EP1681680A2 - Dynamische Spaltenblockauswahl - Google Patents

Dynamische Spaltenblockauswahl Download PDF

Info

Publication number
EP1681680A2
EP1681680A2 EP05077828A EP05077828A EP1681680A2 EP 1681680 A2 EP1681680 A2 EP 1681680A2 EP 05077828 A EP05077828 A EP 05077828A EP 05077828 A EP05077828 A EP 05077828A EP 1681680 A2 EP1681680 A2 EP 1681680A2
Authority
EP
European Patent Office
Prior art keywords
memory cells
data
integrated circuit
shift register
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05077828A
Other languages
English (en)
French (fr)
Other versions
EP1681680B1 (de
EP1681680A3 (de
Inventor
Paul Adrian Cernea
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SanDisk Corp
Original Assignee
SanDisk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SanDisk Corp filed Critical SanDisk Corp
Publication of EP1681680A2 publication Critical patent/EP1681680A2/de
Publication of EP1681680A3 publication Critical patent/EP1681680A3/de
Application granted granted Critical
Publication of EP1681680B1 publication Critical patent/EP1681680B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1048—Data bus control circuits, e.g. precharging, presetting, equalising
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1015—Read-write modes for single port memories, i.e. having either a random port or a serial port
    • G11C7/1036—Read-write modes for single port memories, i.e. having either a random port or a serial port using data shift registers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G11C7/106—Data output latches
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1087—Data input latches

Definitions

  • the present invention relates to nonvolatile erasable programmable memories and more specifically, techniques for reading and writing data for these types of memories.
  • Memory and storage is one of the key technology areas that is enabling the growth in the information age. With the rapid growth in the Internet, World Wide Web (WWW), wireless phones, personal digital assistant, digital cameras, digital camcorders, digital music players, computers, networks, and more, there is continually a need for better memory and storage technology.
  • a particular type of memory is nonvolatile memory.
  • a nonvolatile memory retains its memory or stored state even when power is removed.
  • Some types of nonvolatile erasable programmable memories include Flash, EEPROM, EPROM, MRAM, FRAM, ferroelectric, and magnetic memories.
  • Some nonvolatile storage products include CompactFlash (CF) cards, MultiMedia cards (MMC), Flash PC cards (e.g., ATA Flash cards), SmartMedia cards, and memory sticks.
  • a widely used type of semiconductor memory storage cell is the floating gate memory cell.
  • Some types of floating gate memory cells include Flash, EEPROM, and EPROM.
  • the memory cells are configured or programmed to a desired configured state. In particular, electric charge is placed on or removed from the floating gate of a Flash memory cell to put the memory into two or more stored states.
  • One state is an erased state and there may be one or more programmed states. Alternatively, depending on the technology and terminology, there may be a programmed state and one or more erased states.
  • a Flash memory cell can be used to represent at least two binary states, a 0 or a 1.
  • a Flash memory cell can store more than two binary states, such as a 00, 01, 10, or 11; this cell can store multiple states and may be referred to as a multistate memory cell. The cell may have more than one programmed states. If one state is the erased state (00), the programmed states will be 01, 10, and 11, although the actual encoding of the states may vary.
  • nonvolatile memories Despite the success of nonvolatile memories, there also continues to be a need to improve the technology. It is desirable to improve the density, speed, durability, and reliability of these memories. It is also desirable to reduce power consumption.
  • the invention provides a technique of accessing selecting circuits assigned to columns of an array of memory cells to hold data read or to be written into the memory cells.
  • the selecting circuits may be latches.
  • the memory cells are multistate memory cells.
  • the selected selecting circuit In a read mode, the selected selecting circuit will transfer the stored information through an output line to the output buffer for output from the integrated circuit. And while in a programming mode, the selected selecting circuit will receive data from an input buffer. This data will be written into a memory cell.
  • the invention is an integrated circuit including a number of nonvolatile memory cells arranged in rows and columns.
  • a number of read/write circuits are connected to a number of array columns of memory cells.
  • a read/write circuit includes a sense amplifier circuit.
  • a number of first latch circuits are connected to the same set of read/write circuits and a first I/O line.
  • a number of second latch circuits are connected to one or more sense amplifiers and a second I/O line.
  • There is a shift register chain including a number of shift register stages, acting as pointers. Each stage has a data input and a data output. Each stage has a clock input. Each shift register has its input connected to the previous shift register output and the output connected to the next shift register input.
  • the first latches may be implemented using a pair of cross-coupled inverters.
  • the second latches may be implemented using a pair of cross-coupled inverters. Other techniques for implementing a latch may be used such as using other logic gates including NAND and NOR.
  • Each stage of the shift register may be a master-slave-type register.
  • Each memory cell may store a plurality of bits of data.
  • the memory cells may be multistate memory cells.
  • One of the first latch circuits and one of the second latch circuits may hold data to be written into or read from a single memory cell for a column of the memory cells.
  • the first latches are connected between the first I/O line and a different one of the read/write circuits.
  • the second latches are connected between the second I/O line and the same read/write circuit as the first latch one of the sense amplifiers.
  • the first and second latches are not part of a shift register.
  • the first latch circuits do not form a shift register.
  • the second latch circuits do not form a shift register. Therefore, data is not serially passed from one of the first latch circuits to a next one of the first latch circuits. Data is not serially passed from one of the second latch circuits to a next one of the second latch circuits.
  • the invention is a method of operating an integrated circuit.
  • a first latch is provided to hold data associated with a first column of memory cells.
  • a second latch is provided to hold data associated with a second column of memory cells.
  • a shift register is provided having a first stage with an output connected to an enable input of the first latch, and a second stage with an output connected to an enable input of the second latch.
  • a strobe bit is loaded into the first stage of the shift register to enable connecting of the first latch to an I/O line.
  • the shift register is clocked to advance the strobe bit from the first stage of the shift register to the second stage to enable connecting of the second latch to the I/O line. Connecting of the first latch to the I/O line is disabled upon clocking the shift register.
  • Integrated circuits providing nonvolatile storage include nonvolatile erasable-programmable memory cells. Many types of integrated circuits having nonvolatile memory cells include memories, microcontrollers, microprocessors, and programmable logic. Nonvolatile memory integrated circuits may be combined with other nonvolatile memory integrated circuits to form larger memories. The nonvolatile memory integrated circuits may also be combined with other integrated circuits or components such as controllers, microprocessors, random access memories (RAM), or I/O devices, to form a nonvolatile memory system.
  • RAM random access memories
  • I/O devices I/O devices
  • nonvolatile storage or memory cells include Flash, EEPROM, and EPROM.
  • Flash electrically erasable programmable read-only memory
  • EPROM electrically erasable programmable read-only memory
  • MRAM magnetic RAM
  • FRAM magnetic RAM
  • This patent application discusses some specific embodiments of the invention as applied to Flash or EEPROM technology. However, this discussion is to provide merely an specific example of an application of the invention and is not intended to limit the invention to Flash or EEPROM technology.
  • Figure 1 shows a memory integrated circuit with memory cells 101.
  • the integrated circuit may be a memory such as a Flash chip or may be an integrated circuit with a embedded memory portion, such as an ASIC or microprocessor with memory.
  • the memory cells store binary information.
  • the memory cells are nonvolatile memory cells. Examples of some nonvolatile memory cells are floating gate cells, which include Flash, EEPROM, or EPROM cells.
  • the memory cells are arranged in an array of rows and columns. There may be any number of rows and columns, read/write circuit 106 are coupled to columns of the memory cells. In an embodiment, there is one read/write circuit for each column of memory cells. In other embodiments, one read/write circuit may be shared among two or more columns of memory cells.
  • Sense amplifiers are used to read the states of the memory cells. The sense amplifies may also be combined with other circuits in order to write or store data into the memory cells. The combination is referred to as a read/write circuit.
  • the memory cells are multistate cells, capable of storing multiple bits of data per cell.
  • the memory cells store two bits of data. This dual-bit memory cell was selected in order to illustrate the principles of the invention.
  • Multistate memory cells may store more than two bits of data, such as three, four, and more.
  • Figure 1 shows four shift registers 109, 114, 117, and 122.
  • Each shift register stage has an input of IN and an output or OUT. Data is clocked in and out of the registers using a clock input at a CLK input. The clock input is connected to all the registers.
  • FIG. 2 An example of a specific circuit implementation of a register of the shift register is shown in Figure 2. This is known as a master-slave register. There are other circuit implementations for a register that may be used.
  • An input 202 is the input to the shift register or is connected to a previous stage of the shift register.
  • An output 206 is the output to the shift register or is connected to a next stage of the shift register.
  • Each of the four shift registers has one register which is associated with and connected to a particular read-write (RW) circuit.
  • Each read-write circuit includes circuitry to read a state of memory cell and circuitry to write data into a memory cell.
  • the circuitry was shown as a single block, but could also be drawn as two blocks, one for the write circuitry and one for the read circuitry.
  • An example of read circuitry is a sense amplifier (SA) circuit.
  • SA sense amplifier
  • each read-write circuit has four registers associated with it. Two of these registers are used to hold the data to be written into the memory cell. Two registers are used to load the new data to be written while programming is is proceeding, for improved performance.
  • registers 109 and 114 may be used to hold write data
  • registers 117 and 122 may be used to load write data.
  • the write data is serially streamed into the shift registers using IN and then written using read-write circuitry (i.e., write circuit) into the memory cells.
  • Data from the memory cells is read out using the read-write circuit (i . e ., read circuit or sense amplifier) and stored into the registers.
  • the sense amplifiers can sense in parallel and dump data in parallel, in the shift registers.
  • the embodiment of Figure 1 shows a separate set of registers for loading/unloading and actual read and write data.
  • one set of registers may be shared to handle both load and write or read and unload; this will save integrated circuit area.
  • the circuits store and transfer data by means of shift registers:
  • read circuitry or sense amplifiers dump data into shift registers, then data are streamed out.
  • data are shifted in and stored into these shift registers.
  • Shift registers are made of two latches, a "master” and a “slave.” Shifting in or out data through the masters and the slaves creates a lot of noise, depending upon data pattern. For example, if data is mostly alternating 0s and 1s, then thousand of masters and slaves will toggle their outputs accordingly.
  • Figure 3 shows another circuit architecture for reading and writing data to memory cells 301 of an integrated circuit.
  • the integrated circuit may be a memory such as a Flash chip or may be an integrated circuit with a embedded memory portion, such as an ASIC or microprocessor with memory.
  • the memory cells store binary information.
  • the memory cells are nonvolatile memory cells. Examples of some nonvolatile memory cells are floating gate, Flash, or EEPROM cells.
  • the memory cells are arranged in an array of rows and columns. The may be any number of rows and columns.
  • Read-write (RW) circuits 306 are coupled to columns of the memory cells. In an embodiment, there is one read-write circuit for each column of memory cells. In other embodiments, one read-write circuit may be shared among two or more columns of memory cells. The read-write circuits are used to read the states of the memory cells. The read-write circuits may be also be used to write or store data into the memory cells. The read-write circuitry may include sense amplifier circuits, as discussed above.
  • the memory cells are multistate cells, capable of storing multiple bits of data per cell.
  • memory cells 301 of Figure 3 are dual-bit multibit memory cells. This dual-bit memory cell was selected in order to illustrate the principles of the invention. Multistate memory cells may store more than two bits of data, such as three, four, and more. And, the principles of the invention would also apply. As the number of bits that can be stored in a single multistate cell increases, the advantages of the architecture in Figure 3 over that in Figure 1 also increase.
  • the temporary storage circuits may be any circuitry used to hold data for the memory cells.
  • the temporary storage circuits are latches. However, other types of logic may also be used. The connection is not shown.
  • Each latch is connected to one of four input lines, 333, 336, 338, and 340. These input lines are lines used to input data into the latches. Data is loaded into a particular latch based on an ENABLE signal input of each latch (not shown). When the LOAD signal is asserted (active low or active high signal) for a particular latch, then that latch is loaded.
  • the input lines are shown running on top of the latches. They may also run beside the latches. Also, in other embodiments of the invention, there may be a single input line and data from the input line is shifted into the latches serially.
  • An example of a specific circuit implementation of a latch is shown in Figure 4.
  • Other circuit implementation for a latch that may also be used.
  • An input 402 is the input of the latch and will be connected to an input line.
  • the ENABLE signal is connected to a pass transistor or pass gate that allows data to be connected to or disconnected from input 402.
  • This latch circuit includes cross-coupled inverters to hold data.
  • the latch also connects to the read-write circuit so that data may be passed between the circuits (such as by using pass transistor 408).
  • the latch also connects to the output through a pass transistor 413.
  • I/O input/output
  • an input/output (I/O) line may be used, so only one of the pass transistors 402 or 413 is needed.
  • the single pass transistor would connect the latch to the I/O line.
  • inverters instead of inverters, other logic gates may be used, such as NAND, NOR, XOR, AND, and OR gates, and combinations of these.
  • this circuitry contains half the circuitry of a master-slave register as shown in Figure 2.
  • the master portion of a master-slaver register is one latch, and the slave portion is another latch.
  • CMOS pass gate There are many ways to form a pass gate, and any of these techniques may be used.
  • a CMOS pass gate may be used.
  • a CMOS pass gate includes NMOS and PMOS transistors connected in parallel.
  • a high voltage pass gate may be used.
  • a high-voltage NMOS pass gate is enabled or turned on (or placed in an on state) by placing a high voltage, above VCC, at its gate or control electrode.
  • An NMOS pass gate are turned off or put in an off state by placing its control electrode at VSS or ground.
  • the circuitry in Figure 3 further includes a shift register 346, one stage for each read-write circuit.
  • This shift register is similar to one shift register of Figure 1.
  • the output of each shift register stage is connected to the ENABLE signal input of the particular latches that stage is associated with.
  • each read-write circuit is connected to and has four latches associated with it. Two of these latches are used to hold the data to be written into the memory cell. Two latches are used to load the data to be written into the memory cell during the next write cycle. For example, latches 309 and 314 may be used to hold write data, and latches 317 and 322 may be used to hold load new data. Accordingly, during the read mode, two latches are used to hold and unload current data, while new data is prepared in the other two latches.
  • the write data is input into the latches via the appropriate input lines and then written using the appropriate read-write circuit into the memory cells.
  • Data from the memory cells is read out using the sense amplifier and stored into the latches.
  • the read data is output from the latches using the appropriate output lines.
  • the communication line between the latch and the read-write circuit as well as the output line is not shown.
  • Data is input from the latches one at a time using the input lines. This is done by using an ENABLE signal, so that the latches associated with a read-write circuit or column in the array are connected to the input lines one at a time.
  • the ENABLE signal for a the latches comes from the shift registers.
  • the shift registers are loaded with a pattern (for active high logic) which is all 0s, except for one 1 (e.g., 0001000000). This bit may be referred to as a strobe bit. For example, shift register associated with the first column has a 1, and the rest of the shift register contain 0.
  • This 1 is connected to the ENABLE input of the latches for the first column, which connects one or more of these latches to the I/O lines 333, 336, 338, and 340. Data can be read or written to this column.
  • the input to the shift register is connected to 0 and the shift register is clocked.
  • the 1 propagates to the next shift register stage.
  • This 1 is connected to the ENABLE input of the latches for the second column, which connects these latches to the I/O lines. This operation continues until the desired data is read or written from the latches.
  • Figures 5 and 6 show more clearly the operation of latches and shift register.
  • the first shift register has a 1; the data latch associated with that shift register and column is connected to the I/O line.
  • Figure 6 the shift register has been clocked, and the next shift register has the 1; the data latch associated with that shift register and column is connected to the I/O line.
  • the circuitry may also be designed for an active low LOAD signal. Then, the shift register will contain all 1s and a 0 for the particular latches to be enabled ( e.g ., 1110111111).
  • FIG. 3 shows a separate set of latches for shifting in or out (loading/unloading) data and the actual operation.
  • one set of latches may be shared to handle serially the shifting and this will save integrated circuit area.
  • this improves performance because both types of data may be input and output at the same time.
  • FIG. 3 Another advantage of the Figure 3 approach over that in Figure 1 is a reduction in the amount of noise generated.
  • a 1 or 0 for active low
  • Only one bit is being switched for each clock.
  • only one set of latches is being connected to the I/O lines at a time. Both these contribute to reduce the amount of noise when inputting and output data from the memory cells. By reducing the amount of noise, this improves the reliability of the integrated circuit since it will be less like that data will be corrupted by noise.
  • Two latches are for the shifting the strobe.
  • Two latches are for storing old data, and two latches are for loading new data.
  • circuitry of Figure 3 is comparatively very quiet: one clock signal and one latch output switching (for the strobe) plus two I/Os to be driven, compared to six clocks and thousands of latches switching at a time.
  • One embodiment may use a combined input/output (I/O) line to input and output data to the latches.
  • I/O input/output
  • Figure 7 shows the details of another embodiment of the invention.
  • the data on an input line is connected to and stored in a respective latch.
  • This data in the latches may be connected to the read-write circuit 106 for writing the data into the memory cells.
  • This implementation includes a single output line where data from the latches are output.
  • Another embodiment may have four output lines, one for each of the latches. However, having more lines does impact die size, and having fewer lines produces a more compact layout.
  • Figure 8 shows another embodiment of the invention.
  • the data from the input line may be transferred to each latch.
  • this implementation provides for a more compact layout.
  • each of these embodiments may be combined with others.

Landscapes

  • Static Random-Access Memory (AREA)
  • Read Only Memory (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Storage Device Security (AREA)
EP05077828A 2001-09-17 2002-09-17 Dynamische Spaltenblockauswahl Expired - Lifetime EP1681680B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/956,416 US6560146B2 (en) 2001-09-17 2001-09-17 Dynamic column block selection
EP02773439A EP1428220B1 (de) 2001-09-17 2002-09-17 Dynamische spaltenblockauswahl

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP02773439A Division EP1428220B1 (de) 2001-09-17 2002-09-17 Dynamische spaltenblockauswahl

Publications (3)

Publication Number Publication Date
EP1681680A2 true EP1681680A2 (de) 2006-07-19
EP1681680A3 EP1681680A3 (de) 2006-08-02
EP1681680B1 EP1681680B1 (de) 2008-12-24

Family

ID=25498221

Family Applications (2)

Application Number Title Priority Date Filing Date
EP05077828A Expired - Lifetime EP1681680B1 (de) 2001-09-17 2002-09-17 Dynamische Spaltenblockauswahl
EP02773439A Expired - Lifetime EP1428220B1 (de) 2001-09-17 2002-09-17 Dynamische spaltenblockauswahl

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP02773439A Expired - Lifetime EP1428220B1 (de) 2001-09-17 2002-09-17 Dynamische spaltenblockauswahl

Country Status (9)

Country Link
US (2) US6560146B2 (de)
EP (2) EP1681680B1 (de)
JP (1) JP2005504404A (de)
KR (1) KR100918592B1 (de)
CN (1) CN100476986C (de)
AT (2) ATE418782T1 (de)
DE (2) DE60230551D1 (de)
TW (1) TW580702B (de)
WO (1) WO2003025939A2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586793B2 (en) 2001-09-17 2009-09-08 Sandisk Corporation Dynamic column block selection
US7974124B2 (en) 2009-06-24 2011-07-05 Sandisk Corporation Pointer based column selection techniques in non-volatile memories
US8842473B2 (en) 2012-03-15 2014-09-23 Sandisk Technologies Inc. Techniques for accessing column selecting shift register with skipped entries in non-volatile memories
EP2330594B1 (de) * 2009-05-26 2018-07-11 Crocus Technology S.A. Nichtflüchtige logische Vorrichtungen mit Magnettunnelübergängen

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170802B2 (en) * 2003-12-31 2007-01-30 Sandisk Corporation Flexible and area efficient column redundancy for non-volatile memories
US6560146B2 (en) * 2001-09-17 2003-05-06 Sandisk Corporation Dynamic column block selection
US20030154331A1 (en) * 2002-02-13 2003-08-14 Globespanvirata Incorporated System and method for shared use of common GPIO line
US7707351B2 (en) * 2002-10-31 2010-04-27 Ring Technology Enterprises Of Texas, Llc Methods and systems for an identifier-based memory section
US6879526B2 (en) * 2002-10-31 2005-04-12 Ring Technology Enterprises Llc Methods and apparatus for improved memory access
US20050007858A1 (en) * 2003-07-10 2005-01-13 Smith Kenneth K. Method and system for reducing power when writing information to MRAM
TWI286764B (en) * 2005-01-20 2007-09-11 Himax Tech Ltd Memory architecture of display device and memory writing method for the same
JP4896011B2 (ja) * 2005-03-31 2012-03-14 スパンション エルエルシー 半導体装置及びその制御方法
US7379330B2 (en) * 2005-11-08 2008-05-27 Sandisk Corporation Retargetable memory cell redundancy methods
US8102705B2 (en) 2009-06-05 2012-01-24 Sandisk Technologies Inc. Structure and method for shuffling data within non-volatile memory devices
US8027195B2 (en) * 2009-06-05 2011-09-27 SanDisk Technologies, Inc. Folding data stored in binary format into multi-state format within non-volatile memory devices
US20110002169A1 (en) 2009-07-06 2011-01-06 Yan Li Bad Column Management with Bit Information in Non-Volatile Memory Systems
US8468294B2 (en) * 2009-12-18 2013-06-18 Sandisk Technologies Inc. Non-volatile memory with multi-gear control using on-chip folding of data
US8144512B2 (en) 2009-12-18 2012-03-27 Sandisk Technologies Inc. Data transfer flows for on-chip folding
US8725935B2 (en) 2009-12-18 2014-05-13 Sandisk Technologies Inc. Balanced performance for on-chip folding of non-volatile memories
US9342446B2 (en) 2011-03-29 2016-05-17 SanDisk Technologies, Inc. Non-volatile memory system allowing reverse eviction of data updates to non-volatile binary cache
US8681548B2 (en) 2012-05-03 2014-03-25 Sandisk Technologies Inc. Column redundancy circuitry for non-volatile memory
KR20140031554A (ko) * 2012-09-04 2014-03-13 에스케이하이닉스 주식회사 불휘발성 메모리 장치 및 그것의 동작 방법
US9076506B2 (en) 2012-09-28 2015-07-07 Sandisk Technologies Inc. Variable rate parallel to serial shift register
US8897080B2 (en) 2012-09-28 2014-11-25 Sandisk Technologies Inc. Variable rate serial to parallel shift register
US9490035B2 (en) 2012-09-28 2016-11-08 SanDisk Technologies, Inc. Centralized variable rate serializer and deserializer for bad column management
US9934872B2 (en) 2014-10-30 2018-04-03 Sandisk Technologies Llc Erase stress and delta erase loop count methods for various fail modes in non-volatile memory
US9224502B1 (en) 2015-01-14 2015-12-29 Sandisk Technologies Inc. Techniques for detection and treating memory hole to local interconnect marginality defects
US10032524B2 (en) 2015-02-09 2018-07-24 Sandisk Technologies Llc Techniques for determining local interconnect defects
US9564219B2 (en) 2015-04-08 2017-02-07 Sandisk Technologies Llc Current based detection and recording of memory hole-interconnect spacing defects
US9269446B1 (en) 2015-04-08 2016-02-23 Sandisk Technologies Inc. Methods to improve programming of slow cells
US10170166B1 (en) * 2017-09-08 2019-01-01 Winbond Electronics Corp. Data transmission apparatus for memory and data transmission method thereof
US10971202B1 (en) 2020-04-15 2021-04-06 Sandisk Technologies Llc Low latency data transfer
JP7002807B1 (ja) * 2021-03-04 2022-01-20 茉美 安平 草抜き装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710348A (en) * 1970-04-02 1973-01-09 Ibm Connect modules
JPS61292747A (ja) * 1985-06-20 1986-12-23 Nec Corp バツフアレジスタ
US4720815A (en) * 1985-05-20 1988-01-19 Fujitsu Limited Semiconductor memory device in form of shift register with two-phase clock signal supply
US4757477A (en) * 1986-06-06 1988-07-12 Fujitsu Limited Dual-port semiconductor memory device
US5172338A (en) * 1989-04-13 1992-12-15 Sundisk Corporation Multi-state EEprom read and write circuits and techniques
JPH06150666A (ja) * 1992-11-12 1994-05-31 Sanyo Electric Co Ltd 入力回路
US5479370A (en) * 1992-02-20 1995-12-26 Kabushiki Kaisha Toshiba Semiconductor memory with bypass circuit

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895360A (en) * 1974-01-29 1975-07-15 Westinghouse Electric Corp Block oriented random access memory
US5095344A (en) 1988-06-08 1992-03-10 Eliyahou Harari Highly compact eprom and flash eeprom devices
US5268870A (en) 1988-06-08 1993-12-07 Eliyahou Harari Flash EEPROM system and intelligent programming and erasing methods therefor
EP0675502B1 (de) 1989-04-13 2005-05-25 SanDisk Corporation EEPROM-System mit aus mehreren Chips bestehender Blocklöschung
US5343063A (en) 1990-12-18 1994-08-30 Sundisk Corporation Dense vertical programmable read only memory cell structure and processes for making them
US5270979A (en) 1991-03-15 1993-12-14 Sundisk Corporation Method for optimum erasing of EEPROM
US6230233B1 (en) 1991-09-13 2001-05-08 Sandisk Corporation Wear leveling techniques for flash EEPROM systems
US6222762B1 (en) 1992-01-14 2001-04-24 Sandisk Corporation Multi-state memory
US5783958A (en) * 1996-01-19 1998-07-21 Sgs-Thomson Microelectronics, Inc. Switching master slave circuit
US6091666A (en) * 1996-10-04 2000-07-18 Sony Corporation Nonvolatile flash memory with fast data programming operation
JP3317187B2 (ja) * 1997-04-25 2002-08-26 日本電気株式会社 半導体記憶装置
JPH11162183A (ja) 1997-11-28 1999-06-18 New Core Technology Kk 不揮発性半導体多値メモリ装置
KR200257595Y1 (ko) * 2001-07-20 2001-12-24 배호영 식물이 활착 된 식생 롤
US6560146B2 (en) * 2001-09-17 2003-05-06 Sandisk Corporation Dynamic column block selection

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710348A (en) * 1970-04-02 1973-01-09 Ibm Connect modules
US4720815A (en) * 1985-05-20 1988-01-19 Fujitsu Limited Semiconductor memory device in form of shift register with two-phase clock signal supply
JPS61292747A (ja) * 1985-06-20 1986-12-23 Nec Corp バツフアレジスタ
US4757477A (en) * 1986-06-06 1988-07-12 Fujitsu Limited Dual-port semiconductor memory device
US5172338A (en) * 1989-04-13 1992-12-15 Sundisk Corporation Multi-state EEprom read and write circuits and techniques
US5172338B1 (en) * 1989-04-13 1997-07-08 Sandisk Corp Multi-state eeprom read and write circuits and techniques
US5479370A (en) * 1992-02-20 1995-12-26 Kabushiki Kaisha Toshiba Semiconductor memory with bypass circuit
JPH06150666A (ja) * 1992-11-12 1994-05-31 Sanyo Electric Co Ltd 入力回路

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 011, no. 162 (P-579), 26 May 1987 (1987-05-26) -& JP 61 292747 A (NEC CORP), 23 December 1986 (1986-12-23) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 473 (P-1795), 2 September 1994 (1994-09-02) -& JP 06 150666 A (SANYO ELECTRIC CO LTD), 31 May 1994 (1994-05-31) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586793B2 (en) 2001-09-17 2009-09-08 Sandisk Corporation Dynamic column block selection
US7768841B2 (en) 2001-09-17 2010-08-03 Sandisk Corporation Dynamic column block selection
EP2330594B1 (de) * 2009-05-26 2018-07-11 Crocus Technology S.A. Nichtflüchtige logische Vorrichtungen mit Magnettunnelübergängen
US7974124B2 (en) 2009-06-24 2011-07-05 Sandisk Corporation Pointer based column selection techniques in non-volatile memories
US8842473B2 (en) 2012-03-15 2014-09-23 Sandisk Technologies Inc. Techniques for accessing column selecting shift register with skipped entries in non-volatile memories

Also Published As

Publication number Publication date
EP1681680B1 (de) 2008-12-24
EP1681680A3 (de) 2006-08-02
ATE418782T1 (de) 2009-01-15
KR20040058183A (ko) 2004-07-03
TW580702B (en) 2004-03-21
US6560146B2 (en) 2003-05-06
DE60212982T2 (de) 2007-02-15
WO2003025939A2 (en) 2003-03-27
DE60230551D1 (de) 2009-02-05
CN1568522A (zh) 2005-01-19
CN100476986C (zh) 2009-04-08
KR100918592B1 (ko) 2009-09-24
EP1428220B1 (de) 2006-07-05
US20030058691A1 (en) 2003-03-27
US6822911B2 (en) 2004-11-23
ATE332563T1 (de) 2006-07-15
WO2003025939A3 (en) 2003-11-13
US20030223274A1 (en) 2003-12-04
JP2005504404A (ja) 2005-02-10
EP1428220A2 (de) 2004-06-16
DE60212982D1 (de) 2006-08-17

Similar Documents

Publication Publication Date Title
EP1681680B1 (de) Dynamische Spaltenblockauswahl
US7586793B2 (en) Dynamic column block selection
EP2446439B1 (de) Zeigerbasierte spaltenauswahlverfahren bei nichtflüchtigen speichern
US6751129B1 (en) Efficient read, write methods for multi-state memory
JP5562809B2 (ja) 不揮発性メモリのシリアルコアアーキテクチャ
EP1981030B1 (de) Verkettete Kaskadenvorrichtungen
US7447070B2 (en) Highly compact non-volatile memory and method therefor with internal serial buses
US6940753B2 (en) Highly compact non-volatile memory and method therefor with space-efficient data registers
US20140126293A1 (en) Centralized Variable Rate Serializer and Deserializer for Bad Column Management
US20050219910A1 (en) Highly compact non-volatile memory and method thereof
US6567970B1 (en) PLD configuration architecture
US6622201B1 (en) Chained array of sequential access memories enabling continuous read

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

17P Request for examination filed

Effective date: 20051208

AC Divisional application: reference to earlier application

Ref document number: 1428220

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

17Q First examination report despatched

Effective date: 20061109

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SANDISK CORPORATION

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AC Divisional application: reference to earlier application

Ref document number: 1428220

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60230551

Country of ref document: DE

Date of ref document: 20090205

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090324

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090404

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090525

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090324

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20090925

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090930

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20090917

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090917

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090325

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090930

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090917

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090917

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081224

REG Reference to a national code

Ref country code: NL

Ref legal event code: SD

Effective date: 20111229

REG Reference to a national code

Ref country code: FR

Ref legal event code: TP

Owner name: SANDISK TECHNOLOGIES INC., US

Effective date: 20120229

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: PATENTANWAELTE MAXTON LANGMAACK & PARTNER, DE

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: PATENTANWAELTE MAXTON LANGMAACK & PARTNER, DE

Effective date: 20120713

Ref country code: DE

Ref legal event code: R081

Ref document number: 60230551

Country of ref document: DE

Owner name: SANDISK TECHNOLOGIES INC., PLANO, US

Free format text: FORMER OWNER: SANDISK CORP., MILPITAS, CALIF., US

Effective date: 20120713

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

Effective date: 20120713

Ref country code: DE

Ref legal event code: R081

Ref document number: 60230551

Country of ref document: DE

Owner name: SANDISK TECHNOLOGIES LLC, PLANO, US

Free format text: FORMER OWNER: SANDISK CORP., MILPITAS, CALIF., US

Effective date: 20120713

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

Effective date: 20120713

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20130910

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20130910

Year of fee payment: 12

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20150529

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140930

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

Ref country code: DE

Ref legal event code: R081

Ref document number: 60230551

Country of ref document: DE

Owner name: SANDISK TECHNOLOGIES LLC, PLANO, US

Free format text: FORMER OWNER: SANDISK TECHNOLOGIES INC., PLANO, TEX., US

Ref country code: DE

Ref legal event code: R082

Ref document number: 60230551

Country of ref document: DE

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20190903

Year of fee payment: 18

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60230551

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210401