CN104246362A - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
CN104246362A
CN104246362A CN201380020638.5A CN201380020638A CN104246362A CN 104246362 A CN104246362 A CN 104246362A CN 201380020638 A CN201380020638 A CN 201380020638A CN 104246362 A CN104246362 A CN 104246362A
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CN
China
Prior art keywords
semi
light source
source device
optical element
conductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201380020638.5A
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Chinese (zh)
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CN104246362B (en
Inventor
菲利普·黑尔比希
斯特凡·施魏格尔
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Osram GmbH
Osram Co Ltd
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Osram Co Ltd
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Publication of CN104246362A publication Critical patent/CN104246362A/en
Application granted granted Critical
Publication of CN104246362B publication Critical patent/CN104246362B/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An illumination device having at least one semi-conductor light source arrangement (1) which is fixed to a support (2), wherein the at least one semi-conductor light source arrangement (1) is fixed to the support (2) at at least three locations by means of press fits. These press fits are designed as clip-like holders in the form of holes (170, 180 190) in a holding part (10) of the semi-conductor light source arrangement (1) and in the form of rod-like fastening elements (21, 22, 23) arranged in said holes (170, 180, 190) and fixed in the support (2) or on the support (2).

Description

Lighting device
Technical field
The present invention relates to a kind of lighting device as described in the preamble according to claim 1.
Background technology
This lighting device is such as open in WO 2008/065030 A1.Described open source literature describes a kind of lighting device, and described lighting device has semi-conductor light source device, and described semi-conductor light source device is fixed on by means of bonding agent and is configured on heat sink bearing part.
Summary of the invention
The object of the invention is, the lighting device of the above-mentioned type is provided, wherein fixes semi-conductor light source device with improvement.
Described object is realized by the lighting device with the feature of claim 1.Especially favourable design of the present invention is described in the dependent claims.
Lighting device according to the present invention has at least one semi-conductor light source device, and described semi-conductor light source device is fixing on the load bearing member by means of press-fit on multiple position.
Term is press-fitted in the relation between these retaining elements representing two mutual coordinations of at least one semi-conductor light source device and bearing part, wherein the first retaining element is hole and the second retaining element is the bar-shaped retaining element be arranged in hole, such as brace, pin, rivet, screw etc., and wherein at least on direction in space, the size in hole is less than the corresponding size of bar-shaped retaining element, and bar-shaped retaining element is arranged in hole by clamping engagement or press-fit.In professional domain, press-fit is also referred to as being interference fit.Such as, the first retaining element, the i.e. hole of press-fit are arranged on the second retaining element setting in the retention member of at least one semi-conductor light source device and bar-shaped on the load bearing member.But, also can be put upside down.In other words, the first retaining element, the i.e. hole of press-fit can be arranged on the second retaining element in bearing part and bar-shaped and can be arranged on the retention member of at least one semi-conductor light source device.As other alternative scheme, can not only in bearing part but also arrange porose at least one semi-conductor light source device, conforming to each other with the hole at least one semi-conductor light source device wherein in bearing part, the hole neutralization making bar-shaped retaining element can be incorporated into bearing part to be incorporated in the hole of at least one semi-conductor light source device and the hole being arranged on bearing part by clamping engagement or press-fit with in the hole conformed to it in semi-conductor light source device, to make bearing part and semi-conductor light source device be fixed to one another by means of bar-shaped retaining element.
By at least one semi-conductor light source device is fixing on the load bearing member by means of being press-fitted in multiple position, at least one semi-conductor light source device locating and orienting accurately is on the load bearing member possible.In particular, by the mechanical stress of press-fit, the tolerance in the size of at least one semi-conductor light source device and bearing part can be compensated, and guarantees at least one semi-conductor light source device seamlessly to fix on the load bearing member.In addition, press-fit allows the good thermal coupling between at least one semi-conductor light source device and its bearing part.
Advantageously, at least one semi-conductor light source device is fixing on the load bearing member respectively by press-fit at least three positions.Thus, guarantee at least one semi-conductor light source device seamlessly to fix on the load bearing member with the position expected and orientation.
Advantageously, at least two positions in three above-mentioned positions on the load bearing member, press-fit is configured to the holding unit of clip like.Compensate the different thermal coefficient of expansion of at least one semi-conductor light source device and bearing part thus to the relative position of semi-conductor light source device and directed impact, and also guarantee seamlessly to arrange semi-conductor light source device and bearing part in the state of semi-conductor light source device heat intensive in running status, namely.The mechanical stress acting on semi-conductor light source device occurred when semi-conductor light source device is different with the thermal expansion of bearing part is absorbed by the holding unit of clip like.In addition, the holding unit of clip like also compensates and is arranged on by press-fit the mechanical stress that the retaining element on semi-conductor light source device causes about the inaccurate orientation of the setting retaining element on the load bearing member of press-fit.
Preferably, press-fit by the hole in the retention member of at least one semi-conductor light source device and be arranged in hole, bar-shaped and fixing on the load bearing member or the retaining element be fixed in bearing part formed.Thus, bar-shaped retaining element can additionally for fixing optical element on the load bearing member, and described optical element is arranged on the downstream of at least one semi-conductor light source device.The retaining element being preferably selected from brace, pin, rivet and screw etc. is used as bar-shaped retaining element.Bar-shaped retaining element is preferably made up of metal in order to good heat conduction and is preferably separately positioned in the boring of bearing part.Thus, at least one semi-conductor light source device locating and orienting accurately is on the load bearing member possible, because boring can be implemented with high accuracy.Boring in bearing part is therefore, it is possible to be used as at least one semi-conductor light source device and optical element orientation on the load bearing member additional if desired and the benchmark of installation.
The above-mentioned retention member of at least one semi-conductor light source device is preferably made up of plastics.Thus, at least one semi-conductor light source device semiconductor light source can in a straightforward manner by means of injection moulding be provided with housing or fixing framework for be arranged on further heat sink on.
Advantageously, the holding unit of clip like is respectively by the hole extending to the outer seamed edge of retention member in retention member and retention member and formed by the bar-shaped retaining element arranged in the hole, and described retaining element is fixing in the carrier or be fixed on carrier.Thus, clamping effect is realized in a straightforward manner.In other words, bar-shaped retaining element in hole is arranged at Kong Zhongru by the such fixing of clip.In particular, the retention member of at least one semi-conductor light source device is clamped on bar-shaped retaining element, and described retaining element is such as pressed in bearing part or is configured to the part of bearing part.
Preferably have at least one optical element according to lighting device of the present invention, described optical element is arranged on the downstream of at least one semi-conductor light source device, and the light launched by least one semi-conductor light source device is mapped at least one optical element.Described optical element is preferably fixing on the load bearing member by means of press-fit on the position identical with at least one semi-conductor light source device.Thus, improve system effectiveness, because the common press-fit of at least one semi-conductor light source device and at least one optical element be used for fixing on the load bearing member, thus the position of at least one optical element when it is fixed on the load bearing member and directed additional tolerance can not be caused.
Advantageously, at least one optical element has basic portion section, described basic portion section is provided with the hole for press-fit, and at least one some holes in the hole in the basic portion section of wherein at least one optical element conforms to the hole in the retention member of at least one semi-conductor light source device.Passing hole is arranged in the basic portion section of at least one optical element to be guaranteed, hole does not affect the optical characteristics of at least one optical element.Because at least one some holes in the hole in the basic portion section of at least one optical element conforms to the hole in the retention member of at least one semi-conductor light source device, so at least one optical element and at least one semi-conductor light source device are fixing on the load bearing member by common press-fit in the position of this some holes.
The basic portion section of at least one optical element preferably has the retaining component of at least two clip like, and described retaining component is formed by the hole of basic portion section with the outer seamed edge extending to basic portion section respectively.Thus, compensate the relative position of different thermal coefficient of expansions on optical element, semi-conductor light source device and bearing part and the impact of orientation of at least one optical element, at least one semi-conductor light source device and bearing part, and also guarantee seamlessly to arrange optical element, semi-conductor light source device and bearing part in the running status of semi-conductor light source device.The mechanical stress acting on optical element produced different with the thermal coefficient of expansion of bearing part at optical element, semi-conductor light source device is absorbed by the retaining component of clip like.In addition, the retaining component of clip like also compensates and is arranged on by press-fit the mechanical stress that the retaining element on optical element causes about the inaccurate orientation of the setting retaining element on the load bearing member of press-fit.
Preferably, be provided with fixing bar-shaped retaining element on the load bearing member or in bearing part, the hole that described retaining element is arranged on the retention member of at least one semi-conductor light source device neutralizes in the hole of basic portion section of at least one optical element.Thereby, it is possible to realize semi-conductor light source device and optical element common press-fit on the load bearing member in a straightforward manner.In addition, at least one semi-conductor light source device and at least one optical element can be installed on the load bearing member in a production stage by common press-fit.
According to a preferred embodiment of the present invention, the boring in the retention member of the hole in the basic portion section of at least one optical element and at least one semi-conductor light source device is formed in the same way.
The hole of press-fit is advantageously configured to boring for the reason of production aspect, and the diameter of described boring is less than the diameter being arranged on the portion's section in corresponding hole of bar-shaped retaining element, and its mesopore has at least one gap on its edge respectively.By the gap on the edge of boring, absorb the power caused by the interference of setting bar-shaped retaining element in the borehole.
Advantageously, at least two boring, gap extends to the outer seamed edge of the retention member of semiconductor optical device or extends to the outer seamed edge of basic portion section of optical element from the edge of corresponding boring.Thus, described boring acts on as clip, described clip clamps bar-shaped retaining element around and described clip can realize, absorb mechanical force, described mechanical force is as the different thermal expansion by the retention member of semi-conductor light source device, the basic portion section of optical element and bearing part or caused by the inaccurate arrangement of boring.
Generally, for lighting device according to the present invention draws other advantages described in detail below.
By in press-fit that is multiple, that preferably exist at least three positions, the tolerance of at least one semi-conductor light source device calibration is on the load bearing member very little.In addition, by at least one semi-conductor light source device and the common press-fit on the load bearing member of at least one optical element, do not cause the additional tolerance of at least one optical element, described additional tolerance can reduce the precision of the calibration of the whole system of bearing part, semi-conductor light source device and optical element.By press-fit, bearing part, at least one semi-conductor light source device and at least one optical element are subject to mechanical stress all the time, guarantee at least one semi-conductor light source device and the gapless arrangement on the load bearing member of at least one optical element thus.In addition, the impact of the different thermal expansion of the above-mentioned parts according to lighting device of the present invention is compensated thus.In particular, the power produced by the different thermal expansion of bearing part, semi-conductor light source device and optical element is absorbed by press-fit.In addition, at least one optical element, extraordinary thermal coupling between at least one semi-conductor light source device and bearing part are guaranteed in press-fit, make the heat produced at run duration at least one semi-conductor light source device and at least one optical element directly can export to cooling body via bearing part.Advantageously, bearing part itself is configured to heat sink or cooling body and then is preferably made up of metal.
Accompanying drawing explanation
The present invention is elaborated below according to two preferred embodiments.It illustrates:
Fig. 1 illustrates the stereogram of the lighting device according to the first embodiment of the present invention;
Fig. 2 illustrates the stereogram of lighting device according to a second embodiment of the present invention;
Fig. 3 illustrates the cross section of lighting device when not having bearing part running through and describe in fig. 2;
Fig. 4 illustrates the stereogram of the semi-conductor light source device of lighting device according to the first and second aspects of the present invention;
Fig. 5 illustrates the stereogram of the optical element of lighting device according to a second embodiment of the present invention;
Fig. 6 illustrates the cross section be press-fitted in when comprising bearing part running through and describe in figure 3.
Detailed description of the invention
Lighting device according to the first embodiment of the present invention is schematically shown in FIG.Described lighting device has semi-conductor light source device 1 and bearing part 2, and semi-conductor light source device 1 is fixed on described bearing part by means of press-fit.Semi-conductor light source device 1 has: five light-emitting diode chip for backlight unit 11, and described light-emitting diode chip for backlight unit sets in a row on the base 12; With the retention member 10 be made of plastics, the substrate 12 with light-emitting diode chip for backlight unit 11 is embedded in described retention member by means of injection molding technology.The substrate 12 with light-emitting diode chip for backlight unit 11 is arranged in the window portion of retention member 10, the light of light-emitting diode chip for backlight unit 11 is launched and hinders by retention member 10 hardly.In addition, in retention member 10, be mounted with the parts of the operational outfit 13 for running light-emitting diode chip for backlight unit 11.Semi-conductor light source device 1 also has the contact spring 14 of metal, and described contact spring is used for the electrical connection between the contact site of five light-emitting diode chip for backlight unit 11 and the contact site of operational outfit 13.In addition, semi-conductor light source device 1 has electric terminal 15, and described electric terminal is connected for powering and manipulating light-emitting diode chip for backlight unit 11 and its operational outfit 13 with electrical connection cable 16.Three sidepieces of the retention member 10 of semi-conductor light source device 1 are provided with each connecting plate 17,18,19.Described connecting plate 17,18,19 is respectively equipped with boring 170,180,190, and described boring is respectively used to set up the press-fit with bearing part 2.In order to set up and the press-fit of bearing part 2 and be provided with rivet 21,22,23 in each boring 170,180,190, wherein the diameter of the portion's section be arranged in corresponding boring 170,180 or 190 of rivet 21,22,23 is greater than the diameter of corresponding boring 170,180 or 190 slightly.
Boring 170,180,190 shown in Figure 4 is arranged and shape in the plastic casing 10 of semi-conductor light source device 1.Boring 170,180,190 forms the angle of virtual triangle.Two borings of putting toward each other 170,180 are respectively equipped with gap 171,181, and described gap extends to the outer seamed edge of affiliated connecting plate 17 or 18 respectively from the edge of corresponding boring 170 or 180.In other words, by gap 171,181, boring 170,180 extends until the outer seamed edge of connecting plate 17,18.Thus, described connecting plate 17,18 obtains the effect of clip, and described clip clamps accordingly around, be configured with the rivet 21 or 22 of the interference about corresponding boring 170 or 180.The 3rd boring 190 be arranged in connecting plate 19 has two gaps 191,192, and these two gaps are put toward each other about diameter and are separately positioned on the edge of boring 190, but do not extend to the outer seamed edge of the 3rd connecting plate 19.Two give the effect of the 3rd connecting plate 19 clamping element about the opposite gap 191,192 of diameter and boring 190.3rd connecting plate 19 has the 3rd rivet 23 of the interference about boring 190 according to the type fixture construction of clamping element.The boring 190 being provided with gap 191,192 in the 3rd connecting plate 19 can realize the accurately location of semi-conductor light source device 1 on bearing part 2, and the mechanical force wherein caused by the interference of the 3rd rivet 23 is compensated by two gaps 191,192.The connecting plate 17,18 with other two clip like in affiliated boring 170,180 and corresponding gap 171,181 can realize compensating by the different thermal expansion of semi-conductor light source device 1 and bearing part 2 or the mechanical force that caused about the inaccurate location of boring 170,180,190 by rivet 21,22,23.Even if at rivet 21,22,23 about boring 170,180,190 very accurately location and under cold state (under the room temperature of 22 DEG C), by incompatiblely guaranteeing gapless fixing on bearing part 2 of semi-conductor light source device 1 by means of being press-fitted of above-mentioned boring and rivet.
Bearing part 2 is configured to cooling body and is made up of the material of high-termal conductivity, such as, be made up of aluminium or copper.Rivet 21,22,23 is separately positioned in the boring 200 of bearing part 2 by press-fit.The smooth surface being arranged on bearing part 2 for three of rivet 21,22,23 borings 200 with virtual triangle is formed for the locus of semi-conductor light source device 1 and the benchmark of orientation.
Draw lighting device according to a second embodiment of the present invention in figs 2 and 3.Lighting device is according to a second embodiment of the present invention identical with the lighting device of above-mentioned first embodiment according to the present invention to a great extent.It is only according to the difference of the lighting device of above-mentioned first embodiment of the present invention, lighting device according to a second embodiment of the present invention also has optical element 3 except semi-conductor light source device 1 and bearing part 2, and described optical element is arranged on the downstream of semi-conductor light source device 1.In particular, semi-conductor light source device 1 and bearing part 2 are configured to be identical in two embodiments of the invention.Therefore, to the description of semi-conductor light source device 1 according to a second embodiment of the present invention and bearing part 2 with reference to according to the semi-conductor light source device 1 of the first embodiment of the present invention and the corresponding description of bearing part 2.Optical element 3 is made up of transparent plastic material and has portion's section 31 of truncated cone shape and flat basic portion section 30.Bearing part 2, semi-conductor light source device 1 and optical element 3 are stacked setting according to the type of sandwich, wherein semi-conductor light source device 1 is arranged between bearing part 2 and optical element 3, and the optically-coupled of being launched by light-emitting diode chip for backlight unit 11 is input in portion's section 31 of the truncated cone shape of optical element 3.The basic portion section 30 of optical element 3 is provided with three borings 32,33,34, and described boring conforms to the boring 170,180,190 in the plastic casing 10 of semi-conductor light source device 1.Boring 170,180,190 in boring 32,33,34 in the basic portion section 30 of optical element 3 and the plastic casing 10 of semi-conductor light source device 1 is of similar shape and directed.In particular, the boring 32,33,34 of the basic portion section 30 of optical element 3 is configured with the gap 321,331,341 and 342 with the identical formation of boring 170,180,190 in the plastic casing 10 of semi-conductor light source device 1.Thus, in lighting device according to a second embodiment of the present invention, rivet 21 ', 22 ', 23 ' is separately positioned on by press-fit in the boring 32,33 or 34 in the boring 170,180 or 190 of the retention member 10 of semi-conductor light source device 1 and the basic portion section 30 of optical element 3.The diameter of the portion's section in the boring 170,180 or 190 being inserted into semi-conductor light source device 1 of rivet 21 ', 22 ', 23 ' and the boring 32,33 or 34 of optical element 3 is less times greater than the diameter of these borings 170,180,190,32,33 or 34.By this way, semi-conductor light source device 1 and the common press-fit of optical element 3 on bearing part 2 is realized.Rivet 21 ', 22 ', 23 ' is arranged in the boring 200 of bearing part 2 by press-fit respectively.On the smooth surface being arranged on bearing part 2 for three of rivet 21 ', 22 ', 23 ' borings 200 with virtual triangle and the locus formed for semi-conductor light source device 1 and optical element 3 and directed benchmark.
The details of optical element 3, especially hole 32,33,34 shape and arranging schematically illustrate in Figure 5.
Boring 32,33,34 forms the angle of virtual triangle.Two borings of putting toward each other 32,33 are respectively equipped with gap 321,331, and described gap extends to the outer seamed edge of the basic portion section 30 of optical element 3 respectively from the edge of corresponding boring 32 or 33.In other words, by gap 321,331, boring 32,33 extends until the outer seamed edge of basic portion section 30 of optical element 3.Thus, basic portion section 30 be provided with the effect that boring and this region in gap obtain clip, described clip clamps accordingly around, be configured with about hole accordingly 31 or 32 the rivet 21 ' or 22 ' of interference.The 3rd boring 34 be arranged in the basic portion section 30 of optical element 3 has two gaps 341,342, and these two gaps are put toward each other about diameter and are separately positioned on the edge of boring 34, but do not extend to the outer seamed edge of basic portion section 30.Two effects giving the region clamping element being provided with the 3rd boring and two gaps described in the basic portion section 30 of optical element 3 about the opposite gap 341,342 of diameter and boring 34 have the 3rd rivet 23 ' of the interference about boring 34 for fixture construction.The boring 34 being provided with gap 341,342 in the basic portion section 30 of optical element 3 can realize the accurately location of optical element 3 on bearing part 2, and that is wherein caused by the interference of the 3rd rivet 23 ' is compensated by two gaps 341,342 mechanical force of optical element 3.Two other boring 32,33 and corresponding gap 321,331 can realize compensating by the different thermal expansion of optical element 3, semi-conductor light source device 1 and bearing part 2 or the mechanical force that caused about the inaccurate location of boring 32,33,34 by rivet 21 ', 22 ', 23 '.Even if at rivet 21 ', 22 ', 23 ' about boring 32,33,34 very accurately location and under cold state (under the room temperature of 22 DEG C), also by incompatiblely guaranteeing gapless fixing on bearing part 2 of optical element 3 by means of being press-fitted of above-mentioned boring and rivet.
Boring 32,33,34 in the basic portion section 30 of optical element 3 and gap 321,331,341,342 are placed in above boring 170,180,190 and gap 171,181,191,192 exactly and rivet 21 ', 22 ', the 23 ' boring 32,33 or 34 be inserted in by press-fit respectively in the basic portion section 30 of optical element 3 also has in the boring 170,180 or 190 in the plastic casing 10 of semi-conductor light source device 1.Thus, three different positions realize optical element 3 and the common press-fit of semi-conductor light source device 1 on bearing part 2.Rivet 21,22,23 or 21 ', 22 ', 23 ' is in both embodiments by metal, be such as made up of copper or aluminium.Rivet 21,22,23 or 21 ', 22 ', 23 ' is arranged in the scope of 0.02mm to 0.06mm about the interference of the boring 170,180,190 or 32,33,34 in semi-conductor light source device 1 or optical element 3.In other words, the diameter being inserted in the portion's section in the above-mentioned boring 0.02mm to 0.06mm larger than the diameter of above-mentioned boring of rivet.Rivet 21,22,23 or 21 ', 22 ', 23 ' convergent on one end, can be incorporated into described rivet better in boring.According to rivet 23 ', this situation is schematically shown in figure 6.
The present invention is not limited to the embodiment elaborated hereinbefore of the present invention.Such as, semi-conductor light source device 1 not only comprises light-emitting diode chip for backlight unit 11, and comprise other semiconductor light sources arbitrary, the light emitting diode of such as any type and laser diode, described light emitting diode and laser diode if desired by means of luminescent material at its run duration transmitting white or colourama, and semi-conductor light source device also includes OLED (OLED).Bearing part 2 can also install multiple semi-conductor light source device.In addition, optical element 3 comprises arbitrarily other embodiment, such as optical lens, the optical element (TIR optical element) with total reflection, optical conductor and reflector.Optical element 3 is therefore, it is possible to be made up of transparent material, such as glass, sapphire and plastics or be configured in case of a reflector be metal or dichroic.In addition, optical element can have luminescent material on light entrance face or light-emitting face or on light reflection surface, and described luminescent material causes the wavelength convert of light.Optical element 3 can be arranged on the downstream of one or more semi-conductor light source device 1.In addition, bearing part 2 is not necessarily made up of copper or aluminium, but can form by the metal of other good heat conductive or by the pottery with thermal conductive resin, such as, be made up of aluminium oxide ceramics or aluminium nitride ceramics.

Claims (15)

1. a lighting device, described lighting device has at least one semi-conductor light source device (1), described semi-conductor light source device is fixed on bearing part (2), it is characterized in that, semi-conductor light source device described at least one (1) is fixed on described bearing part (2) by means of press-fit in multiple position.
2. lighting device according to claim 1, wherein semi-conductor light source device described at least one (1) is fixed on described bearing part (2) by means of press-fit at least three positions.
3. lighting device according to claim 2, at least two positions in three positions wherein on described bearing part (2), described press-fit is configured to the holding unit of clip like.
4. lighting device according to any one of claim 1 to 3, wherein said press-fit is by the hole (170 in the retention member (10) of described semi-conductor light source device (1), 180,190) and be arranged on described hole (170,180,190) in, bar-shaped and be fixed in described bearing part (2) or be fixed on retaining element (21,22,23) on described bearing part (2) and formed.
5. lighting device according to claim 4, wherein said retention member (10) is made of plastics.
6. the lighting device according to any one of claim 3 to 5, wherein the described holding unit of clip like is respectively by the hole (170 extending to the outer seamed edge of described retention member (10) in described retention member (10) and described retention member (10), 180) and arrange in the hole be fixed in described bearing part (2) or the bar-shaped retaining element (21,22) be fixed on described bearing part (2) is formed.
7. lighting device according to any one of claim 1 to 6, wherein said lighting device has at least one optical element (3), described optical element is arranged on the downstream of semi-conductor light source device described at least one (1), and wherein optical element described at least one (3) and semi-conductor light source device described at least one (1) are fixed on described bearing part (2) by means of common press-fit.
8. lighting device according to claim 7, wherein optical element described at least one (3) has basic portion section (30), described basic portion section is provided with the hole (32 for described press-fit, 33,34), hole (32 in the described basic portion section (30) of wherein optical element described at least one (3), 33,34) hole (170 in the described retention member (10) of at least one some holes in and semi-conductor light source device described at least one (1), 180,190) conform to.
9. lighting device according to claim 8, wherein the described basic portion section (30) of optical element described at least one (3) has the retaining component (32 of at least two clip like, 33), described retaining component respectively by described basic portion section (30) and extend to described optical element (3) described basic portion section (30) outer seamed edge hole (32,33) formed.
10. lighting device according to claim 8 or claim 9, wherein in order to form described press-fit, be fixed in described bearing part (2) or be fixed on the bar-shaped retaining element (21 ' on described bearing part (2), 22 ', 23 ') hole (170 in the described retention member (10) of semi-conductor light source device described at least one (1) is not only arranged on, 180,190) in and the hole (32 be arranged in the described basic portion section (30) of optical element described at least one (3), 33,34) in.
Lighting device according to any one of 11. according to Claim 8 to 10, hole (32 in the described basic portion section (30) of wherein optical element described at least one (3), 33,34) hole (170 and in the described retention member (10) of semi-conductor light source device described at least one (1), 180,190) form in the same way.
12. lighting devices according to any one of claim 3 to 11, wherein said hole (32,33,34,170,180,190) be configured to boring, described boring has at least one gap (321,331,341 on its edge, 342,171,181,191,192).
13. lighting devices according to claim 12, wherein at least two borings (32,33,170,180) in, described gap (321,331,171,181) from corresponding boring (32,33,170,180) edge extends to the outer seamed edge of the described retention member (10) of semi-conductor light source device described at least one (1) or extends to the outer seamed edge of described basic portion section (30) of optical element described at least one (3).
14. lighting devices according to claim 4 or 10, wherein bar-shaped described retaining element (21,22,23; 21 ', 22 ', 23 ') be the element being selected from pin, rivet and screw.
15. lighting devices according to claim 14, wherein bar-shaped described retaining element (21,22,23; 21 ', 22 ', 23 ') be separately positioned in the boring (200) of described bearing part (2).
CN201380020638.5A 2012-04-17 2013-04-12 Lighting device Active CN104246362B (en)

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PCT/EP2013/057723 WO2013156411A1 (en) 2012-04-17 2013-04-12 Illumination device

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EP2839209A1 (en) 2015-02-25
CN104246362B (en) 2017-11-03
US20150077988A1 (en) 2015-03-19
WO2013156411A1 (en) 2013-10-24
US9739459B2 (en) 2017-08-22
EP2839209B1 (en) 2017-02-01
DE102012206332A1 (en) 2013-10-17

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