EP2820348B1 - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
EP2820348B1
EP2820348B1 EP13704110.9A EP13704110A EP2820348B1 EP 2820348 B1 EP2820348 B1 EP 2820348B1 EP 13704110 A EP13704110 A EP 13704110A EP 2820348 B1 EP2820348 B1 EP 2820348B1
Authority
EP
European Patent Office
Prior art keywords
semiconductor light
light source
source module
lighting device
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13704110.9A
Other languages
German (de)
French (fr)
Other versions
EP2820348A1 (en
Inventor
Gerhard Behr
Stephan Schwaiger
Philipp Helbig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2820348A1 publication Critical patent/EP2820348A1/en
Application granted granted Critical
Publication of EP2820348B1 publication Critical patent/EP2820348B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/02—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for adjustment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers

Definitions

  • the invention relates to a lighting device according to the preamble of claim 1.
  • An illumination device is for example in the WO 2006/066530 A1 disclosed.
  • This document describes a lighting device with a semiconductor light source module and an optic, which are mounted on the front of a common carrier.
  • the optics has a plurality of dowel pins which extend through holes in the semiconductor light source module and in the carrier that fits through the holes.
  • the in the WO 2006/066530 A1 The disclosed construction does not allow easy replacement of the semiconductor light source module.
  • the illumination device has a semiconductor light source module and an optical system as well as a common carrier for the semiconductor light source module and the optical system, wherein the optical system is mounted on a front side of the carrier by means of at least one dowel pin which extends into a fitting of the semiconductor light source module.
  • the semiconductor light source module abuts against a rear side of the carrier opposite the front side, and the at least one dowel pin protrudes through an aperture in the carrier and extends into the fitting bore of the semiconductor light source module, the at least one dowel pin forming a shoulder adjacent to one the rear side of the carrier abutting bearing surface of the semiconductor light source module abuts.
  • measuring hole means that the diameter of the bore is matched to the diameter of the bore in the bore portion of the at least one dowel pin. That is, the diameter of the fitting hole in the semiconductor light source module corresponds to the diameter of the arranged in the mating bore portion of the at least one dowel pin.
  • the opening in the carrier and the fitting hole in the semiconductor light source module and the arrangement of optics and half light source module on different sides of the carrier can be replaced in the illumination device according to the invention, the semiconductor light source module in a simple manner, without previously the optics or other parts of the Lighting device according to the invention must be dismantled for this purpose.
  • the at least one dowel pin in cooperation with the fitting hole in the semiconductor light source module allows exact alignment or adjustment of the optics with respect to the semiconductor light source module.
  • the dowel pin determines the height of the optics on the support surface of the semiconductor light source module and defined by the fitting bore in the semiconductor light source module, the orientation and position of the optics with respect to the semiconductor light source module in a plane parallel to the support surface.
  • the at least one dowel pin is integrally formed with the optics.
  • the at least one dowel pin can be used not only for adjustment but as a means for attaching the optics to the semiconductor light source module.
  • the production is simplified because the same can be produced with the optics in the same manufacturing step dowel pin.
  • the at least one dowel pin is hollow and has a screw thread for receiving a screw.
  • the at least one dowel pin can additionally be used to attach the optics to the semiconductor light source module.
  • the at least one dowel pin protrudes from the bore in the semiconductor light source module from a side of the semiconductor light source module facing away from the contact surface and the protruding from the bore in the semiconductor light source module portion of the dowel pin is provided with a screw thread for a nut.
  • the lighting device according to the invention has first fastening means which are provided for fixing the support surface of the semiconductor light source module on the rear side of the carrier.
  • the first fastening means may be formed as a screw connection between the semiconductor light source module and optics or as a clamping device which presses the semiconductor light source module with its bearing surface against the rear side of the carrier.
  • the screw connection has over the clamping device the advantage that with their help, a comparatively high contact pressure between the semiconductor light source module and the carrier can be achieved and thus a good thermal coupling between the semiconductor light source module and carrier is made possible.
  • second fastening means are provided which serve to fix the optics on the carrier.
  • These second fastening means allow the optics to be fixed to the carrier independently of the at least one dowel pin and to ensure that the connection between the optics and the carrier remains in the case of a dismantled semiconductor light source module.
  • the second fastening means are designed as a snap or latching connection between the optics and the carrier. The snap or locking connection allows a fixation of the optics on the carrier in an already roughly aligned alignment.
  • the support of the illumination device according to the invention advantageously has a recess for receiving a section of the semiconductor light source module provided with semiconductor light sources. This makes it possible for the section of the semiconductor light source module equipped with the semiconductor light sources to extend to the front side of the carrier so that the light emitted by the semiconductor light sources impinges on the optics arranged on the front side of the carrier.
  • the carrier of the illumination device according to the invention is designed as a heat sink.
  • effective cooling of the semiconductor light source module can be ensured since the heat generated by the semiconductor light source module is dissipated to the environment by means of the heat sink.
  • the semiconductor light source module of the illumination device according to the invention preferably has a heat sink on which the semiconductor light sources are arranged.
  • the bearing surface of the semiconductor light source module is formed as part of the heat sink. This ensures a good thermal coupling of the semiconductor light sources to the heat sink and ensures that the heat generated by the semiconductor light sources is dissipated via the heat sink and the support surface on the carrier, which is preferably designed as a heat sink.
  • the above offer screw connections described between the semiconductor light source module and the carrier by means of at least one dowel the ability to generate a high contact pressure between the support surface of the semiconductor light source module and the back of the carrier, thereby achieving a good thermal coupling between the semiconductor light source module and the carrier.
  • the heat sink is preferably made of metal, such as copper or aluminum, or ceramic, such as aluminum nitride, to ensure good thermal conductivity.
  • the carrier formed as a heat sink is preferably made of metal, for example of aluminum, in order to ensure a good thermal conductivity and is preferably provided with cooling fins in order to achieve a large surface which is in contact with the ambient air for the purpose of cooling.
  • the semiconductor light source module of the illumination device has electrical components of an operating device for the semiconductor light sources.
  • the semiconductor light source module can be connected directly to the mains voltage, for example the vehicle electrical system voltage of a motor vehicle.
  • the electrical components of the operating device are arranged on the heat sink of the semiconductor light source module in order to be able to dissipate the heat generated by the electrical components of the operating device also via the heat sink to the carrier designed as a heat sink.
  • Lighting device shown is an illumination device, which is provided for use in the headlight of a motor vehicle.
  • This lighting device has as essential components a semiconductor light source module 1, an optic 2 and a common carrier 3 for the semiconductor light source module 1 and the optics 2.
  • the carrier 3 is formed by a rectangular aluminum plate which has a flat front side 31 and a rear side 32 and at the rear side 32 of which cooling fins 30 are arranged.
  • the carrier 3 has on a longitudinal edge a recess 33 for receiving the semiconductor light source module 1.
  • the carrier 3 serves as a heat sink for the semiconductor light source module 1 and is therefore sometimes referred to below as a heat sink 3.
  • In the carrier three openings 34 are mounted for each a dowel pin 23 of the optics 2.
  • the three openings 34 in the carrier 3 are arranged in the manner of a triangle on the front side 31 of the carrier 3. That is, the three openings 34 form on the front side 31 of the carrier 3, the vertices of a fictitious triangle.
  • the optical system 2 is designed as a reflector to reflect the light emitted by the semiconductor light source module 1.
  • the optic 2 is cup-shaped, shaped with a substantially parabolic curvature. She has a light Reflective surface 21, which faces the semiconductor light sources of the semiconductor light source module 1.
  • the light-reflecting surface 21 is arranged on the inside of the shell-like optical system 2.
  • three hollow dowel pins 23 are formed, which are each provided in its interior with a screw thread and which serve to adjust the spatial position and orientation of the optical system 2 with respect to the semiconductor light source module 1.
  • the in FIG. 6 only shown very schematically third dowel pin 23 has the same construction as in FIG.
  • the two optics pins 2 are arranged on the front side 31 of the carrier 3 and their three dowel pins 23 each protrude through an opening 34 in the carrier 3.
  • the three dowel pins 23 each have two sections 231, 232 with different outer diameters.
  • the first portion 231 is formed on the outer side 22 of the optical system 2 and the second portion 232 immediately adjoins the first portion 231 and forms the free end of the respective dowel pin 23.
  • At the transition from the first portion 231 to the second portion 232 forms each dowel pin 23 a paragraph 230, which is due to the different outer diameter of the two sections 231, 232, respectively.
  • the outer diameter of the second shoulder 232 is smaller than the outer diameter of its first portion 231 at each dowel pin 23.
  • the first portion 231 of the dowel pins 23 each extend through the corresponding aperture 34 in the carrier 3, so that the second portion 232 of the dowel pins 23 respectively at the back 32 of the carrier 3 stands out.
  • the optic 2 is provided with two spring-formed snap hooks 24, which are integrally formed on the outside 22 of the optic 2 and in each case engage behind in a recess 35 of the support 3 on its rear side 32.
  • the attachment of the optics 2 by means of the snap hook 24 is shown schematically in the Figures 5 and 6 shown.
  • the semiconductor light source module 1 has a heat sink 10 made of aluminum with a first wedge-like section 11, on the surface 110 of which a mounting plate 4 with five light-emitting diode chips 40 arranged in a row is mounted.
  • the LED chips 40 emit white light during their operation.
  • the mounting plate 4 is formed, for example, as a metal core board.
  • electrical components (not shown) of an operating device for the light-emitting diode chips 40 are mounted on a surface of the heat sink 10.
  • the first section 11 of the semiconductor light source module 10 is arranged in the recess 33 of the carrier 3 and projects beyond the front side 31 of the carrier 3, so that the light-emitting diode chips 40 are arranged substantially at the focal point of the parabolic optic 2 and the light emitted by the light-emitting diode chips 40 on the Light reflective inner side 21 of the optical system 2 hits.
  • the heat sink 10 further has a second, plate-like portion 12 which is angled perpendicular to the first portion 11.
  • the second, plate-like portion 12 of the heat sink 10 forms a bearing surface 120, which rests against the back 32 of the carrier 3.
  • the second, plate-like portion 12 of the heat sink 10 are three mating holes 121 arranged for each one of the three dowel pins 23 of the optics 2.
  • the diameter of the holes 121 is in each case matched to the outer diameter of the second portion 232 of the corresponding dowel pin 23, so that the second portion 232 of the dowel pins 23 respectively fits exactly into the corresponding bore 121.
  • the diameter of the holes 121 is thus smaller than the outer diameter of the first portion 231 of the dowel pins 23.
  • the second portion 232 of the three dowel pins 23 each extend into the corresponding bore 121 in the second, plate-like portion 12 of the heat sink 10, so that the paragraph 230 of the respective rests against the support surface 120 of the second, plate-like portion 12 of the heat sink 10.
  • the paragraph 230 of the dowel pins 23 therefore determines the height of the optics 2 on the support surface 120 of the second, plate-like portion 12 of the heat sink 10 and thus the altitude of the optics 2 with respect to the LED chips 40.
  • the spatial position and orientation of the optics 2 with respect to the LED chips 40th in directions parallel to the support surface 120 is determined by the position of the three holes 121. Since the outer diameter of the second portion 232 of the three dowel pins 23 is matched to the diameter of the corresponding bore 121, the dowel pins 23 are each arranged without play in the corresponding bore 121.
  • a bushing 7 is also arranged, which contains the electrical contacts for powering the semiconductor light source module 1 and is provided for receiving a plug.
  • the semiconductor light source module 1 is supplied with the vehicle electrical system voltage of the motor vehicle.
  • the carrier 3 three beyond the side edges of the support 3 protruding fastening devices 8 are further arranged, which serve for mounting the illumination device in a motor vehicle.
  • the screws 5 and 6 are released on the rear side 122 of the second, plate-like section 12 of the heat sink 10 of the semiconductor light source module 1.
  • the semiconductor light source module 1 can be removed from the rear side 32 of the carrier 3 by being pulled off from the second sections 232 of the dowel pins 23 which extend into the bores 121.
  • the optic 2 is after removing the screws 5 and the semiconductor light source module 1 by means of the snap hook 24 and the pins 34 stuck in the apertures 34 on the carrier 3 still sufficiently fixed so that they can not be detached from the carrier 3.
  • the assembly of the new semiconductor light source module 1 is done in the reverse order as the disassembly.
  • the semiconductor light source module 1 can additionally have a primary optics which is arranged directly above the light-emitting diode chips 40 and directs the light emitted by the light-emitting diode chips 40 onto the light-reflecting inner side 21 of the optical system 2.
  • This primary optics may be, for example, an optical lens or an optical concentrator.
  • the semiconductor light sources of the semiconductor light source module 1 may have other light sources such as superluminescent diodes or laser diodes instead of the light emitting diode chips 40.
  • the optics 2 may have other shapes than the shell-like according to the preferred embodiment.
  • the light-reflecting surface 21 of the optics may be partially or completely coated with phosphor.
  • the dowel pins 23 of the optics 2 do not necessarily have to be hollow.
  • the second portions 232 of the dowel pins 23 may be formed so as to protrude through the corresponding bore 121 in the second portion 12 of the heat sink 10 of the semiconductor light source module 1 and the portion of the second portion 232 of the dowel pins projecting from the back surface 122 of the heat sink 10 is a screw thread having, on which a nut can be screwed to screw the semiconductor light source module 1 to the optics 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

Die Erfindung betrifft eine Beleuchtungseinrichtung gemäß dem Oberbegriff des Anspruchs 1.The invention relates to a lighting device according to the preamble of claim 1.

I. Stand der Technik I. State of the art

Eine Beleuchtungseinrichtung ist beispielsweise in der WO 2006/066530 A1 offenbart. Diese Schrift beschreibt eine Beleuchtungseinrichtung mit einem Halbleiterlichtquellenmodul und einer Optik, die auf der Vorderseite eines gemeinsamen Trägers montiert sind. Insbesondere weist die Optik mehrere Passstifte auf, die sich durch passgerechte Bohrungen im Halbleiterlichtquellenmodul und im Träger erstrecken.
Die in der WO 2006/066530 A1 offenbarte Konstruktion erlaubt keinen einfachen Austausch des Halbleiterlichtquellenmoduls.An illumination device is for example in the WO 2006/066530 A1 disclosed. This document describes a lighting device with a semiconductor light source module and an optic, which are mounted on the front of a common carrier. In particular, the optics has a plurality of dowel pins which extend through holes in the semiconductor light source module and in the carrier that fits through the holes.
The in the WO 2006/066530 A1 The disclosed construction does not allow easy replacement of the semiconductor light source module.

In den Druckschriften JP2010182486A und EP 1 467 146 A2 sind weitere Beleuchtungseinrichtungen mit jeweils einem Halbleiterlichtquellenmodul und einer Optik offenbart.In the pamphlets JP2010182486A and EP 1 467 146 A2 Further lighting devices are disclosed, each with a semiconductor light source module and an optics.

II. Darstellung der Erfindung II. Presentation of the invention

Es ist Aufgabe der Erfindung, eine gattungsgemäße Beleuchtungseinrichtung bereitzustellen, die auf einfache Weise einen Austausch des Halbleiterlichtquellenmoduls erlaubt und eine Justage des Halbleiterlichtquellenmoduls bezüglich der Optik ermöglicht.
Diese Aufgabe wird erfindungsgemäß durch eine Beleuchtungseinrichtung mit den Merkmalen des Anspruchs 1 gelöst. Besonders vorteilhafte Ausführungen der Erfindung sind in den abhängigen Ansprüchen beschrieben.It is an object of the invention to provide a generic lighting device that allows a simple way to exchange the semiconductor light source module and allows adjustment of the semiconductor light source module with respect to the optics.
This object is achieved by a lighting device with the features of claim 1. Particularly advantageous embodiments of the invention are described in the dependent claims.

Die erfindungsgemäße Beleuchtungseinrichtung besitzt ein Halbleiterlichtquellenmodul und eine Optik sowie einem gemeinsamen Träger für das Halbleiterlichtquellenmodul und die Optik, wobei die Optik auf einer Vorderseite des Trägers mittels mindestens eines Passstifts montiert ist, der sich in eine passgerechte des Halbleiterlichtquellenmoduls erstreckt. Erfindungsgemäß liegt das Halbleiterlichtquellenmodul an einer der Vorderseite gegenüberliegenden Rückseite des Trägers an, und der mindestens eine Passstift ragt durch einen Durchbruch in dem Träger hindurch und erstreckt sich in die passgerechte Bohrung des Halbleiterlichtquellenmoduls, wobei der mindestens eine Passstift einen Absatz ausbildet, der an einer an der Rückseite des Trägers anliegenden Auflagefläche des Halbleiterlichtquellenmoduls anliegt. Der Begriff "passgerechte Bohrung" bedeutet, dass der Durchmesser der Bohrung passgerecht auf den Durchmesser des in der Bohrung steckenden Abschnitts des mindestens einen Passstifts abgestimmt ist. Das heißt, der Durchmesser der passgerechten Bohrung im Halbleiterlichtquellenmodul entspricht dem Durchmesser des in der passgerechten Bohrung angeordneten Abschnitts des mindestens einen Passstifts.The illumination device according to the invention has a semiconductor light source module and an optical system as well as a common carrier for the semiconductor light source module and the optical system, wherein the optical system is mounted on a front side of the carrier by means of at least one dowel pin which extends into a fitting of the semiconductor light source module. According to the invention, the semiconductor light source module abuts against a rear side of the carrier opposite the front side, and the at least one dowel pin protrudes through an aperture in the carrier and extends into the fitting bore of the semiconductor light source module, the at least one dowel pin forming a shoulder adjacent to one the rear side of the carrier abutting bearing surface of the semiconductor light source module abuts. The term "mating hole" means that the diameter of the bore is matched to the diameter of the bore in the bore portion of the at least one dowel pin. That is, the diameter of the fitting hole in the semiconductor light source module corresponds to the diameter of the arranged in the mating bore portion of the at least one dowel pin.

Aufgrund der oben beschriebenen, speziellen Konstruktion des mindestens einen Passstifts, des Durchbruchs im Träger und der passgerechten Bohrung im Halbleiterlichtquellenmodul sowie der Anordnung von Optik und Halblichtquellenmodul an unterschiedlichen Seiten des Trägers kann bei der erfindungsgemäßen Beleuchtungseinrichtung das Halbleiterlichtquellenmodul auf einfache Weise ausgewechselt werden, ohne dass zuvor die Optik oder andere Teile der erfindungsgemäßen Beleuchtungseinrichtung für diesen Zweck demontiert werden müssen. Außerdem ermöglicht der mindestens eine Passstift im Zusammenwirken mit der passgerechten Bohrung im Halbleiterlichtquellenmodul eine exakte Ausrichtung bzw. Justage der Optik bezüglich des Halbleiterlichtquellenmoduls. Insbesondere wird mittels des Absatzes des Passstifts die Höhe der Optik über der Auflagefläche des Halbleiterlichtquellenmoduls festgelegt und mittels der passgerechten Bohrung im Halbleiterlichtquellenmodul die Ausrichtung und Lage der Optik bezüglich des Halbleiterlichtquellenmoduls in einer Ebene parallel zur Auflagefläche definiert.Due to the above-described special construction of the at least one dowel pin, the opening in the carrier and the fitting hole in the semiconductor light source module and the arrangement of optics and half light source module on different sides of the carrier can be replaced in the illumination device according to the invention, the semiconductor light source module in a simple manner, without previously the optics or other parts of the Lighting device according to the invention must be dismantled for this purpose. In addition, the at least one dowel pin in cooperation with the fitting hole in the semiconductor light source module allows exact alignment or adjustment of the optics with respect to the semiconductor light source module. In particular, by means of the paragraph of the dowel pin determines the height of the optics on the support surface of the semiconductor light source module and defined by the fitting bore in the semiconductor light source module, the orientation and position of the optics with respect to the semiconductor light source module in a plane parallel to the support surface.

Vorteilhafterweise ist der mindestens eine Passstift einteilig mit der Optik ausgebildet. Dadurch kann der mindestens eine Passstift nicht nur zur Justage, sondern als Mittel zur Befestigung der Optik am Halbleiterlichtquellenmodul genutzt werden. Außerdem wird dadurch die Fertigung vereinfacht, da der simultan mit der Optik im gleichen Fertigungsschritt Passstift hergestellt werden kann.Advantageously, the at least one dowel pin is integrally formed with the optics. As a result, the at least one dowel pin can be used not only for adjustment but as a means for attaching the optics to the semiconductor light source module. In addition, the production is simplified because the same can be produced with the optics in the same manufacturing step dowel pin.

Gemäß einem bevorzugten Ausführungsbeispiel der Erfindung ist der mindestens eine Passstift hohl ausgebildet und besitzt ein Schraubgewinde zur Aufnahme einer Schraube. Dadurch kann der mindestens eine Passstift zusätzlich auch zur Befestigung der Optik am Halbleiterlichtquellenmoduls genutzt werden.According to a preferred embodiment of the invention, the at least one dowel pin is hollow and has a screw thread for receiving a screw. As a result, the at least one dowel pin can additionally be used to attach the optics to the semiconductor light source module.

Gemäß einem anderen Ausführungsbeispiel der Erfindung ragt der mindestens eine Passstift aus der Bohrung im Halbleiterlichtquellenmodul aus einer von der Auflagefläche abgewandten Seite des Halbleiterlichtquellenmoduls heraus und der aus der Bohrung im Halbleiterlichtquellenmodul herausragende Abschnitt des Passstifts ist mit einem Schraubgewinde für eine Mutter versehen. Diese Ausführungsform bietet ebenfalls die im vorstehenden Absatz genannten Vorteile des oben beschriebenen bevorzugten Ausführungsbeispiels der Erfindung.According to another exemplary embodiment of the invention, the at least one dowel pin protrudes from the bore in the semiconductor light source module from a side of the semiconductor light source module facing away from the contact surface and the protruding from the bore in the semiconductor light source module portion of the dowel pin is provided with a screw thread for a nut. This embodiment also provides the advantages mentioned in the preceding paragraph of the preferred embodiment of the invention described above.

Vorteilhafterweise weist die erfindungsgemäße Beleuchtungseinrichtung erste Befestigungsmittel auf, die zur Fixierung der Auflagefläche des Halbleiterlichtquellenmoduls an der Rückseite des Trägers vorgesehen. Beispielsweise können die ersten Befestigungsmittel als Schraubverbindung zwischen Halbleiterlichtquellenmodul und Optik oder als Klemmvorrichtung ausgebildet sein, die das Halbleiterlichtquellenmodul mit seiner Auflagefläche an die Rückseite des Trägers drückt. Die Schraubverbindung hat gegenüber den Klemmvorrichtung den Vorteil, dass mit ihrer Hilfe ein vergleichsweise hoher Anpressdruck zwischen Halbleiterlichtquellenmodul und Träger erzielbar ist und damit eine gute thermische Kopplung zwischen Halbleiterlichtquellenmodul und Träger ermöglicht wird.Advantageously, the lighting device according to the invention has first fastening means which are provided for fixing the support surface of the semiconductor light source module on the rear side of the carrier. For example, the first fastening means may be formed as a screw connection between the semiconductor light source module and optics or as a clamping device which presses the semiconductor light source module with its bearing surface against the rear side of the carrier. The screw connection has over the clamping device the advantage that with their help, a comparatively high contact pressure between the semiconductor light source module and the carrier can be achieved and thus a good thermal coupling between the semiconductor light source module and carrier is made possible.

Vorteilhafterweise sind bei der erfindungsgemäßen Beleuchtungseinrichtung zweite Befestigungsmittel vorhanden, die zur Fixierung der Optik am Träger dienen. Diese zweiten Befestigungsmittel erlauben eine Fixierung der Optik am Träger unabhängig von dem mindestens einen Passstift und gewährleisten, dass bei demontiertem Halbleiterlichtquellenmodul die Verbindung zwischen Optik und Träger bestehen bleibt. Vorzugsweise sind die zweiten Befestigungsmittel als Schnapp- oder Rastverbindung zwischen Optik und Träger ausgebildet sein. Die Schnapp- oder Rastverbindung ermöglicht eine Fixierung der am Optik am Träger in einer bereits grob justierten Ausrichtung.Advantageously, in the illumination device according to the invention second fastening means are provided which serve to fix the optics on the carrier. These second fastening means allow the optics to be fixed to the carrier independently of the at least one dowel pin and to ensure that the connection between the optics and the carrier remains in the case of a dismantled semiconductor light source module. Preferably, the second fastening means are designed as a snap or latching connection between the optics and the carrier. The snap or locking connection allows a fixation of the optics on the carrier in an already roughly aligned alignment.

Der Träger der erfindungsgemäßen Beleuchtungseinrichtung besitzt vorteilhafterweise eine Aussparung zur Aufnahme eines mit Halbleiterlichtquellen versehenen Abschnitts des Halbleiterlichtquellenmoduls. Dadurch wird ermöglicht, dass der mit den Halbleiterlichtquellen bestückte Abschnitt des Halbleiterlichtquellenmoduls sich bis zur Vorderseite des Trägers erstreckt, so dass das von den Halbleiterlichtquellen emittierte Licht auf die an der Vorderseite des Trägers angeordnete Optik auftrifft.The support of the illumination device according to the invention advantageously has a recess for receiving a section of the semiconductor light source module provided with semiconductor light sources. This makes it possible for the section of the semiconductor light source module equipped with the semiconductor light sources to extend to the front side of the carrier so that the light emitted by the semiconductor light sources impinges on the optics arranged on the front side of the carrier.

Vorzugsweise ist der Träger der erfindungsgemäßen Beleuchtungseinrichtung als Kühlkörper ausgebildet. Dadurch kann eine effektive Kühlung des Halbleiterlichtquellenmoduls gewährleistet werden, da die vom Halbleiterlichtquellenmodul erzeugte Wärme mittels des Kühlkörpers an die Umgebung abgeführt wird.Preferably, the carrier of the illumination device according to the invention is designed as a heat sink. As a result, effective cooling of the semiconductor light source module can be ensured since the heat generated by the semiconductor light source module is dissipated to the environment by means of the heat sink.

Das Halbleiterlichtquellenmodul der erfindungsgemäßen Beleuchtungseinrichtung besitzt vorzugsweise eine Wärmesenke, auf der die Halbleiterlichtquellen angeordnet sind. Außerdem ist die Auflagefläche des Halbleiterlichtquellenmoduls als Bestandteil der Wärmesenke ausgebildet ist. Dadurch wird eine gute thermische Kopplung der Halbleiterlichtquellen an die Wärmesenke gewährleistet und sicher gestellt, dass die von den Halbleiterlichtquellen erzeugte Wärme über die Wärmesenke und die Auflagefläche an den vorzugsweise als Kühlkörper ausgebildeten Träger abgeführt wird. In diesem Zusammenhang bieten die oben beschriebenen Schraubverbindungen zwischen Halbleiterlichtquellenmodul und Träger mittels des mindestens einen Passstifts die Möglichkeit, einen hohen Anpressdruck zwischen der Auflagefläche des Halbleiterlichtquellenmoduls und der Rückseite des Trägers zu erzeugen und dadurch eine gute thermische Kopplung zwischen Halbleiterlichtquellenmodul und Träger zu erzielen.The semiconductor light source module of the illumination device according to the invention preferably has a heat sink on which the semiconductor light sources are arranged. In addition, the bearing surface of the semiconductor light source module is formed as part of the heat sink. This ensures a good thermal coupling of the semiconductor light sources to the heat sink and ensures that the heat generated by the semiconductor light sources is dissipated via the heat sink and the support surface on the carrier, which is preferably designed as a heat sink. In this regard, the above offer screw connections described between the semiconductor light source module and the carrier by means of at least one dowel the ability to generate a high contact pressure between the support surface of the semiconductor light source module and the back of the carrier, thereby achieving a good thermal coupling between the semiconductor light source module and the carrier.

Die Wärmesenke besteht vorzugsweise aus Metall, beispielsweise Kupfer oder Aluminium, oder aus Keramik, beispielsweise Aluminiumnitrid, um eine gute Wärmeleitfähigkeit zu gewährleisten. Der als Kühlkörper ausgebildete Träger besteht vorzugsweise aus Metall, beispielsweise aus Aluminium, um eine gute Wärmeleitfähigkeit zu gewährleisten und ist vorzugsweise mit Kühlrippen versehen, um eine große Oberfläche zu erzielen, die zwecks Kühlung mit der Umgebungsluft im Kontakt ist.The heat sink is preferably made of metal, such as copper or aluminum, or ceramic, such as aluminum nitride, to ensure good thermal conductivity. The carrier formed as a heat sink is preferably made of metal, for example of aluminum, in order to ensure a good thermal conductivity and is preferably provided with cooling fins in order to achieve a large surface which is in contact with the ambient air for the purpose of cooling.

Vorteilhafterweise besitzt das Halbleiterlichtquellenmodul der erfindungsgemäßen Beleuchtungseinrichtung elektrische Komponenten einer Betriebsvorrichtung für die Halbleiterlichtquellen. Dadurch kann das Halbleiterlichtquellenmodul unmittelbar an die Netzspannung, beispielsweise die Bordnetzspannung eines Kraftfahrzeugs, angeschlossen werden. Vorzugsweise sind die elektrischen Komponenten der Betriebsvorrichtung auf der Wärmesenke des Halbleiterlichtquellenmoduls angeordnet, um die von den elektrischen Komponenten der Betriebsvorrichtung erzeugte Wärme ebenfalls über die Wärmesenke an den als Kühlkörper ausgebildeten Träger abführen zu können.Advantageously, the semiconductor light source module of the illumination device according to the invention has electrical components of an operating device for the semiconductor light sources. As a result, the semiconductor light source module can be connected directly to the mains voltage, for example the vehicle electrical system voltage of a motor vehicle. Preferably, the electrical components of the operating device are arranged on the heat sink of the semiconductor light source module in order to be able to dissipate the heat generated by the electrical components of the operating device also via the heat sink to the carrier designed as a heat sink.

III. Beschreibung des bevorzugten Ausführungsbeispiels III. Description of the Preferred Embodiment

Nachstehend wird die Erfindung anhand eines bevorzugten Ausführungsbeispiels näher erläutert. Es zeigen:

Figur 1
Einen Längsschnitt durch die Beleuchtungseinrichtung gemäß dem bevorzugten Ausführungsbeispiel der Erfindung in schematischer Darstellung mit Schnittebene im Bereich zweier Passstifte
Figur 2
Einen Querschnitt durch die in Figur 1 abgebildeten Beleuchtungseinrichtung in schematischer Darstellung mit Schnittebene im Bereich eines Passstifts
Figur 3
Einen Ausschnitt aus der Figur 1 mit vergrößerter Darstellung eines Passstifts
Figur 4
Einen Längsschnitt durch die Optik der in Figur 1 abgebildeten Beleuchtungseinrichtung
Figur 5
Einen Querschnitt durch die in Figur 1 abgebildeten Beleuchtungseinrichtung in schematischer Darstellung mit Schnittebene im Bereich der Befestigung von Halbleiterlichtquellenmodul und Träger
Figur 6
Einen Längsschnitt durch die in Figur 1 abgebildete Beleuchtungseinrichtung in schematischer Darstellung mit Schnittebene im Bereich der Befestigung von Optik und Träger
Figur 7
Eine Rückansicht der in Figur 1 abgebildeten Beleuchtungseinrichtung in perspektivischer Darstellung
Figur 8
Eine Vorderansicht der in Figur 1 abgebildeten Beleuchtungseinrichtung in perspektivische Darstellung
The invention will be explained in more detail below with reference to a preferred embodiment. Show it:
FIG. 1
A longitudinal section through the illumination device according to the preferred embodiment of the invention in a schematic representation with sectional plane in the region of two dowel pins
FIG. 2
A cross section through the in FIG. 1 illustrated illumination device in a schematic representation with sectional plane in the region of a dowel pin
FIG. 3
A section of the FIG. 1 with enlarged view of a dowel pin
FIG. 4
A longitudinal section through the optics of FIG. 1 pictured illumination device
FIG. 5
A cross section through the in FIG. 1 illustrated illumination device in a schematic representation with sectional plane in the region of the attachment of semiconductor light source module and carrier
FIG. 6
A longitudinal section through the in FIG. 1 illustrated illumination device in a schematic representation with sectional plane in the field of attachment of optics and support
FIG. 7
A rear view of the in FIG. 1 illustrated illumination device in perspective view
FIG. 8
A front view of the in FIG. 1 illustrated illumination device in perspective view

Bei der in den Figuren 1 bis 8 dargestellten Beleuchtungseinrichtung handelt es sich um eine Beleuchtungseinrichtung, die zum Einsatz im Frontscheinwerfer eines Kraftfahrzeugs vorgesehen ist. Diese Beleuchtungseinrichtung besitzt als wesentliche Komponenten ein Halbleiterlichtquellenmodul 1, eine Optik 2 und einen gemeinsamen Träger 3 für das Halbleiterlichtquellenmodul 1 und die Optik 2.In the in the FIGS. 1 to 8 Lighting device shown is an illumination device, which is provided for use in the headlight of a motor vehicle. This lighting device has as essential components a semiconductor light source module 1, an optic 2 and a common carrier 3 for the semiconductor light source module 1 and the optics 2.

Der Träger 3 wird von einer rechteckigen Aluminiumplatte gebildet, die eine ebene Vorderseite 31 und eine Rückseite 32 aufweist und an deren Rückseite 32 Kühlrippen 30 angeordnet sind. Der Träger 3 besitzt an einer Längskante eine Aussparung 33 zur Aufnahme des Halbleiterlichtquellenmoduls 1. Der Träger 3 dient als Kühlkörper für das Halbleiterlichtquellenmodul 1 und wird daher nachfolgend gelegentlich auch als Kühlkörper 3 bezeichnet. Im Träger sind drei Durchbrüche 34 für jeweils einen Passstift 23 der Optik 2 angebracht. Die drei Durchbrüche 34 im Trägers 3 sind nach Art eines Dreiecks auf der Vorderseite 31 des Trägers 3 angeordnet. Das heißt, die drei Durchbrüche 34 bilden auf der Vorderseite 31 des Trägers 3 die Eckpunkte eines fiktiven Dreiecks.The carrier 3 is formed by a rectangular aluminum plate which has a flat front side 31 and a rear side 32 and at the rear side 32 of which cooling fins 30 are arranged. The carrier 3 has on a longitudinal edge a recess 33 for receiving the semiconductor light source module 1. The carrier 3 serves as a heat sink for the semiconductor light source module 1 and is therefore sometimes referred to below as a heat sink 3. In the carrier three openings 34 are mounted for each a dowel pin 23 of the optics 2. The three openings 34 in the carrier 3 are arranged in the manner of a triangle on the front side 31 of the carrier 3. That is, the three openings 34 form on the front side 31 of the carrier 3, the vertices of a fictitious triangle.

Die Optik 2 ist als Reflektor ausgebildet, um das von dem Halbleiterlichtquellenmodul 1 emittierte Licht zu reflektieren. Die Optik 2 ist schalenartig, mit im wesentlichen parabolischer Krümmung geformt. Sie besitzt eine Licht reflektierende Oberfläche 21, die den Halbleiterlichtquellen des Halbleiterlichtquellenmoduls 1 zugewandt ist. Die Licht reflektierende Oberfläche 21 ist auf der Innenseite der schalenartigen Optik 2 angeordnet. An einer von der Innenseite 21 abgewandten Außenseite 22 der schalenartigen Optik 2 sind drei hohle Passstifte 23 angeformt, die jeweils in ihrem Inneren mit einem Schraubgewinde versehen sind und die zur Justage der räumlichen Lage und Orientierung der Optik 2 bezüglich des Halbleiterlichtquellenmoduls 1 dienen. Der in Figur 6 nur sehr schematisch dargestellte dritte Passstift 23 besitzt dieselbe Konstruktion wie die in Figur 1 dargestellten beiden anderen Passstifte 23. Die Optik 2 ist an der Vorderseite 31 des Trägers 3 angeordnet und ihre drei Passstifte 23 ragen jeweils durch einen Durchbruch 34 in dem Träger 3 hindurch. Die drei Passstifte 23 besitzen jeweils zwei Abschnitte 231, 232 mit unterschiedlichem Außendurchmesser. Der erste Abschnitt 231 ist an der Außenseite 22 der Optik 2 angeformt und der zweite Abschnitt 232 schließt sich unmittelbar an den ersten Abschnitt 231 an und bildet das freie Ende des jeweiligen Passstifts 23. Am Übergang vom ersten Abschnitt 231 zum zweiten Abschnitt 232 bildet jeder Passstift 23 einen Absatz 230 aus, der jeweils durch den unterschiedlichen Außendurchmesser der beiden Abschnitte 231, 232 bedingt ist. Der Außendurchmesser des zweiten Absatzes 232 ist bei jedem Passstift 23 kleiner als der Außendurchmesser seines ersten Abschnitts 231. Der erste Abschnitt 231 der Passstifte 23 ragt jeweils durch den entsprechenden Durchbruch 34 in dem Träger 3 hindurch, so dass der zweite Abschnitt 232 der Passstifte 23 jeweils an der Rückseite 32 des Trägers 3 herausragt. Zur Fixierung der Optik 2 an dem Träger 3 ist die Optik 2 mit zwei federnd ausgebildeten Schnapphaken 24 ausgestattet, die an der Außenseite 22 der Optik 2 angeformt sind und jeweils in einer Ausnehmung 35 des Trägers 3 an seiner Rückseite 32 hinterrasten. Die Befestigung der Optik 2 mittels der Schnapphaken 24 ist schematisch in den Figuren 5 und 6 dargestellt.The optical system 2 is designed as a reflector to reflect the light emitted by the semiconductor light source module 1. The optic 2 is cup-shaped, shaped with a substantially parabolic curvature. She has a light Reflective surface 21, which faces the semiconductor light sources of the semiconductor light source module 1. The light-reflecting surface 21 is arranged on the inside of the shell-like optical system 2. On a side facing away from the inner side 21 outside 22 of the shell-like optical system 2, three hollow dowel pins 23 are formed, which are each provided in its interior with a screw thread and which serve to adjust the spatial position and orientation of the optical system 2 with respect to the semiconductor light source module 1. The in FIG. 6 only shown very schematically third dowel pin 23 has the same construction as in FIG. 1 The two optics pins 2 are arranged on the front side 31 of the carrier 3 and their three dowel pins 23 each protrude through an opening 34 in the carrier 3. The three dowel pins 23 each have two sections 231, 232 with different outer diameters. The first portion 231 is formed on the outer side 22 of the optical system 2 and the second portion 232 immediately adjoins the first portion 231 and forms the free end of the respective dowel pin 23. At the transition from the first portion 231 to the second portion 232 forms each dowel pin 23 a paragraph 230, which is due to the different outer diameter of the two sections 231, 232, respectively. The outer diameter of the second shoulder 232 is smaller than the outer diameter of its first portion 231 at each dowel pin 23. The first portion 231 of the dowel pins 23 each extend through the corresponding aperture 34 in the carrier 3, so that the second portion 232 of the dowel pins 23 respectively at the back 32 of the carrier 3 stands out. To fix the optic 2 to the support 3, the optic 2 is provided with two spring-formed snap hooks 24, which are integrally formed on the outside 22 of the optic 2 and in each case engage behind in a recess 35 of the support 3 on its rear side 32. The attachment of the optics 2 by means of the snap hook 24 is shown schematically in the Figures 5 and 6 shown.

Das Halbleiterlichtquellenmodul 1 besitzt eine Wärmesenke 10 aus Aluminium mit einem ersten, keilartig ausgebildeten Abschnitt 11, auf dessen Oberfläche 110 eine Montageplatte 4 mit fünf, in einer Reihe angeordneten Leuchtdiodenchips 40 montiert ist. Die Leuchtdiodenchips 40 emittieren während ihres Betriebs weißes Licht. Die Montageplatte 4 ist beispielsweise als Metallkernplatine ausgebildet. Außerdem sind auf einer Oberfläche der Wärmesenke 10 elektrische Komponenten (nicht abgebildet) einer Betriebsvorrichtung für die Leuchtdiodenchips 40 montiert. Der erste Abschnitt 11 des Halbleiterlichtquellenmoduls 10 ist in der Aussparung 33 des Trägers 3 angeordnet und überragt die Vorderseite 31 des Trägers 3, so dass die Leuchtdiodenchips 40 im Wesentlichen im Brennpunkt der parabolischen Optik 2 angeordnet sind und das von den Leuchtdiodenchips 40 emittierte Licht auf die Licht reflektierende Innenseite 21 der Optik 2 trifft. Die Wärmesenke 10 besitzt ferner einen zweiten, plattenartig ausgebildeten Abschnitt 12, der senkrecht zum ersten Abschnitt 11 abgewinkelt ist. Der zweite, plattenartige Abschnitt 12 der Wärmesenke 10 bildet eine Auflagefläche 120 aus, die an der Rückseite 32 des Trägers 3 anliegt. In dem zweiten, plattenartigen Abschnitt 12 der Wärmesenke 10 sind drei passgerechte Bohrungen 121 für jeweils einen der drei Passstifte 23 der Optik 2 angeordnet. Der Durchmesser der Bohrungen 121 ist jeweils auf den Außendurchmesser des zweiten Abschnitts 232 des entsprechenden Passstifts 23 abgestimmt, so dass der zweite Abschnitt 232 der Passstifte 23 jeweils exakt in die entsprechende Bohrung 121 passt. Insbesondere ist der Durchmesser der Bohrungen 121 somit kleiner als der Außendurchmesser des ersten Abschnitts 231 der Passstifte 23. Der zweite Abschnitt 232 der drei Passstifte 23 erstreckt sich jeweils in die entsprechende Bohrung 121 im zweiten, plattenartigen Abschnitt 12 der Wärmesenke 10, so dass der Absatz 230 des jeweiligen an der Auflagefläche 120 des zweiten, plattenartigen Abschnitts 12 der Wärmesenke 10 anliegt. In Figur 3 ist dieser Sachverhalt schematisch dargestellt. Der Absatz 230 der Passstifte 23 bestimmt daher die Höhe der Optik 2 über der Auflagefläche 120 des zweiten, plattenartigen Abschnitts 12 der Wärmesenke 10 und damit die Höhenlage der Optik 2 bezüglich der Leuchtdiodenchips 40. Die räumliche Lage und Ausrichtung der Optik 2 bezüglich der Leuchtdiodenchips 40 in Richtungen parallel zur Auflagefläche 120 wird durch die Lage der drei Bohrungen 121 festgelegt. Da der Außendurchmesser des zweiten Abschnitts 232 der drei Passstifte 23 jeweils auf den Durchmesser der entsprechenden Bohrung 121 abgestimmt ist, sind die Passstifte 23 jeweils spielfrei in der entsprechenden Bohrung 121 angeordnet. Zur Fixierung der Optik 2 an dem Halbleiterlichtquellenmodul 1 wird von der Rückseite 32 des Trägers 3 bzw. von einer von der Auflagefläche 120 abgewandten Rückseite 122 des zweiten Abschnitts 12 der Wärmesenke 10 jeweils eine Schraube 5 in jede der drei Bohrungen 121 eingeführt und mit dem Schraubgewinde in dem entsprechenden hohlen Passstift 23 verschraubt. Durch die Schrauben 5 wird der Absatz 230 des entsprechenden Passstifts 23 an die Auflagefläche 120 des zweiten Abschnitts 12 der Wärmesenke 10 gedrückt. Zur Fixierung des Halbleiterlichtquellenmoduls 1 an dem Träger 3 sind zwei weitere Schrauben 6 vorgesehen, die in Schraubenlöcher an der Rückseite 122 des zweiten, plattenartigen Abschnitts 12 der Wärmesenke 10 eingeführt sind und mit entsprechenden Schraubenlöcher im Träger 3 verschraubt sind. An der Rückseite 122 des zweiten, plattenartigen Abschnitts 12 der Wärmesenke 10 ist außerdem eine Buchse 7 angeordnet, welche die elektrischen Kontakte zur Energieversorgung des Halbleiterlichtquellenmoduls 1 enthält und zur Aufnahme eines Steckers vorgesehen ist. Über die Buchse 7 wird das Halbleiterlichtquellenmodul 1 mit der Bordnetzspannung des Kraftfahrzeugs versorgt. An der Rückseite 32 des Trägers 3 sind ferner drei über die Seitenkanten des Trägers 3 hinausragende Befestigungsvorrichtungen 8 angeordnet, die zur Montage der Beleuchtungseinrichtung in einem Kraftfahrzeug dienen.The semiconductor light source module 1 has a heat sink 10 made of aluminum with a first wedge-like section 11, on the surface 110 of which a mounting plate 4 with five light-emitting diode chips 40 arranged in a row is mounted. The LED chips 40 emit white light during their operation. The mounting plate 4 is formed, for example, as a metal core board. In addition, electrical components (not shown) of an operating device for the light-emitting diode chips 40 are mounted on a surface of the heat sink 10. The first section 11 of the semiconductor light source module 10 is arranged in the recess 33 of the carrier 3 and projects beyond the front side 31 of the carrier 3, so that the light-emitting diode chips 40 are arranged substantially at the focal point of the parabolic optic 2 and the light emitted by the light-emitting diode chips 40 on the Light reflective inner side 21 of the optical system 2 hits. The heat sink 10 further has a second, plate-like portion 12 which is angled perpendicular to the first portion 11. The second, plate-like portion 12 of the heat sink 10 forms a bearing surface 120, which rests against the back 32 of the carrier 3. In the second, plate-like portion 12 of the heat sink 10 are three mating holes 121 arranged for each one of the three dowel pins 23 of the optics 2. The diameter of the holes 121 is in each case matched to the outer diameter of the second portion 232 of the corresponding dowel pin 23, so that the second portion 232 of the dowel pins 23 respectively fits exactly into the corresponding bore 121. In particular, the diameter of the holes 121 is thus smaller than the outer diameter of the first portion 231 of the dowel pins 23. The second portion 232 of the three dowel pins 23 each extend into the corresponding bore 121 in the second, plate-like portion 12 of the heat sink 10, so that the paragraph 230 of the respective rests against the support surface 120 of the second, plate-like portion 12 of the heat sink 10. In FIG. 3 This situation is shown schematically. The paragraph 230 of the dowel pins 23 therefore determines the height of the optics 2 on the support surface 120 of the second, plate-like portion 12 of the heat sink 10 and thus the altitude of the optics 2 with respect to the LED chips 40. The spatial position and orientation of the optics 2 with respect to the LED chips 40th in directions parallel to the support surface 120 is determined by the position of the three holes 121. Since the outer diameter of the second portion 232 of the three dowel pins 23 is matched to the diameter of the corresponding bore 121, the dowel pins 23 are each arranged without play in the corresponding bore 121. To fix the optic 2 to the semiconductor light source module 1 is from the back 32 of the support 3 or from a remote from the support surface 120 back 122 of the second portion 12 of the heat sink 10 each have a screw 5 in each of the three holes 121 is inserted and bolted to the screw thread in the corresponding hollow dowel pin 23. By the screws 5, the shoulder 230 of the corresponding dowel pin 23 is pressed against the support surface 120 of the second portion 12 of the heat sink 10. For fixing the semiconductor light source module 1 to the carrier 3, two further screws 6 are provided, which are inserted into screw holes on the back 122 of the second, plate-like portion 12 of the heat sink 10 and screwed with corresponding screw holes in the carrier 3. On the back 122 of the second, plate-like portion 12 of the heat sink 10, a bushing 7 is also arranged, which contains the electrical contacts for powering the semiconductor light source module 1 and is provided for receiving a plug. About the socket 7, the semiconductor light source module 1 is supplied with the vehicle electrical system voltage of the motor vehicle. On the back 32 of the carrier 3, three beyond the side edges of the support 3 protruding fastening devices 8 are further arranged, which serve for mounting the illumination device in a motor vehicle.

Zum Auswechseln des Halbleiterlichtquellenmoduls 1 werden die Schrauben 5 und 6 an der Rückseite 122 des zweiten, plattenartigen Abschnitts 12 der Wärmesenke 10 des Halbleiterlichtquellenmoduls 1 gelöst. Dadurch kann das Halbleiterlichtquellenmodul 1 von der Rückseite 32 des Trägers 3 abgenommen werden, indem es von den sich in die Bohrungen 121 erstreckenden zweiten Abschnitte 232 der Passstifte 23 abgezogen wird. Die Optik 2 ist nach dem Entfernen der Schrauben 5 und des Halbleiterlichtquellenmoduls 1 mittels der Schnapphaken 24 und der in den Durchbrüchen 34 steckenden Passstifte 23 am Träger 3 noch ausreichend fixiert, so dass sie sich nicht vom Träger 3 lösen kann. Die Montage des neuen Halbleiterlichtquellenmoduls 1 geschieht in umgekehrte Reihenfolge wie die Demontage.To replace the semiconductor light source module 1, the screws 5 and 6 are released on the rear side 122 of the second, plate-like section 12 of the heat sink 10 of the semiconductor light source module 1. As a result, the semiconductor light source module 1 can be removed from the rear side 32 of the carrier 3 by being pulled off from the second sections 232 of the dowel pins 23 which extend into the bores 121. The optic 2 is after removing the screws 5 and the semiconductor light source module 1 by means of the snap hook 24 and the pins 34 stuck in the apertures 34 on the carrier 3 still sufficiently fixed so that they can not be detached from the carrier 3. The assembly of the new semiconductor light source module 1 is done in the reverse order as the disassembly.

Die Erfindung beschränkt sich nicht auf das oben näher beschriebene Ausführungsbeispiel. Beispielsweise kann das Halbleiterlichtquellenmodul 1 zusätzlich eine Primäroptik aufweisen, die unmittelbar über den Leuchtdiodenchips 40 angeordnet ist und das von den Leuchtdiodenchips 40 emittierte Licht auf die Licht reflektierende Innenseite 21 der Optik 2 lenkt. Diese Primäroptik kann beispielsweise eine optische Linse oder ein optischer Konzentrator sein. Die Halbleiterlichtquellen des Halbleiterlichtquellenmoduls 1 können anstelle der Leuchtdiodenchips 40 auch andere Lichtquellen wie beispielsweise Superlumineszenzdioden oder Laserdioden besitzen. Außerdem kann auch die Optik 2 andere Formen aufweisen als die schalenartige gemäß dem bevorzugten Ausführungsbeispiel. Ferner kann die Licht reflektierende Oberfläche 21 der Optik teilweise oder vollständig mit Leuchtstoff beschichtet sein.The invention is not limited to the embodiment described in more detail above. By way of example, the semiconductor light source module 1 can additionally have a primary optics which is arranged directly above the light-emitting diode chips 40 and directs the light emitted by the light-emitting diode chips 40 onto the light-reflecting inner side 21 of the optical system 2. This primary optics may be, for example, an optical lens or an optical concentrator. The semiconductor light sources of the semiconductor light source module 1 may have other light sources such as superluminescent diodes or laser diodes instead of the light emitting diode chips 40. In addition, the optics 2 may have other shapes than the shell-like according to the preferred embodiment. Furthermore, the light-reflecting surface 21 of the optics may be partially or completely coated with phosphor.

Weiterhin müssen die Passstifte 23 der Optik 2 nicht unbedingt hohl ausgebildet sein. Stattdessen können die zweiten Abschnitte 232 der Passstifte 23 derart ausgebildet sein, dass sie durch die entsprechende Bohrung 121 im zweiten Abschnitt 12 der Wärmesenke 10 des Halbleiterlichtquellenmoduls 1 hindurchragen und der an der Rückseite 122 der Wärmesenke 10 herausregende Teil des zweiten Abschnitts 232 der Passstifte ein Schraubgewinde aufweist, auf das eine Mutter aufgeschraubt werden kann, um das Halbleiterlichtquellenmodul 1 mit der Optik 2 zu verschrauben. Furthermore, the dowel pins 23 of the optics 2 do not necessarily have to be hollow. Instead, the second portions 232 of the dowel pins 23 may be formed so as to protrude through the corresponding bore 121 in the second portion 12 of the heat sink 10 of the semiconductor light source module 1 and the portion of the second portion 232 of the dowel pins projecting from the back surface 122 of the heat sink 10 is a screw thread having, on which a nut can be screwed to screw the semiconductor light source module 1 to the optics 2.

Claims (10)

  1. Lighting device having a semiconductor light source module (1) and an optical unit (2) and also a common support (3) for the semiconductor light source module (1) and the optical unit (2), wherein the optical unit (2) is mounted on a front side (31) of the support (3) and has at least one dowel (23), which extends into a precisely fitting hole (121) in the semiconductor light source module (1), wherein
    - the semiconductor light source module (1) rests on a rear side (32) of the support (3), opposite the front side (31),
    - the at least one dowel (23) projects through an aperture (34) in the support (3) and extends into the precisely fitting hole (121) in the semiconductor light source module (1), characterized in that
    - the at least one dowel (23) forms a shoulder (230), which rests on a supporting surface (120) of the semiconductor light source module (1) that rests on the rear side (32) of the support (3).
  2. Lighting device according to Claim 1, wherein the at least one dowel (23) is formed in one piece with the optical unit (2).
  3. Lighting device according to Claim 1 or 2, wherein the at least one dowel (23) is designed to be hollow and has a screw thread to receive a screw (5).
  4. Lighting device according to Claim 1 or 2, wherein the at least one dowel projects out of the precisely fitting hole (121) in the semiconductor light source module (1), out of a side (122) of the semiconductor light source module (1) that faces away from the supporting surface (120), and the section of the dowel projecting out of the hole (121) in the semiconductor light source module (1) is provided with a screw thread for a nut.
  5. Lighting device according to one of Claims 1 to 4, wherein first fixing means (6) are provided in order to fix the supporting surface (120) of the semiconductor light source module (1) to the rear side (32) of the support (3).
  6. Lighting device according to one of Claims 1 to 5, wherein there are second fixing means (24, 35) for fixing the optical unit (2) to the support (3).
  7. Lighting device according to Claim 6, wherein the second fixing means (24, 35) are formed as a latching or snap-in connection between optical unit (2) and support (3).
  8. Lighting device according to one of Claims 1 to 7, wherein the support (3) has a cutout (33) to receive a section (11) of the semiconductor light source module (1) that is provided with semiconductor light sources (40).
  9. Lighting device according to one of Claims 1 to 8, wherein the support (3) is formed as a cooling element.
  10. Lighting device according to one of Claims 1 to 9, wherein the semiconductor light source module (1) has a heat sink (10), and wherein the supporting surface (120) is formed as a constituent part of the heat sink (10), and the semiconductor light sources (40) are arranged on the heat sink (10).
EP13704110.9A 2012-02-27 2013-02-13 Illumination device Active EP2820348B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012202933A DE102012202933A1 (en) 2012-02-27 2012-02-27 lighting device
PCT/EP2013/052878 WO2013127632A1 (en) 2012-02-27 2013-02-13 Lighting device

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EP2820348A1 EP2820348A1 (en) 2015-01-07
EP2820348B1 true EP2820348B1 (en) 2016-04-13

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US (1) US9297522B2 (en)
EP (1) EP2820348B1 (en)
CN (1) CN104136835B (en)
DE (1) DE102012202933A1 (en)
ES (1) ES2582503T3 (en)
HU (1) HUE029602T2 (en)
WO (1) WO2013127632A1 (en)

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US9297522B2 (en) 2016-03-29
EP2820348A1 (en) 2015-01-07
DE102012202933A1 (en) 2013-08-29
CN104136835A (en) 2014-11-05
HUE029602T2 (en) 2017-02-28
ES2582503T3 (en) 2016-09-13
US20140376232A1 (en) 2014-12-25
CN104136835B (en) 2016-07-06
WO2013127632A1 (en) 2013-09-06

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