EP1774543A1 - Elektrisches bauelement mit aussenelektroden und verfahren zur herstellung eines elektrischen bauelements mit aussenelektroden - Google Patents
Elektrisches bauelement mit aussenelektroden und verfahren zur herstellung eines elektrischen bauelements mit aussenelektrodenInfo
- Publication number
- EP1774543A1 EP1774543A1 EP05773181A EP05773181A EP1774543A1 EP 1774543 A1 EP1774543 A1 EP 1774543A1 EP 05773181 A EP05773181 A EP 05773181A EP 05773181 A EP05773181 A EP 05773181A EP 1774543 A1 EP1774543 A1 EP 1774543A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrical component
- adhesive layer
- base body
- electrodes
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed with two or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Definitions
- the invention relates to an electrical component, in particular an NTC component, as well as its production.
- US Pat. No. 5,245,309 discloses ceramic NTC components in which the ceramic base body is produced using multilayer technology and consists of ceramic layers with internal electrodes arranged therein. These internal electrodes each clock an outer contact body and form an electrode terminal. Furthermore, here an outer passivation layer, for. As glass on the surface of the device, be applied. With this technique, it is possible to realize different resistances by varying the arrangement of the internal electrodes in the case of components having the same component standard.
- an NTC component with a base body which has at least a first and a second, respectively, spatially shaped ceramic partial area from comprises different NTC materials, wherein at least ei ⁇ ne first and a second contact layer are provided on the surface of the base body.
- NTC components having different electrical properties are produced.
- the resistance value of a thermistor element can be varied by varying the distance between the ends of the internal electrodes. This avoids that NTC components, which have a low resistance value, turn out to be particularly thin and can thus be damaged by fractures or cracks.
- An electrical component comprising:
- the electrical component has at least one electrical contact body, which is applied to the surface of the base body and connected electrically conductively to the ends of the electrodes.
- the surface of the base body is provided with an adhesive layer for at least partial connection of the contact body with the ceramic part of the surface of the base body.
- An electrical component designed in this way has the advantage that the adhesive layer is removed from the electrode ends when it is heated, and the region thus exposed enables contact bodies to be contacted with the electrode ends, without an adhesive layer changing the resistance of the electrical component remains to a significant extent between the electrode ends and the contact body.
- the maximum area of the ceramic surface of the basic body is utilized for the adhesion with the contact body.
- the ceramic base body is provided there with an adhesive layer which protects against aggressive environmental conditions, where the contact body is not arranged on the base body.
- the contact bodies can also be realized as contact layers, or else as ends of contact wires which establish a connection to an external current and voltage source.
- the contact bodies are connected to the ceramic areas of the ceramic surface, even though they are plated through simultaneously with the electrode ends arranged in the same area.
- a further advantage is the fact that the contact bodies adhere more strongly to the ceramic base body and thus have a high peel strength.
- the contact body could be burned during a thermal fixing phase only on the ceramic body with simultaneous, significant change in the basic resistance value of the electrical component.
- Mit ⁇ means of one of the electrical components proposed here, it is therefore particularly advantageous that the influence of Einbren ⁇ nens the contact body is reduced to the resistance of elektri ⁇ 's device by the coating of the ceramic body, since no more adhesive and Entkopplungs ⁇ layer adheres to the electrode ends and the fürkon- takttechnik of the electrodes to the contact body is particularly pure.
- the ceramic base body is electrically insulated from the contact bodies, so that a reduced change in the basic resistance value of the electrical component can also be achieved here.
- the adhesive layer is electrically insulating and thus also a decoupling layer. It is preferred that the reduced adhesion of the adhesion layer at the ends of the electrodes lies in a temperature range of between 50 and 200 K below the stoving temperature of the contact body. This results in the advantage that when the contact body is burned onto the ceramic base body, sufficient softening of the adhesive layer takes place such that the adhesive layer can be discharged from the ends of the electrodes by itself.
- the adhesive layer comprises a lead-borosilicate mixture so that it is particularly thoroughly dissipated on softening from the ends of the electrodes.
- a method is proposed in which a ceramic base body having a partially ceramic surface is produced, in the interior of which a plurality of electrodes are formed so that the ends of the electrodes form part of the surface, the surface of the main body is wetted with an adhesive layer, which adheres poorly to the ends of the electrodes at a predetermined temperature.
- the manufacturing method is preferably erwei ⁇ tert that a contact body is applied to the base body, wherein during a thermal fixing phase, the e- lekthari component is heated so that the adhesive layer from the parts of the surface of the body, which are formed with electrodes removed and a through-contact tion of the contact body with the ends of the electrodes er ⁇ is sufficient.
- thermal fixing phase is understood to mean a thermal phase in which the contact bodies are baked onto the ceramic base body, ie the burning-in of the contact bodies is part of the thermal fixing phase.
- FIGS. 1 and 2 each show a longitudinal and cross-sectional view of a preferred embodiment of an NTC electrical component
- FIG. 3 shows the behavior of three basic ceramic bodies with or without an adhesive and decoupling layer in specific production steps at different temperatures.
- FIG. 1 shows how a ceramic base body 2, which preferably has a manganese-nickel mixed oxide, is provided with electrodes 3 arranged parallel to one another, which each extend with one end 6 to the surface and thus form part of the surface. At the same time, an adhesive and decoupling layer 5 is applied to the ceramic base body.
- the electrodes preferably have a silver-palladium (Ag-Pd) alloy.
- the contact bodies have a base metalization of silver (Ag), which is preferably reinforced galvanically with a nickel and a tin layer.
- Ag silver
- Such an NTC electrical component is preferably produced as follows: A glass layer 5 is applied to the sintered ceramic base body 2. This ge happens preferably by a method for depositing PH ⁇ ner layers such. B. by immersion in a Glasschli- cker, spraying a glass slip and subsequent or process-accompanying drying.
- the glass slip is advantageously mixed with a binder which improves the adhesion of the dried layer. Typical layer thicknesses, dried in green, range between 1 and 20 ⁇ m.
- An exemplary glass slip composition could consist of 100 grams of glass powder, 3 to 20 grams of binder, and 500 to 1000 grams of water.
- binders cellulose derivatives, such as.
- carboxymethyl cellulose, hydroxypropylmethyl cellulose, polyvinyl alcohol, polyethylene glycol and silicone resins ver ⁇ be used.
- the composition of the glass is to be aligned with the wetting, in particular of the ceramic body, ie the ceramic surface of the ceramic base body.
- a typical composition of the glass can come from the systems B-Si (borosilicate), in particular lead borosilicate (Pb-B-Si), or Zn-B-Si (tin borosilicate), optionally with further additives zen, such as B. Ba, Al, Cu, Fe, Cr, Mg.
- the adhesion layer already adheres to the surface of the contact body, since this has a surface composition which causes the adhesion layer to penetrate between the particles of the contact body surface.
- thermal fixation usually in the range between 650 ° C. and 850 ° C.
- the glass is selected such that its softening point is about 50 to 200 K below the baking temperature of the Kunststoffkör ⁇ or the termination.
- the adhesive layer is heated to a temperature at which it begins to soften and finally is removed from the ends of the electrodes.
- the adhesive layer remains adhered to the ceramic surface of the ceramic base body, but not at the ends of the electrodes, so that through-connection of the termination or the contact body to the ends of the electrodes is made possible.
- the through-contact of the contact body to the electrode ends takes place in that the contact body during the thermal fixation phase partially softens and thus flows to the electrode ends.
- This liquefied Kunststoffmaschinemaschinema ⁇ material can then harden and thus forms a solid electrical contact with the electrodes.
- the composition of the adhesive layer should be chosen so that the general interaction between the glass and the electrode material is taken into account in that the removal of the softened glass layer in the thermal fixing phase is correspondingly facilitated.
- the thickness of the adhesion layer applied to the surface of the ceramic base body should also be selected such that complete softening of the adhesion layer at the ends of the electrodes can be achieved during the thermal fixing phase.
- the remaining adhesive layer between the contact bodies and the ceramic surface of the ceramic base body results in an increased peel strength of the contact body, so that a peel strength of the contact bodies of up to 50 Newton can be achieved.
- reference parts without an adhesive layer between the contact bodies and the ceramic surface have a defect content in a peel-off test of typically 10 to 20%, whereas the component proposed according to the invention has this test at 100%.
- the change in the basic resistance value of the electrical component through the burn-in of the contact bodies can be reduced by about 12% to less than 4% with the electrical component according to the invention.
- the change in the resistance of the ceramic body in the galvanic reinforcement of the contact body, caused by the ceramic removal of the exposed surface of the ceramic body in acidic electroplating baths is reduced from 2% to less than 0.5% (see Figure 3).
- a reduction in the sensitivity of the resistance value of the ceramic component to the interference resistance is achieved, in particular by means of the adhesion and decoupling layer. burning of terminations on the ceramic base body achieved.
- the ceramic base body is produced in a known multilayer technique.
- the adhesive layer applied to the areas of the base body, which does not lie between the contact body and the main body, serves as a protective layer which is resistant to aggressive environmental conditions in further process steps, such as, for. As in the galvanic reinforcement of the termination with nickel-tin layers or during Flussmit ⁇ telangriff during soldering.
- FIG. 2 shows a view of the electrical component 1 in the direction of the arrow shown in FIG.
- the area 8 exposed by the adhesive layer is shown schematically around the one end of the electrode 6.
- the contact body 4, which lies with this perspective between the observer of the electrical component and the ceramic base body, is not shown for the free view of the cross section of the electrical component.
- FIG. 3 shows the change of the resistance value ⁇ W of 3 ceramic base bodies with or without an adhesion and depletion layer in certain production steps at different temperatures.
- the left bar group shows the case when the ceramic base body is provided with an adhesive layer according to the invention. Showing: 1. the left-hand bar Bl shows a small change in the resistance value AW 1 of the ceramic body in a period of 10 minutes before and after the galvanic amplification of the termination at 25 ° C.
- the middle bar B2 grooves have a slight change in the standing Wider ⁇ value of the basic body over a period of 10 Mi ⁇ before and after the galvanic reinforcement of the Termi ⁇ discrimination at temperatures between 25 and 100 0 C.
- the right-hand bar B3 the negative change in the resistance value of the ceramic base body during the thermal fixing phase.
- the middle bar group shows the case when the ceramic base body is also provided with an adhesive layer according to the invention, this time with a thicker layer order, in which case a waiting time of 20 minutes after the above-described times 1 to 3 was inserted until the Measurement of the resistance value was carried out.
- a waiting time of 20 minutes after the above-described times 1 to 3 was inserted until the Measurement of the resistance value was carried out As in the case of the left group of beams, here too a high stability of the resistance value of the ceramic base body is to be seen.
- the right-hand group of bars shows the reference case where according to the prior art no adhesive and decoupling layer is present between the contact body or the termination and the ceramic base body. In this case, the changes in the resistance values of the ceramic base body in the above-described cases 1 to 3 are much higher. LIST OF REFERENCE NUMBERS
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004037588A DE102004037588A1 (de) | 2004-08-03 | 2004-08-03 | Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements |
| PCT/DE2005/001377 WO2006012889A1 (de) | 2004-08-03 | 2005-08-03 | Elektrisches bauelement mit aussenelektroden und verfahren zur herstellung eines elektrischen bauelements mit aussenelektroden |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1774543A1 true EP1774543A1 (de) | 2007-04-18 |
| EP1774543B1 EP1774543B1 (de) | 2008-10-08 |
Family
ID=35033519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05773181A Ceased EP1774543B1 (de) | 2004-08-03 | 2005-08-03 | Elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8194388B2 (de) |
| EP (1) | EP1774543B1 (de) |
| JP (1) | JP5174459B2 (de) |
| DE (2) | DE102004037588A1 (de) |
| WO (1) | WO2006012889A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100189882A1 (en) * | 2006-09-19 | 2010-07-29 | Littelfuse Ireland Development Company Limited | Manufacture of varistors with a passivation layer |
| DE102007044604A1 (de) * | 2007-09-19 | 2009-04-09 | Epcos Ag | Elektrisches Vielschichtbauelement |
| CN201146087Y (zh) * | 2008-01-14 | 2008-11-05 | 爱普科斯电子元器件(珠海保税区)有限公司 | 新型过热短路型压敏电阻 |
| KR101412950B1 (ko) * | 2012-11-07 | 2014-06-26 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
| WO2020018651A1 (en) | 2018-07-18 | 2020-01-23 | Avx Corporation | Varistor passivation layer and method of making the same |
| JP7578511B2 (ja) * | 2021-03-02 | 2024-11-06 | Tdk株式会社 | 積層コンデンサ |
| KR20230103096A (ko) | 2021-12-31 | 2023-07-07 | 삼성전기주식회사 | 적층형 전자 부품 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4701827A (en) * | 1986-02-10 | 1987-10-20 | Kyocera Corporation | Multilayer ceramic capacitor |
| JPH01135501A (ja) | 1987-11-19 | 1989-05-29 | Toshiba Corp | ミキサセトラーの流量制御装置 |
| JP2833242B2 (ja) * | 1991-03-12 | 1998-12-09 | 株式会社村田製作所 | Ntcサーミスタ素子 |
| JP3036567B2 (ja) * | 1991-12-20 | 2000-04-24 | 三菱マテリアル株式会社 | 導電性チップ型セラミック素子及びその製造方法 |
| JPH08115845A (ja) * | 1994-10-14 | 1996-05-07 | Tokin Corp | 積層セラミックコンデンサ |
| KR100255906B1 (ko) * | 1994-10-19 | 2000-05-01 | 모리시타 요이찌 | 전자부품과 그 제조방법 |
| JPH097877A (ja) * | 1995-04-18 | 1997-01-10 | Rohm Co Ltd | 多層セラミックチップ型コンデンサ及びその製造方法 |
| JP3494508B2 (ja) * | 1995-06-26 | 2004-02-09 | 日本碍子株式会社 | 可燃性ガスセンサ、可燃性ガス濃度の測定方法及び触媒劣化検知方法 |
| JPH10149942A (ja) * | 1996-11-20 | 1998-06-02 | Tokin Corp | 積層セラミックコンデンサ及び積層チップインダクタの製造方法 |
| DE19714686A1 (de) * | 1997-04-09 | 1998-10-15 | Siemens Matsushita Components | Elektro-keramisches Bauelement und Verfahren zu seiner Herstellung |
| JPH11219846A (ja) * | 1998-01-29 | 1999-08-10 | Tama Electric Co Ltd | 表面実装部品とその製造方法 |
| JP2001135501A (ja) * | 1999-11-02 | 2001-05-18 | Mitsubishi Materials Corp | チップ型サーミスタ |
| DE10018377C1 (de) * | 2000-04-13 | 2001-12-06 | Epcos Ag | Keramisches Vielschichtbauelement und Verfahren zur Herstellung |
| DE10144364A1 (de) | 2001-09-10 | 2003-04-03 | Epcos Ag | Elektrisches Vielschichtbauelement |
| DE10147898A1 (de) | 2001-09-28 | 2003-04-30 | Epcos Ag | Elektrochemisches Bauelement mit mehreren Kontaktflächen |
| DE10159451A1 (de) | 2001-12-04 | 2003-06-26 | Epcos Ag | Elektrisches Bauelement mit einem negativen Temperaturkoeffizienten |
| DE10202915A1 (de) | 2002-01-25 | 2003-08-21 | Epcos Ag | Elektrokeramisches Bauelement mit Innenelektroden |
| JP4211510B2 (ja) * | 2002-08-13 | 2009-01-21 | 株式会社村田製作所 | 積層型ptcサーミスタの製造方法 |
| DE10350343B4 (de) * | 2002-10-29 | 2016-10-06 | Tdk Corp. | Chipförmiger Varistor und Verfahren zu dessen Herstellung |
| DE10313891A1 (de) | 2003-03-27 | 2004-10-14 | Epcos Ag | Elektrisches Vielschichtbauelement |
| US6965167B2 (en) * | 2003-06-17 | 2005-11-15 | Inpaq Technology Co., Ltd. | Laminated chip electronic device and method of manufacturing the same |
-
2004
- 2004-08-03 DE DE102004037588A patent/DE102004037588A1/de not_active Ceased
-
2005
- 2005-08-03 WO PCT/DE2005/001377 patent/WO2006012889A1/de not_active Ceased
- 2005-08-03 US US11/659,439 patent/US8194388B2/en not_active Expired - Lifetime
- 2005-08-03 JP JP2007524173A patent/JP5174459B2/ja not_active Expired - Fee Related
- 2005-08-03 DE DE502005005633T patent/DE502005005633D1/de not_active Expired - Lifetime
- 2005-08-03 EP EP05773181A patent/EP1774543B1/de not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2006012889A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE502005005633D1 (de) | 2008-11-20 |
| US20080095991A1 (en) | 2008-04-24 |
| US8194388B2 (en) | 2012-06-05 |
| WO2006012889A1 (de) | 2006-02-09 |
| JP2008508735A (ja) | 2008-03-21 |
| EP1774543B1 (de) | 2008-10-08 |
| JP5174459B2 (ja) | 2013-04-03 |
| DE102004037588A1 (de) | 2006-02-23 |
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