EP1636402A2 - Surfaces de contact pour contacts electriques, et procede de production correspondant - Google Patents

Surfaces de contact pour contacts electriques, et procede de production correspondant

Info

Publication number
EP1636402A2
EP1636402A2 EP04741622A EP04741622A EP1636402A2 EP 1636402 A2 EP1636402 A2 EP 1636402A2 EP 04741622 A EP04741622 A EP 04741622A EP 04741622 A EP04741622 A EP 04741622A EP 1636402 A2 EP1636402 A2 EP 1636402A2
Authority
EP
European Patent Office
Prior art keywords
metal
alloys
deposited
layer
lubricant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04741622A
Other languages
German (de)
English (en)
Inventor
Peter Rehbein
Volker Haas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1636402A2 publication Critical patent/EP1636402A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]

Definitions

  • the invention relates to improved contact surfaces for electrical contacts and a method for their production according to the preamble of the independent claims.
  • substrates made of a copper-based alloy are typically used, which ensures good electrical conductivity.
  • the substrate is made of a copper-based alloy with high strength and high stress relaxation resistance.
  • a cover layer is often applied to the substrate in order to reduce the insertion forces, wear, oxidation, to ensure the electrical function and to reduce tarnishing of the copper-based substrate at elevated temperature, and to improve the solderability.
  • Typical cover layers consist of silver, gold, nickel, palladium / nickel alloys, tin or tin alloys.
  • Tin is often used to minimize costs, and these are usually hot-dip tinned or galvanically deposited layers with thicknesses in the range of a few ⁇ m. Tin is characterized by its ductility and its good electrical conductivity. Disadvantages of these tin cover layers are their high susceptibility to fretting corrosion, their plastic deformation, their tendency to adhesion and their low wear resistance.
  • the substrate consists of copper-based alloys such as CuSn-Bronze, CuNiSi, etc., which often serve as the base material for electrical connectors. At elevated temperatures, copper can diffuse out of the substrate and settle with it Tin combined to form intermetallic compounds such as Cu 6 Sn 5 and Cu 3 Sn The formation of these intermetallic compounds reduces the amount of unreacted or free tin on the surface, which degrades the electrical, corrosion and other performance characteristics.
  • thermal tin has not proven to be a successful solution under all test conditions (e.g. chemical tests or abrasive loads) and therefore only has a negligible market share.
  • US-A-5,916,695 discloses electrical contact with a copper-based substrate provided with a tin-based top layer.
  • a barrier layer is applied between the substrate and the cover layer.
  • This barrier layer contains 20 to 40% by weight of nickel and preferably consists mainly of copper (Cu-based).
  • the tin-based cover layer can contain additives such as SiO 2 , Al 2 O 3 , SiC, graphite or MoS 2 as lubricants.
  • the contact surfaces according to the invention have the advantage over the prior art that, with good contacting, they require lower insertion forces.
  • antioxidants in the lubricant contained offers protection of the surface against corrosion.
  • a diffusion barrier layer is additionally deposited on the substrate.
  • the essence of the invention is the construction of a cover layer on a copper-based substrate for electrical contacts, which allows lower plug-in forces to be required with consistently good contacting and that good wear resistance is achieved over the entire service life of the electrical contact.
  • a contact surface 12 is first produced on the electrical contact, ie on the copper-based substrate 10, by means of galvanic processes, for example high-speed deposition in belt systems.
  • a metal for example tin, silver or copper
  • placeholder material a further substance that can be easily removed from the metal at a later time
  • the layer thickness is generally between approximately 0.5 and approximately 10 ⁇ m.
  • the placeholder material can be polystyrene balls, for example. However, latex balls or other plastics are also conceivable that can be easily thermally decomposed or dissolved.
  • Polyethylene, base metals, sulfur, phosphorus, sulfur compounds, phosphorus compounds, sisal, corn starch and the like can also be used.
  • the detachment of the substance can be carried out by means of thermal and / or solvent treatment, e.g. dissolving the polystyrene balls in toluene.
  • Thermal treatment lends itself to substances that decompose easily and pass into the gas phase, treatment with solvents, for example toluene, acetone, cleaning gasoline, alcohols and the like, is preferred if, for example, a thermal load causes a Melt forms, which is difficult to remove, or if it is easier, faster or cheaper in terms of process technology.
  • a highly porous skeleton formed by the metal, the so-called metal foam 14 remains. The pores form over the entire layer. It is important to ensure that the percentage of pores is in the range of approx. 20 to approx. 50%, otherwise the percolation of the lubricant is not guaranteed. If problems with mechanical stability should occur, the pore content should be adjusted so that the layer is also mechanically stable.
  • this metal foam is soaked with a lubricant.
  • This lubricant can be both solid lubricants such as graphite, MoS 2 and the like, as well as liquid lubricants such as oils or greases dissolved in solvents.
  • the lubricant Due to the very large capillary action due to the small pores 16 (average pore size in the range of 0.1 to 5 ⁇ m) of the metal foam 14, the lubricant is sucked into the pores 16 and held there. It is also possible to dissolve a solid lubricant in a solvent and then let it soak in. In this way, the metal foam represents a retention volume for the lubricant. It can therefore not be removed from the wear area be driven out and is available over the entire life of the contact.
  • the deposited metal can be, for example, copper and Cu alloys, for example with Be or similar metals, Sn and Sn alloys, in particular Sn-Ag, Ag and Ag alloys, and Au and Au alloys. Trade alloys. These metals can be used with or without diffusion barriers such as nickel plating, as well as with or without flash made of precious metal such as Au, Pt, Ru or Pd, these are preferably deposited on the Cu alloys.
  • the layer thickness of the deposited layer is generally between about 0.5 and 10 ⁇ m.
  • the pore geometry can be either round or multifaceted.
  • the average pore size depends on the size distribution of the placeholder material used and on the layer thickness, whereby pore size ⁇ layer thickness applies. Whether the pore geometry is round or extensive depends on the morphology of the placeholder material used. The proportion of pores is between 1 and 80% by volume of the layer formed.
  • the contact surfaces according to the invention allow lower insertion forces due to the lubricant present, which is preferably oil or fat, but can also be a solid lubricant in the form of graphite, MoS 2 or the like. Good contacting is guaranteed due to the electrical conductivity of the (solid) lubricant. Antioxidants contained in the lubricant protect the surface from corrosion, high wear resistance and a high number of mating cycles are obtained.
  • a great advantage of the contact surfaces according to the invention lies in the fact that the porous metal foam has a retention volume for the lubricant provides. This cannot be driven out of the wear hub and is therefore available over the entire service life of the contact.
  • 10 g / l polystyrene balls with a diameter of approximately 1 ⁇ m are electrodeposited together with Ag.
  • the polystyrene balls are installed in the Ag layer.
  • the balls are then removed with toluene.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Of Switches (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de production de surfaces de contact pour contacts électriques, consistant à déposer, par un processus galvanique, un métal sur un substrat à base de cuivre. Le métal est déposé sur le substrat, conjointement avec un matériau d'écartement, extrait facilement d'un métal par un solvant, après quoi ledit matériau d'écartement est extrait de la couche métallique, et la mousse métallique poreuse restante est imprégnée d'un lubrifiant.
EP04741622A 2003-06-13 2004-05-21 Surfaces de contact pour contacts electriques, et procede de production correspondant Withdrawn EP1636402A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003126788 DE10326788B4 (de) 2003-06-13 2003-06-13 Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung
PCT/EP2004/050881 WO2004111312A2 (fr) 2003-06-13 2004-05-21 Surfaces de contact pour contacts electriques, et procede de production correspondant

Publications (1)

Publication Number Publication Date
EP1636402A2 true EP1636402A2 (fr) 2006-03-22

Family

ID=33546557

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04741622A Withdrawn EP1636402A2 (fr) 2003-06-13 2004-05-21 Surfaces de contact pour contacts electriques, et procede de production correspondant

Country Status (5)

Country Link
US (1) US20060204741A1 (fr)
EP (1) EP1636402A2 (fr)
JP (1) JP2006527305A (fr)
DE (1) DE10326788B4 (fr)
WO (1) WO2004111312A2 (fr)

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JP4855032B2 (ja) * 2005-09-29 2012-01-18 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
US7604871B2 (en) * 2006-06-07 2009-10-20 Honeywell International Inc. Electrical components including abrasive powder coatings for inhibiting tin whisker growth
JP2008106290A (ja) * 2006-10-23 2008-05-08 Ricoh Co Ltd 電気接点部材
WO2009035444A1 (fr) * 2006-11-15 2009-03-19 Massachusetts Institute Of Technology Procédés de façonnage de la topographie de surface d'un métal ou d'un alliage nanocristallin ou amorphe et articles formés par de tels procédés
EP2006420A1 (fr) * 2007-06-22 2008-12-24 Danmarks Tekniske Universitet - DTU Couche microporeuse pour diminuer la friction dans un procédé de formage de métaux
EP2009146A1 (fr) * 2007-06-22 2008-12-31 Danmarks Tekniske Universitet - DTU Revêtement ou structure microporeux et processus pour le produire
JP2009209453A (ja) * 2008-02-05 2009-09-17 Kyushu Nogeden:Kk 錫めっき膜および該錫めっき膜を形成する錫めっき浴
FR2962856B1 (fr) * 2010-07-16 2012-08-17 Amc Holding Dispositif de connexion electrique a conductance amelioree
DE102011088793A1 (de) * 2011-12-16 2013-06-20 Tyco Electronics Amp Gmbh Elektrischer Steckverbinder mit mikrostrukturiertem Kontaktelement
JP5851232B2 (ja) * 2011-12-22 2016-02-03 日本圧着端子製造株式会社 部品
JP5851231B2 (ja) * 2011-12-22 2016-02-03 日本圧着端子製造株式会社 部品
KR20130096045A (ko) * 2012-02-21 2013-08-29 엘지전자 주식회사 다공성 금속 구조체 및 그 제조 방법
FR2996348B1 (fr) 2012-10-03 2015-05-15 Amc Holding Poudre et pate pour ameliorer la conductance des connexions electriques
FR2997788B1 (fr) 2012-11-05 2016-01-22 Amc Etec Dispositif de sectionnement d'une ligne d'alimentation electrique a courant de haute intensite
FR3008429A1 (fr) * 2013-07-12 2015-01-16 Commissariat Energie Atomique Procede de synthese d'une mousse metallique, mousse metallique, ses utilisations et dispositif comprenant une telle mousse metallique
DE102014005941A1 (de) * 2014-04-24 2015-11-12 Te Connectivity Germany Gmbh Verfahren zum Herstellen eines elektrischen Kontaktelements zur Vermeidung von Zinnwhiskerbildung, und Kontaktelement
JP6514031B2 (ja) * 2015-05-19 2019-05-15 日本圧着端子製造株式会社 圧着端子
DE102016214693B4 (de) * 2016-08-08 2018-05-09 Steinbeiss-Forschungszentrum, Material Engineering Center Saarland Elektrisch leitendes Kontaktelement für einen elektrischen Steckverbinder, elektrischer Steckverbinder, der ein solches Kontaktelement umfasst, und Verfahren zum Einschließen eines Hilfsstoffes unter der Kontaktoberfläche eines solchen Kontaktelements
JP7082337B2 (ja) * 2017-03-06 2022-06-08 帝国イオン株式会社 耐摩耗性皮膜及びその形成方法、並びに耐摩耗性部材
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Also Published As

Publication number Publication date
DE10326788B4 (de) 2005-05-25
WO2004111312A3 (fr) 2005-06-16
DE10326788A1 (de) 2005-02-10
WO2004111312A2 (fr) 2004-12-23
JP2006527305A (ja) 2006-11-30
US20060204741A1 (en) 2006-09-14

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