink 1 are required for the support plate 2.
  • one or more spacers may be provided between the primary optics 5 and the support plate 2 or the mounting surface 10, which limit the penetration depth of the pins 52 in the holes 22.
  • Primary optics is a composite optical concentrator similar to the optical concentrator 5 of in FIG. 4 imaged embodiment of the invention is formed.
  • This optical concentrator 5 engages in the Vergusswanne 4 and is optically coupled to the LED chips 3, for example by means of Canada balm.
  • the optical concentrator 5 concentrates the light generated by the light-emitting diode chips 3, so that it emerges from the end face 51 of the concentrator 5 facing away from the light-emitting diode chips 3 with reduced divergence.
  • the optical concentrator 5 is, for example, a Compound Parabolic Concentrator (CPC) or a Compound Ellyptic Concentrator (CEC) or a Compound Hyperbolic Concentrator (CHC).
  • CPC Compound Parabolic Concentrator
  • CEC Compound Ellyptic Concentrator
  • CHC Compound Hyperbolic Concentrator
  • the primary optics 5 are arranged with respect to the LED chips 3 in a well-defined position and orientation on the heat sink 1 or on the carrier plate 2.
  • the primary optics 5 is matched to the optics of the vehicle headlight (secondary optics).
  • the electrical components required for the operation of the LED chips 3 are arranged on a mounting plate 6 designed as a lead frame.
  • the assembled with the aforementioned electrical components (not shown) mounting plate 6 is arranged a matching recess of the central fin 14 and fixed.
  • the mounted on the mounting plate 6 electrical components protrude into the space between the mounting plate 6 and the adjacent cooling fins 13 and / or 15.
  • On the mounting plate 6, the electrical connection 7 of the lighting device is also mounted.
  • the electrical terminal 7 is formed as a socket with contact pins 71, which is provided for receiving a connector adapted thereto.
  • the arranged on the mounting plate 6 electrical components are supplied with electrical energy.
  • the consisting of the aforementioned electrical components power supply circuit of the LED chips 3 by means of power supply lines (not shown), which are passed through the opening 100 in the mounting surface 10 and contacted with the conductors 21 on the support plate 2, electrically connected to the LED chips 3.
  • FIG. 3 schematically is a holder 30 for in the FIGS. 1 . 2 . 5 and 6 illustrated embodiments of the illumination device according to the invention.
  • This holder 30 is part of the vehicle headlight and is located for example on the side facing away from the light exit opening of the vehicle headlight reflector back of the vehicle headlight reflector.
  • a holder 30 with the in FIG. 3 can be provided 300 shown assembly opening.
  • the edge of the mounting opening 300 is provided with matching recesses 301, 302, 303 for the locking tabs 17, 18, 19 of the lighting device.
  • a stop 304 for the locking tab 19 and a ramp 305 are further arranged.
  • the illumination device with its mounting surface 10 which forms the projecting into the reflector of the vehicle headlight front of the illumination device, attached to the holder 30, wherein the locking tab 19 in the recess 303, the locking tab 17 in the recess 301 and the locking tab 18 engage in the recess 302 and the front 10 of the illumination device including the locking tabs 17 to 19 protrude through the mounting hole 300, so that the back of the holder 30 abuts the spring ring 101 on the heat sink 1.
  • the illumination device By means of a rotary movement, the illumination device is rotated relative to the section 30 by approximately one quarter turn, so that the locking tab 19 slides over the ramp 305 and bears against the stop 304.
  • the stopper 304 prevents further rotational movement in the screwing direction.
  • the ramp 305 complicates a rotational movement in the direction of rotation and prevents an automatic unlocking of the bayonet lock.
  • the pressure spring 103 is in the region between the stopper 304 and the ramp 305 at the edge of the mounting hole 300 with a press fit.
  • the illumination device Due to the spring action of the pressure spring 103, the illumination device is pressed against the obliquely extending edge regions 306, 307 of the mounting opening, so that the illumination device is supported on three sections of the edge of the mounting opening 300 and thus secured against movements in the flange plane.
  • the holder 30 or the edge of the mounting opening 300 is arranged in the locked state of the bayonet lock with a press fit between the locking tabs 17 to 19 and the spring ring 101.
  • the three locking tabs 17 to 19 lie in a common plane, which forms a reference plane for the alignment of the LED chips 3 and the primary optics 5 with respect to the reflector of the vehicle headlight.
  • the alignment of the LED chips 3 and the primary optics 5 on the heat sink 1 ensures in conjunction with the above-described bayonet between the holder 30 and the illumination device according to the invention a clearly defined mounting position of the light source or light sources in the vehicle headlight.
  • FIG. 4 a lighting device according to a second embodiment of the invention is shown.
  • This illumination device has a heat sink 400 with a circular disk-shaped mounting surface 401 and parallel cooling fins 402, which extend perpendicular to the mounting surface 401.
  • the heat sink 400 is formed as a one-piece die-cast aluminum part.
  • the outer contour of the heat sink 400 substantially corresponds to that of a circular cylinder, apart from the cavities between the cooling fins 402.
  • the mounting surface 401 three recesses 403 in the surface of the heat sink 400 at an angular distance of 120 degrees. These recesses 403 are part of a bayonet closure between the illumination device and the vehicle headlight, in which the illumination device is used.
  • the carrier plates 404, 405, 406 are fixed for each five LED chips (also called LED chips).
  • the carrier plates 404, 405, 406 are arranged in a row, so that a total of fifteen light-emitting diode chips are arranged in a row on the front side 401 of the heat sink 400.
  • the two outer support plates 404, 406 are each mounted on a slope of the mounting surface 401 of the heat sink 400.
  • the LED chips are as described in the first embodiment ( FIG. 1 ), arranged in a Vergusswanne 407 and are in the representation of FIG. 4 obscured by primary optics 5.
  • the primary optics 5 has a plurality of molded pins or dowel pins 52, by means of which it is anchored in holes in the heat sink 400.
  • the primary optics 5 engages in the Vergusswannen 407, is optically coupled to the arranged in the Vergusswannen 407 LED chips and their spatial position and orientation is adjusted by means of the pins or dowel pins 52 with respect to the support plate 404-406.
  • the light generated by the LEDs exits the light exit opening 51 of the primary optics 5 with reduced divergence.
  • the electrical components for operating the light-emitting diode chips are mounted on a mounting plate 408 designed as a lead frame, which is arranged in a recess of the heat sink 400 in the region of the mounting surface 401.
  • the mounting plate 408 covers the aforementioned recess in the heat sink 400. It is practically designed as a cover for this recess.
  • the electrical components are mounted on the underside of the mounting plate 408, so that the electrical components protrude into the recess. In the presentation of the FIG. 4 the top of the mounting plate 408 is visible. The depth of the aforementioned recess is matched to the height of the mounted on the mounting board 408 electrical components.
  • a second recess on the edge of the mounting surface 401 designed as a socket 409 electrical connection of the lighting device is arranged. Via the contact pins of the socket 409, the electrical components mounted on the mounting plate 408 are supplied with electrical energy.
  • the formed by the electrical components on the mounting plate 408 Circuit arrangement is used to power the LED chips.
  • 405, 406, electrical contacts 410 are provided for contacting the light-emitting diode chips arranged on the support plates 404 to 406.
  • the primary optics 5 of the illumination device is tuned to the downstream secondary optics of the vehicle headlight.
  • the secondary optics can be a reflector, for example a free-form surface reflector, an optical lens system or a combination of an optical lens system with a reflector.
  • FIGS. 1 and 2 a third embodiment of the illumination device according to the invention is shown.
  • This lighting device is largely identical to the lighting device according to the first embodiment, which in the FIGS. 1 and 2 is shown. Therefore, in the corresponding Figures 1 and 2 such as 5 and 6 for identical parts of the two embodiments also uses the same reference numerals. For the description of these parts, reference is made to the description of the corresponding parts of the first embodiment.
  • the illumination device according to the third embodiment differs from that according to the first embodiment only by the different design of the electrical connection 7 '.
  • the electrical connection 7 'of the illumination device is mounted on the mounting plate 6.
  • the contact webs 71 ' extendend parallel to the cooling ribs 11 to 16 and project beyond the cooling ribs 11 to 16 so that the free ends of the contact webs 71' protrude from the heat sink 1.
  • colored light-emitting light-emitting diodes can also be used in order to use the lighting device as a light source in rear lights of the vehicle, for example as a brake light, tail light or flashing light.

Abstract

A lighting device includes at least one light-emitting diode and a cooling aggregate (400) for cooling the at least one light-emitting diode, wherein the at least one light-emitting diode is arranged on the cooling aggregate (400) and the cooling aggregate (400) is provided with at least one recess in which a mounting plate (408) equipped with electrical components is located. Also described is a vehicle headlight including at least one lighting device of the aforementioned kind.

Description

Die Erfindung betrifft eine Beleuchtungseinrichtung gemäß dem Oberbegriff des Patentanspruchs 1 sowie einen Fahrzeugscheinwerfer mit mindestens einer derartigen Beleuchtungseinrichtung.The invention relates to a lighting device according to the preamble of patent claim 1 and a vehicle headlight with at least one such lighting device.

I. Stand der Technik I. State of the art

Eine derartige Beleuchtungseinrichtung ist beispielsweise in der EP-A 1 298 382 offenbart. Diese Schrift beschreibt eine Beleuchtungseinrichtung mit mehreren Leuchtdioden, die auf einem Kühlkörper angeordnet sind, und einer Optik sowie einem elektrischen Modul zum Betreiben der Leuchtdioden. Diese Beleuchtungseinrichtung ist zum Einsatz in einem Fahrzeug und als Ersatz für eine herkömmliche Glühlampe vorgesehen.Such a lighting device is for example in the EP-A 1 298 382 disclosed. This document describes a lighting device with a plurality of light emitting diodes, which are arranged on a heat sink, and an optic and an electrical module for operating the light emitting diodes. This lighting device is intended for use in a vehicle and as a replacement for a conventional light bulb.

Die US 2004/0190285 A1 offenbart eine Beleuchtungseinrichtung mit einer Hochleistungsleuchtdiode, die zusammen mit einer metallischen Wärmesenke und einer Montageplatine mit elektrischen Bauteilen zum Betrieb der Leuchtdioden in einem gemeinsamen Gehäuse angeordnet ist.The US 2004/0190285 A1 discloses a lighting device with a high-power light-emitting diode, which is arranged together with a metallic heat sink and a mounting board with electrical components for operating the light-emitting diodes in a common housing.

Die US 2002/0125839 A1 offenbart eine Beleuchtungseinrichtung mit Leuchtdioden, die auf einer Montageplatte in einer lichtdurchlässigen Röhre angeordnet sind. Die Montageplatte ist in einer trogartigen Wärmesenke angeordnet.The US 2002/0125839 A1 discloses a lighting device with light-emitting diodes which are arranged on a mounting plate in a light-transmitting tube. The mounting plate is arranged in a trough-like heat sink.

II. Darstellung der Erfindung II. Presentation of the invention

Es ist Aufgabe der Erfindung, eine gattungsgemäße Beleuchtungseinrichtung bereitzustellen, die einen möglichst kompakten Aufbau und eine möglichst gute Wärmeableitung für die von der Beleuchtungseinrichtung generierte Wärme besitzt.It is an object of the invention to provide a generic lighting device that has a very compact design and the best possible heat dissipation for the heat generated by the lighting device.

Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Patentanspruchs 1 gelöst. Besonders vorteilhafte Ausführungen der Erfindung sind in den abhängigen Patentansprüchen beschrieben.This object is achieved by the features of claim 1. Particularly advantageous embodiments of the invention are described in the dependent claims.

Die erfindungsgemäße Beleuchtungseinrichtung weist mindestens eine Leuchtdiode und einen Kühlkörper für die mindestens eine Leuchtdiode auf, wobei der Kühlkörper mindestens eine Aussparung besitzt, in der eine mit elektrischen Bauteilen bestückte Montageplatte angeordnet ist. Dadurch wird ein kompakter Aufbau erzielt, da die elektrischen Bauteile, die zum Betrieb der mindestens einen Leuchtdiode dienen,The illumination device according to the invention has at least one light emitting diode and a heat sink for the at least one light emitting diode, wherein the heat sink has at least one recess in which a mounted with electrical components mounting plate is arranged. This achieves a compact construction, since the electrical components which serve to operate the at least one light-emitting diode

in der Aussparung des Kühlkörpers angeordnet sind. Die Aussparung in dem Kühlkörper bietet für die auf der Montageplatte angeordneten elektrischen Bauteile einen ähnlich guten Schutz wie ein üblicherweise verwendetes Gehäuse, das die Bauteile umschließt. Durch den Kontakt zwischen der Montageplatte und dem Kühlkörper wird die von den elektrischen Bauteilen generierte Wärme an den Kühlkörper abgegeben. Der Kühlkörper der erfindungsgemäßen Beleuchtungseinrichtung dient sowohl zur Kühlung der auf ihm angeordneten Leuchtdioden als auch zur Kühlung der zum Betrieb der Leuchtdioden erforderlichen elektrischen Bauteile, die auf der Montageplatte angeordnet sind. Die Anordnung der elektrischen Bauteile auf einer Montageplatte, beispielsweise einem Lead-Frame, hat den Vorteil, dass die so bestückte Montageplatte als Baueinheit auf dem Kühlkörper montierbar ist.are arranged in the recess of the heat sink. The recess in the heat sink provides for the arranged on the mounting plate electrical components as well as a well-used housing that encloses the components. Due to the contact between the mounting plate and the heat sink, the heat generated by the electrical components is released to the heat sink. The heat sink of the illumination device according to the invention serves both for cooling the light-emitting diodes arranged on it and for cooling the electrical components required for the operation of the light-emitting diodes, which are arranged on the mounting plate. The arrangement of the electrical components on a mounting plate, such as a lead frame, has the advantage that the assembled mounting plate is mounted as a unit on the heat sink.

Gemäß einem bevorzugten Ausführungsbeispiel der Erfindung besitzt der Kühlkörper zwecks Vergrößerung seiner Oberfläche zur Optimierung der Kühlwirkung Kühlrippen, wobei die Aussparung für die mit den elektrischen Bauteilen bestückte Montageplatte im Bereich der Kühlrippen angeordnet ist. Dadurch wird eine größere räumliche Distanz zwischen den beiden Wärmequellen auf dem Kühlkörper, nämlich den Leuchtdioden und den elektrischen Bauteilen, gewährleistet. Insbesondere wird dadurch erreicht, dass die Leuchtdioden nicht durch die von den elektrischen Bauteilen generierte Wärme aufgeheizt werden. Vorteilhafter Weise ist bei dem vorgenannten bevorzugten Ausführungsbeispiel eine der Kühlrippen mit der mindestens einen Aussparung für die mit den elektrischen Bauteilen bestückte Montageplatte versehen oder eine der Kühlrippen ist durch die mit den elektrischen Bauteilen bestückte Montageplatte ersetzt. Die Montageplatte ist somit parallel zwischen zwei Kühlrippen verlaufend ausgerichtet und dadurch wird die Kühlung der auf der Montagplatte angeordneten elektrischen Bauteile optimiert, insbesondere wenn mittels eines Gebläses ein Kühlgasstrom zwischen den Kühlrippen hindurchgeleitet wird.According to a preferred embodiment of the invention, the heat sink in order to increase its surface to optimize the cooling effect cooling ribs, wherein the recess for the assembled with the electrical components mounting plate is arranged in the region of the cooling fins. This ensures a greater spatial distance between the two heat sources on the heat sink, namely the light-emitting diodes and the electrical components. In particular, it is achieved that the light-emitting diodes are not heated by the heat generated by the electrical components. Advantageously, in the aforementioned preferred embodiment, one of the cooling fins is provided with the at least one recess for the mounting plate equipped with the electrical components, or one of the cooling fins is replaced by the mounting plate fitted with the electrical components. The mounting plate is thus aligned parallel between two cooling fins and thereby the cooling of the mounted on the mounting plate electrical components is optimized, especially when a cooling gas flow is passed between the cooling fins by means of a blower.

Gemäß des vorgenannten bevorzugten Ausführungsbeispiels der Erfindung ist der elektrische Anschluss der Beleuchtungseinrichtung ebenfalls auf der Montageplatte angeordnet, um einen kompakten Aufbau zu gewährleisten. Gemäß eines anderen bevorzugten Ausführungsbeispiels der Erfindung ist der elektrische Anschluss der Beleuchtungseinrichtung in einer weiteren Aussparung des Kühlkörpers angeordnet, um die mechanische Belastung, die bei der Benutzung des elektrischen Kontakts entstehen, durch den Kühlkörper abzufangen und nicht auf die dahinter angeordnete Montageplatte mit den darauf montierten elektrischen Bauteile zu übertragen.According to the aforementioned preferred embodiment of the invention, the electrical connection of the illumination device is also arranged on the mounting plate in order to ensure a compact construction. According to another preferred embodiment of the invention, the electrical connection is the Lighting device disposed in a further recess of the heat sink to absorb the mechanical stress caused by the use of the electrical contact through the heat sink and not to transfer to the underlying mounting plate with the electrical components mounted thereon.

Vorteilhafter Weise ist der Kühlkörper der erfindungsgemäßen Beleuchtungseinrichtung mit Mitteln zur lagerichtigen Montage der Beleuchtungseinrichtung in einem Fahrzeugscheinwerfer versehen. Dadurch wird eine Justage der auf dem Kühlkörper angeordneten mindestens einen Leuchtdiode gegenüber dem optischen System des Fahrzeugscheinwerfers ermöglicht, weil die mindestens eine Leuchtdiode vorzugsweise in definierter Lage und Orientierung bezüglich des Kühlkörpers auf dem Kühlkörper angeordnet und ausgerichtet ist, wie beispielsweise in der deutschen Patentanmeldung mit dem amtlichen Aktenzeichen 10 2004 052 687.7 beschrieben ist.Advantageously, the heat sink of the lighting device according to the invention is provided with means for the correct position mounting of the lighting device in a vehicle headlight. As a result, an adjustment of the arranged on the heat sink at least one light emitting diode relative to the optical system of the vehicle headlight is made possible because the at least one light emitting diode is preferably arranged and aligned in a defined position and orientation with respect to the heat sink on the heat sink, as in the German patent application with the Official Gazette 10 2004 052 687.7.

Die vorgenannten Mittel zur lagerichtigen Montage der Beleuchtungseinrichtung sind vorzugsweise als Bestandteil eines Bajonettverschlusses zwischen der Beleuchtungseinrichtung und dem Fahrzeugscheinwerfer ausgebildet. Der Bajonettverschluss gewährleistet aufgrund der zur Verriegelung erforderlichen Steck-Dreh-Bewegung eine sichere Fixierung der Beleuchtungseinrichtung im Fahrzeugscheinwerter. Die Anschläge für die vorgenannte Steck-Dreh-Bewegung gewährleisten die lagerichtige Orientierung der mindestens einen Leuchtdiode bezüglich des Fahrzeugscheinwerferreflektors. Außerdem befindet sich die Beleuchtungseinrichtung über den Bajonettverschluss im Kontakt mit dem Fahrzeugscheinwerferreflektor, so dass dieser ebenfalls zur Wärmeableitung beiträgt. Gemäß eines bevorzugten Ausführungsbeispiels der Erfindung weist der elektrische Anschluss der Beleuchtungseinrichtung mindestens einen Kontaktsteg auf, der sich senkrecht zur Achse der Drehbewegung des Bajonettverschlusses erstreckt, so dass durch die Drehbewegung beim Verriegeln bzw. Entriegeln des Bajonettverschlusses der elektrische Kontakt zwischen dem mindestens einen Kontaktsteg und seinem Gegenkontakt am Fahrzeugscheinwerfer hergestellt bzw. gelöst wird. Auf diese Weise erfolgt gleichzeitig mit der Betätigung des Bajonettverschlusses auch die elektrische Kontaktierung der Beleuchtungseinrichtung in dem Fahrzeugscheinwerfer. Es ist daher kein zusätzlicher Handgriff, wie zum Beispiel das Aufstecken eines Steckers etc., zur elektrischen Kontaktierung der Beleuchtungseinrichtung erforderlich.The aforementioned means for the correct installation of the illumination device are preferably formed as part of a bayonet closure between the illumination device and the vehicle headlight. The bayonet lock ensures due to the required locking for plug-in rotation movement secure fixation of the lighting device in Fahrzeugscheinwerter. The stops for the aforementioned plug-in rotary movement ensure the correct orientation of the at least one light emitting diode with respect to the vehicle headlight reflector. In addition, the illumination device is located on the bayonet closure in contact with the vehicle headlight reflector, so that this also contributes to heat dissipation. According to a preferred embodiment of the invention, the electrical connection of the illumination device has at least one contact web, which extends perpendicular to the axis of rotation of the bayonet closure, so that by the rotational movement when locking or unlocking the bayonet closure of the electrical contact between the at least one contact web and his Mating contact is made or released on the vehicle headlight. In this way, at the same time as the actuation of the bayonet closure and the electrical contacting of the illumination device in the vehicle headlight. It is therefore not an additional handle, such as Example plugging a plug, etc., required for electrical contacting of the lighting device.

Die erfindungsgemäße Beleuchtungseinrichtung ist vorzugsweise zur Verwendung als Lichtquelle in einem Scheinwerfer eines Kraftfahrzeugs vorgesehen. In dem Fahrzeugscheinwerfer sind vorzugsweise mehrere der erfindungsgemäßen Beleuchtungseinrichtungen angeordnet, wobei jede der Beleuchtungseinrichtungen mit einem bestimmten Teil des optischen Systems des Fahrzeugscheinwerfers zusammenwirkt, um durch Einschalten einer bestimmten Kombination dieser im Fahrzeugscheinwerfer angeordneten Beleuchtungseinrichtungen entsprechende Lichtverteilungen, wie zum Beispiel die Lichtverteilung für Standlicht, Abblendlicht, Fernlicht oder Nebellicht zu erzeugen.The illumination device according to the invention is preferably provided for use as a light source in a headlight of a motor vehicle. In the vehicle headlight, preferably a plurality of the illumination devices according to the invention are arranged, each of the illumination devices interacting with a specific part of the optical system of the vehicle headlight, by switching on a specific combination of these arranged in the vehicle headlights lighting devices corresponding light distributions, such as the light distribution for parking lights, low beam, To produce high beam or fog light.

III. Beschreibung der bevorzugten Ausführungsbeispiele III. Description of the preferred embodiments

Nachstehend wird die Erfindung anhand einiger bevorzugter Ausführungsbeispiele näher erläutert. Es zeigen:

Figur 1
Eine Draufsicht auf die Vorderseite einer Beleuchtungseinrichtung gemäß des ersten Ausführungsbeispiels der Erfindung
Figur 2
Eine Draufsicht auf die Rückseite der Beleuchtungseinrichtung gemäß des ersten Ausführungsbeispiels der Erfindung
Figur 3
Eine Darstellung der Montageöffnung im Fahrzeugscheinwerfer, die auf die in den Figuren 1, 2, 5 und 6 abgebildeten Ausführungsbeispiele abgestimmt ist
Figur 4
Eine Seitenansicht einer Beleuchtungseinrichtung gemäß des zweiten Ausführungsbeispiels der Erfindung
Figur 5
Eine Seitenansicht einer Beleuchtungseinrichtung gemäß des dritten Ausführungsbeispiels der Erfindung
Figur 6
Eine Draufsicht auf die Rückseite der Beleuchtungseinrichtung gemäß des dritten Ausführungsbeispiels der Erfindung
The invention will be explained in more detail below with reference to a few preferred embodiments. Show it:
FIG. 1
A plan view of the front of a lighting device according to the first embodiment of the invention
FIG. 2
A plan view of the back of the illumination device according to the first embodiment of the invention
FIG. 3
A representation of the mounting opening in the vehicle headlight, which in the FIGS. 1 . 2 . 5 and 6 matched embodiments is tuned
FIG. 4
A side view of a lighting device according to the second embodiment of the invention
FIG. 5
A side view of a lighting device according to the third embodiment of the invention
FIG. 6
A plan view of the back of the illumination device according to the third embodiment of the invention

In den Figuren 1 und 2 ist die Beleuchtungseinrichtung gemäß des ersten Ausführungsbeispiels dargestellt. Diese Beleuchtungseinrichtung besitzt einen Kühlkörper 1 mit einer kreisscheibenförmigen Montagefläche 10 und parallel verlaufenden Kühlrippen 11, 12, 13 , 14, 15, 16, die sich senkrecht zur Montagefläche 10 erstrecken. Der Kühlkörper 1 ist als einteiliges Aluminiumdruckgussteil ausgebildet. Die Außenkontur des Kühlkörpers 1 entspricht im wesentlichen der eines Kreiszylinders, wenn man von den Hohlräumen zwischen den Kühlrippen 11 bis 16 und den Verriegelungslaschen 17, 18, 19 absieht, die Bestandteil eines Bajonettverschlusses zwischen der Beleuchtungseinrichtung und einem Fahrzeugscheinwerfer sind. Die drei Verriegelungslaschen 17, 18, 19 sind äquidistant entlang des Umfangs der kreiszylindrischen Montagefläche 10 in einem Abstand von 120 Grad angeordnet. Sie sind radial nach außen gerichtet. Die beiden Verriegelungslaschen 17, 18 besitzen dieselbe Gestalt, sind aber spiegelsymmetrisch bzgl. des Durchmessers der Montagefläche 10 angeordnet, der mittig durch die dritte Verriegelungslasche 19 verläuft. Die Verriegelungslasche 19 besitzt eine andere Gestalt als die erste 17 und zweite Verriegelungslasche 18, um eine eindeutige Orientierung und Einbaulage der Beleuchtungseinrichtung in dem Fahrzeugscheinwerfer zu gewährleisten. Die beiden außen angeordneten Kühlrippen 11 und 16 weisen auf ihrer äußeren Oberfläche ein Profil 11a bzw. 16a auf, um eine bessere Griffigkeit bei der Betätigung des Bajonettverschlusses zu gewährleisten. Neben der Verriegelungslasche 19 weist die Montagefläche 10 eine Vertiefung 102 auf, um Platz für die Montage einer seitlichen, senkrecht zur Achse der Drehbewegung des Bajonettverschlusses wirkenden Andruckfeder 103 zu schaffen. Die Andruckfeder 103 ist zwischen der Verriegelungslasche 19 und dem Federring 101 angeordnet. Sie ist in der Darstellung der Figur 1 durch die Verriegelungslasche 19 verdeckt.In the FIGS. 1 and 2 the illumination device according to the first embodiment is shown. This lighting device has a heat sink 1 with a circular disk-shaped mounting surface 10 and parallel cooling fins 11, 12, 13, 14, 15, 16, which extend perpendicular to the mounting surface 10. The heat sink 1 is formed as a one-piece die-cast aluminum part. The outer contour of the heat sink 1 substantially corresponds to that of a circular cylinder, apart from the cavities between the cooling fins 11 to 16 and the locking tabs 17, 18, 19, which are part of a bayonet between the lighting device and a vehicle headlight. The three locking tabs 17, 18, 19 are arranged equidistantly along the circumference of the circular cylindrical mounting surface 10 at a distance of 120 degrees. They are directed radially outward. The two locking tabs 17, 18 have the same shape, but mirror-symmetrically with respect to. The diameter of the mounting surface 10 are arranged, which extends centrally through the third locking tab 19. The locking tab 19 has a different shape than the first 17 and second locking tab 18 to ensure a clear orientation and installation position of the illumination device in the vehicle headlight. The two outer cooling fins 11 and 16 have on their outer surface a profile 11a and 16a, respectively, in order to ensure a better grip when operating the bayonet closure. In addition to the locking tab 19, the mounting surface 10 has a recess 102 to provide space for mounting a lateral, acting perpendicular to the axis of rotation of the bayonet fitting pressure spring 103. The pressure spring 103 is disposed between the locking tab 19 and the spring ring 101. She is in the presentation of FIG. 1 covered by the locking tab 19.

Auf der Montagefläche 10 des Kühlkörpers 1 ist eine Trägerplatte 2, beispielsweise eine so genannte Metallkernplatine, für insgesamt fünf Leuchtdiodenchips 3 (auch LED-Chips genannt) fixiert. Bei der Metallkernplatine 2 handelt es sich um eine Metallplatte, die mit einer elektrischen Isolierung, beispielsweise aus Keramik, versehen ist. Auf der elektrischen Isolierung der Metallkernplatine 2 sind Leiterbahnen 21 zur elektrischen Kontaktierung der LED-Chips 3 angeordnet. Die Trägerplatte bzw. Metallkernplatine 2 gewährleistet eine elektrische Isolierung zwischen dem metallischen Kühlkörper 1 den LED-Chips 3. Die Trägerplatte 2 ist beispielsweise mechanisch, durch Klemmsitz in einer Aussparung des Kühlkörpers 1 oder mittels einer Rastverbindung oder mit Hilfe eines Klebemittels auf der Montagefläche 10 des Kühlkörpers 1 verankert. Zur Ausrichtung und lagerichtigen Montage der Trägerplatte 2 auf der Montagefläche 10 des Kühlkörpers 1 können beispielsweise zwei Bohrungen in der Montagefläche 10 angebracht sein, in die jeweils ein passgerecht geformter Stift an der Unterseite der Trägerplatte 2 eingreift. Diese Bohrungen können auch die Ausrichtung und Einbaulage der Trägerplatte 2 bezüglich der Verriegelungslaschen 17 bis 19 definieren. Die fünf Leuchtdiodenchips 3 sind auf der Trägerplatte 2 in einer Reihe angeordnet und von den Wänden einer so genannten Vergusswanne 4 umgeben, so dass die aus den fünf Leuchtdiodenchips 3 bestehende Reihe am Boden der Vergusswanne 4 angeordnet ist. Die Vergusswanne 4 ist teilweise mit einer lichtdurchlässigen, die Leuchtdiodenchips 3 bedeckenden Vergussmasse gefüllt, welche beispielsweise zwei verschiedene Leuchtstoffe enthält, um die Wellenlänge eines Teils der von den Leuchtdiodenchips 3 generierten elektromagnetischen Strahlung zu konvertieren, so dass die Beleuchtungseinrichtung während ihres Betriebs weißes Licht emittiert. Derartige Leuchtstoffe sind beispielsweise in der WO 98/12757 beschrieben. Die den Leuchtdiodenchips 3 zugewandte Oberfläche 4a der Wände der Vergusswanne 4 sind lichtreflektierend ausgebildet. Bei den Leuchtdiodenchips 3 handelt es sich beispielsweise um Dünnfilm-Leuchtdiodenchips, deren Grundprinzip beispielsweise in der Druckschrift I. Schnitzer et al., Appl. Phys. Lett. 63 (16), 18. Oktober 1993, 2174-2176 beschrieben ist. Die fünf Leuchtdiodenchips 3 bilden zusammen mit der Vergussmasse und den darin integrierten Leuchtstoffen fünf Leuchtdioden.On the mounting surface 10 of the heat sink 1 is a support plate 2, for example, a so-called metal core board, fixed for a total of five LED chips 3 (also called LED chips). The metal core board 2 is a metal plate, which is provided with an electrical insulation, such as ceramic. On the electrical insulation of the metal core board 2 printed conductors 21 are arranged for electrical contacting of the LED chips 3. The support plate or metal core plate 2 ensures electrical insulation between the metallic heat sink 1 the LED chips 3. The support plate 2 is mechanically, for example, by clamping fit in a recess of the heat sink 1 or by means of a snap connection or with the aid of an adhesive on the mounting surface 10 of Heatsink 1 anchored. For alignment and correct mounting of the support plate 2 on the mounting surface 10 of the heat sink 1, for example, two holes in the mounting surface 10 may be mounted, in each of which engages a properly shaped pin on the underside of the support plate 2. These holes can also define the orientation and mounting position of the carrier plate 2 with respect to the locking tabs 17-19. The five light-emitting diode chips 3 are arranged in a row on the carrier plate 2 and surrounded by the walls of a so-called potting trough 4, so that the row consisting of the five light-emitting diode chips 3 is arranged at the bottom of the potting pan 4. The Vergusswanne 4 is partially filled with a translucent, the light-emitting diode chips 3 covering potting compound, which contains, for example, two different phosphors to convert the wavelength of a portion of the generated by the LED chips 3 electromagnetic radiation, so that the illumination device emits white light during their operation. Such phosphors are for example in the WO 98/12757 described. The light emitting diode chips 3 facing surface 4a of the walls of Vergusswanne 4 are formed light-reflecting. The light-emitting diode chips 3 are, for example, thin-film light-emitting diode chips whose basic principle is described, for example, in US Pat Reference I. Schnitzer et al., Appl. Phys. Lett. 63 (16), 18 October 1993, 2174-2176 is described. The five light-emitting diode chips 3, together with the potting compound and the phosphors integrated therein, form five light-emitting diodes.

Die Trägerplatte 2 weist vier Bohrungen 22 auf, in die jeweils ein passgerecht darauf abgestimmter Stift 52 einer Primäroptik 5 (in Figur 4 abgebildet) oder einer Halterung für die Primäroptik 5 eingreift. Dadurch wird mittels der Stifte 52 die Primäroptik 5 an der Trägerplatte 2 fixiert und ihre Einbaulage und Orientierung bezüglich der Trägerplatte 2 und damit auch bezüglich der Verriegelungslaschen 17 bis 19 festgelegt. Vorzugsweise sind die Bohrungen 22 passgerecht über entsprechenden Bohrungen in der Montagefläche 10 des Kühlkörpers 1 angeordnet, so dass die Stifte 52 der Primäroptik 5 durch die Bohrungen 22 der Trägerplatte 2 hindurchgeführt sind und in die vorgenannten Bohrungen in dem Kühlkörper 1 greifen. Dadurch wird mittels der Passstifte 52 zusätzlich zu der Primäroptik 5 auch die Trägerplatte 2 an dem Kühlkörper 1 fixiert und ausgerichtet. In diesem Fall werden für die Trägerplatte 2 keine separaten Mittel zur Befestigung auf der Montagefläche 10 des Kühlkörpers 1 benötigt. Um den Abstand der Primäroptik 5 über den darunter befindlichen Leuchtdiodenchips 3 auf den richtigen Wert einzustellen, können zwischen der Primäroptik 5 und der Trägerplatte 2 oder der Montagefläche 10 ein oder mehrere Abstandshalter vorgesehen sein, welche die Eindringtiefe der Stifte 52 in den Bohrungen 22 begrenzen. Bei der Primäroptik handelt es sich um einen zusammengesetzten optischen Konzentrator, der ähnlich wie der optische Konzentrator 5 des in Figur 4 abgebildeten Ausführungsbeispiels der Erfindung ausgebildet ist. Ein Ende dieses optischen Konzentrators 5 greift in die Vergusswanne 4 und ist beispielsweise mittels Kanadabalsam optisch an die Leuchtdiodenchips 3 gekoppelt. Der optische Konzentrator 5 bündelt das von den Leuchtdiodenchips 3 generierte Licht, so dass es aus der von den Leuchtdiodenchips 3 abgewandten Stirnseite 51 des Konzentrators 5 mit verringerter Divergenz austritt. Bei dem optischen Konzentrator 5 handelt es sich beispielsweise um einen zusammengesetzten parabolischen Konzentrator (Compound Parabolic Concentrator, CPC) oder einen zusammengesetzten elliptischen Konzentrator (Compound Ellyptic Concentrator, CEC) oder um einen zusammengesetzten hyperbolischen Konzentrator (Compound Hyperbolic Concentrator, CHC). Die Primäroptik 5 ist bezüglich der Leuchtdiodenchips 3 in einer wohldefinierten Lage und Orientierung auf dem Kühlkörper 1 bzw. auf der Trägerplatte 2 angeordnet. Die Primäroptik 5 ist auf die Optik des Fahrzeugscheinwerfers (Sekundäroptik) abgestimmt.The support plate 2 has four holes 22, in each of which a suitably matched thereto pin 52 a primary optics 5 (in FIG. 4 shown) or a holder for the primary optics 5 engages. As a result, by means of the pins 52, the primary optics 5 fixed to the support plate 2 and their installation position and orientation with respect to the support plate 2 and thus also with respect to the locking tabs 17 to 19 fixed. Preferably, the bores 22 are arranged in a fitting manner via corresponding bores in the mounting surface 10 of the heat sink 1, so that the pins 52 of the primary optics 5 are passed through the bores 22 of the carrier plate 2 and engage in the aforementioned holes in the heat sink 1. As a result, in addition to the primary optics 5, the carrier plate 2 is also fixed and aligned on the heat sink 1 by means of the dowel pins 52. In this case, no separate means for mounting on the mounting surface 10 of the heat sink 1 are required for the support plate 2. In order to set the distance of the primary optics 5 on the underlying LED chips 3 to the correct value, one or more spacers may be provided between the primary optics 5 and the support plate 2 or the mounting surface 10, which limit the penetration depth of the pins 52 in the holes 22. Primary optics is a composite optical concentrator similar to the optical concentrator 5 of in FIG. 4 imaged embodiment of the invention is formed. One end of this optical concentrator 5 engages in the Vergusswanne 4 and is optically coupled to the LED chips 3, for example by means of Canada balm. The optical concentrator 5 concentrates the light generated by the light-emitting diode chips 3, so that it emerges from the end face 51 of the concentrator 5 facing away from the light-emitting diode chips 3 with reduced divergence. The optical concentrator 5 is, for example, a Compound Parabolic Concentrator (CPC) or a Compound Ellyptic Concentrator (CEC) or a Compound Hyperbolic Concentrator (CHC). The primary optics 5 are arranged with respect to the LED chips 3 in a well-defined position and orientation on the heat sink 1 or on the carrier plate 2. The primary optics 5 is matched to the optics of the vehicle headlight (secondary optics).

Die zum Betrieb der Leuchtdiodenchips 3 erforderlichen elektrischen Bauteile sind auf einer als Lead-Frame ausgebildeten Montageplatte 6 angeordnet. Die mit den vorgenannten elektrischen Bauteilen (nicht abgebildet) bestückte Montageplatte 6 ist einer passgerechten Aussparung der mittleren Kühlrippe 14 angeordnet und fixiert. Die auf der Montageplatte 6 montierten elektrischen Bauteile ragen in den Zwischenraum zwischen die Montageplatte 6 und die benachbarten Kühlrippen 13 oder/und 15. Auf der Montageplatte 6 ist ferner der elektrische Anschluss 7 der Beleuchtungseinrichtung montiert. Der elektrische Anschluss 7 ist als Buchse mit Kontaktpins 71 ausgebildet, die zur Aufnahme eines darauf abgestimmten Steckers vorgesehen ist. Mittels der Buchse 7 werden die auf der Montageplatte 6 angeordneten elektrischen Bauteile mit elektrischer Energie versorgt. Die aus den vorgenannten elektrischen Bauteilen bestehende Stromversorgungsschaltung der Leuchtdiodenchips 3 ist mittels Stromzuführungen (nicht abgebildet), die durch den Durchbruch 100 in der Montagefläche 10 hindurchgeführt und mit den Leiterbahnen 21 auf der Trägerplatte 2 kontaktiert sind, mit den Leuchtdiodenchips 3 elektrisch leitend verbunden.The electrical components required for the operation of the LED chips 3 are arranged on a mounting plate 6 designed as a lead frame. The assembled with the aforementioned electrical components (not shown) mounting plate 6 is arranged a matching recess of the central fin 14 and fixed. The mounted on the mounting plate 6 electrical components protrude into the space between the mounting plate 6 and the adjacent cooling fins 13 and / or 15. On the mounting plate 6, the electrical connection 7 of the lighting device is also mounted. The electrical terminal 7 is formed as a socket with contact pins 71, which is provided for receiving a connector adapted thereto. By means of the socket 7, the arranged on the mounting plate 6 electrical components are supplied with electrical energy. The consisting of the aforementioned electrical components power supply circuit of the LED chips 3 by means of power supply lines (not shown), which are passed through the opening 100 in the mounting surface 10 and contacted with the conductors 21 on the support plate 2, electrically connected to the LED chips 3.

In der Figur 3 ist schematisch eine Halterung 30 für die in den Figuren 1, 2, 5 und 6 abgebildeten Ausführungsbeispiele der erfindungsgemäßen Beleuchtungseinrichtung dargestellt. Diese Halterung 30 ist Bestandteil des Fahrzeugscheinwerfers und befindet sich beispielsweise an der von der Lichtaustrittsöffnung des Fahrzeugscheinwerferreflektors abgewandten Rückseite des Fahrzeugscheinwerferreflektors. Beispielsweise kann an der Rückseite des vorgenannten Reflektors eine Halterung 30 mit der in Figur 3 dargestellten Montageöffnung 300 vorgesehen sein. Der Rand der Montageöffnung 300 ist mit passgerechten Aussparungen 301, 302, 303 für die Verriegelungslaschen 17, 18, 19 der Beleuchtungseinrichtung versehen. Am Rand der Montageöffnung 300 sind ferner ein Anschlag 304 für die Verriegelungslasche 19 und eine Rampe 305 angeordnet. Die Montageöffnung 300 mit den Aussparungen 301 bis 303 und dem Anschlag 304 sowie der Rampe 305 bildet zusammen mit den Verriegelungslaschen 17 bis 19 einen Bajonettverschluss zwischen der Beleuchtungseinrichtung und der Halterung 30 des Fahrzeugscheinwerfers. Zur Betätigung des Bajonettverschlusses wird die Beleuchtungseinrichtung mit ihrer Montagefläche 10, welche die in den Reflektor des Fahrzeugscheinwerfers hineinragende Vorderseite der Beleuchtungseinrichtung bildet, auf die Halterung 30 aufgesteckt, wobei die Verriegelungslasche 19 in die Aussparung 303, die Verriegelungslasche 17 in die Aussparung 301 und die Verriegelungslasche 18 in die Aussparung 302 eingreifen und die Vorderseite 10 der Beleuchtungseinrichtung inklusive der Verriegelungslaschen 17 bis 19 durch die Montageöffnung 300 hindurchragen, so dass die Rückseite der Halterung 30 an dem Federring 101 auf dem Kühlkörper 1 anliegt. Mittels einer Drehbewegung wird die Beleuchtungseinrichtung gegenüber dem Abschnitt 30 um ca. eine Vierteldrehung gedreht, so dass die Verriegelungslasche 19 über die Rampe 305 gleitet und am Anschlag 304 anliegt. Der Anschlag 304 verhindert eine weitere Drehbewegung in die Eindrehrichtung. Die Rampe 305 erschwert eine Drehbewegung in Ausdrehrichtung und verhindert eine selbsttätige Entriegelung des Bajonettverschlusses. Die Andruckfeder 103 liegt im Bereich zwischen dem Anschlag 304 und der Rampe 305 an dem Rand der Montageöffnung 300 mit Klemmsitz an. Durch die Federwirkung der Andruckfeder 103 wird die Beleuchtungseinrichtung an die schräg zueinander verlaufenden Randbereiche 306, 307 der Montageöffnung gedrückt, so dass sich die Beleuchtungseinrichtung an drei Abschnitten des Randes der Montageöffnung 300 abstützt und damit gegen Bewegungen in der Flanschebene abgesichert ist. Die Halterung 30 bzw. der Rand der Montageöffnung 300 ist im verriegelten Zustand des Bajonettverschlusses mit Klemmsitz zwischen den Verriegelungslaschen 17 bis 19 und dem Federring 101 angeordnet. Die drei Verriegelungslaschen 17 bis 19 liegen in einer gemeinsamen Ebene, die eine Referenzebene für die Ausrichtung der Leuchtdiodenchips 3 und der Primäroptik 5 bezüglich dem Reflektor des Fahrzeugscheinwerfers bildet. Das heißt, die Ausrichtung der Leuchtdiodenchips 3 und der Primäroptik 5 auf dem Kühlkörper 1 gewährleistet in Verbindung mit dem oben beschriebenen Bajonettverschluss zwischen der Halterung 30 und der erfindungsgemäßen Beleuchtungseinrichtung eine eindeutig definierte Einbaulage der Lichtquelle bzw. Lichtquellen in dem Fahrzeugscheinwerfer.In the FIG. 3 schematically is a holder 30 for in the FIGS. 1 . 2 . 5 and 6 illustrated embodiments of the illumination device according to the invention. This holder 30 is part of the vehicle headlight and is located for example on the side facing away from the light exit opening of the vehicle headlight reflector back of the vehicle headlight reflector. For example, at the back of the aforementioned reflector, a holder 30 with the in FIG. 3 can be provided 300 shown assembly opening. The edge of the mounting opening 300 is provided with matching recesses 301, 302, 303 for the locking tabs 17, 18, 19 of the lighting device. At the edge of the mounting opening 300, a stop 304 for the locking tab 19 and a ramp 305 are further arranged. The mounting opening 300 with the recesses 301 to 303 and the stop 304 and the ramp 305 together with the locking tabs 17 to 19 a bayonet between the illumination device and the holder 30 of the vehicle headlight. To actuate the bayonet closure, the illumination device with its mounting surface 10, which forms the projecting into the reflector of the vehicle headlight front of the illumination device, attached to the holder 30, wherein the locking tab 19 in the recess 303, the locking tab 17 in the recess 301 and the locking tab 18 engage in the recess 302 and the front 10 of the illumination device including the locking tabs 17 to 19 protrude through the mounting hole 300, so that the back of the holder 30 abuts the spring ring 101 on the heat sink 1. By means of a rotary movement, the illumination device is rotated relative to the section 30 by approximately one quarter turn, so that the locking tab 19 slides over the ramp 305 and bears against the stop 304. The stopper 304 prevents further rotational movement in the screwing direction. The ramp 305 complicates a rotational movement in the direction of rotation and prevents an automatic unlocking of the bayonet lock. The pressure spring 103 is in the region between the stopper 304 and the ramp 305 at the edge of the mounting hole 300 with a press fit. Due to the spring action of the pressure spring 103, the illumination device is pressed against the obliquely extending edge regions 306, 307 of the mounting opening, so that the illumination device is supported on three sections of the edge of the mounting opening 300 and thus secured against movements in the flange plane. The holder 30 or the edge of the mounting opening 300 is arranged in the locked state of the bayonet lock with a press fit between the locking tabs 17 to 19 and the spring ring 101. The three locking tabs 17 to 19 lie in a common plane, which forms a reference plane for the alignment of the LED chips 3 and the primary optics 5 with respect to the reflector of the vehicle headlight. That is, the alignment of the LED chips 3 and the primary optics 5 on the heat sink 1 ensures in conjunction with the above-described bayonet between the holder 30 and the illumination device according to the invention a clearly defined mounting position of the light source or light sources in the vehicle headlight.

In Figur 4 ist eine Beleuchtungseinrichtung gemäß einem zweiten Ausführungsbeispiel der Erfindung dargestellt. Diese Beleuchtungseinrichtung besitzt einen Kühlkörper 400 mit einer kreisscheibenförmigen Montagefläche 401 und parallel verlaufenden Kühlrippen 402, die sich senkrecht zur Montagefläche 401 erstrecken. Der Kühlkörper 400 ist als einteiliges Aluminiumdruckgussteil ausgebildet. Die Außenkontur des Kühlkörpers 400 entspricht im wesentlichen der eines Kreiszylinders, wenn man von den Hohlräumen zwischen den Kühlrippen 402 absieht. Entlang eines Kreises sind auf der Montagefläche 401 drei Vertiefungen 403 in der Oberfläche des Kühlkörpers 400 in einem Winkelabstand von 120 Grad angeordnet. Diese Vertiefungen 403 sind Bestandteil eines Bajonettverschlusses zwischen der Beleuchtungseinrichtung und dem Fahrzeugscheinwerfer, in den die Beleuchtungseinrichtung eingesetzt wird. Auf der Montagefläche 401 sind drei Trägerplatten 404, 405, 406 für jeweils fünf Leuchtdiodenchips (auch LED-Chips genannt) fixiert. Die Trägerplatten 404, 405, 406 sind in einer Reihe angeordnet, so dass insgesamt fünfzehn Leuchtdiodenchips in einer Reihe auf der Vorderseite 401 des Kühlkörpers 400 angeordnet sind. Die beiden äußeren Trägerplatten 404, 406 sind jeweils auf einer Schrägen der Montagefläche 401 des Kühlkörpers 400 montiert. Die Leuchtdiodenchips sind, wie beim ersten Ausführungsbeispiel beschrieben ist (Figur 1), in einer Vergusswanne 407 angeordnet und werden in der Darstellung der Figur 4 durch die Primäroptik 5 verdeckt. Die Primäroptik 5 besitzt mehrere angeformte Zapfen bzw. Passstifte 52, mittels derer sie in Bohrungen in dem Kühlkörper 400 verankert ist. Die Primäroptik 5 greift in die Vergusswannen 407 ein, ist optisch an die in den Vergusswannen 407 angeordneten Leuchtdiodenchips gekoppet und ihre räumliche Lage sowie Ausrichtung ist mittels der Zapfen bzw. Passstifte 52 bezüglich der Trägerplatte 404 bis 406 justiert. Das von den Leuchtdioden generierte Licht tritt aus der Lichtaustrittsöffnung 51 der Primäroptik 5 mit reduzierter Divergenz aus. Die elektrischen Bauteile zum Betrieb der Leuchtdiodenchips sind auf einer als Lead-Frame ausgebildeten Montageplatte 408 montiert, die in einer Aussparung des Kühlkörpers 400 im Bereich der Montagefläche 401 angeordnet ist. Die Montageplatte 408 deckt die vorgenannte Aussparung im Kühlkörper 400 ab. Sie ist praktisch als Deckel für diese Aussparung ausgebildet. Die elektrischen Bauteile sind auf der Unterseite der Montageplatte 408 montiert, so dass die elektrischen Bauteile in die Aussparung hineinragen. In der Darstellung der Figur 4 ist die Oberseite der Montageplatte 408 sichtbar. Die Tiefe der vorgenannten Aussparung ist auf die Bauhöhe der auf der Montagplatine 408 montierten elektrischen Bauteile abgestimmt. In einer zweiten Aussparung am Rand der Montagefläche 401 ist ein als Buchse 409 ausgebildeter elektrischer Anschluss der Beleuchtungseinrichtung angeordnet. Über die Kontaktpins der Buchse 409 werden die auf der Montageplatte 408 montierten elektrischen Bauteile mit elektrischer Energie versorgt. Die von den elektrischen Bauteilen auf der Montageplatte 408 gebildete Schaltungsanordnung dient zur Stromversorgung der Leuchtdiodenchips. An dem den Trägerplatten 404, 405, 406 zugewandten Rand der Montageplatte 408 sind elektrische Kontakte 410 zur Kontaktierung der auf den Trägerplatten 404 bis 406 angeordneten Leuchtdiodenchips vorgesehen.In FIG. 4 a lighting device according to a second embodiment of the invention is shown. This illumination device has a heat sink 400 with a circular disk-shaped mounting surface 401 and parallel cooling fins 402, which extend perpendicular to the mounting surface 401. The heat sink 400 is formed as a one-piece die-cast aluminum part. The outer contour of the heat sink 400 substantially corresponds to that of a circular cylinder, apart from the cavities between the cooling fins 402. Along one Circle are arranged on the mounting surface 401 three recesses 403 in the surface of the heat sink 400 at an angular distance of 120 degrees. These recesses 403 are part of a bayonet closure between the illumination device and the vehicle headlight, in which the illumination device is used. On the mounting surface 401 three support plates 404, 405, 406 are fixed for each five LED chips (also called LED chips). The carrier plates 404, 405, 406 are arranged in a row, so that a total of fifteen light-emitting diode chips are arranged in a row on the front side 401 of the heat sink 400. The two outer support plates 404, 406 are each mounted on a slope of the mounting surface 401 of the heat sink 400. The LED chips are as described in the first embodiment ( FIG. 1 ), arranged in a Vergusswanne 407 and are in the representation of FIG. 4 obscured by primary optics 5. The primary optics 5 has a plurality of molded pins or dowel pins 52, by means of which it is anchored in holes in the heat sink 400. The primary optics 5 engages in the Vergusswannen 407, is optically coupled to the arranged in the Vergusswannen 407 LED chips and their spatial position and orientation is adjusted by means of the pins or dowel pins 52 with respect to the support plate 404-406. The light generated by the LEDs exits the light exit opening 51 of the primary optics 5 with reduced divergence. The electrical components for operating the light-emitting diode chips are mounted on a mounting plate 408 designed as a lead frame, which is arranged in a recess of the heat sink 400 in the region of the mounting surface 401. The mounting plate 408 covers the aforementioned recess in the heat sink 400. It is practically designed as a cover for this recess. The electrical components are mounted on the underside of the mounting plate 408, so that the electrical components protrude into the recess. In the presentation of the FIG. 4 the top of the mounting plate 408 is visible. The depth of the aforementioned recess is matched to the height of the mounted on the mounting board 408 electrical components. In a second recess on the edge of the mounting surface 401 designed as a socket 409 electrical connection of the lighting device is arranged. Via the contact pins of the socket 409, the electrical components mounted on the mounting plate 408 are supplied with electrical energy. The formed by the electrical components on the mounting plate 408 Circuit arrangement is used to power the LED chips. At the edge of the mounting plate 408 facing the support plates 404, 405, 406, electrical contacts 410 are provided for contacting the light-emitting diode chips arranged on the support plates 404 to 406.

Die Primäroptik 5 der Beleuchtungseinrichtung ist auf die nachgeschaltete Sekundäroptik des Fahrzeugscheinwerfers abgestimmt. Bei der Sekundäroptik kann es sich um einen Reflektor, beispielsweise einen Freiformflächenreflektor, ein optisches Linsensystem oder eine Kombination von einem optischen Linsensystem mit einem Reflektor handeln.The primary optics 5 of the illumination device is tuned to the downstream secondary optics of the vehicle headlight. The secondary optics can be a reflector, for example a free-form surface reflector, an optical lens system or a combination of an optical lens system with a reflector.

In den Figuren 5 und 6 ist ein drittes Ausführungsbeispiel der erfindungsgemäßen Beleuchtungseinrichtung dargestellt. Diese Beleuchtungseinrichtung ist weitgehend identisch zu der Beleuchtungseinrichtung gemäß des ersten Ausführungsbeispiels, das in den Figuren 1 und 2 abgebildet ist. Daher werden in den entsprechenden Figuren 1 und 2 sowie 5 und 6 für identische Teile der beiden Ausführungsbeispiele auch dieselben Bezugszeichen verwendet. Für die Beschreibung dieser Teile wird auf die Beschreibung der entsprechenden Teile des ersten Ausführungsbeispiels verwiesen. Die Beleuchtungseinrichtung gemäß dem dritten Ausführungsbeispiel unterscheidet sich von der gemäß dem ersten Ausführungsbeispiel nur durch die unterschiedliche Ausbildung des elektrischen Anschlusses 7'. Der elektrische Anschluss 7' der Beleuchtungseinrichtung ist auf der Montageplatte 6 montiert. Er besitzt vier metallische Kontaktstege 71', die in dem Hohlraum zwischen den Kühlrippen 13 und 14 angeordnet sind und sich in radialer Richtung des im wesentlichen kreiszylindrischen Kühlkörpers 1 erstrecken. Insbesondere verlaufen die Kontaktstege 71' parallel zu den Kühlrippen 11 bis 16 und überragen die Kühlrippen 11 bis 16. so dass die freien Enden der Kontaktstege 71' von dem Kühlkörper 1 abstehen. Bei der Montage der Beleuchtungseinrichtung in der Montageöffnung 300 der Halterung 30 (Figur 3), das heißt, während der Verriegelung des Bajonettverschlusses werden die Kontaktstege 71' in die Kontaktposition mit ihren Gegenkontakten am Fahrzeugscheinwerfer gedreht. Durch die Verriegelung des Bajonettverschlusses wird damit auch der elektrische Kontakt zwischen der Beleuchtungseinrichtung und der Bordnetzspannung des Fahrzeugs hergestellt. Beim Entriegeln des Bajonettverschlusses wird dem entsprechend auch automatisch der elektrische Kontakt zur Stromversorgung unterbrochen.In the Figures 5 and 6 a third embodiment of the illumination device according to the invention is shown. This lighting device is largely identical to the lighting device according to the first embodiment, which in the FIGS. 1 and 2 is shown. Therefore, in the corresponding Figures 1 and 2 such as 5 and 6 for identical parts of the two embodiments also uses the same reference numerals. For the description of these parts, reference is made to the description of the corresponding parts of the first embodiment. The illumination device according to the third embodiment differs from that according to the first embodiment only by the different design of the electrical connection 7 '. The electrical connection 7 'of the illumination device is mounted on the mounting plate 6. It has four metallic contact webs 71 ', which are arranged in the cavity between the cooling ribs 13 and 14 and extend in the radial direction of the substantially circular-cylindrical heat sink 1. In particular, the contact webs 71 'extend parallel to the cooling ribs 11 to 16 and project beyond the cooling ribs 11 to 16 so that the free ends of the contact webs 71' protrude from the heat sink 1. When mounting the illumination device in the mounting opening 300 of the holder 30 (FIG. FIG. 3 ), that is, during the locking of the bayonet closure, the contact webs 71 'are rotated into the contact position with their mating contacts on the vehicle headlight. Due to the locking of the bayonet lock so that the electrical contact between the lighting device and the vehicle electrical system voltage of the Vehicle produced. When unlocking the bayonet lock the corresponding electrical contact to the power supply is automatically interrupted accordingly.

Die Erfindung beschränkt sich nicht auf die oben erläuterten Ausführungsbeispiele. Beispielsweise können anstelle der weißes Licht emittierenden Leuchtdiode auch farbiges Licht emittierende Leuchtdioden verwendet werden, um die Beleuchtungseinrichtung als Lichtquelle in Heckleuchten des Fahrzeugs, zum Beispiel als Bremslicht, Rücklicht oder Blinklicht etc. einzusetzen.The invention is not limited to the embodiments explained above. For example, instead of the white light-emitting light-emitting diode, colored light-emitting light-emitting diodes can also be used in order to use the lighting device as a light source in rear lights of the vehicle, for example as a brake light, tail light or flashing light.

Claims (9)

  1. Illumination device having at least one light-emitting diode (3) and a heat sink (1) for the purpose of cooling the at least one light-emitting diode (3), the heat sink (1) having cooling ribs (11 to 16) and at least one cutout in which a mounting plate (6) is arranged, characterized in that the at least one cutout for the mounting plate (6) is arranged in the region of the cooling ribs (11 to 16), and the mounting plate (6) is fitted with electrical components for operating the at least one light-emitting diode (3).
  2. Illumination device according to Claim 1, characterized in that the heat sink (400) has at least one further cutout for the electrical connection (409) of the illumination device.
  3. Illumination device according to Claim 1, characterized in that one of the cooling ribs (14) is provided with the at least one cutout.
  4. Illumination device according to Claim 1 and 3, characterized in that the electrical connection (7; 7') of the illumination device is arranged on the mounting plate (6).
  5. Illumination device according to Claim 1, characterized in that the at least one light-emitting diode (3) is arranged and aligned in a defined position and orientation with respect to the heat sink (1; 400).
  6. Illumination device according to Claim 1 or 5, characterized in that the heat sink (1; 400) is provided with means (17, 18, 19; 403) for mounting the illumination device in the correct position in a vehicle headlight.
  7. Illumination device according to Claim 6, characterized in that the means (17, 18, 19) are formed as part of a bayonet-type lock (17 to 19, 300 to 305) between the illumination device and the vehicle headlight.
  8. Illumination device according to Claim 7, characterized in that the electrical connection (7') of the illumination device has at least one contact web (71') which extends perpendicularly with respect to the axis of the rotary movement of the bayonet-type lock (17 to 19, 300 to 305), with the result that, owing to the rotary movement when the bayonet-type lock (17 to 19, 300 to 305) is latched or unlatched, the electrical contact between the at least one contact web (71') and its opposing contact on the vehicle headlight is produced or released.
  9. Vehicle headlight having at least one illumination device according to one or more of the preceding claims.
EP05823447A 2004-12-22 2005-12-01 Lighting device comprising at least one light-emitting diode and vehicle headlight Active EP1828678B1 (en)

Applications Claiming Priority (2)

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DE102004062989A DE102004062989A1 (en) 2004-12-22 2004-12-22 Lighting device with at least one light emitting diode and vehicle headlights
PCT/DE2005/002171 WO2006066531A1 (en) 2004-12-22 2005-12-01 Lighting device comprising at least one light-emitting diode and vehicle headlight

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EP (1) EP1828678B1 (en)
JP (1) JP4608553B2 (en)
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DE (2) DE102004062989A1 (en)
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TW200639353A (en) 2006-11-16
US20080130308A1 (en) 2008-06-05
ES2342549T3 (en) 2010-07-08
EP1828678A1 (en) 2007-09-05
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DE502005009336D1 (en) 2010-05-12
DE102004062989A1 (en) 2006-07-06
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US7806562B2 (en) 2010-10-05
JP2008524816A (en) 2008-07-10
ATE462932T1 (en) 2010-04-15

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