EP2839209B1 - Illumination device - Google Patents
Illumination device Download PDFInfo
- Publication number
- EP2839209B1 EP2839209B1 EP13725083.3A EP13725083A EP2839209B1 EP 2839209 B1 EP2839209 B1 EP 2839209B1 EP 13725083 A EP13725083 A EP 13725083A EP 2839209 B1 EP2839209 B1 EP 2839209B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor light
- light source
- carrier
- source arrangement
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- Such a lighting device is for example in the WO 2006/097067 A1 disclosed.
- This publication describes a lighting device with a semiconductor light source arrangement which is fixed by means of a press fit on a support designed as a heat sink.
- the illumination device has at least one semiconductor light source arrangement which is fixed at several locations by means of a press fit on a carrier.
- press-fit here refers to a relationship between two mutually matched fastening elements of the at least one semiconductor light source arrangement and the carrier, wherein the first fastening element a hole and the second fastener is a rod-like fastener disposed in the hole, such as a land, a pin, a rivet, a screw or the like, and wherein in at least one spatial direction the dimension of the hole is smaller than the corresponding dimension of the rod-like fastener such that the rod-like fastener is press-fitted into the hole.
- the interference fit is also referred to as interference fit.
- the first fastening element of the press-fit that is, the hole
- the second, rod-like fastening element is arranged on the carrier.
- the first fastening element of the interference fit namely the hole
- the second rod-like fastening element can be arranged on a holding part of the at least one semiconductor light source arrangement.
- holes may be arranged both in the carrier and in the at least one semiconductor light source arrangement, the holes in the carrier and in the at least one semiconductor light source arrangement corresponding to each other, so that a rod-like fastening element both in a hole of the carrier and in a hole of at least a semiconductor light source arrangement can be introduced and is arranged with a press fit or in the hole of the carrier and the corresponding hole in the semiconductor light source arrangement to fix the carrier and semiconductor light source arrangement by means of the rod-like fastener to each other.
- the at least one semiconductor light source arrangement By fixing the at least one semiconductor light source arrangement by means of press-fitting at a plurality of locations on the carrier, precise positioning and alignment of the at least one semiconductor light source arrangement on the carrier is possible.
- tolerances in the dimensions for the at least one semiconductor light source arrangement and the carrier can be compensated by the mechanical stress of the press fit, and a backlash-free attachment of the at least one semiconductor light source arrangement to the carrier can be ensured.
- the interference fit allows a good thermal coupling between the at least one semiconductor light source arrangement and its carrier.
- the at least one semiconductor light source arrangement is fixed to the support in each case by an interference fit at at least three locations. This ensures a backlash-free attachment of the at least one semiconductor light source arrangement on the carrier in the desired position and orientation.
- the press fits are formed as bracket-type holders at at least two of the three abovementioned locations on the carrier.
- the effects of different coefficients of thermal expansion of the at least one semiconductor light source arrangement and of the carrier on the relative position and orientation of the semiconductor light source arrangement and carrier are compensated and a backlash-free arrangement of semiconductor light source arrangement and carrier also in the operating state, that is ensured in the strongly heated state of the semiconductor light source arrangement.
- the at the different thermal expansion of semiconductor light source arrangement and carrier, acting on the semiconductor light source assembly mechanical stresses are absorbed by the clip-like brackets.
- the clip-type brackets also compensate for mechanical stresses caused by inaccurate alignment of the press-fit fasteners disposed on the semiconductor light source array with respect to the press-fit fasteners disposed on the carrier.
- the interference fits of holes are formed in a support part of the at least one semiconductor light source arrangement and in the holes arranged, rod-like and fixed to the carrier or in the carrier fasteners.
- the rod-like fastening elements can additionally be used for fixing an optical system on the carrier, which is arranged downstream of the at least one semiconductor light source arrangement.
- rod-like fasteners preferably serve fasteners from the group of web, pin, rivet and screw or the like.
- the rod-like fastening elements are preferably made of metal for the purpose of good heat conduction and are preferably each arranged in a borehole of the carrier.
- the holes in the carrier can therefore be used as a reference for the alignment and mounting of the at least one semiconductor light source arrangement and optionally an additional optics are used on the carrier.
- the above-mentioned holding part of the at least one semiconductor light source arrangement is preferably made of plastic.
- the semiconductor light sources of the at least one semiconductor light source arrangement can be provided in a simple manner by means of injection molding with a housing or a mounting frame for further mounting on a heat sink.
- the clip-like brackets are each formed by the support member and a hole in the support member which extends to an outer edge of the support member, as well as arranged therein a rod-like fastener which is fixed in the carrier or on the carrier.
- a clamping effect is achieved in a simple manner. That is, the rod-like fastener disposed in the hole is supported in the hole as by a clamp.
- the mounting part of the at least one semiconductor light source arrangement clings to the rod-like fastening element, which is pressed in, for example, in the carrier or is formed as part of the carrier.
- the illumination device preferably has at least one optical system arranged downstream of the at least one semiconductor light source arrangement, so that light emitted by the at least one semiconductor light source arrangement hits the at least one optical system.
- This optic is preferably in the same places as the at least one semiconductor light source arrangement fixed by means of a press fit on the carrier.
- the system efficiency is increased because a common press fit is used for the at least one semiconductor light source arrangement and the at least one optical system for fixing on the carrier and thus no additional tolerance for the position and orientation of the at least one optic is caused when it is mounted on the carrier.
- the at least one optic has a base portion provided with holes for the interference fits, wherein at least some of the holes in the base portion of the at least one optic correspond to the holes in the support portion of the at least one semiconductor light source assembly.
- the holes in a base section of the at least one optical system it is ensured that the holes do not influence the optical properties of the at least one optical system. Since at least some of the holes in the base portion of the at least one optic correspond to the holes in the support portion of the at least one semiconductor light source array, the at least one optic and the at least one semiconductor light source array can be fixed to the locations of these holes by a common interference fit on the support.
- the base portion of the at least one optic preferably has at least two bracket-like support members, each formed by the base portion and a hole extending to an outer edge of the base portion.
- fixed or rod-like fastening elements are provided on or in the carrier, which are arranged both in a hole in the holding part of the at least one semiconductor light source arrangement and in a hole in the base part of the at least one optical system.
- a common press fit of semiconductor light source arrangement and optics on the carrier can be realized in a simple manner.
- the at least one semiconductor light source arrangement and the at least one optical system can be mounted on the carrier in one production step by the common press fit.
- the holes in the base portion of the at least one optic and the drill holes in the support portion of the formed at least one semiconductor light source arrangement similar.
- the holes of the press fits are advantageously designed as boreholes whose diameter is smaller than the diameter of the section of the rod-like fastening element arranged in the corresponding hole, the holes each having at least one slot at its edge.
- the slot at the edge of the borehole absorbs the forces caused by the excess of the rod-like fastening element arranged in the borehole.
- the slot advantageously extends from the edge of the respective borehole to an outer edge of the mounting part of the semiconductor light source arrangement or up to an outer edge of the base section of the optics.
- this borehole acts like a clamp which clasps the rod-shaped fastening element and makes it possible to absorb mechanical forces which are caused, for example, by the different thermal expansion of the semiconductor light source arrangement, the base section of the optics and supports or by inaccurate placement of the boreholes.
- the tolerance of the adjustment of the at least one semiconductor light source arrangement is on the carrier very low.
- the joint interference fit of the at least one semiconductor light source array and the at least one optic on the carrier does not cause any additional tolerance for the at least one optic which would reduce the accuracy of adjusting the entire system of carrier, semiconductor light source array and optics.
- the carrier, the at least one semiconductor light source arrangement and the at least one optical system are always under mechanical tension, whereby a play-free seating of the at least one semiconductor light source arrangement and the at least one optical system on the carrier is ensured.
- the carrier itself is designed as a heat sink or heat sink and therefore preferably consists of metal.
- FIG. 1 a lighting device according to the first embodiment of the invention is shown schematically.
- This illumination device has a semiconductor light source arrangement 1 and a carrier 2, on which the semiconductor light source arrangement 1 is fixed by means of a press fit.
- the semiconductor light source arrangement 1 has five light-emitting diode chips 11 arranged in a row are arranged on a substrate 12, and a support member 10 made of plastic, in which the substrate 12 is embedded with the LED chips 11 by means of plastic injection molding.
- the substrate 12 with the light-emitting diode chips 11 is arranged in a window of the holding part 10, so that the light emission of the light-emitting diode chips 11 is hardly hindered by the holding part 10.
- the semiconductor light source arrangement 1 also has metallic contact springs 14, which serve for the electrical connection between the contacts of the five light-emitting diode chips 11 and the contacts of the operating device 13. Furthermore, the semiconductor light source arrangement 1 has electrical connections 15, which are connected to electrical connection cables 16 for the power supply and control of the light-emitting diode chips 11 and their operating device 13.
- a tab 17, 18, 19 is arranged on each side of the holder part 10 of the semiconductor light source arrangement 1. These tabs 17, 18, 19 are each provided with a borehole 170, 180, 190, which serves in each case for producing a press fit with the carrier 2.
- a rivet 21, 22, 23 is arranged to produce the interference fit with the carrier 2, the diameter of the portion of the rivets 21, 22, 23 arranged in the respective borehole 170, 180 and 190, respectively, being slight greater than the diameter of the respective borehole 170, 180 and 190, respectively.
- FIG. 4 The shape and arrangement of the bores 170, 180, 190 in the plastic housing 10 of the semiconductor light source device 1 is shown in FIG FIG. 4 shown.
- the holes 170, 180, 190 form the corners of a fictitious triangle.
- Two opposing bores 170, 180 are each provided with a slot 171, 181 extending from the edge of the corresponding borehole 170, 180, respectively, to an outer edge of the associated tab 17, 18, respectively. That is, through the slots 171, 181, the borehole 170, 180 extends to the outer edge of the tab 17, 18.
- these tabs 17, 18 get the effect of a clip, the respective, with excess with respect to the corresponding borehole 170 and 180 equipped rivet 21 and 22 clasped.
- the third borehole 190 arranged in the tab 19 has two slots 191, 192 which are diametrically opposed to one another and are each arranged on the edge of the borehole 190, but do not extend as far as an outer edge of the third tab 19.
- the two diametrically opposed slots 191, 192 and the borehole 190 give the third tab 19 the effect of a clamp.
- the third tab 19 fixes the third, with excess with respect to the borehole 190 equipped rivet 23 in the manner of a terminal.
- the borehole 190 provided in the third tab 19 with the slots 191, 192 enables the semiconductor light source arrangement 1 to be accurately positioned on the carrier 2, the mechanical forces caused by the excess of the third rivet 23 being compensated by the two slots 191, 192.
- the other two, clip-like tabs 17, 18 with the associated bores 170, 180 and the corresponding slots 171, 181 allow the compensation of mechanical forces caused by differential thermal expansion of the semiconductor light source assembly 1 and support 2 or by inaccurate placement of the rivets 21, 22, 23 with respect to the bores 170, 180, 190. Even with very accurate positioning of the rivets 21, 22, 23 with respect to the holes 170, 180, 190 and in the cold state (at room temperature of 22 ° C) by the interference fit by means of the aforementioned holes and rivets play-free attachment of the semiconductor light source assembly 1 on the Carrier 2 guaranteed.
- the carrier 2 is designed as a heat sink and consists of a material with high thermal conductivity, for example, aluminum or copper.
- the rivets 21, 22, 23 are each arranged in a borehole 200 of the carrier 2 with a press fit.
- the three drill holes 200 for the rivets 21, 22, 23 are arranged in a fictitious triangle on a flat surface of the carrier 2 and form a reference for the spatial position and orientation of the semiconductor light source arrangement 1.
- the illumination device according to the second embodiment of the invention is shown.
- the illumination device according to the second embodiment of the invention is largely identical to the illumination device according to the first embodiment of the invention described above. It differs from the illumination device according to the above-described first embodiment of the invention only in that the illumination device according to the second embodiment of the invention additionally to the semiconductor light source arrangement 1 and the carrier 2 still has an optical system 3 which is arranged downstream of the semiconductor light source arrangement 1.
- the semiconductor light source arrangement 1 and the carrier 2 are identical in both embodiments of the invention. Therefore, for the description of the semiconductor light source device 1 and the carrier 2 according to the second embodiment of the invention, reference is made to the corresponding description of the semiconductor light source device 1 and the carrier 2 according to the first embodiment of the invention.
- the optic 3 is made of transparent plastic material and has a frusto-conical portion 31 and a flat base portion 30.
- the carrier 2, the semiconductor light source arrangement 1 and the optics 3 are arranged one above the other in the manner of a sandwich, the semiconductor light source arrangement 1 being arranged between the carrier 2 and the optic 3 in such a way that the light emitted by the light-emitting diode chips 11 enters the frustoconical portion 31 of the optic 3 is coupled.
- the base section 30 of the optics 3 is provided with three boreholes 32, 33, 34, which correspond to the boreholes 170, 180, 190 in the plastic housing 10 of the semiconductor light source arrangement 1.
- the boreholes 32, 33, 34 in the base portion 30 of the optic 3 have the same shape and orientation as the bores 170, 180, 190 in the plastic housing 10 of the semiconductor light source assembly 1.
- the boreholes 32, 33, 34 in the base portion 30 of the optic 3 with identically formed slots 321, 331, 341 and 342 as the holes 170, 180, 190 in the plastic housing 10 of the semiconductor light source assembly 1 equipped.
- the rivets 21 ', 22', 23 'in the illumination device according to the second embodiment of the invention in each case with a press fit both in a borehole 170, 180 and 190 of the support member 10 of the semiconductor light source assembly 1 and in a borehole 32, 33 and 34 arranged in the base portion 30 of the optical system 3.
- the diameter of the portion of the rivet 21 ', 22', 23 'stuck in the bores 170, 180 or 190 of the semiconductor light source arrangement 1 and in the boreholes 32, 33 and 34, respectively, of the optics 3 is slightly larger than the diameter of these bores 170, 180 , 190, 32, 33 and 34, respectively. In this way, a common interference fit of the semiconductor light source arrangement 1 and the optical system 3 on the carrier 2 is achieved.
- optics 3 Details of the optics 3, in particular the shape and arrangement of the boreholes 32, 33, 34 are in the FIG. 5 shown schematically.
- the holes 32, 33, 34 form the corners of a fictitious triangle.
- Two opposing boreholes 32, 33 are each provided with a slot 321, 331 extending from the edge of the corresponding borehole 32, 33, respectively, to an outer edge of the base portion 30 of the optic 3. That is, through the slots 321, 331, the borehole 32, 33 extends to the outer edge of the of the base portion 30 of the optic 3.
- these portions of the base portion 30 provided with the bores and slots receive the effect of a staple clasping the respective rivet 21 'and 22' respectively, which are oversized with respect to the corresponding borehole 31 and 32, respectively.
- the third borehole 34 arranged in the base portion 30 of the optic 3 has two slots 341, 342 which are diametrically opposed to one another and respectively arranged at the edge of the borehole 34, but do not extend to an outer edge of the base portion 30.
- the two diametrically opposed slots 341, 342 and the borehole 34 provide this, provided with the third borehole and the two slots portion of the base portion 30 of the optics 3 the action of a clamp for fixing the excessively with respect to the borehole 34 equipped rivet 23 '.
- the borehole 34 provided with the slots 341, 342 in the base section 30 of the optic 3 enables an exact positioning of the optic 3 on the support 2, wherein the mechanical forces caused by the excess of the third rivet 23 'on the optic 3 from the two slots 341, 342 be compensated.
- the other two holes 32, 33 and the corresponding slots 321, 331 allow the compensation of mechanical forces caused by differential thermal expansion of the optics 3, semiconductor light source assembly 1 and support 2 or by inaccurate placement of the rivets 21 ', 22', 23 'respect the boreholes 32, 33, 34 are caused. Even with very accurate positioning of the rivet 21 ', 22', 23 'with respect to the holes 32, 33, 34 and in the cold state (at room temperature of 22 ° C) by means of the press fit the aforementioned holes and rivets ensures a backlash-free attachment of the optics 3 on the support 2.
- the boreholes 32, 33, 34 and the slots 321, 331, 341, 342 in the base portion 30 of the optic 3 are placed just above the bores 170, 180, 190 and the slots 171, 181, 191, 192 and the rivets 21 ' , 22 ', 23' are each press-fitted both in a borehole 32, 33 and 34 in the base portion 30 of the optic 3 and in a borehole 170, 180 and 190 in the plastic housing 10 of the semiconductor light source assembly 1.
- the rivets 21, 22, 23 and 21 ', 22', 23 ' are made in both embodiments of metal, such as copper or aluminum.
- the excess of the rivets 21, 22, 23 or 21 ', 22', 23 'with respect to the bores 170, 180, 190 or 32, 33, 34 in the semiconductor light source arrangement 1 or in the optics 3 is in the range of 0, 02 mm to 0.06 mm. That is, the diameter of the portion of the rivet inserted in the aforesaid bores is 0.02 mm to 0.06 mm larger than the diameter of the aforementioned bores.
- the rivets 21, 22, 23 and 21 ', 22', 23 ' are tapered at one end, to better introduce them into the holes can. In Figure 6, this fact is shown schematically with reference to the rivet 23 '.
- the semiconductor light source arrangement 1 comprises not only light-emitting diode chips 11, but also any desired ones other semiconductor light sources, such as any type of light-emitting diodes and laser diodes, which optionally emit white or colored light with the aid of phosphor during their operation, as well as organic light-emitting diodes (OLED).
- a plurality of semiconductor light source arrangements can be mounted on the carrier 2.
- the optics 3 includes any other embodiments, such as optical lenses, total reflection optics (TIR optics), optical fibers and reflectors.
- the optic 3 may be made of transparent material such as glass, sapphire and plastic, or may be metallic or dichroic in the case of a reflector. Furthermore, the optics may have at a light entrance surface or light exit surface or at a light reflection surface phosphor which causes a wavelength conversion of the light.
- the optics 3 may be arranged downstream of one or more semiconductor light source arrangements 1.
- the support 2 need not necessarily be made of copper or aluminum, but may be made of another good heat conductive metal or of a ceramic having good thermal conductivity, such as alumina or aluminum nitride ceramic.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Eine derartige Beleuchtungseinrichtung ist beispielsweise in der
Es ist Aufgabe der Erfindung, eine gattungsgemäße Beleuchtungseinrichtung mit einer verbesserten Fixierung der Halbleiterlichtquellenanordnung bereitzustellen.It is an object of the invention to provide a generic lighting device with an improved fixation of the semiconductor light source arrangement.
Diese Aufgabe wird durch eine Beleuchtungseinrichtung mit den Merkmalen des Anspruchs 1 gelöst. Besonders vorteilhafte Ausgestaltungen der Erfindung sind in den abhängigen Ansprüchen beschrieben.This object is achieved by a lighting device having the features of
Die erfindungsgemäße Beleuchtungseinrichtung besitzt mindestens eine Halbleiterlichtquellenanordnung, die an mehreren Orten mittels Presspassung auf einem Träger fixiert ist.The illumination device according to the invention has at least one semiconductor light source arrangement which is fixed at several locations by means of a press fit on a carrier.
Der Begriff Presspassung bezeichnet hier eine Beziehung zwischen zwei auf einander abgestimmten Befestigungselementen der mindestens einen Halbleiterlichtquellenanordnung und des Trägers, wobei das erste Befestigungselement ein Loch und das zweite Befestigungselement ein in dem Loch angeordnetes stabartiges Befestigungselement ist, wie beispielsweise ein Steg, ein Stift, ein Niet, eine Schraube oder dergleichen, und wobei zumindest in einer Raumrichtung die Abmessung des Lochs kleiner als die entsprechende Abmessung des stabartigen Befestigungselements ist, so dass das stabartige Befestigungselement mit Klemmsitz oder Presssitz in dem Loch angeordnet ist. In Fachkreisen wird die Presspassung auch als Übermaßpassung bezeichnet. Beispielsweise ist das erste Befestigungselement der Presspassung, das heißt das Loch, in einem Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung angeordnet und das zweite, stabartige Befestigungselement ist am Träger angeordnet. Es kann aber auch umgekehrt sein. Das heißt, das erste Befestigungselement der Presspassung, nämlich das Loch, kann im Träger angeordnet sein und das zweite stabartige Befestigungselement kann an einem Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung angeordnet sein. Als weitere Alternative können sowohl im Träger als auch in der mindestens einen Halbleiterlichtquellenanordnung Löcher angeordnet sein, wobei die Löcher im Träger und in der mindestens einen Halbleiterlichtquellenanordnung zueinander korrespondieren, so dass ein stabartiges Befestigungselement sowohl in ein Loch des Trägers als auch in ein Loch der mindestens einen Halbleiterlichtquellenanordnung eingeführt werden kann und mit Klemmsitz oder Presssitz in dem Loch des Trägers und dem dazu korrespondierenden Loch in der Halbleiterlichtquellenanordnung angeordnet ist, um Träger und Halbleiterlichtquellenanordnung mit Hilfe des stabartigen Befestigungselements aneinander zu fixieren.The term press-fit here refers to a relationship between two mutually matched fastening elements of the at least one semiconductor light source arrangement and the carrier, wherein the first fastening element a hole and the second fastener is a rod-like fastener disposed in the hole, such as a land, a pin, a rivet, a screw or the like, and wherein in at least one spatial direction the dimension of the hole is smaller than the corresponding dimension of the rod-like fastener such that the rod-like fastener is press-fitted into the hole. In professional circles, the interference fit is also referred to as interference fit. For example, the first fastening element of the press-fit, that is, the hole, is arranged in a holding part of the at least one semiconductor light source arrangement, and the second, rod-like fastening element is arranged on the carrier. But it can also be the other way around. That is, the first fastening element of the interference fit, namely the hole, can be arranged in the carrier and the second rod-like fastening element can be arranged on a holding part of the at least one semiconductor light source arrangement. As a further alternative, holes may be arranged both in the carrier and in the at least one semiconductor light source arrangement, the holes in the carrier and in the at least one semiconductor light source arrangement corresponding to each other, so that a rod-like fastening element both in a hole of the carrier and in a hole of at least a semiconductor light source arrangement can be introduced and is arranged with a press fit or in the hole of the carrier and the corresponding hole in the semiconductor light source arrangement to fix the carrier and semiconductor light source arrangement by means of the rod-like fastener to each other.
Durch die Fixierung der mindestens einen Halbleiterlichtquellenanordnung mittels Presspassung an mehreren Orten auf dem Träger ist eine genaue Positionierung und Ausrichtung der mindestens einen Halbleiterlichtquellenanordnung auf dem Träger möglich. Insbesondere können durch die mechanische Spannung der Presspassung Toleranzen bei den Abmessungen für die mindestens eine Halbleiterlichtquellenanordnung und den Träger kompensiert werden und eine spielfreie Befestigung der mindestens einen Halbleiterlichtquellenanordnung auf dem Träger gewährleistet werden. Ferner erlaubt die Presspassung eine gute thermische Kopplung zwischen der mindestens einen Halbleiterlichtquellenanordnung und ihrem Träger.By fixing the at least one semiconductor light source arrangement by means of press-fitting at a plurality of locations on the carrier, precise positioning and alignment of the at least one semiconductor light source arrangement on the carrier is possible. In particular, tolerances in the dimensions for the at least one semiconductor light source arrangement and the carrier can be compensated by the mechanical stress of the press fit, and a backlash-free attachment of the at least one semiconductor light source arrangement to the carrier can be ensured. Furthermore, the interference fit allows a good thermal coupling between the at least one semiconductor light source arrangement and its carrier.
Erfindungsgemäß ist die mindestens eine Halbleiterlichtquellenanordnung an mindestens drei Orten auf dem Träger jeweils durch eine Presspassung fixiert. Dadurch wird eine spielfreie Befestigung der mindestens einen Halbleiterlichtquellenanordnung auf dem Träger in der gewünschten Lage und Ausrichtung gewährleistet.According to the invention, the at least one semiconductor light source arrangement is fixed to the support in each case by an interference fit at at least three locations. This ensures a backlash-free attachment of the at least one semiconductor light source arrangement on the carrier in the desired position and orientation.
Erfindungsgemäß sind an mindestens zwei der drei vorgenannten Orte auf dem Träger die Presspassungen als klammerartige Halterungen ausgebildet. Dadurch werden die Auswirkungen unterschiedlicher thermischer Ausdehnungskoeffizienten der mindestens einen Halbleiterlichtquellenanordnung und des Trägers auf die relative Lage und Ausrichtung von Halbleiterlichtquellenanordnung und Träger kompensiert und eine spielfreie Anordnung von Halbleiterlichtquellenanordnung und Träger auch im Betriebszustand, das heißt, im stark erwärmten Zustand der Halbleiterlichtquellenanordnung gewährleistet. Die bei der unterschiedlichen thermischen Ausdehnung von Halbleiterlichtquellenanordnung und Träger entstehenden, auf die Halbleiterlichtquellenanordnung wirkenden mechanischen Spannungen werden von den klammerartigen Halterungen aufgenommen. Außerdem kompensieren die klammerartigen Halterungen auch mechanische Spannungen, die durch ungenaue Ausrichtung der an der Halbleiterlichtquellenanordnung angeordneten Befestigungselemente der Presspassung bezüglich der am Träger angeordneten Befestigungselemente der Presspassung verursacht werden.According to the invention, the press fits are formed as bracket-type holders at at least two of the three abovementioned locations on the carrier. As a result, the effects of different coefficients of thermal expansion of the at least one semiconductor light source arrangement and of the carrier on the relative position and orientation of the semiconductor light source arrangement and carrier are compensated and a backlash-free arrangement of semiconductor light source arrangement and carrier also in the operating state, that is ensured in the strongly heated state of the semiconductor light source arrangement. The at the different thermal expansion of semiconductor light source arrangement and carrier, acting on the semiconductor light source assembly mechanical stresses are absorbed by the clip-like brackets. In addition, the clip-type brackets also compensate for mechanical stresses caused by inaccurate alignment of the press-fit fasteners disposed on the semiconductor light source array with respect to the press-fit fasteners disposed on the carrier.
Vorzugsweise werden die Presspassungen von Löchern in einem Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung und von in den Löchern angeordneten, stabartigen und am Träger oder im Träger fixierten Befestigungselementen gebildet. Dadurch können die stabartigen Befestigungselemente zusätzlich für die Fixierung einer Optik auf dem Träger genutzt werden, die der mindestens einen Halbleiterlichtquellenanordnung nachgeordnet ist. Als stabartige Befestigungselemente dienen vorzugsweise Befestigungselemente aus der Gruppe von Steg, Stift, Niet und Schraube oder dergleichen. Die stabartigen Befestigungselemente bestehen zwecks guter Wärmeleitung vorzugsweise aus Metall und sind vorzugsweise jeweils in einem Bohrloch des Trägers angeordnet. Dadurch ist eine genaue Positionierung und Ausrichtung der mindestens einen Halbleiterlichtquellenanordnung auf dem Träger möglich, da Bohrlöcher mit hoher Präzision ausgeführt werden können. Die Bohrlöcher im Träger können daher als Referenz für die Ausrichtung und Montage der mindestens einen Halbleiterlichtquellenanordnung sowie gegebenenfalls einer zusätzlichen Optik auf dem Träger verwendet werden.Preferably, the interference fits of holes are formed in a support part of the at least one semiconductor light source arrangement and in the holes arranged, rod-like and fixed to the carrier or in the carrier fasteners. As a result, the rod-like fastening elements can additionally be used for fixing an optical system on the carrier, which is arranged downstream of the at least one semiconductor light source arrangement. As rod-like fasteners preferably serve fasteners from the group of web, pin, rivet and screw or the like. The rod-like fastening elements are preferably made of metal for the purpose of good heat conduction and are preferably each arranged in a borehole of the carrier. Thereby, an accurate positioning and alignment of the at least one semiconductor light source arrangement on the carrier is possible because wells can be made with high precision. The holes in the carrier can therefore be used as a reference for the alignment and mounting of the at least one semiconductor light source arrangement and optionally an additional optics are used on the carrier.
Das oben genannte Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung besteht vorzugsweise aus Kunststoff. Dadurch können die Halbleiterlichtquellen der mindestens einen Halbleiterlichtquellenanordnung auf einfache Weise mittels Spritzgussverfahren mit einem Gehäuse oder einem Halterungsrahmen für die weitere Montage auf einer Wärmesenke versehen werden.The above-mentioned holding part of the at least one semiconductor light source arrangement is preferably made of plastic. As a result, the semiconductor light sources of the at least one semiconductor light source arrangement can be provided in a simple manner by means of injection molding with a housing or a mounting frame for further mounting on a heat sink.
Vorteilhafterweise werden die klammerartigen Halterungen jeweils vom Halterungsteil und von einem Loch im Halterungsteil, das sich bis zu einer Außenkante des Halterungsteils erstreckt, sowie von einem darin angeordneten stabartigen Befestigungselement gebildet, das im Träger oder am Träger fixiert ist. Dadurch wird auf einfache Weise eine Klammerwirkung erzielt. Das heißt, das in dem Loch angeordnete stabartige Befestigungselement wird in dem Loch wie von einer Klammer gehaltert. Insbesondere klammert sich das Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung an das stabartige Befestigungselement, das beispielsweise in dem Träger eingepresst ist oder als Bestandteil des Trägers ausgebildet ist.Advantageously, the clip-like brackets are each formed by the support member and a hole in the support member which extends to an outer edge of the support member, as well as arranged therein a rod-like fastener which is fixed in the carrier or on the carrier. As a result, a clamping effect is achieved in a simple manner. That is, the rod-like fastener disposed in the hole is supported in the hole as by a clamp. In particular, the mounting part of the at least one semiconductor light source arrangement clings to the rod-like fastening element, which is pressed in, for example, in the carrier or is formed as part of the carrier.
Die erfindungsgemäße Beleuchtungseinrichtung besitzt vorzugsweise mindestens eine Optik, die der mindestens einen Halbleiterlichtquellenanordnung nachgeordnet ist, so dass von der mindestens einen Halbleiterlichtquellenanordnung emittiertes Licht auf die mindestens eine Optik trifft. Diese Optik ist vorzugsweise an denselben Orten wie die mindestens eine Halbleiterlichtquellenanordnung mittels Presspassung auf dem Träger fixiert. Dadurch wird die Systemeffizienz erhöht, weil eine gemeinsame Presspassung für die mindestens eine Halbleiterlichtquellenanordnung und die mindestens eine Optik zur Fixierung auf dem Träger genutzt wird und somit keine zusätzliche Toleranz für die Lage und Ausrichtung der mindestens einen Optik bei ihrer Befestigung auf dem Träger verursacht wird.The illumination device according to the invention preferably has at least one optical system arranged downstream of the at least one semiconductor light source arrangement, so that light emitted by the at least one semiconductor light source arrangement hits the at least one optical system. This optic is preferably in the same places as the at least one semiconductor light source arrangement fixed by means of a press fit on the carrier. As a result, the system efficiency is increased because a common press fit is used for the at least one semiconductor light source arrangement and the at least one optical system for fixing on the carrier and thus no additional tolerance for the position and orientation of the at least one optic is caused when it is mounted on the carrier.
Vorteilhafterweise besitzt die mindestens eine Optik einen Basisabschnitt, der mit Löchern für die Presspassungen versehen ist, wobei zumindest einige der Löcher im Basisabschnitt der mindestens einen Optik zu den Löchern in dem Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung korrespondieren. Durch Anordnung der Löcher in einem Basisabschnitt der mindestens einen Optik ist gewährleistet, dass die Löcher nicht die optischen Eigenschaften der mindestens einen Optik beeinflussen. Da zumindest einige der Löcher im Basisabschnitt der mindestens einen Optik zu den Löchern in dem Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung korrespondieren, können die mindestens eine Optik und die mindestens eine Halbleiterlichtquellenanordnung an den Orten dieser Löcher durch eine gemeinsame Presspassung auf dem Träger fixiert werden.Advantageously, the at least one optic has a base portion provided with holes for the interference fits, wherein at least some of the holes in the base portion of the at least one optic correspond to the holes in the support portion of the at least one semiconductor light source assembly. By arranging the holes in a base section of the at least one optical system, it is ensured that the holes do not influence the optical properties of the at least one optical system. Since at least some of the holes in the base portion of the at least one optic correspond to the holes in the support portion of the at least one semiconductor light source array, the at least one optic and the at least one semiconductor light source array can be fixed to the locations of these holes by a common interference fit on the support.
Der Basisabschnitt der mindestens einen Optik besitzt vorzugsweise mindestens zwei klammerartige Halterungselemente, die jeweils vom Basisabschnitt und von einem sich bis einer Außenkante des Basisabschnitts erstreckenden Loch gebildet werden. Dadurch werden die Auswirkungen unterschiedlicher thermischer Ausdehnungskoeffizienten der mindestens einen Optik, der mindesten einen Halbleiterlichtquellenanordnung und des Trägers auf die relative Lage und Ausrichtung von Optik, Halbleiterlichtquellenanordnung und Träger kompensiert und eine spielfreie Anordnung von Optik, Halbleiterlichtquellenanordnung und Träger auch im Betriebszustand der Halbleiterlichtquellenanordnung gewährleistet. Die bei der unterschiedlichen thermischen Ausdehnung von Optik, Halbleiterlichtquellenanordnung und Träger entstehenden, auf die Optik wirkenden mechanischen Spannungen werden von den klammerartigen Halterungselementen aufgenommen. Außerdem kompensieren die klammerartigen Halterungselemente auch mechanische Spannungen, die durch ungenaue Ausrichtung der an der Optik angeordneten Befestigungselemente der Presspassung bezüglich der am Träger angeordneten Befestigungselemente der Presspassung verursacht werden.The base portion of the at least one optic preferably has at least two bracket-like support members, each formed by the base portion and a hole extending to an outer edge of the base portion. As a result, the effects of different thermal expansion coefficients of at least one optical system which compensates at least one semiconductor light source arrangement and the carrier for the relative position and orientation of optics, semiconductor light source arrangement and carrier and ensures a backlash-free arrangement of optics, semiconductor light source arrangement and carrier even in the operating state of the semiconductor light source arrangement. The resulting in the different thermal expansion of optics, semiconductor light source assembly and carrier, acting on the optics mechanical stresses are absorbed by the bracket-like support members. In addition, the clip-like support members also compensate for mechanical stresses caused by inaccurate alignment of the optically-mounted fasteners of the press-fit with respect to the press-fit fasteners disposed on the support.
Vorzugsweise sind am oder im Träger fixierte, stabartige Befestigungselemente vorgesehen, die sowohl in einem Loch im Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung als auch in einem Loch im Basisabschnitt der mindestens einen Optik angeordnet sind. Dadurch kann auf einfache Weise eine gemeinsame Presspassung von Halbleiterlichtquellenanordnung und Optik auf dem Träger verwirklicht werden. Außerdem können durch die gemeinsame Presspassung die mindestens eine Halbleiterlichtquellenanordnung und die mindestens eine Optik in einem Fertigungsschritt auf dem Träger montiert werden.Preferably, fixed or rod-like fastening elements are provided on or in the carrier, which are arranged both in a hole in the holding part of the at least one semiconductor light source arrangement and in a hole in the base part of the at least one optical system. As a result, a common press fit of semiconductor light source arrangement and optics on the carrier can be realized in a simple manner. In addition, the at least one semiconductor light source arrangement and the at least one optical system can be mounted on the carrier in one production step by the common press fit.
Gemäß dem bevorzugten Ausführungsbeispiel der Erfindung sind die Löcher in dem Basisabschnitt der mindestens einen Optik und die Bohrlöcher in dem Halterungsteil der mindestens einen Halbleiterlichtquellenanordnung gleichartig ausgebildet.According to the preferred embodiment of the invention, the holes in the base portion of the at least one optic and the drill holes in the support portion of the formed at least one semiconductor light source arrangement similar.
Die Löcher der Presspassungen sind aus fertigungstechnischen Gründen vorteilhafterweise als Bohrlöcher ausgebildet, deren Durchmesser kleiner als der Durchmesser des in dem entsprechenden Loch angeordneten Abschnitts des stabartigen Befestigungselements ist, wobei die Löcher an ihrem Rand jeweils mindestens einen Schlitz aufweisen. Durch den Schlitz am Rand des Bohrlochs werden die durch das Übermaß des in dem Bohrloch angeordneten stabartigen Befestigungselements verursachten Kräfte aufgenommen.For manufacturing reasons, the holes of the press fits are advantageously designed as boreholes whose diameter is smaller than the diameter of the section of the rod-like fastening element arranged in the corresponding hole, the holes each having at least one slot at its edge. The slot at the edge of the borehole absorbs the forces caused by the excess of the rod-like fastening element arranged in the borehole.
Vorteilhafterweise erstreckt sich bei mindestens zwei Bohrlöchern der Schlitz vom Rand des jeweiligen Bohrlochs bis zu einer Außenkante des Halterungsteils der Halbleiterlichtquellenanordnung beziehungsweise bis zu einer Außenkante des Basisabschnitts der Optik. Dadurch wirkt dieses Bohrloch wie eine Klammer, die das stabförmige Befestigungselement umklammert und die es ermöglicht, mechanische Kräfte aufzufangen, die beispielsweise durch die unterschiedliche thermische Ausdehnung von Halterungsteil der Halbleiterlichtquellenanordnung, Basisabschnitt der Optik und Träger oder durch eine ungenaue Platzierung der Bohrlöcher verursacht sind.In the case of at least two boreholes, the slot advantageously extends from the edge of the respective borehole to an outer edge of the mounting part of the semiconductor light source arrangement or up to an outer edge of the base section of the optics. As a result, this borehole acts like a clamp which clasps the rod-shaped fastening element and makes it possible to absorb mechanical forces which are caused, for example, by the different thermal expansion of the semiconductor light source arrangement, the base section of the optics and supports or by inaccurate placement of the boreholes.
Insgesamt ergeben sich für die erfindungsgemäße Beleuchtungseinrichtung die unten aufgeführten weiteren Vorteile.Overall, for the lighting device according to the invention, the further advantages listed below result.
Durch die an mehreren, vorzugsweise an mindestens drei, Orten vorhandene Presspassung ist die Toleranz der Justage der mindestens einen Halbleiterlichtquellenanordnung auf dem Träger sehr gering. Außerdem wird durch die gemeinsame Presspassung der mindestens einen Halbleiterlichtquellenanordnung und der mindestens einen Optik auf dem Träger keine zusätzliche Toleranz für die mindestens eine Optik verursacht, welche die Genauigkeit der Justage des gesamten Systems von Träger, Halbleiterlichtquellenanordnung und Optik reduzieren würde. Durch die Presspassungen stehen der Träger, die mindestens eine Halbleiterlichtquellenanordnung und die mindestens eine Optik stets unter mechanischer Spannung, wodurch ein spielfreier Sitz der mindestens einen Halbleiterlichtquellenanordnung und der mindestens einen Optik auf dem Träger gewährleistet ist. Außerdem werden dadurch die Auswirkungen der unterschiedlichen thermischen Ausdehnung der vorgenannten Teile der erfindungsgemäßen Beleuchtungseinrichtung kompensiert. Insbesondere werden die Kräfte, die durch unterschiedliche thermische Ausdehnung von Träger, Halbleiterlichtquellenanordnung und Optik entstehen, durch die Presspassungen aufgefangen. Ferner gewährleisten die Presspassungen eine sehr gute thermische Kopplung zwischen der mindestens einen Optik, der mindestens einen Halbleiterlichtquellenanordnung und dem Träger, so dass die Wärme, die an der mindestens einen Halbleiterlichtquellenanordnung und an der mindestens einen Optik während des Betriebs entsteht, über den Träger direkt zu einem Kühlkörper abgeführt werden kann. Vorteilhafterweise ist der Träger selbst als Wärmesenke oder Kühlkörper ausgebildet und besteht daher vorzugsweise aus Metall.Due to the interference fit existing at a plurality of, preferably at least three, locations, the tolerance of the adjustment of the at least one semiconductor light source arrangement is on the carrier very low. Moreover, the joint interference fit of the at least one semiconductor light source array and the at least one optic on the carrier does not cause any additional tolerance for the at least one optic which would reduce the accuracy of adjusting the entire system of carrier, semiconductor light source array and optics. As a result of the interference fits, the carrier, the at least one semiconductor light source arrangement and the at least one optical system are always under mechanical tension, whereby a play-free seating of the at least one semiconductor light source arrangement and the at least one optical system on the carrier is ensured. In addition, this compensates for the effects of the different thermal expansion of the abovementioned parts of the illumination device according to the invention. In particular, the forces resulting from different thermal expansion of the carrier, semiconductor light source arrangement and optics are absorbed by the interference fits. Furthermore, the interference fits ensure very good thermal coupling between the at least one optical system, the at least one semiconductor light source arrangement and the carrier so that the heat generated at the at least one semiconductor light source arrangement and at the at least one optical system during operation directly via the carrier a heat sink can be dissipated. Advantageously, the carrier itself is designed as a heat sink or heat sink and therefore preferably consists of metal.
Nachstehend wird die Erfindung anhand zweier bevorzugter Ausführungsbeispiele näher erläutert. Es zeigen:
Figur 1- Eine perspektivische Ansicht einer Beleuchtungseinrichtung gemäß dem ersten Ausführungsbeispiel der Erfindung
Figur 2- Eine perspektivische Ansicht einer Beleuchtungseinrichtung gemäß dem zweiten Ausführungsbeispiel der Erfindung
Figur 3- Einen Querschnitt durch die in
abgebildete Beleuchtungseinrichtung ohne TrägerFigur 2 - Figur 4
- Eine perspektivische Ansicht der Halbleiterlichtquellenanordnung der Beleuchtungseinrichtungen gemäß dem ersten und zweiten Ausführungsbeispiel der Erfindung
- Figur 5
- Eine perspektivische Ansicht der Optik der Beleuchtungseinrichtung gemäß dem zweiten Ausführungsbeispiel der Erfindung
- Figur 6
- Einen Querschnitt durch die in
abgebildete Presspassung inklusive TrägerFigur 3
- FIG. 1
- A perspective view of a lighting device according to the first embodiment of the invention
- FIG. 2
- A perspective view of a lighting device according to the second embodiment of the invention
- FIG. 3
- A cross section through the in
FIG. 2 pictured illumination device without a carrier - FIG. 4
- A perspective view of the semiconductor light source arrangement of the illumination devices according to the first and second embodiments of the invention
- FIG. 5
- A perspective view of the optics of the illumination device according to the second embodiment of the invention
- FIG. 6
- A cross section through the in
FIG. 3 Pictured press fit including carrier
In
Die Form und Anordnung der Bohrlöcher 170, 180, 190 in dem Kunststoffgehäuse 10 der Halbleiterlichtquellenanordnung 1 ist in
Der Träger 2 ist als Kühlkörper ausgebildet und besteht aus einem Material mit hoher Wärmeleitfähigkeit, beispielsweise aus Aluminium oder Kupfer. Die Niete 21, 22, 23 sind jeweils in einem Bohrloch 200 des Trägers 2 mit Presssitz angeordnet. Die drei Bohrlöcher 200 für die Niete 21, 22, 23 sind in einem fiktiven Dreieck auf einer ebenen Oberfläche des Trägers 2 angeordnet und bilden eine Referenz für die räumliche Lage und Ausrichtung der Halbleiterlichtquellenanordnung 1.The
In den
Details der Optik 3, insbesondere die Form und Anordnung der Bohrlöcher 32, 33, 34 sind in der
Die Bohrlöcher 32, 33, 34 bilden die Ecken eines fiktiven Dreiecks. Zwei einander gegenüberliegende Bohrlöcher 32, 33 sind jeweils mit einem Schlitz 321, 331 versehen, der sich jeweils vom Rand des entsprechenden Bohrlochs 32 bzw. 33 zu einer Außenkante des Basisabschnitts 30 der Optik 3 erstreckt. Das heißt, durch die Schlitze 321, 331 erstreckt sich das Bohrloch 32, 33 bis zur Außenkante der des Basisabschnitts 30 der Optik 3. Dadurch bekommen diese, mit den Bohrlöchern und Schlitzen versehenen Bereiche des Basisabschnitts 30 die Wirkung einer Klammer, die den jeweiligen, mit Übermaß bezüglich des entsprechenden Bohrlochs 31 bzw. 32 ausgestatteten Niet 21' bzw. 22' umklammert. Das dritte, in dem Basisabschnitt 30 der Optik 3 angeordnete Bohrloch 34 weist zwei Schlitze 341, 342 auf, die einander diametral gegenüberliegen und jeweils am Rand des Bohrlochs 34 angeordnet sind, sich aber nicht bis zu einer Außenkante des Basisabschnitts 30 erstrecken. Die beiden diametral gegenüberliegenden Schlitze 341, 342 und das Bohrloch 34 verleihen diesem, mit dem dritten Bohrloch und den beiden Schlitzen versehenen Bereich des Basisabschnitts 30 der Optik 3 die Wirkung einer Klemme zur Fixierung des mit Übermaß bezüglich des Bohrlochs 34 ausgestatteten Niets 23'. Das mit den Schlitzen 341, 342 versehene Bohrloch 34 im Basisabschnitt 30 der Optik 3 ermöglicht eine genaue Positionierung der Optik 3 auf dem Träger 2, wobei die vom Übermaß des dritten Niets 23' verursachten mechanischen Kräfte auf die Optik 3 von den beiden Schlitzen 341, 342 kompensiert werden. Die anderen beiden Bohrlöcher 32, 33 und die entsprechende Schlitze 321, 331 ermöglichen die Kompensation von mechanischen Kräften, die durch unterschiedliche thermische Ausdehnung von Optik 3, Halbleiterlichtquellenanordnung 1 und Träger 2 oder durch ungenaue Platzierung der Niete 21', 22', 23' bezüglich der Bohrlöcher 32, 33, 34 verursacht sind. Auch bei sehr genauer Positionierung der Niete 21', 22', 23' bezüglich der Bohrlöcher 32, 33, 34 und im kalten Zustand (bei Raumtemperatur von 22°C) wird durch die Presspassung mittels der vorgenannte Bohrlöcher und Niete eine spielfreie Befestigung der Optik 3 auf dem Träger 2 gewährleistet.The
Die Bohrlöcher 32, 33, 34 und die Schlitze 321, 331, 341, 342 in dem Basisabschnitt 30 der Optik 3 sind genau über den Bohrlöchern 170, 180, 190 und den Schlitzen 171, 181, 191, 192 platziert und die Niete 21', 22', 23' stecken jeweils mit Presssitz sowohl in einem Bohrloch 32, 33 bzw. 34 im Basisabschnitt 30 der Optik 3 als auch in einem Bohrloch 170, 180 bzw. 190 im Kunststoffgehäuse 10 der Halbleiterlichtquellenanordnung 1. Dadurch wird an drei unterschiedlichen Orten eine gemeinsame Presspassung von Optik 3 und Halbleiterlichtquellenanordnung 1 auf dem Träger 2 erreicht. Die Niete 21, 22, 23 bzw. 21', 22', 23' bestehen bei beiden Ausführungsbeispielen aus Metall, beispielsweise aus Kupfer oder Aluminium. Das Übermaß der Niete 21, 22, 23 bzw. 21', 22', 23' bezüglich der Bohrlöcher 170, 180, 190 bzw. 32, 33, 34 in der Halbleiterlichtquellenanordnung 1 bzw. in der Optik 3 liegt im Bereich von 0,02 mm bis 0,06 mm. Das heißt, der Durchmesser des in den vorgenannten Bohrlöchern steckenden Abschnitts der Niete ist um 0,02 mm bis 0,06 mm größer als der Durchmesser der vorgenannten Bohrlöcher. Die Niete 21, 22, 23 bzw. 21', 22', 23' sind an einem Ende verjüngt, um sie besser in die Bohrlöcher einführen zu können. In Figur 6 ist dieser Sachverhalt anhand des Niets 23' schematisch dargestellt.The
Die Erfindung beschränkt sich nicht auf die oben näher erläuterten Ausführungsbeispiele der Erfindung. Beispielsweise umfasst die Halbleiterlichtquellenanordnung 1 nicht nur Leuchtdiodenchips 11, sondern auch beliebige andere Halbleiterlichtquellen, wie zum Beispiel beliebige Arten von Leuchtdioden und Laserdioden, die gegebenenfalls mit Hilfe von Leuchtstoff während ihres Betriebs weißes oder farbiges Licht emittieren, sowie auch organische Leuchtdioden (OLED). Auf dem Träger 2 können ferner mehrere Halbleiterlichtquellenanordnungen montiert sein. Außerdem umfasst die Optik 3 beliebige andere Ausführungsformen, wie zum Beispiel optische Linsen, Optiken mit Totalreflexion (TIR-Optiken), Lichtleiter und auch Reflektoren. Die Optik 3 kann demzufolge aus transparentem Material wie beispielsweise Glas, Saphir und Kunststoff bestehen oder im Fall eines Reflektors metallisch oder dichroitisch ausgebildet sein. Weiterhin kann die Optik an einer Lichteintrittsfläche oder Lichtaustrittsfläche oder an einer Lichtreflexionsfläche Leuchtstoff aufweisen, der eine Wellenlängenkonversion des Lichts bewirkt. Die Optik 3 kann einer oder mehreren Halbleiterlichtquellenanordnungen 1 nachgeordnet sein. Ferner muss der Träger 2 nicht unbedingt aus Kupfer oder Aluminium bestehen, sondern kann aus einem anderen gut Wärme leitenden Metall oder aus einer Keramik mit guter Wärmeleitfähigkeit, wie beispielsweise Aluminiumoxid- oder Aluminiumnitridkeramik bestehen.The invention is not limited to the above-described embodiments of the invention. By way of example, the semiconductor
Claims (13)
- Illumination device having at least one semiconductor light source arrangement (1) that is fixed to a carrier (2) at at least three locations by means of a press fit, characterized in that the press fits at at least two of the three locations on the carrier (2) are embodied as clamp-type holding devices.
- Illumination device according to Claim 1, wherein the press fits are formed by holes (170, 180, 190) in a holding device part (10) of the semiconductor light source arrangement (1) and by rod-type fastening elements (21, 22, 23) that are arranged in the holes (170, 180, 190) and are fixed in the carrier (2) or on the carrier (2).
- Illumination device according to Claim 2, wherein the holding device part (10) is embodied from synthetic material.
- Illumination device according to either one of the Claims 2 and 3, wherein the clamp-type holding devices are formed in each case by the holding device part (10) and by a hole (170, 180) in the holding device part (10), said hole extending as far as an outer edge of the holding device part (10), and a rod-type fastening element (21, 22) that is arranged in said hole and is fixed in the or on the carrier (2).
- Illumination device according to any one of the Claims 1 to 4, wherein the illumination device comprises at least one optical device (3) that is arranged downstream of the at least one semiconductor light source arrangement (1) and wherein the at least one optical device (3) and the at least one semiconductor light source arrangement (1) are fixed to the carrier (2) by means of a common press fit.
- Illumination device according to Claim 5, wherein the at least one optical device (3) comprises a base section (30) that is provided with holes (32, 33, 34) for the press fit, wherein at least some of the holes (32, 33, 34) in the base section (30) of the at least one optical device (3) correspond to the holes (170, 180, 190) in the holding device part (10) of the at least one semiconductor light source arrangement (1).
- Illumination device according to Claim 6, wherein the base section (30) of the at least one optical device (3) comprises at least two clamp-type holding device elements (32, 33) that are formed in each case by a hole (32, 33) that extends as far as an outer edge of the base section (30) of the optical device (3).
- Illumination device according to Claim 6 or 7, wherein for the purpose of forming the press fit a rod-type fastening element (21', 22', 23') that is fixed in the carrier (2) or on the carrier (2) is arranged both in a hole (170, 180, 190) in the holding device part (10) of the at least one semiconductor light source arrangement (1) as well as in a hole (32, 33, 34) in the base section (30) of the at least one optical device (3).
- Illumination device according to any one of the Claims 6 to 8, wherein the holes (32, 33, 34) in the base section (30) of the at least one optical device (3) and the holes (170, 180, 190) in the holding device part (10) of the at least one semiconductor light source arrangement (1) are embodied in an identical manner.
- Illumination device according to any one of the Claims 6 to 9, wherein the holes (32, 33, 34, 170, 180, 190) are embodied as bore holes that comprise at least one slot (321, 331, 341, 342, 171, 181, 191, 192) on their edge.
- Illumination device according to Claim 10, wherein in the case of at least two bore holes (32, 33, 170, 180), the slots (321, 331, 171, 181) extend from the edge of the respective bore hole (32, 33, 170, 180) as far as an outer edge of the holding device part (10) of the at least one semiconductor light arrangement (1) or rather to an outer edge of the base section (30) of the at least one optical device (3).
- Illumination device according to any one of the Claims 2 or 8, wherein the rod-type fastening elements (21, 22, 23; 21', 22', 23') are elements from the group of pins, rivets and screws.
- Illumination device according to Claim 12, wherein the rod-type fastening elements (21, 22, 23; 21', 22', 23') are arranged in each case in a bore hole (200) of the carrier (2).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012206332A DE102012206332A1 (en) | 2012-04-17 | 2012-04-17 | lighting device |
PCT/EP2013/057723 WO2013156411A1 (en) | 2012-04-17 | 2013-04-12 | Illumination device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2839209A1 EP2839209A1 (en) | 2015-02-25 |
EP2839209B1 true EP2839209B1 (en) | 2017-02-01 |
Family
ID=48520901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13725083.3A Active EP2839209B1 (en) | 2012-04-17 | 2013-04-12 | Illumination device |
Country Status (5)
Country | Link |
---|---|
US (1) | US9739459B2 (en) |
EP (1) | EP2839209B1 (en) |
CN (1) | CN104246362B (en) |
DE (1) | DE102012206332A1 (en) |
WO (1) | WO2013156411A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10133255A1 (en) * | 2001-07-09 | 2003-01-30 | Osram Opto Semiconductors Gmbh | LED module for lighting devices |
DE102005033709B4 (en) * | 2005-03-16 | 2021-12-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Light emitting module |
DE102006048230B4 (en) * | 2006-10-11 | 2012-11-08 | Osram Ag | Light-emitting diode system, method for producing such and backlighting device |
DE202006017583U1 (en) * | 2006-11-17 | 2008-03-27 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | lighting device |
DE202006018081U1 (en) | 2006-11-28 | 2007-02-08 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lighting unit for e.g. vehicle headlight, has fastening unit with projection and/or recess that works together with counterpiece at illuminating part of lighting fixture, such that projection and/or recess and counterpiece are interlocked |
JP4973213B2 (en) * | 2007-01-31 | 2012-07-11 | 三菱電機株式会社 | Light source device, planar light source device, and display device |
JP4811377B2 (en) * | 2007-09-25 | 2011-11-09 | パナソニック電工株式会社 | Surface emitting device |
US20090207617A1 (en) * | 2008-02-20 | 2009-08-20 | Merchant Viren B | Light emitting diode (led) connector clip |
AT11762U1 (en) * | 2008-09-01 | 2011-04-15 | Mse Elektronik Gmbh | LIGHTING BODY WITH MODULAR DESIGN |
JP5409217B2 (en) * | 2009-09-07 | 2014-02-05 | 株式会社小糸製作所 | Vehicle lighting |
DE102009052340A1 (en) * | 2009-11-03 | 2011-05-05 | Automotive Lighting Reutlingen Gmbh | Light-emitting diode module of a motor vehicle lighting device, motor vehicle lighting device and method for fixing a light-emitting diode in the light-emitting diode module |
DE102010031312A1 (en) * | 2010-07-14 | 2012-01-19 | Osram Ag | Fixing element, light module and lighting device |
DE102010039120A1 (en) * | 2010-08-10 | 2012-02-16 | Osram Ag | Circuit board of lamp system, has attachment element that is provided in back side and is configured as electrical transmission element for semiconductor light source |
DE102011102550A1 (en) | 2010-11-18 | 2012-05-24 | Osram Ag | Housing for receiving at least one light source |
EP2587562A4 (en) * | 2011-01-14 | 2013-06-12 | Panasonic Corp | Illumination light source |
US8807793B2 (en) * | 2011-09-26 | 2014-08-19 | IDEAL, Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
DE202012101344U1 (en) * | 2012-04-12 | 2012-06-12 | Up Consulting Gbr ( Vertreten Durch Den Gesellschafter: Bohumir Opatril, 59262 Nedvedice, Cz) | Lighting device and LED lighting system |
JP5614732B2 (en) * | 2012-12-26 | 2014-10-29 | Smk株式会社 | LED module board connector |
-
2012
- 2012-04-17 DE DE102012206332A patent/DE102012206332A1/en not_active Withdrawn
-
2013
- 2013-04-12 CN CN201380020638.5A patent/CN104246362B/en active Active
- 2013-04-12 WO PCT/EP2013/057723 patent/WO2013156411A1/en active Application Filing
- 2013-04-12 EP EP13725083.3A patent/EP2839209B1/en active Active
- 2013-04-12 US US14/390,042 patent/US9739459B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9739459B2 (en) | 2017-08-22 |
CN104246362B (en) | 2017-11-03 |
DE102012206332A1 (en) | 2013-10-17 |
US20150077988A1 (en) | 2015-03-19 |
WO2013156411A1 (en) | 2013-10-24 |
CN104246362A (en) | 2014-12-24 |
EP2839209A1 (en) | 2015-02-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2820348B1 (en) | Illumination device | |
EP3004724B1 (en) | Lighting device for a vehicle headlight | |
EP1859196B1 (en) | Light emitting module comprising leds and dowel pins for assembling an optical element | |
DE102012213193B4 (en) | ARRANGEMENT OF OPTICAL SEMICONDUCTOR ELEMENTS | |
EP2095016B1 (en) | Illumination unit for vehicle headlights, and vehicle headlight | |
DE102016117450A1 (en) | Lighting device with improved connection to the power supply | |
EP3339720B1 (en) | Primary lens assembly for use in a motor vehicle lighting device and motor vehicle lighting device with such a primary lens assembly | |
EP3032170B1 (en) | Fixing device for fixing led modules to fixing rails | |
DE102005020908A1 (en) | Lighting device for back lighting of liquid crystal display, has optical unit with radiation emission surface which has convex curved partial region that partially surrounds concave curved partial region in distance to optical axis | |
DE102010030863A1 (en) | LED lighting device and method for producing an LED lighting device | |
EP2766657B1 (en) | Led module with a heat sink | |
DE112018002439B4 (en) | Cover for an optoelectronic component and optoelectronic component | |
DE112015004631B4 (en) | Laser component and method for its manufacture | |
DE10341884B4 (en) | Flexible circuit carrier arrangement | |
AT513339B1 (en) | Light module for a motor vehicle and motor vehicle headlights | |
DE212020000556U1 (en) | Lighting device with transparent stabilizer element | |
EP2873913A1 (en) | LED light | |
EP2839209B1 (en) | Illumination device | |
DE102012205806B4 (en) | Mounting arrangement for mounting a housing of an LED module | |
DE202018105898U1 (en) | Lighting device with leadframe | |
EP2143989B1 (en) | Lighting unit, LED module and method | |
DE10117018C2 (en) | Optical or optoelectronic arrangement | |
DE102018205663A1 (en) | ASSEMBLY, HEADLIGHTS AND PROCEDURE | |
DE102012103198B4 (en) | Carrier device for a lighting module and method for its production | |
DE102008056171A1 (en) | Illuminating unit for use as light source in headlamp, has electrical contacts arranged on end section of mounting plate and divided into different spatial alignment and arrangement for supplying power to LED arrangement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20141117 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAX | Request for extension of the european patent (deleted) | ||
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21V 29/89 20150101ALN20160902BHEP Ipc: F21V 19/00 20060101AFI20160902BHEP Ipc: F21Y 101/00 20160101ALN20160902BHEP Ipc: F21V 17/12 20060101ALN20160902BHEP |
|
INTG | Intention to grant announced |
Effective date: 20160923 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP Ref country code: AT Ref legal event code: REF Ref document number: 865909 Country of ref document: AT Kind code of ref document: T Effective date: 20170215 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502013006256 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 5 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20170201 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170502 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170501 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170601 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170501 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170601 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502013006256 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20171103 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20170501 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170412 Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170430 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170430 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20170430 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 6 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170412 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170501 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20130412 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170201 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20230424 Year of fee payment: 11 Ref country code: DE Payment date: 20230420 Year of fee payment: 11 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: AT Payment date: 20230420 Year of fee payment: 11 |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230821 |