EP1756645A1 - Dispositif et procede d'inspection optique en lumiere reflechie et/ou en lumiere transmise de microstructures en ir - Google Patents

Dispositif et procede d'inspection optique en lumiere reflechie et/ou en lumiere transmise de microstructures en ir

Info

Publication number
EP1756645A1
EP1756645A1 EP05745043A EP05745043A EP1756645A1 EP 1756645 A1 EP1756645 A1 EP 1756645A1 EP 05745043 A EP05745043 A EP 05745043A EP 05745043 A EP05745043 A EP 05745043A EP 1756645 A1 EP1756645 A1 EP 1756645A1
Authority
EP
European Patent Office
Prior art keywords
sample
microstructured
light illumination
inspecting
transmitted light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05745043A
Other languages
German (de)
English (en)
Inventor
Uwe Graf
Lambert Danner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Tencor MIE GmbH
Original Assignee
Vistec Semiconductor Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vistec Semiconductor Systems GmbH filed Critical Vistec Semiconductor Systems GmbH
Publication of EP1756645A1 publication Critical patent/EP1756645A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/088—Condensers for both incident illumination and transillumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks

Definitions

  • the invention relates to an apparatus for the optical inspection of microstructured samples with a sample holder to which the sample can be applied for inspection, and to a method for the optical inspection of microstructured samples in which a sample holder is provided to which the sample is applied for inspection and an observation device, in particular a microscope, with which the sample is observed.
  • microstructured samples e.g. wafers
  • Masks or a microstructured component on a substrate are particularly suitable for optical devices.
  • the surface can be examined by evaluating rays which are retroreflected by the surface of the wafer.
  • Optical devices are also known which can recognize a wide variety of structures on the surface of the sample of a wafer by image recognition.
  • the sample is usually illuminated in the bright field and scanned with a camera, such as a matrix or line scan camera.
  • a camera such as a matrix or line scan camera.
  • US Pat. No. 6,587,193 it is also known to examine the surface of a wafer, an illumination being selected which scans the wafer in the form of a line.
  • the illumination line is guided over the surface of the wafer in such a way that a two-dimensional image can be generated.
  • a method and a device for examining a wafer is also known. Illumination is irradiated onto the wafer in such a way that an edge of the wafer is hit. The edge of the wafer can thus be detected and processed by an image processing unit. Wafers of the wafer can then be determined by comparing the edge image determined with a stored comparison image.
  • the known systems for inspecting wafers are designed almost exclusively for incident light inspection in the visual or UV range and for inspecting microstructured samples e.g. encapsulated or embedded objects or wafers structured on both sides as well as stack structures from several wafers are generally not suitable or not suitable.
  • the object of the present invention is to further develop the known sample inspection technique in such a way that it is also suitable for the inspection of encapsulated or embedded objects or wafers structured on both sides and stacked structures composed of several wafers.
  • this object is achieved by a device for inspecting microstructured samples with the features according to claim 1 and a method for inspecting microstructured samples with the features according to claim 9.
  • an inspection device in particular a microscope, which enables simultaneous or separate incident and transmitted light illumination of the samples in the IR and additionally offers visual incident light illumination.
  • the incident light illumination has an incident light source and a filter device for filtering radiation from the optical spectral range.
  • a light source that emits radiation with components from the infrared spectral range (IR) can be used as the illumination device for the transmitted light device.
  • the desired wavelength can be selected together with interchangeable filters for wavelength selection.
  • the light is preferably coupled into the system via a light guide. With this illumination, which is different in incident and transmitted light, it is possible to combine the advantages of IR illumination with those of visual incident light illumination.
  • transmitted light the sample only passes IR light at the locations that are transparent for it. This creates a very high-contrast image.
  • the simultaneous IR incident light illumination enables the display of objects that cannot be displayed in transmitted light due to the shading effect of metallization layers.
  • the result is a detailed, high-contrast image with structures that are not visible in the reflected light due to the lack of transparency of many layers.
  • the usual visual incident light image is available for orientation. Both pictures, i.e.
  • the combined incident / transmitted light IR image and the visual incident light image can be simultaneously displayed on an IR special camera and a normal visual color or B / W CC D camera via a wavelength-selective double TV outlet and on a computer on a monitor output: This functionality can be further improved by adjusting the light wavelengths used, in particular using exchangeable filters for incident and transmitted light illumination.
  • the device can be further improved by using switchable shutters in the beam path of the incident and transmitted light illumination.
  • the acquisition of the images of the samples takes place depending on the set wavelength with conventional lenses and tube lenses or with IR lenses, in particular with special, corresponding sample thicknesses.
  • the entire system can be automated, which is particularly advantageous for inline use in the production of wafers.
  • the images of the incident and transmitted light system can be combined with one another in such a way that they can be output together on an output device, in particular a monitor.
  • FIG. Schematically an overview of a wafer inspection device
  • the single figure shows schematically a characteristic structure according to the invention of a wafer inspection device 10, in particular a microscope for observing a wafer 28.
  • wafer inspection device 10 should not be construed as a limitation.
  • microstructured samples such as. B. wafers, masks or microstructured components (encapsulated or unencapsulated) on a substrate (usually a semiconductor substrate), are examined.
  • the wafer inspection device 10 has an incident light illumination device 50. This essentially consists of an incident light source 12, the light of which can be coupled directly or indirectly onto the wafer 28. For this purpose, the incident light beam 11 can be guided through a collector 14.
  • the light wavelength desired for illumination can be filtered out of the optical spectral range.
  • a switchable diaphragm 15 can be provided in order to select the part desired for illuminating the wafer 28 from the incident light beam 11.
  • About a divider 18 can the incident light beam is then directed onto the wafer 28, which is fixed in the substrate holder 26.
  • the light from the incident light source 12 can also be coupled directly, for example with the aid of an optical fiber.
  • the light reflected by the wafer 28 is captured with a conventional objective 22, which is provided on an objective turret 20, and fed to a CCD camera 44 via an exchangeable tube lens 40.
  • the image data generated in this way are processed in a computing unit, in particular a PC 46, and output with an output device, in particular a monitor 48.
  • a transmitted light illumination 52 is simultaneously provided according to the invention, with the aid of which the wafer can additionally be illuminated in transmitted light.
  • This transmitted light illumination 52 has a transmitted light source 38, a collector 36 and a filter device 34.
  • the Filterein device makes it possible to filter a desired IR spectral component from the light of the light source 38, which is to be used for the transmitted light illumination of the wafer.
  • An optical waveguide 32 for example in the form of an optical waveguide bundle, is preferably used to couple in the IR light.
  • the IR transmitted light After the IR transmitted light has passed through an intermediate optical system 33, it can be directed onto the wafer 28 via a splitter mirror 30.
  • a condenser which is combined with a switchable diaphragm, is usually arranged between the divider mirror 30 and the wafer 28.
  • the image can thus be fed to an IR camera 42 and the data generated thereby can be forwarded to a computing unit, for example the PC 46.
  • the data can in turn be processed and output via the monitor 48.
  • the wafer can be focused manually or automatically via an auto focus system, which makes a significant contribution to the complete automation of the entire examination process.
  • the data originating from the IR incident and transmitted light examination and the VIS incident light examination can be fed to a special, wavelength-selective TV double output 41, which, as shown, with a visual CCD camera and an IR Camera is equipped.
  • Both images can be processed in the PC 46 in such a way that they can be displayed either individually or as an overall image on the monitor 48. It is precisely the combination of the two imaging methods that makes it possible to structurally capture inner elements of the wafer or structures on the underside and to combine them with the data obtained from the visual incident light illumination. In this way, the monitoring of the production process of wafers or the other samples mentioned can be significantly increased.

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Microscoopes, Condenser (AREA)

Abstract

Pour l'analyse d'échantillons microstructurés, par exemple, d'une plaquette à semi-conducteurs (28), on utilise jusqu'à présent des dispositifs et des procédés d'analyse qui, pour la plupart, fonctionnent visuellement ou selon des processus en lumière réfléchie UV. En vue d'élargir les possibilités d'utilisation de ces dispositifs, à savoir, et en particulier, de représenter des détails de structure qui ne sont pas visibles en VIS ou en UV, par suite de la non-transparence des couches de recouvrement ou des matériaux intermédiaires, par exemple, des plaquettes structurées des deux côtés, on applique en lumière réfléchie, une lumière IR et on produit en même temps un éclairage en lumière transmise IR (52) qui offre, entre autre, une nette amélioration de contraste de l'image IR. De cette façon, l'échantillon peut être représenté en même temps en lumière réfléchie IR et/ou en lumière transmise ainsi qu'en lumière réfléchie VIS.
EP05745043A 2004-06-16 2005-05-23 Dispositif et procede d'inspection optique en lumiere reflechie et/ou en lumiere transmise de microstructures en ir Withdrawn EP1756645A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004029212A DE102004029212B4 (de) 2004-06-16 2004-06-16 Vorrichtung und Verfahren zur optischen Auf- und/oder Durchlichtinspektion von Mikrostrukturen im IR
PCT/EP2005/052351 WO2005124422A1 (fr) 2004-06-16 2005-05-23 Dispositif et procede d'inspection optique en lumiere reflechie et/ou en lumiere transmise de microstructures en ir

Publications (1)

Publication Number Publication Date
EP1756645A1 true EP1756645A1 (fr) 2007-02-28

Family

ID=34968027

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05745043A Withdrawn EP1756645A1 (fr) 2004-06-16 2005-05-23 Dispositif et procede d'inspection optique en lumiere reflechie et/ou en lumiere transmise de microstructures en ir

Country Status (6)

Country Link
US (1) US8154718B2 (fr)
EP (1) EP1756645A1 (fr)
JP (1) JP2008502929A (fr)
CN (1) CN101019061A (fr)
DE (1) DE102004029212B4 (fr)
WO (1) WO2005124422A1 (fr)

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CN104267015B (zh) * 2014-07-09 2017-01-18 香港应用科技研究院有限公司 用于生理检测的光信号检测装置及分析样本成分的方法
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Also Published As

Publication number Publication date
US20070247618A1 (en) 2007-10-25
DE102004029212A1 (de) 2006-01-12
DE102004029212B4 (de) 2006-07-13
CN101019061A (zh) 2007-08-15
WO2005124422A1 (fr) 2005-12-29
JP2008502929A (ja) 2008-01-31
US8154718B2 (en) 2012-04-10

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